Transfer fixture for sprayed chip
Through the negative pressure adsorption technology and positioning groove structure fixing the chip, the problems of damage and shaking and displacement of the existing fixtures on the chip are solved, and the stability and damage-free protection of the chip during the transfer and assembly process are achieved.
Patent Information
- Application Number
- CN202422485480.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-10-15
AI Technical Summary
The existing chip transfer clamps are easily damaged or scratched on the surface after spraying, and the chip is easily shaken or displaced during the transfer.
The negative pressure adsorption device is used to perform negative pressure adsorption through the chip on the positioning mechanism, and the chip is fixed using the positioning groove and through-hole structure to avoid direct contact and apply squeeze pressure.
Effectively prevent the chip from shaking or shifting during the transfer process, avoid damage or scratches, and ensure the stability and integrity of the chip.
Smart Images

Figure CN223277823U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip fixtures, in particular to a chip transfer fixture after spraying. Background Art
[0002] An automotive fingerprint chip is a chip product used in automobiles and equipped with embedded fingerprint recognition technology. It performs on-chip fingerprint image acquisition, feature extraction, and feature comparison. After the automotive fingerprint chip is spray-coated, it needs to be placed on a fixture to secure it in place and undergo a transfer process. Current transfer fixtures typically apply a compressive force to the chip, crimping or clamping it in place. This can easily damage the chip or scratch its surface. Utility Model Content
[0003] The purpose of the utility model is to provide a chip transfer fixture after spraying, which performs negative pressure adsorption on the chip on the positioning mechanism through negative pressure adsorption equipment, so that the chip remains in a fixed state, so that the chip will not shake or shift during the transfer process, and avoids the fixture from directly contacting the chip and generating squeezing force on the chip, thereby not causing damage to the chip or scratching the chip surface.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip post-spraying transfer fixture, comprising an upper cover, a positioning groove is provided on the upper end surface of the upper cover, the positioning groove comprises a plurality of main slots distributed at intervals and edge slots located at the edges of the plurality of main slots, and a positioning mechanism is provided on both sides of each main slot, the positioning mechanism comprises a main support rib in a vertical direction and secondary support ribs distributed on both sides of the main support rib and in a horizontal direction, a plurality of secondary support ribs are arranged at intervals on each side of the main support rib, a plurality of first through holes penetrating the upper cover are formed on the main support rib, and a second through hole penetrating the upper cover is formed on each secondary support rib.
[0005] Preferably, there are two edge notches, and the two edge notches are symmetrically distributed on both sides of the upper end surface of the upper cover.
[0006] Preferably, the edge notches are arranged in a comb-teeth shape, and the width of the edge notches is the same as the width of the main notches.
[0007] Preferably, the depth of the edge notch is the same as the depth of the main notch, both being 1 mm.
[0008] Preferably, a gap is formed between every two adjacent secondary supporting ribs.
[0009] Preferably, the multiple first through holes on each main support rib are spaced apart in the vertical direction, and second through holes are provided on both sides of each first through hole, and the first through hole and the second through holes on both sides thereof are distributed in a straight line.
[0010] Preferably, a ventilation groove is provided on the lower end surface of the upper cover, and the depth of the ventilation groove is 3.5 mm.
[0011] Preferably, it further comprises a base, wherein the upper end surface of the base is formed with a suspended groove, and the depth of the suspended groove is 73 mm.
[0012] Preferably, a stepped groove is provided on the outer circle of the suspended groove, and the depth of the stepped groove is 5 mm.
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention provides a positioning groove and a positioning mechanism on the upper cover. When the chip needs to be transferred, the chip is placed horizontally on the positioning mechanism. Then, through the existing negative pressure adsorption technology (the negative pressure adsorption equipment is fixed in the suspended groove), the chip on the positioning mechanism is negatively adsorbed from the inside of the suspended groove through the first through hole and the second through hole, so that the chip remains fixed, so that the chip will not shake or shift during the transfer process, and the fixture is prevented from directly contacting the chip and generating squeezing force on the chip, so that the chip will not be damaged or scratched on the chip surface. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is one of the schematic diagrams of the upper cover of the present utility model;
[0015] Figure 2 For the utility model Figure 1 A magnified view of the structure at point A;
[0016] Figure 3 It is a top view of the utility model;
[0017] Figure 4 This is the second schematic diagram of the upper cover of the utility model;
[0018] Figure 5 It is a schematic diagram of the base of the utility model.
[0019] The reference numerals and names in the figure are as follows: 1. Upper cover; 2. Positioning groove; 21. Edge notch; 22. Main notch; 3. Positioning mechanism; 31. Main support rib; 32. Secondary support rib; 33. Gap; 4. First through hole; 5. Second through hole; 6. Ventilation groove; 7. Base; 8. Suspension groove; 9. Step groove. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.
[0022] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.
[0023] See also Figure 1 The present invention provides an embodiment of a chip post-spraying transfer fixture, comprising an upper cover 1, a positioning groove 2 is provided on the upper end surface of the upper cover 1, and a positioning mechanism 3 is generated by the positioning groove 2;
[0024] See also Figures 2 to 3The positioning groove 2 includes a plurality of main grooves 22 distributed at intervals and edge grooves 21 located at the edges of the plurality of main grooves 22. There are two edge grooves 21 in total, and the two edge grooves 21 are symmetrically distributed on both sides of the upper end surface of the upper cover 1. The edge grooves 21 are arranged in a comb-like shape, and the width value of the edge groove 21 is the same as the width value of the main groove 22. The depth value of the edge groove 21 is the same as the depth value of the main groove 22, both of which are 1mm. A positioning mechanism 3 is provided on both sides of each main groove 22. The positioning mechanism 3 includes a main support rib 31 with a vertical direction and a main support rib 31 distributed on the main support rib. Secondary support ribs 32 are arranged horizontally on both sides of the rib 31. Multiple secondary support ribs 32 are spaced apart on each side of the main support rib 31, and a gap 33 is formed between each two adjacent secondary support ribs 32. Multiple first through holes 4 are formed on the main support rib 31 and penetrate the upper cover 1. A second through hole 5 is formed on each secondary support rib 32 and penetrates the upper cover 1. The multiple first through holes 4 on each main support rib 31 are spaced apart in the vertical direction, and a second through hole 5 is provided on both sides of each first through hole 4, and the first through hole 4 and the second through holes 5 on both sides thereof are distributed in a straight line.
[0025] See also Figure 4 A vent groove 6 is provided on the lower end surface of the upper cover 1, and the depth of the vent groove 6 is 3.5 mm;
[0026] See also Figure 5 , and also includes a base 7, the base 7 has a suspended groove 8 formed on the upper end surface, the depth of the suspended groove 8 is 73mm, and a stepped groove 9 is provided on the outer circle of the suspended groove 8, the depth of the stepped groove 9 is 5mm.
[0027] During operation of the present invention, the upper cover 1 is first placed in the stepped groove 9, and the upper cover 1 is adapted to the stepped groove 9 so that the upper cover 1 can maintain a stable and immobile state, and the chip to be transferred is placed flat on the main support rib 31, and the outer circle of the chip is placed on the secondary support rib 32, so that the chip can remain horizontal, and the chip can just cover part of the first through hole 4 and the second through hole 5. The equipment for negative pressure adsorption is fixed in the suspended groove 8, and the negative pressure adsorption equipment works and utilizes the first through hole 4 and the second through hole 5 for ventilation, so that the chip on the positioning mechanism 3 can be adsorbed, so that the chip maintains its horizontal state without moving or misalignment, thereby ensuring the stability of the chip during the transfer process.
[0028] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
Claims
1. A chip transfer fixture after spraying, comprising an upper cover (1), characterized in that: The upper end surface of the upper cover (1) is provided with a positioning groove (2), the positioning groove (2) includes a plurality of main grooves (22) distributed at intervals and edge grooves (21) located at the edges of the plurality of main grooves (22), and a positioning mechanism (3) is provided on both sides of each of the main grooves (22), the positioning mechanism (3) includes a main supporting rib (31) running vertically and auxiliary supporting ribs (32) distributed on both sides of the main supporting rib (31) and running horizontally, a plurality of auxiliary supporting ribs (32) are arranged at intervals on each side of the main supporting rib (31), a plurality of first through holes (4) penetrating the upper cover (1) are formed on the main supporting rib (31), and a second through hole (5) penetrating the upper cover (1) is formed on each of the auxiliary supporting ribs (32).
2. The chip post-spraying transfer fixture according to claim 1, characterized in that: There are two edge notches (21) in total, and the two edge notches (21) are symmetrically distributed on both sides of the upper end surface of the upper cover (1).
3. The chip post-spraying transfer fixture according to claim 1, characterized in that: The edge notch (21) is arranged in a comb-teeth shape, and the width of the edge notch (21) is the same as the width of the main notch (22).
4. The chip post-spraying transfer fixture according to claim 1, characterized in that: The depth of the edge notch (21) is the same as that of the main notch (22), both being 1 mm.
5. The chip transfer fixture after spraying according to claim 1, characterized in that: A gap (33) is formed between every two adjacent auxiliary support ribs (32).
6. The chip transfer fixture after spraying according to claim 1, characterized in that: The plurality of first through holes (4) on each of the main support ribs (31) are spaced apart in the vertical direction, and second through holes (5) are provided on both sides of each of the first through holes (4), and the first through holes (4) and the second through holes (5) on both sides thereof are distributed in a straight line.
7. The chip transfer fixture after spraying according to claim 1, characterized in that: The lower end surface of the upper cover (1) is provided with a ventilation groove (6), and the depth of the ventilation groove (6) is 3.5 mm.
8. The chip transfer fixture after spraying according to claim 1, characterized in that: It also includes a base (7), wherein the upper end surface of the base (7) is formed with a suspended groove (8), and the depth of the suspended groove (8) is 73 mm.
9. The chip transfer fixture after spraying according to claim 8, characterized in that: The outer circle of the suspended groove (8) is provided with a stepped groove (9), and the depth of the stepped groove (9) is 5 mm.