Anti-blocking floating bed baffle device for VCP (Vinyl Chloride Polymer) copper-plated wire

Abstract

The utility model relates to an anti-jamming floating bed baffle device for a VCP copper-plated wire, which comprises a PCB (printed circuit board), a left baffle and a right baffle which are arranged in a copper-plated tank, the left baffle is arranged on the left side of the PCB, the right baffle is arranged on the right side of the PCB, and the left baffle and the right baffle are symmetrically arranged on the bottom surface of the copper-plated tank below the PCB; the distance between the front end of the left baffle and the front end face of the copper plating tank is smaller than the length of a PCB, the distance between the rear end of the left baffle and the rear end face of the copper plating tank is smaller than the length of the PCB, and the distance between the front end of the right baffle and the front end face of the copper plating tank is smaller than the length of the PCB. The distance between the rear end of the right baffle and the rear end face of the copper plating tank is smaller than the length of the PCB. The left side of the left baffle is provided with a row of multiple groups of titanium blue, and the right side of the right baffle is provided with a row of multiple groups of titanium blue. According to the utility model, the problem that the PCB is easy to be clamped in the gap of the floating bed baffle to cause the scrapping of the PCB is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production equipment, in particular to a floating bed baffle device for preventing board jamming of VCP copper plating wires. Background Art

[0002] A vertical continuous plating line (VCP) is the most common equipment used in PCB electroplating. During the plating process, circuit boards are primarily transported by a conveyor before being plated. The floating bed in a VCP serves to relatively stabilize the plated parts. Because PCB plating is rack plating, only the anode end is secured, while the other end, submerged in the bath, remains unfixed. Plating tanks for copper and nickel plating, for example, incorporate aeration and other devices to agitate the bath (except for tin plating). The accelerated bath flow can impact the bottom of the PCB parts, causing them to deviate from their center position, potentially leading to adverse consequences. To prevent this, floating beds (or floating frames) are installed on both sides of the PCB. Guide grooves at each end secure the floating frames to the center of the bath. This ensures that the PCB parts only move up and down within the center of the anode, preventing them from straying or even contacting the anode, thus ensuring high-quality plating. However, during the transportation process, the PCB board has a certain degree of warping. During the production process, it is washed by high-pressure spray, and the PCB board is easily stuck in the gap of the floating bed baffle, causing the PCB board to be scrapped. Summary of the Invention

[0003] The purpose of the utility model is to overcome the above-mentioned shortcomings and provide a floating bed baffle device for VCP copper plating wire to prevent board jamming and solve the board jamming problem in the PCB board production process.

[0004] The purpose of this utility model is achieved in this way:

[0005] A floating bed baffle device for preventing stuck boards in VCP copper plating lines comprises a PCB board, a left baffle, and a right baffle disposed in a copper plating tank. The top of one end of the copper plating tank is provided with an inlet for the PCB board, and the top of the other end is provided with an outlet for the PCB board. The PCB board enters the copper plating tank through the inlet and exits through the outlet.

[0006] A left baffle is provided on the left side of the PCB board, and a right baffle is provided on the right side of the PCB board. The left and right baffles are symmetrically arranged on the bottom surface of the copper plating tank below the PCB board; the distance between the front end of the left baffle and the front end surface of the copper plating tank is less than the length of the PCB board, the distance between the rear end of the left baffle and the rear end surface of the copper plating tank is less than the length of the PCB board, the distance between the front end of the right baffle and the front end surface of the copper plating tank is less than the length of the PCB board, and the distance between the rear end of the right baffle and the rear end surface of the copper plating tank is less than the length of the PCB board; a row of multiple groups of titanium blue is provided on the left side of the left baffle, and a row of multiple groups of titanium blue is provided on the right side of the right baffle.

[0007] Furthermore, the front end of the left baffle reaches the front end surface of the copper plating tank, the rear end of the left baffle reaches the rear end surface of the copper plating tank, and the length of the left baffle is not less than the length of the PCB board in the copper plating tank; the front end of the right baffle reaches the front end surface of the copper plating tank, the rear end of the right baffle reaches the rear end surface of the copper plating tank, and the length of the right baffle is not less than the length of the PCB board in the copper plating tank.

[0008] Furthermore, the front end of the left baffle is close to the front end surface of the copper plating tank, but is not tightly attached to the front end surface of the copper plating tank; the rear end of the left baffle is close to the rear end surface of the copper plating tank, but is not tightly attached to the rear end surface of the copper plating tank; the front end of the right baffle is close to the front end surface of the copper plating tank, but is not tightly attached to the front end surface of the copper plating tank; the rear end of the right baffle is close to the rear end surface of the copper plating tank, but is not tightly attached to the rear end surface of the copper plating tank.

[0009] Furthermore, each group of titanium blue is evenly spaced.

[0010] Furthermore, the titanium blue is arranged in the copper plating tank near the inner wall.

[0011] Furthermore, the titanium blue on the left side of the left baffle and the titanium blue on the right side of the right baffle are symmetrically arranged with respect to the PCB board.

[0012] Furthermore, no floating bed is provided between the left baffle and the titanium blue on the left side. Similarly, no floating bed is provided between the right baffle and the titanium blue on the right side.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The utility model provides a floating bed baffle device for preventing PCB from getting stuck in VCP copper plating lines. The floating bed between the copper plating tanks is omitted, and two baffles with zero gap are directly provided. The baffles are designed to be extended and connected, so as to avoid the problem that PCB boards are easily stuck in the gap between the floating bed baffles, causing the PCB boards to be stuck and scrapped, thereby improving production efficiency, improving the yield rate, and reducing scrap costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of Example 1 of the present utility model.

[0016] Figure 2 This is a schematic diagram of the internal structure of Example 1 of the present utility model.

[0017] Figure 3 It is a top view of embodiment 1 of the present utility model.

[0018] Figure 4 It is a side view of embodiment 2 of the present utility model.

[0019] in:

[0020] Copper plating tank 1, inlet 1.1, outlet 1.2, PCB board 2, left baffle 3, right baffle 4, titanium blue 5. DETAILED DESCRIPTION

[0021] To better understand the technical solution of the present invention, the following detailed description is provided with reference to the relevant illustrations. It should be understood that the following specific embodiments are not intended to limit the specific implementation of the technical solution of the present invention; they are merely examples of possible implementations of the technical solution of the present invention. It should be noted that the description herein of the positional relationships of the various components, such as component A being located above component B, is based on the relative positions of the components in the illustrations and is not intended to limit the actual positional relationships of the components. Example 1

[0022] See also Figure 1-Figure 3 , Figure 1 A schematic diagram of the explosion structure of Example 1 is provided. As shown in the figure, the present invention relates to a floating bed baffle device for preventing stuck boards in VCP copper plating wires. The device comprises a PCB board 2, a left baffle 3, and a right baffle 4 disposed within a copper plating tank 1. The top of one end of the copper plating tank 1 is provided with an inlet 1.1 for the PCB board 2, and the top of the other end is provided with an outlet 1.2 for the PCB board 2. The PCB board 2 enters the copper plating tank 1 through the inlet 1.1 and extends out through the outlet 1.2.

[0023] A left baffle 3 is provided on the left side of the PCB board 2, and a right baffle 4 is provided on the right side of the PCB board 2. The left baffle 3 and the right baffle 4 are symmetrically arranged on the bottom surface of the copper plating tank 1 below the PCB board 2.

[0024] The front end of the left baffle 3 reaches the front end surface of the copper plating tank 1, and the rear end of the left baffle 3 reaches the rear end surface of the copper plating tank 1, that is, the length of the left baffle 3 is extended to be connected to not less than the length of the PCB board 2 in the copper plating tank 1; similarly, the front end of the right baffle 4 reaches the front end surface of the copper plating tank 1, and the rear end of the right baffle 4 reaches the rear end surface of the copper plating tank 1, that is, the length of the right baffle 4 is extended to be connected to not less than the length of the PCB board 2 in the copper plating tank 1.

[0025] A row of multiple groups of titanium blue 5 is provided on the left side of the left baffle 3, and a row of multiple groups of titanium blue 5 is provided on the right side of the right baffle 4. Each group of titanium blue 5 is arranged evenly spaced, and the titanium blue 5 is arranged near the inner wall of the copper plating tank 1; the titanium blue 5 serves as an anode, and the titanium blue 5 on the left side of the left baffle 3 and the titanium blue 5 on the right side of the right baffle 4 are arranged symmetrically about the PCB board 2.

[0026] No floating bed is provided between the left baffle 3 and the titanium blue 5 on the left side. Similarly, no floating bed is provided between the right baffle 4 and the titanium blue 5 on the right side. Example 2

[0027] See also Figure 4 , Figure 4 The figure shows a side view of a floating bed baffle device for preventing stuck plate of VCP copper plating wire in this embodiment 2. As shown in the figure, the floating bed baffle device for preventing stuck plate of VCP copper plating wire in this embodiment 2 differs from that in embodiment 1 in the following aspects:

[0028] The front end of the left baffle 3 is close to the front end surface of the copper plating tank 1, but is not tightly attached to the front end surface of the copper plating tank 1. However, the distance between the front end of the left baffle 3 and the front end surface of the copper plating tank 1 is less than the length of the PCB board; the rear end of the left baffle 3 is close to the rear end surface of the copper plating tank 1, but is not tightly attached to the rear end surface of the copper plating tank 1. However, the distance between the rear end of the left baffle 3 and the rear end surface of the copper plating tank 1 is less than the length of the PCB board.

[0029] Similarly, the front end of the right baffle 4 is close to the front end surface of the copper plating tank 1, and is not tightly attached to the front end surface of the copper plating tank 1, but the distance between the front end of the right baffle 4 and the front end surface of the copper plating tank 1 is less than the length of the PCB board; the rear end of the right baffle 4 is close to the rear end surface of the copper plating tank 1, and is not tightly attached to the rear end surface of the copper plating tank 1, but the distance between the rear end of the right baffle 4 and the rear end surface of the copper plating tank 1 is less than the length of the PCB board.

[0030] Working principle:

[0031] The utility model relates to a floating bed baffle device for preventing VCP copper-plated wire from getting stuck. The floating beds between grooves are removed, and the baffles are extended and connected so that the baffles are set with zero gap, thereby preventing the PCB board from getting stuck in the gap between the floating bed baffles, causing the PCB board to be stuck and scrapped.

[0032] The above are only specific application examples of the present invention and do not constitute any limitation on the scope of protection of the present invention. Any technical solution formed by equivalent transformation or equivalent replacement shall fall within the scope of protection of the present invention.

Claims

1. A floating bed baffle device for preventing stuck board of VCP copper plating wire, characterized by: It comprises a PCB board (2), a left baffle (3) and a right baffle (4) arranged in a copper plating tank (1); an inlet (1.1) for the PCB board (2) is provided at the top of one end of the copper plating tank (1); and an outlet (1.2) for the PCB board (2) is provided at the top of the other end; the PCB board (2) enters the copper plating tank (1) from the inlet (1.1) and exits from the outlet (1.2); A left baffle (3) is provided on the left side of the PCB board (2), and a right baffle (4) is provided on the right side of the PCB board (2); the left baffle (3) and the right baffle (4) are symmetrically arranged on the bottom surface of the copper plating tank (1) below the PCB board (2); the distance between the front end of the left baffle (3) and the front end surface of the copper plating tank (1) is less than the length of the PCB board (2), the distance between the rear end of the left baffle (3) and the rear end surface of the copper plating tank (1) is less than the length of the PCB board (2), the distance between the front end of the right baffle (4) and the front end surface of the copper plating tank (1) is less than the length of the PCB board (2), and the distance between the rear end of the right baffle (4) and the rear end surface of the copper plating tank (1) is less than the length of the PCB board (2); a row of multiple groups of titanium blue (5) is provided on the left side of the left baffle (3), and a row of multiple groups of titanium blue (5) is provided on the right side of the right baffle (4).

2. The anti-stuck floating bed baffle device for VCP copper plating wire according to claim 1, characterized in that: The front end of the left baffle (3) reaches the front end surface of the copper plating tank (1), the rear end of the left baffle (3) reaches the rear end surface of the copper plating tank (1), and the length of the left baffle (3) is not less than the length of the PCB board (2) in the copper plating tank (1); the front end of the right baffle (4) reaches the front end surface of the copper plating tank (1), the rear end of the right baffle (4) reaches the rear end surface of the copper plating tank (1), and the length of the right baffle (4) is not less than the length of the PCB board (2) in the copper plating tank (1).

3. The anti-stuck floating bed baffle device for VCP copper plating wire according to claim 1, characterized in that: The front end of the left baffle (3) is close to the front end surface of the copper plating tank (1) but is not in close contact with the front end surface of the copper plating tank (1); the rear end of the left baffle (3) is close to the rear end surface of the copper plating tank (1) but is not in close contact with the rear end surface of the copper plating tank (1); the front end of the right baffle (4) is close to the front end surface of the copper plating tank (1) but is not in close contact with the front end surface of the copper plating tank (1); the rear end of the right baffle (4) is close to the rear end surface of the copper plating tank (1) but is not in close contact with the rear end surface of the copper plating tank (1).

4. The anti-stuck floating bed baffle device for VCP copper plating wire according to claim 1, characterized in that: Each group of titanium blue (5) is evenly spaced.

5. The anti-stuck floating bed baffle device for VCP copper plating wire according to claim 1, characterized in that: The titanium blue (5) is arranged in the copper plating tank (1) near the inner wall.

6. The anti-stuck floating bed baffle device for VCP copper plating wire according to claim 1, characterized in that: The titanium blue (5) on the left side of the left baffle (3) and the titanium blue (5) on the right side of the right baffle (4) are symmetrically arranged with respect to the PCB board (2).

7. The anti-stuck floating bed baffle device for VCP copper plating wire according to claim 1, characterized in that: No floating bed is provided between the left baffle (3) and the titanium blue (5) on the left side, and no floating bed is provided between the right baffle (4) and the titanium blue (5) on the right side.

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