Cooling fan and electronic equipment

Abstract

The embodiment of the utility model provides a cooling fan and electronic equipment, and the cooling fan provided by the embodiment of the utility model has the advantages that on the basis of a cooling fan in the related technology, under the condition of the same architecture feature, the cooling efficiency is improved; the thickness of the bottom plate, corresponding to the bottom of the cooling fan, of the fan blades of the impeller is reduced, or the bottom plate is not arranged in the area, corresponding to the bottom of the cooling fan, of the fan blades of the impeller, so that the height of the fan blades of the impeller can be increased, the cooling performance of the cooling fan is improved, or the cooling performance of the cooling fan is improved under the condition that the cooling performance of the cooling fan is kept. The overall height of the cooling fan can be reduced, and lightening and thinning of the electronic equipment are facilitated.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic products, and in particular to a heat dissipation fan and an electronic device. Background Art

[0002] The electronic components in electronic devices such as mobile phones and laptops usually generate heat during operation. In order to prevent heat accumulation from affecting the working performance of the electronic components, a cooling fan is usually installed in the electronic device to use the airflow generated by the cooling fan to transfer the heat of the electronic components to the outside of the electronic device.

[0003] As people place increasing emphasis on quality of life and refined tastes, their pursuit of technological perfection is also reaching new heights. Consequently, portable and trendy electronic devices are becoming thinner and more refined. However, this pursuit of thinner and lighter electronic devices also comes at the expense of increasing component power. This necessitates enhanced cooling fan performance. However, the need for high cooling performance and thinness presents a conflicting challenge. Utility Model Content

[0004] The embodiments of the present application provide a heat dissipation fan and an electronic device, which can solve the contradiction between the high heat dissipation performance of the heat dissipation fan and the lightness and thinness of the electronic device.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, comprising: a support member and a heat dissipation fan;

[0007] The cooling fan includes: a shell, an impeller and a driving device, the impeller is connected to the driving device, the driving device is used to drive the impeller to rotate, the shell and the support member are combined to form an accommodating cavity, the impeller and the driving device are both arranged in the accommodating cavity, and the driving device is connected to the support member.

[0008] The electronic device provided in the embodiment of the present application directly encloses the housing of the cooling fan and the support member in the electronic device to form a housing chamber for accommodating the impeller and the drive device. Compared with the cooling fans in the related art, this is equivalent to eliminating the base plate, so that the impeller blades can be designed to be higher, thereby improving the heat dissipation performance of the cooling fan. Alternatively, while keeping the impeller blade height unchanged, the overall height of the cooling fan can be reduced, which is conducive to the lightweighting of the electronic device. In addition, since the cooling fan provided in the embodiment of the present application eliminates the base plate compared to the cooling fans in the related art, the manufacturing cost of the cooling fan can be reduced, which is also conducive to the lightweighting of electronic devices.

[0009] In a possible embodiment, the shell includes a side panel, at least one end of the side panel is connected to the support member, and the side panel and the support member enclose to form the accommodating cavity.

[0010] Compared to related art cooling fans, the cooling fan in the electronic device eliminates the top and bottom plates, allowing the impeller blades to be designed higher, thereby improving the cooling performance of the cooling fan. Alternatively, while maintaining the height of the impeller blades, the height of the side panels can be reduced, thereby reducing the overall height of the cooling fan, which facilitates the lightweighting of the electronic device. Furthermore, because the cooling fan in the electronic device provided in the embodiments of the present application eliminates the top and bottom plates compared to related art cooling fans, it can reduce the manufacturing cost of the cooling fan, which also facilitates the lightweighting of electronic devices.

[0011] In a possible embodiment, the shell also includes a first base plate, the driving device is arranged on the first base plate, the driving device is connected to the support member through the first base plate, and the projection area of ​​the driving device on the first base plate along the first direction is greater than or equal to the area of ​​the first base plate, wherein the first direction is perpendicular to the first base plate.

[0012] The electronic device provided in the embodiments of the present application eliminates the base plate directly below the impeller blades in the cooling fan, allowing the impeller blades to be designed to be taller, thereby improving the cooling performance of the cooling fan. Alternatively, while maintaining the impeller blade height, the side panels can be lowered, thereby reducing the overall height of the cooling fan, thereby facilitating a slimmer and lighter electronic device.

[0013] In a possible implementation, the shell further includes a top plate, which is disposed on the top of the accommodating cavity and is connected to the side panels.

[0014] The top plate prevents the impeller in the cooling fan from coming into contact with other components in the electronic device, potentially hindering its rotation. Furthermore, the cooling fan in the electronic device shares the same structural features as the cooling fan in the related art, except that the bottom plate of the cooling fan in the related art is replaced by a support member in the electronic device. This eliminates the need for a bottom plate directly below the impeller, allowing the impeller to be designed higher, thereby improving the cooling performance of the cooling fan. Alternatively, while maintaining the impeller height, the side panels can be lowered, thereby reducing the overall height of the cooling fan, contributing to the thinness and weight reduction of the electronic device.

[0015] In a possible implementation manner, an air inlet is provided on the top plate.

[0016] In a possible implementation manner, a countersunk hole is provided on the support member, and the first bottom plate is provided in the countersunk hole.

[0017] In this way, on the one hand, the installation stability of the driving device on the support member can be enhanced, and on the other hand, the overall height of the heat dissipation fan can be reduced, which is conducive to the lightweight and thinning of the electronic equipment.

[0018] In a possible implementation, a guide air duct is provided on the support member, and the guide air duct is used to guide the airflow blown out by the cooling fan to the air outlet window of the electronic device.

[0019] In a possible implementation, the support member is the main body of the electronic device or a heat dissipation device located inside the main body.

[0020] In one possible embodiment, the heat dissipation device is a heat sink, a heat pipe, a graphite heat sink, a copper heat sink or a heat dissipation coefficient greater than or equal to 10W / (m 2 ·℃) heat source.

[0021] In a possible implementation, the heat dissipation fan is used to dissipate heat from a heat source in the electronic device.

[0022] In a second aspect, an embodiment of the present application provides a cooling fan, comprising: a casing, an impeller, and a driving device, wherein the impeller is connected to the driving device, and the driving device is used to drive the impeller to rotate, the casing comprising: a side panel, a first bottom plate, and a second bottom plate, the inner edge of the second bottom plate is connected to the first bottom plate, the outer edge of the second bottom plate is connected to the side panel, the side panel, the second bottom plate, and the first bottom plate are combined to form a accommodating cavity, the impeller and the driving device are both arranged in the accommodating cavity, the driving device is arranged on the first bottom plate, the projection area of ​​the driving device on the first bottom plate along the first direction is greater than or equal to the area of ​​the first bottom plate, wherein the first direction is perpendicular to the first bottom plate; the surface of the first bottom plate facing the accommodating cavity protrudes beyond the surface of the second bottom plate facing the accommodating cavity, and the thickness of the second bottom plate is less than the thickness of the first bottom plate.

[0023] In the cooling fan provided by the embodiment of the present application, since the thickness of the second bottom plate directly below the impeller blades is less than the thickness of the first bottom plate, the surface of the first bottom plate facing the accommodating cavity protrudes beyond the surface of the second bottom plate facing the accommodating cavity. It can be understood that the bottom plate corresponding to the drive device and the bottom plate corresponding to the impeller blades are designed to be of unequal thickness, and the height of the impeller blades can be designed to be higher, thereby improving the heat dissipation performance of the cooling fan. Alternatively, while keeping the height of the impeller blades unchanged, the height of the side wall can be reduced, thereby reducing the overall height of the cooling fan, which is conducive to the lightweight and thinning of electronic equipment.

[0024] In a possible embodiment, a flange is provided on the outer circumferential surface of the first bottom plate, the flange and the outer circumferential surface of the first bottom plate form a step, the step is located on the side of the flange facing away from the driving device, and the second bottom plate is connected to the step.

[0025] In this way, the first base plate and the second base plate can be fixed, which is also beneficial to the connection reliability of the first base plate and the second base plate.

[0026] In a possible implementation manner, the first bottom plate and the second bottom plate are separate components.

[0027] In a possible implementation, the first bottom plate and the second bottom plate are integrally formed.

[0028] In a possible implementation, the shell further includes a top plate, which is disposed on the top of the accommodating cavity, and the bottom plate is connected to the side panels.

[0029] The top plate prevents the impeller from coming into contact with external structures and hindering the rotation of the impeller.

[0030] In a possible implementation manner, an air inlet is provided on the top plate.

[0031] In a third aspect, an embodiment of the present application provides an electronic device, comprising a main body and the above-described heat dissipation fan disposed in the main body.

[0032] The electronic device provided in the embodiment of the present application, since it has the above-mentioned cooling fan, is configured such that the thickness of the second bottom plate directly below the impeller blades is set to be less than the thickness of the first bottom plate, and the surface of the first bottom plate facing the accommodating cavity protrudes from the surface of the second bottom plate facing the accommodating cavity. It can be understood that the bottom plate corresponding to the driving device and the bottom plate corresponding to the impeller blades are designed to be of unequal thickness, and the height of the impeller blades can be designed to be higher, thereby improving the heat dissipation performance of the cooling fan. Alternatively, while keeping the height of the impeller blades unchanged, the height of the side wall can be reduced, thereby reducing the overall height of the cooling fan, which is conducive to the lightweight and thinning of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the structure of a heat dissipation fan in related art;

[0034] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure of the middle cooling fan along the cutting line AA;

[0035] Figure 3 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application;

[0036] Figure 4A schematic diagram of a partial structure inside an electronic device provided in one embodiment of the present application;

[0037] Figure 5 A schematic cross-sectional view of a cooling fan according to an embodiment of the present invention. Figure 1 ;

[0038] Figure 6 Schematic diagram of a cooling fan provided in an embodiment of the present application being applied to an electronic device Figure 1 ;

[0039] Figure 7 A schematic cross-sectional view of a cooling fan according to an embodiment of the present invention. Figure 2 ;

[0040] Figure 8 Schematic diagram of a cooling fan provided in an embodiment of the present application being applied to an electronic device Figure 2 ;

[0041] Figure 9 A schematic cross-sectional view of a cooling fan according to an embodiment of the present invention. Figure 3 ;

[0042] Figure 10 Schematic diagram of a cooling fan provided in an embodiment of the present application being applied to an electronic device Figure 3 ;

[0043] Figure 11 A schematic cross-sectional view of a cooling fan according to an embodiment of the present invention. Figure 4 ;

[0044] Figure 12 Schematic diagram of a cooling fan provided in an embodiment of the present application being applied to an electronic device Figure 4 ;

[0045] Figure 13 A schematic diagram showing the connection between the first base plate and the second base plate provided in one embodiment of the present application;

[0046] Figure 14 A schematic diagram of the structure of a heat dissipation assembly provided in one embodiment of the present application Figure 1 ;

[0047] Figure 15 A schematic top view of a heat dissipation assembly provided in one embodiment of the present application;

[0048] Figure 16 A schematic diagram of the structure of a heat dissipation assembly provided in one embodiment of the present application Figure 2 ;

[0049] Figure 17 A schematic diagram of the structure of a heat dissipation assembly provided in one embodiment of the present application Figure 3 .

[0050] Description of reference numerals:

[0051] 10- Cooling fan;

[0052] 11-housing; 11a-top plate; 11b-bottom plate; 11c-side panel; 12-impeller; 12a-fan blades; 12b-impeller shaft; 13-air inlet; 14-air outlet; 15-flow channel; 16-motor;

[0053] 100-Electronic equipment;

[0054] 110-main body; 110a-first main body; 110b-second main body; 110c-back shell;

[0055] 120- shaft mechanism; 130- display screen; 140- buttons; 150- mainboard; 160- air inlet window; 170- air outlet window; 180- middle frame;

[0056] 200- cooling fan;

[0057] 210 - housing; 211 - side panel; 2111 - air outlet; 212 - top panel; 2121 - air inlet; 213 - bottom panel; 213a - first bottom panel;

[0058] 213b - second bottom plate; 213c - flange; 213d - step; 220 - impeller; 221 - blades; 230 - drive device; 240 - accommodating chamber;

[0059] 300-heat dissipation component;

[0060] 310 - heat sink; 310a - heat spreader; 311 - countersunk hole. DETAILED DESCRIPTION

[0061] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0062] Before introducing the embodiments of the present application, the basic structure of a heat dissipation fan (also called a centrifugal fan) in the related art is first introduced. Figure 1 This is a schematic diagram of the structure of a heat dissipation fan 10 in the related art, referring to Figure 1 As shown, in the related art, a heat dissipation fan 10 generally includes a housing 11 having a hollow cavity for accommodating an impeller 12 .

[0063] When forming the housing 11, either direct injection molding of a single structure or combining separate structures can be used. The housing 11 can include two cover plates, a top plate 11a and a bottom plate 11b. Furthermore, the housing 11 includes a side panel 11c. The top plate 11a and the bottom plate 11b are positioned opposite each other, while the side panels 11c are fixedly connected to the top and bottom plates 11a and 11b, respectively, to form the housing 11 that accommodates the impeller 12. Furthermore, the gaps between the top plate 11a, the bottom plate 11b, the side panels 11c, and the impeller 12 form the flow channel 15 of the cooling fan 10.

[0064] When installed, the impeller 12 is disposed within the housing 11 and rotates relative to the housing 11. Furthermore, the housing 11 is provided with an air inlet 13 and an air outlet 14 that cooperate with the impeller 12. The air inlet 13 is disposed on the top surface of the housing 11 opposite the impeller 12, and the air outlet 14 is disposed on the side panel 11c between the top and bottom surfaces of the housing 11. Furthermore, there is a gap between the housing 11 and the impeller 12, which is connected to the air inlet 13 and the air outlet 14, respectively, so that the gap serves as a flow channel 15 for circulating air. During use, under the action of the impeller 12, air flows in from the air inlet 13, then flows through the flow channel 15, and then flows out from the air outlet 14.

[0065] When the impeller 12 rotates, air is drawn from the air inlet 13 into the flow channel 15 of the housing 11. Typically, along the direction of air flow within the housing 11, the flow channel 15 is divided into a connected air inlet area, a pressurization area, and a release area. The air inlet area corresponds to the air inlet 13, the area of ​​the air channel 15 near the air outlet 14 is the release area, and the area between the air inlet area and the release area is the pressurization area. When air enters the housing 11 through the air inlet 13, it gradually accelerates under the work of the impeller 12. Part of the airflow is swept into the air inlet area by the impeller 12, and then enters the pressurization area along with the impeller 12. In the pressurization area, the static pressure and flow rate of the airflow gradually increase along the direction of rotation of the impeller 12. The air then continues to flow in the flow channel 15 to the release area, and then flows out from the air outlet 14.

[0066] Figure 2 for Figure 1 The cross-sectional structure diagram of the cooling fan 10 along the cutting line AA is shown in FIG. Figure 2 As shown, a motor 16 is also housed within the hollow cavity enclosed by the top plate 11a, bottom plate 11b, and side panels 11c. This motor 16 is used to drive the impeller 12. The impeller 12 comprises an integrally connected impeller shaft 12b and blades 12a. The impeller shaft 12b is connected to the motor 16. When the motor 16 is activated, it drives the impeller 12 to rotate. At this point, the blades 12a rotate in a plane around the impeller shaft 12b, generating work on the air entering the cooling fan 10.

[0067] Based on the structure of cooling fan 10, it can be seen that the height of blades 12a of cooling fan 10 is strongly correlated with the heat dissipation performance of cooling fan 10. That is, the greater the height of blades 12a, the higher the heat dissipation performance of cooling fan 10. Conversely, the smaller the height of blades 12a, the lower the heat dissipation performance of cooling fan 10. Herein, the height of blades 12a refers to the dimension of blades 12a from bottom plate 11b to top plate 11a of cooling fan 10.

[0068] It is worth mentioning that Figure 2 The figures are not drawn according to the actual shapes and proportions of the parts, and the same may be true for other drawings. Therefore, this application should not be limited to the shapes, proportions, sizes, etc. shown in the drawings.

[0069] With the advancement of technology, the power of electronic components in electronic devices continues to increase, leading to an increase in the heat generated by these components. To improve the heat dissipation performance of cooling fans, the fan blades need to be increased in height, which directly increases the height of the cooling fan. However, the increased height of the cooling fan is not conducive to the development of thinner and lighter electronic devices.

[0070] In view of this, the embodiments of the present application provide a heat dissipation fan and an electronic device, which can solve the above-mentioned problems by optimizing the structure of the heat dissipation fan.

[0071] The heat dissipation fan and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings and specific embodiments.

[0072] The electronic device provided in the embodiments of the present application can be referred to as a user equipment (UE) or a terminal, etc. For example, the electronic device can be a mobile phone, a laptop, a tablet computer (pad), a television, a smart wearable product (such as a smart watch, a smart bracelet, etc.), a virtual reality (VR) device, an augmented reality (AR) device, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a handheld device with a wireless communication function, a computing device, an in-vehicle device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, and other mobile terminals or fixed terminals. In the embodiments of the present application, there is no specific restriction on the form of the terminal device. For ease of understanding, the embodiments of the present application are described by taking the electronic device as a laptop as an example.

[0073] Figure 3 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application, refer to Figure 3 As shown, the electronic device 100 provided in the embodiment of the present application includes a main body 110. The main functions of the main body 110 are two-fold. On the one hand, it provides a base for installing the various components of the electronic device 100, and on the other hand, it provides protection for some components. The main body 110 includes the outer shell, the middle frame, the connectors and structural parts constituting the outer shell or the middle frame of the electronic device, and the like. A receiving cavity may be formed inside the main body 110, and various components of the electronic device 100 may be arranged inside the receiving cavity. The material of the main body 110 is not limited here. In specific practice, those skilled in the art may select it according to actual needs. For example, the material of the main body 110 may be metal, plastic, ceramic, or glass.

[0074] Specifically, the components installed inside the main body 110 may include one or more of a mainboard, a battery module, a wireless communication module, a camera module, an audio playback module, etc. The arrangement and installation method of these components are not limited in this application. Those skilled in the art will understand that the electronic device 100 may include one or more of the components listed above, and of course may include other components, not limited to the components listed above.

[0075] It is understandable that the main body 110 may include only one main body portion, or may include multiple main body portions, for example, Figure 3 As shown, the main body 110 includes a first main body portion 110a and a second main body portion 110b, which are connected by a hinge mechanism 120. For a laptop computer, the first main body portion 110a can be the display side where the display screen 130 and camera module are installed, and the second main body portion 110b can be the keyboard side where components such as the keypad 140, battery module, and motherboard are installed.

[0076] Figure 4 This is a schematic diagram of a partial structure of the internal structure of the electronic device 100 provided in an embodiment of the present application, refer to Figure 4 As shown, in some embodiments of the present application, a main board 150 may be provided in the second main body 110b. The main board 150 is a typical heat-generating electronic component in the electronic device 100. When components such as capacitors are installed on the main board 150, heat is generated. In order to avoid heat accumulation when the main board 150 is working, in the embodiment of the present application, a cooling fan 200 is further provided in the second main body 110b. The second main body 110b is generally further provided with an air inlet window 160 and an air outlet window 170. The air inlet window 160 and the air outlet window 170 are generally located on the back side or side wall of the second main body 110b ( Figure 4 The air inlet window 160 and the air outlet window 170 are located on the side wall of the second main body portion 110b as an example for explanation), the air inlet window 160 is used to connect the external environment with the air inlet of the cooling fan 200, and the air outlet window 170 is used to connect the external environment with the air outlet of the cooling fan 200. Figure 4 Although the air inlet and outlet of the cooling fan 200 are not shown, this does not prevent those skilled in the art from understanding and implementing the technical solution of this application. It should be noted that in this application, the side of the second main body 110b facing away from the user when the electronic device 100 is in use is defined as the back side.

[0077] The present application does not limit the number of the cooling fans 200 provided in the electronic device 100. The number of the cooling fans 200 may be one or more. For example, Figure 4 In the figure, two cooling fans 200 are used for illustration.

[0078] When the electronic device 100 is operating, the motherboard 150 generates heat. Air outside the electronic device 100 enters the electronic device 100 through the air inlet window 160. The air, carrying the heat dissipated by the motherboard 150, is then sucked into the cooling fan 200. The cooling fan 200 accelerates the air and blows it out of the air outlet window 170, thereby dissipating heat from the electronic device 100.

[0079] It is understandable that the cooling fan 200 can dissipate heat from any heat source in the electronic device 100 . In the embodiment of the present application, the cooling fan 200 is used as an example to dissipate heat from the mainboard 150 .

[0080] Figure 5 A cross-sectional view of a cooling fan 200 according to an embodiment of the present application Figure 1 ,refer to Figure 5 As shown, the heat dissipation fan 200 provided in the embodiment of the present application includes: a housing 210 , an impeller 220 and a driving device 230 . Figure 6 Schematic diagram of a cooling fan 200 provided in an embodiment of the present application being applied to an electronic device 100 Figure 1 ,refer to Figure 6 and combined Figure 4 and Figure 5 As shown, the housing 210 can be enclosed with the outer shell of the electronic device 100, the middle frame of the electronic device 100, the devices in the electronic device 100, or the connectors and structural parts in the electronic device 100 to form a receiving cavity. For example, Figure 5 In the description, the housing 210 and the back shell 110c of the electronic device 100 enclose the accommodating cavity 240 as an example. In the above description, the housing of the electronic device 100, the middle frame of the electronic device 100, the components in the electronic device 100, or the connectors and structural components in the electronic device are all referred to as support members for supporting the cooling fan 200. That is, the housing 210 of the cooling fan 200 and the support members enclose the accommodating cavity 240.

[0081] For example, the housing 210 may include side panels 211. The side panels 211 and the support members enclose a housing cavity 240. The impeller 220 and the drive device 230 are disposed in the housing cavity 240. The impeller 220 is connected to the drive device 230, which is used to drive the impeller 220 to rotate. Furthermore, the side panels 211 are provided with air outlets 2111, through which the airflow accelerated by the rotation of the impeller 220 can be blown out of the housing 210.

[0082] The driving device 230 is used to connect to the support member. Specifically, the driving device 230 can be connected to the housing of the electronic device 100, the middle frame 180 of the electronic device 100, the components in the electronic device 100, or the structural components in the electronic device 100 through a series of conventional connection methods such as bonding, clamping, fastener connection, or welding. For example, Figure 6 As shown in , the driving device 230 is fixedly connected to the inner bottom surface of the back shell 110c of the electronic device 100. Here, the shell of the electronic device 100 that faces away from the user when the electronic device 100 is in use is defined as the back shell 110c of the electronic device 100, and the back shell 110c is part of the second main body 110b. In addition, one end of the side panel 211 of the cooling fan 200 can also be fixedly connected to the inner bottom surface of the back shell 110c of the electronic device 100 by a series of conventional connection methods such as bonding, snap-fitting, fastener connection or welding. Of course, in some embodiments of the present application, the other end of the side panel 211 of the cooling fan 200 can also be fixedly connected to other supporting members by a series of conventional connection methods such as bonding, snap-fitting, fastener connection or welding.

[0083] At this time, the side of the cooling fan 200 that is away from the back shell 110c is open (i.e. Figure 6 The top of the cooling fan 200 shown in the figure) can be the air inlet of the cooling fan 200. When the electronic device 100 is running, air enters from the air inlet window 160 of the electronic device 100, carrying the heat emitted by the motherboard 150, and then enters the cooling fan 200 from the top of the cooling fan 200. The cooling fan 200 accelerates the hot air and blows it out from the air outlet 2111 of the side panel 211 of the cooling fan 200, and is discharged to the outside of the electronic device 100 through the air outlet window 170 of the electronic device 100. It should be noted that Figure 6 Although the air outlet of the heat dissipation fan 200 is not shown, it does not prevent those skilled in the art from understanding and implementing the technical solution of the present application.

[0084] It is easy to understand that in the related art, in order to prevent the blades 12a from interfering with the top plate 11a and the bottom plate 11b when the impeller 12 is working, it is necessary to leave gaps between the blades 12a and the top plate 11a, and between the blades 12a and the bottom plate 11b. However, the heat dissipation fan 200 provided in the embodiment of the present application is equivalent to eliminating the top plate 11a and the bottom plate 11b, compared to the heat dissipation fan 10 in the related art, so that the height of the blades 221 of the impeller 220 can be designed to be higher, thereby improving the heat dissipation performance of the heat dissipation fan 200. Alternatively, while keeping the height of the blades 221 of the impeller 220 unchanged (which can also be understood as the case where the heat dissipation performance of the heat dissipation fan 200 remains unchanged), the height of the side panels 211 can be lowered, thereby reducing the overall height of the heat dissipation fan 200, which is conducive to the lightweight and thinning of the electronic device 100. In addition, compared with the heat dissipation fan 10 in the related art, the heat dissipation fan 200 provided in the embodiment of the present application eliminates the top plate 11a and the bottom plate 11b, thereby reducing the manufacturing cost of the heat dissipation fan 200 and contributing to the lightweighting of the electronic device 100.

[0085] Of course, this application does not stop there. Figure 7 A cross-sectional view of a cooling fan 200 according to an embodiment of the present application Figure 2 , Figure 8 Schematic diagram of a cooling fan 200 provided in an embodiment of the present application being applied to an electronic device 100 Figure 2 ,refer to Figure 7 and Figure 8 As shown, to prevent various components of the electronic device 100 from coming into contact with the impeller 220 of the cooling fan 200 when the electronic device 100 is squeezed, thereby hindering the normal rotation of the impeller 220, in some embodiments of the present application, the housing 210 may also include a top plate 212, which is disposed at the top of the accommodating cavity 240 and connected to the side panels 211. The top plate 212 protects the impeller 220, preventing external components of the cooling fan 200 from coming into contact with the impeller 220, thereby ensuring the reliability of the cooling fan 200.

[0086] An air inlet 2121 can be opened on the top plate 212. The air entering the electronic device 100 from the air inlet window 160 of the electronic device 100 can enter the interior of the cooling fan 200 from the air inlet 2121 of the cooling fan 200 after carrying the heat emitted by the motherboard 150. After being accelerated by the impeller 220, the air is discharged from the air outlet 2111 of the cooling fan 200.

[0087] Based on this, the top plate 212, the side panels 211, and the back shell 110c of the electronic device 100 (which may be other components such as a middle frame or structural members in other embodiments) together enclose a housing 240 that accommodates the impeller 220 and the drive device 230. It can be understood that the cooling fan 200 provided in the embodiment of the present application, after being assembled with the electronic device 100, has the same structural features as the cooling fan 10 in the related art, except that the back shell 110c of the electronic device 100 replaces the bottom plate 11b of the cooling fan 10 in the related art. It can be understood that compared to the cooling fan 10 in the related art, the cooling fan 200 provided in the embodiment of the present application eliminates the bottom plate 11b, allowing the height of the impeller 220 blades 221 to be designed higher, thereby improving the heat dissipation performance of the cooling fan 200. Alternatively, while maintaining the height of the impeller 220 blades 221 unchanged, the height of the side panels 211 can be reduced, thereby reducing the overall height of the cooling fan 200, which is conducive to the lightweight and thinning of the electronic device 100.

[0088] Figure 9 A cross-sectional view of a cooling fan 200 according to an embodiment of the present application Figure 3 , Figure 10 Schematic diagram of a cooling fan 200 provided in an embodiment of the present application being applied to an electronic device 100 Figure 3 ,refer to Figure 9 and Figure 10 As shown, in some embodiments of the present application, the housing 210 of the cooling fan 200 may further include a base plate 213, the base plate 213 being arranged at the bottom of the accommodating chamber 240, the base plate 213 may include a first base plate 213a, and the driving device 230 is assembled on the first base plate 213a. The driving device 230 is connected to the back shell 110c (support member) of the electronic device 100 through the first base plate 213a. Among them, the projected area of ​​the driving device 230 on the first base plate 213a along the first direction is greater than or equal to the area of ​​the first base plate 213a, and the first direction is perpendicular to the first base plate 213a. In the example of the present application, the projected area of ​​the driving device 230 on the first base plate 213a along the first direction is equal to the area of ​​the first base plate 213a as an example for explanation. It can be understood that in the cooling fan 200, only the base plate 213 is provided directly below the drive motor, and no base plate is provided directly below the blades 221 of the impeller 220. When the cooling fan 200 is mounted on the electronic device 100, the side of the first bottom plate 213a facing away from the driving device 230 is connected to the back cover 110c of the electronic device 100. The first bottom plate 213a can provide support for the driving device 230, which is beneficial to the reliability of the cooling fan 200.

[0089] At this point, it can be considered that the top plate 212, the side panels 211, the first bottom plate 213a and the back shell 110c of the electronic device 100 (in other embodiments, it can be other components such as the middle frame, structural parts, etc.) together enclose a housing chamber 240 for accommodating the impeller 220 and the drive device 230. It can be understood that compared to the heat dissipation fan 10 in the related art, under the same structural features, the heat dissipation fan 200 provided in the embodiment of the present application, due to the cancellation of the bottom plate directly below the blades 221 of the impeller 220, the height of the blades 221 of the impeller 220 can be designed to be higher, thereby improving the heat dissipation performance of the heat dissipation fan 200. Alternatively, while keeping the height of the blades 221 of the impeller 220 unchanged, the height of the side panels 211 can be lowered, thereby reducing the overall height of the heat dissipation fan 200, which is conducive to the lightweight and thinning of the electronic device 100.

[0090] It should be mentioned that the embodiment of the present application does not limit the thickness of the first base plate 213a, and can be set according to actual working conditions. For example, when the first base plate 213a is connected to the back shell 110c of the electronic device 100 by riveting or welding, due to the limitations of the riveting or welding process, the first base plate 213a can be made appropriately thicker. It can be understood that this does not affect the purpose of designing the height of the fan blades 221 of the impeller 220 to be higher or the cooling fan 200 to be set to be lighter and thinner.

[0091] Figure 11 A cross-sectional view of a cooling fan 200 according to an embodiment of the present application Figure 4 , Figure 12 Schematic diagram of a cooling fan 200 provided in an embodiment of the present application being applied to an electronic device 100 Figure 4 ,refer to Figure 11 and Figure 12 As shown, in some embodiments of the present application, the base plate 213 of the cooling fan 200 may further include a second base plate 213b connected to the first base plate 213a. The second base plate 213b is further connected to the side panels 211. The inner edge of the second base plate 213b is connected to the first base plate 213a, and the outer edge of the second base plate 213b is connected to the side panels 211. The side panels 211, the second base plate 213b, and the first base plate 213a enclose a receiving chamber 240. The impeller 220 and the driving device 230 are both disposed in the receiving chamber 240. The driving device 230 is disposed on the first base plate 213a. The surface of the first base plate 213a facing the receiving chamber 240 protrudes from the surface of the second base plate 213b. In addition, the thickness of the second base plate 213b is less than that of the first base plate 213a.

[0092] At this point, the top plate 212, the side panels 211, the second bottom plate 213b, and the first bottom plate 213a can be considered to form a box-shaped structure, with the impeller 220 and the drive device 230 assembled within the box-shaped structure. Thus, the cooling fan 200 becomes a whole, which is beneficial to the structural reliability of the cooling fan 200. When assembling the cooling fan 200, the bottom plate 213 is mounted on a support member (the outer shell of the electronic device 100, the middle frame of the electronic device 100, the components in the electronic device 100, or the connectors or structural members in the electronic device 100). For example, the bottom plate 213 is mounted on the inner bottom surface of the back shell 110c of the electronic device 100.

[0093] The first base plate 213a and the second base plate 213b can be integrally formed. Here, "integrally formed" means that the two components are processed into an inseparable whole. For example, the first base plate 213a and the second base plate 213b can be integrally formed by mold processing. Alternatively, based on the heat dissipation fan 10 in the related art, the base plate 11b corresponding to the blades 12a of the impeller 12 can be thinned by numerical control machining (CNC) technology to form the second base plate 213b.

[0094] It is understood that, compared to the heat dissipation fan 10 of the related art, under the same structural features, the heat dissipation fan 200 provided in the embodiment of the present application has the following advantages: because the thickness of the second base plate 213b directly below the blades 221 of the impeller 220 is less than the thickness of the first base plate 213a, and the surface of the first base plate 213a facing the accommodating cavity 240 protrudes beyond the surface of the second base plate 213b facing the accommodating cavity, it can be understood that the base plate 213 corresponding to the drive device 230 and the base plate 213 corresponding to the blades 221 of the impeller 220 are designed to have different thicknesses, the height of the blades 221 of the impeller 220 can be designed to be higher, thereby improving the heat dissipation performance of the heat dissipation fan 200. Alternatively, while maintaining the height of the blades 221 of the impeller 220 unchanged, the height of the side panels 211 can be reduced, thereby reducing the overall height of the heat dissipation fan 200, which is conducive to the lightweight and thinning of the electronic device 100.

[0095] Of course, in some embodiments of the present application, the first base plate 213a and the second base plate 213b can be separate parts, and the first base plate 213a can be connected to the second base plate 213b through a series of conventional connection methods such as bonding, clamping, fastener connection or welding.

[0096] Figure 13 This is a schematic diagram of the connection between the first base plate 213a and the second base plate 213b provided in an embodiment of the present application, with reference to Figure 13As shown, in some embodiments of the present application, regarding the connection method between the first bottom plate 213a and the second bottom plate 213b, a flange 213c can be provided on the outer circumference of the first bottom plate 213a, and the flange 213c and the outer circumference of the first bottom plate 213a form a step 213d. The step 213d is located on the side of the flange 213c facing away from the drive device 230. The second bottom plate 213b is connected to the step 213d, for example, by gluing the second bottom plate 213b to the step 213d. This can fix the first bottom plate 213a and the second bottom plate 213b, and also improve the reliability of the connection between the first bottom plate 213a and the second bottom plate 213b.

[0097] In order to more intuitively reflect the effect that can be achieved by the heat dissipation fan 200 provided in the embodiment of the present application, the following table is provided for reference. The following table shows a size comparison diagram of the heat dissipation fan 200 provided in the embodiment of the present application and the heat dissipation fan 10 in the related art under a certain working condition.

[0098] Table 1: Dimensional comparison of the cooling fan provided by the embodiment of the present application and the cooling fan in the related art

[0099]

[0100] As can be seen from the table above, under certain operating conditions, the second base plate 213b of the cooling fan 200 provided in the embodiment of the present application can be reduced from 0.4mm to 0mm-0.4mm compared to the base plate 11b in the related art. As a result, the thickness of the fan blades 221 can be increased from 1.5mm to 1.5mm-1.9mm, and the cooling performance of the cooling fan can be increased by up to 1.9 / 1.5≈1.26 times. Alternatively, while ensuring that the height of the fan blades 221 remains unchanged, the overall height of the cooling fan 200 provided in the embodiment of the present application can be reduced by 0mm-0.4mm, which is conducive to the lightweight and thinning of the electronic device 100.

[0101] This application does not stop there. Figure 14 A schematic diagram of the structure of the heat dissipation assembly 300 provided in one embodiment of the present application Figure 1 The present embodiment further provides a heat dissipation assembly 300, which can be configured in the electronic device 100. The heat dissipation assembly 300 includes a heat dissipation device 310 (the support member described above) and the heat dissipation fan 200 described above. The drive device 230 of the heat dissipation fan 200 is connected to the heat dissipation device 310. The heat dissipation fan 200 in the heat dissipation assembly 300 has the same technical features, technical effects achievable by the technical features, and technical problems solved by the technical effects as the heat dissipation fan 200 provided in the above embodiment, and will not be described in detail here.

[0102] The heat dissipation device 310 may be a heat pipe, a graphite heat dissipation plate, a copper heat dissipation plate, a heat spreader 310a or a heat dissipation coefficient greater than or equal to 10W / (m 2 In the embodiment of the present application, the heat dissipation device 310 is described as a heat spreader 310a.

[0103] Vapor chamber 310a is a hollow cavity with a microstructure inside, typically made of metal. When heat is transferred from the heat source to the evaporation zone of vapor chamber 310a, the coolant in the cavity, heated in the low vacuum environment, begins to vaporize. This vapor absorbs heat energy and rapidly expands, quickly filling the entire cavity. When the vapor comes into contact with a cooler area, it condenses, releasing the heat accumulated during evaporation. The condensed coolant then flows back to the evaporation heat source through the microstructured capillaries, repeating this process within the cavity.

[0104] Figure 15 This is a top view of a heat dissipation assembly 300 provided in one embodiment of the present application, see Figure 15 As shown, when the cooling fan 200 provided in the embodiment of the present application is assembled on the heat spreader 310a to form the heat dissipation assembly 300, since the area between the side panel 211 and the driving device 230 is not provided with a base plate or the thickness of the base plate 11b is reduced on the basis of the cooling fan 10 in the related technology, the heat in the cooling fan 200 is more easily transferred to the heat spreader 310a, thereby improving the heat dissipation efficiency of the heat spreader 310a for the cooling fan 200, and further improving the heat dissipation efficiency of the electronic device 100.

[0105] In addition, a guide air duct may be provided on the heat spreader 310a, through which the airflow blown out by the cooling fan 200 may be directed toward the air outlet window 170 of the electronic device 100, thereby reducing airflow resistance and improving the heat dissipation efficiency of the cooling fan 200. Of course, a guide air duct may also be provided on other supporting members used to support the cooling fan 200 (e.g., the housing of the electronic device 100, the middle frame of the electronic device 100, or connectors or structural members in the electronic device 100). The embodiments of the present application do not limit the specific form and specific arrangement of the guide air duct, as long as it can guide the airflow blown out by the cooling fan 200 toward the air outlet window 170 of the electronic device 100.

[0106] It should be mentioned that, in order to improve the assembly stability of the driving device 230 on the heat plate 310a, the area of ​​the driving device 230 corresponding to the heat plate 310a is not provided with a gas-liquid channel and a capillary column for the circulation of the cooling medium ( Figure 15 (shown by the dotted circle in the middle).

[0107] Figure 16A schematic diagram of the structure of the heat dissipation assembly 300 provided in one embodiment of the present application Figure 2 ,refer to Figure 16 As shown, when the cooling fan 200 has a first base plate 213a, the first base plate 213a carrying the driving device 230 can be directly connected to the heat spreader 310a through a series of conventional methods such as bonding, clamping, fastener connection or welding. Figure 17 As shown in Figure 17 A schematic diagram of the structure of the heat dissipation assembly 300 provided in one embodiment of the present application Figure 3 , a countersunk hole 311 can also be provided on the heat spreader 310a, and the first base plate 213a can be set in the countersunk hole 311. Of course, countersunk holes can also be provided on other supporting members used to support the cooling fan 200 (such as the housing of the electronic device 100, the middle frame of the electronic device 100, the connectors and structural members in the electronic device 100), and the first base plate 213a can be set in the countersunk hole. It is easy to understand that in this way, on the one hand, the installation stability of the driving device 230 on the heat spreader 310a can be enhanced, and on the other hand, the overall height of the cooling fan 200 can be reduced, which is conducive to the lightweight and thinning of the electronic device 100.

[0108] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0109] In the description of the embodiments of the present application, the term "at least one" refers to one or more, and "plurality" refers to two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, and c can represent a, b, c, a and b, a and c, b and c, a and .00b and c, where a, b, and c can be single or multiple.

[0110] In the description of the embodiments of the present application, "parallel", "perpendicular", "equal", and "coplanar" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within ±10° or ±5°. "Perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can be, for example, a deviation within ±10° or ±5°; "equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one. For example, an angle of 180° between two components includes both absolute 180° and approximate 180°, wherein the acceptable deviation range of approximate 180° may be, for example, a deviation within ±10° or ±5°; for example, an angle of 0° between two components includes both absolute 0° and approximate 0°, wherein the acceptable deviation range of approximate 0° may be, for example, a deviation within ±10° or ±5°. For example, an angle of 90° between two components includes both absolute 90° and approximate 90°, wherein the acceptable deviation range of approximate 90° may be, for example, a deviation within ±10° or ±5°.

[0111] In the embodiments of the present application, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a" does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0112] The directional terms mentioned in the embodiments of this application, such as "inside" and "outside", are only used to refer to the directions of the drawings. Therefore, the directional terms used are for better and clearer description and understanding of the embodiments of this application, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, specific directional structure and operation, and therefore should not be understood as limiting the embodiments of this application. In addition, unless otherwise specified in this application, "multiple" in this application means two or more.

[0113] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0114] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0115] The terms "first", "second", "third", "fourth", etc. (if any) in the claims, description and drawings of the embodiments of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0116] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: Support parts and cooling fans; The heat dissipation fan comprises: a housing, an impeller and a driving device, wherein the impeller is connected to the driving device, and the driving device is used to drive the impeller to rotate; The housing and the support member are combined to form an accommodating cavity. The impeller and the driving device are both arranged in the accommodating cavity. The driving device is connected to the support member.

2. The electronic device according to claim 1, wherein The housing of the heat dissipation fan includes a side panel, at least one end of the side panel is connected to the support member, and the side panel and the support member enclose to form the accommodating cavity.

3. The electronic device according to claim 2, wherein: The housing of the cooling fan further comprises a first bottom plate, the driving device of the cooling fan is arranged on the first bottom plate, and the driving device of the cooling fan is connected to the supporting member through the first bottom plate; A projection area of ​​the driving device of the heat dissipation fan on the first base plate along a first direction is greater than or equal to an area of ​​the first base plate, wherein the first direction is perpendicular to the first base plate.

4. The electronic device according to claim 2 or 3, characterized in that: The housing of the heat dissipation fan further includes a top plate, which is arranged on the top of the accommodating cavity and is connected to the side panels.

5. The electronic device according to claim 4, characterized in that An air inlet is provided on the top plate.

6. The electronic device according to claim 3, wherein: The support member is provided with a countersunk hole, and the first bottom plate is arranged in the countersunk hole.

7. The electronic device according to any one of claims 1 to 3, characterized in that: The support member is provided with a guide air duct, and the guide air duct is used to guide the air flow blown out by the heat dissipation fan to the air outlet window of the electronic device.

8. The electronic device according to any one of claims 1 to 3, characterized in that: The supporting member is the main body of the electronic device or a heat dissipation device located inside the main body.

9. The electronic device according to claim 8, wherein: The heat dissipation device is a heat plate, a heat pipe, a graphite heat sink, a copper heat sink or a heat dissipation coefficient greater than or equal to 10W / (m 2 ·℃) heat source.

10. The electronic device according to any one of claims 1 to 3, characterized in that: The heat dissipation fan is used to dissipate heat from a heat source in the electronic device.

11. A cooling fan, characterized in that: include: Casing, impeller and drive unit; The impeller is connected to the driving device, and the driving device is used to drive the impeller to rotate; The housing includes: a side panel, a first bottom plate, and a second bottom plate, wherein the inner edge of the second bottom plate is connected to the first bottom plate, and the outer edge of the second bottom plate is connected to the side panel. The side panel, the second bottom plate, and the first bottom plate together form an accommodating cavity, and the impeller and the driving device are both disposed in the accommodating cavity. The driving device is disposed on the first bottom plate, and a projection area of ​​the driving device on the first bottom plate along a first direction is greater than or equal to an area of ​​the first bottom plate, wherein the first direction is perpendicular to the first bottom plate; The surface of the first bottom plate facing the accommodating cavity protrudes beyond the surface of the second bottom plate facing the accommodating cavity, and the thickness of the second bottom plate is smaller than that of the first bottom plate.

12. The heat dissipation fan according to claim 11, characterized in that: A flange is provided on the outer circumference of the first bottom plate. The flange and the outer circumference of the first bottom plate form a step. The step is located on the side of the flange facing away from the driving device. The second bottom plate is connected to the step.

13. The heat dissipation fan according to claim 11, characterized in that: The first bottom plate and the second bottom plate are separate components.

14. The heat dissipation fan according to claim 11, characterized in that: The first bottom plate and the second bottom plate are integrally formed.

15. The cooling fan according to any one of claims 11 to 14, characterized in that: The shell further includes a top plate, which is arranged on the top of the accommodating cavity, and the bottom plate is connected to the side panels.

16. The heat dissipation fan according to claim 15, characterized in that: An air inlet is provided on the top plate.

17. An electronic device, characterized in that: The heat dissipation fan comprises a main body and a heat dissipation fan according to any one of claims 11 to 16 arranged in the main body.

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