Chip burning clamp
By designing chip recording fixtures, the chip and the clamping limit assembly are used to achieve a stable connection between the chip and the PCB board, the chip damage and high cost in traditional burning methods are solved, and the production efficiency is improved and production costs are reduced.
Patent Information
- Application Number
- CN202422618341.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-10-29
AI Technical Summary
Traditional chip burning methods lead to damage to the PCB board pads, chip damage, low success rate of hot-stained balls, high cost, and low production efficiency.
Design a chip recording fixture, including a base and an open and closed upper cover, and use the electrical connection piece and the clamping limit assembly to achieve the electrical connection between the chip and the PCB board, and stabilize the chip through the downward assembly and the clamping limit assembly to avoid repeated welding damage.
Achieve convenient disassembly and assemble the chip, reduce damage, reduce production costs, and improve production efficiency.
Smart Images

Figure CN223284605U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip burning, in particular to a chip burning fixture. Background Art
[0002] A chip is a processor whose components are miniaturized into one or more integrated circuits. An integrated circuit can accept coded instructions at one or more terminals, execute them, and output signals describing its status. These instructions can be input, aggregated, or stored internally. Chips require a program to operate, and the process of storing the program on the chip is called chip programming.
[0003] Currently, most chip burning, that is, program writing, is completed using various types of burners. Among them, EMMC embedded multimedia controller chips are soldered to the corresponding pads on the PCB board in the form of surface mount components, and then burned through the burner. After burning is completed, the burned chip needs to be removed with a hot air gun.
[0004] This traditional programming method has the following problems: First, during the R&D or testing phase, memory chips need to be repeatedly soldered to the PCB, which can easily damage the corresponding pads on the PCB. Repeated soldering can render the PCB scrapped, and repeated soldering of the memory chip can also damage the chip, affecting the yield of the finished product. Second, after programming is complete and the chip is removed, the solder ball pins on the chip surface are lost, necessitating the re-soldering of the programmed chip by a third party. However, the current solder balling success rate is low, the fees are high, and the production cycle is long, resulting in low production efficiency and increased costs.
[0005] Therefore, it is necessary to provide a chip burning fixture to solve the above problems. Utility Model Content
[0006] In order to overcome the above shortcomings, the purpose of the present invention is to provide a chip burning fixture that can conveniently fix the chip on the PCB board, facilitate disassembly and assembly during program burning, reduce damage to the chip, and reduce the production cost of the enterprise.
[0007] In order to achieve the above objectives, the technical solution adopted by the present invention is: a chip burning fixture, comprising a base and an upper cover hinged on one side thereof and capable of opening and closing; comprising a base and an upper cover hinged on one side thereof and capable of opening and closing; a mounting groove is provided on the upper surface of the base, and a plurality of electrical connection plates are vertically arranged in the mounting groove, the top of each electrical connection plate contacts the pins on the chip, and the electrical pins at the bottom extend out of the lower surface of the base and are electrically connected to the PCB board below the base, a downward pressing component is provided on the side of the upper cover close to the base, and a clamping limit component corresponding to the position of the chip placed thereon is provided on the base.
[0008] Furthermore, the pressing assembly includes at least one guide groove 2 extending along the height direction of the upper cover and a guide rod at least partially located within the guide groove 2. The guide rod extends out of the upper surface of the upper cover at one end away from the base and is provided with a limit block. A lower pressing plate is provided at one end close to the base. The portion of the guide rod located between the guide groove 2 and the lower pressing plate is sleeved with a pressing plate spring. After the upper cover is closed, the elastic force of the pressing plate spring can push the lower pressing plate to press the chip corresponding to its position onto the contact plate, thereby ensuring that the chip can be electrically connected to the PCB board through the contact plate, while also improving the stability of the chip installation. The pressing plate spring can provide a buffering force for the pressing of the lower pressing plate, ensuring that the lower pressing plate will not damage the surface of the chip while pressing the chip.
[0009] Furthermore, the clamping and limiting assembly includes a first clamping plate and a second clamping plate, disposed on opposite sides of the mounting slot. The second clamping plate is fixedly mounted on the upper surface of the base. After the chip is placed on the base, its two sides are clamped between the first and second clamping plates, initially limiting the chip's position. This prevents the chip from shifting when the upper cover is subsequently closed and tightened, potentially affecting contact between the chip pins and the contact pad.
[0010] Furthermore, the clamping plate 1 is movable relative to the clamping plate 2, and the clamping limit assembly also includes a limiting groove recessed from the upper surface of the base and a push plate spring. A telescopic rod is vertically arranged in the limiting groove, and a guide sleeve is horizontally fixed to the lifting end of the top of the telescopic rod. One end of the push plate spring is fixedly connected to the inside of the guide sleeve, and the other end is connected to the clamping plate 1. When the chip is placed on the base, one side of the telescopic rod abuts against the side of the clamping plate 2, and the telescopic rod rises, which drives the guide sleeve and the clamping plate 1 elastically connected to the guide sleeve to move upward and out of the limiting groove. At this time, the push plate spring is no longer under the pressure of the side of the limiting groove, and is in an extended state, driving the clamping plate 1 to move toward the chip and clamping the chip between the clamping plates 1 and 2.
[0011] Furthermore, a convex guide seat is provided at the bottom of the first clamping plate, and a first guide slot is provided at the top of the limiting groove near the mounting slot, for allowing the guide seat to move toward the second clamping plate. The first guide slot cooperates with the guide seat to guide the movement of the first clamping plate toward the second clamping plate, thereby ensuring more stable movement and clamping of the first clamping plate.
[0012] Furthermore, it also includes a base plate, the base screws are connected to the base plate, and the electrical pins at the bottom end of the electrical connection plate are also set through the base plate, and a PCB board is installed on the lower surface of the base plate.
[0013] Furthermore, a snap plate is hingedly connected to the openable side of the top cover via a support pin. When the top cover is closed on the base, the snap plate's notch engages with the snap-in surface on the base. During chip programming, the top cover and base are in a snap-in state, ensuring that the chip is pressed down tightly against the contact pad to ensure electrical connection between the chip and the PCB. After chip programming is complete, the top cover can be opened by pulling the snap plate apart, allowing staff to quickly remove the programmed chip, making chip installation and removal convenient.
[0014] Furthermore, a fixing block is disposed within the mounting slot. Both the mounting slot and the fixing block are square in shape, and the interior of the mounting slot and the outer wall of the fixing block define a confined space for the connection plate to be fixedly mounted. This provides mounting space for the connection plate, allowing it to be securely mounted in the programming fixture.
[0015] Beneficial effects of the utility model:
[0016] In the present invention, the chip is directly placed on the base during programming, and the pins of the chip are electrically connected to the contact plate, so that the electrical connection between the two can be achieved without soldering the pins on the PCB board, which facilitates disassembly and assembly during program programming, effectively reduces damage to the chip, and reduces the production cost of the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is an isometric view of the overall structure of an embodiment of the present utility model;
[0018] Figure 2 This is a schematic cross-sectional view of the structure of the upper cover of one embodiment of the utility model;
[0019] Figure 3 This is a schematic cross-sectional view of the overall structure of the base according to one embodiment of the present invention;
[0020] Figure 4 This is a schematic cross-sectional view of the upper structure of the base according to an embodiment of the present invention;
[0021] In the figure: 1. Base plate; 2. Connecting column; 3. Base; 4. Upper cover; 5. Snap plate; 51. Bayonet; 6. Support pin; 7. Electrical connection plate; 8. Mounting slot; 9. Fixing block; 10. Clamping and limiting assembly; 101. Limiting slot; 102. Clamping plate 1; 103. Clamping plate 2; 104. Telescopic rod; 105. Guide sleeve; 106. Push plate spring; 107. Guide seat; 108. Guide slot 1; 11. Pressing down assembly; 111. Limiting block; 112. Guide rod; 113. Pressure plate spring; 114. Guide slot 2; 115. Pressing down plate; 12. Giving slot; 13. Chip placement slot; 14. Electrical pin. DETAILED DESCRIPTION
[0022] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.
[0023] See attached Figures 1 to 4 As shown, a chip burning fixture in this embodiment includes a base 3 and a hinged upper cover 4 that can be opened and closed. The upper surface of the base 3 is provided with a mounting groove 8. A plurality of electrical connection plates 7 are vertically arranged in the mounting groove 8. The top of each electrical connection plate 7 contacts the pins on the chip, so that the electrical connection plate 7 is electrically connected to the chip.
[0024] The electrical pins 14 at the bottom extend out of the lower surface of the base 3 and are electrically connected to the PCB board below the base 3. By providing the electrical connection plate 7, an electrical connection bridge is formed between the PCB board and the chip, so that subsequent chip burning can be achieved without soldering the pins on the chip to the PCB board, which facilitates disassembly and assembly during program burning, and can also avoid damage to the chip caused by repeated soldering, effectively reducing the company's production costs.
[0025] A pressing assembly 11 is provided on one side of the upper cover 4 near the base 3. After the upper cover 4 is closed on the base 3, the pressing assembly 11 applies pressure to the chip from above, so that it is stably pressed against the base 3 and the pins on the chip can fully contact the contact plate 7, thereby achieving a stable electrical connection between the chip and the contact plate 7.
[0026] The base 3 is provided with a clamping and limiting assembly 10 corresponding to the position of the chip placed thereon. The clamping and limiting assembly 10 can clamp the chip from both sides, making it convenient for the subsequent upper cover 4 to cover and press the chip, thereby realizing convenient installation of the chip.
[0027] The lower pressure assembly 11 includes at least one guide groove 114 extending along the height of the upper cover 4 and a guide rod 112 at least partially located within the guide groove 114. The guide rod 112 extends beyond the upper surface of the upper cover 4 at one end away from the base 3 and is provided with a stopper 111. A lower pressure plate 115 is provided at the end closer to the base 3. A pressure plate spring 113 is sleeved on the portion of the guide rod 112 between the guide groove 114 and the lower pressure plate 115. When the upper cover 4 is closed, the elastic force of the pressure plate spring 113 pushes the lower pressure plate 115 to press the corresponding chip against the contact plate 7, ensuring that the chip is electrically connected to the PCB via the contact plate 7 and improving the stability of the chip installation. The pressure plate spring 113 provides a buffering force for the pressing of the lower pressure plate 115, ensuring that the lower pressure plate 115 does not damage the chip surface while pressing the chip.
[0028] In some embodiments, there are two guide grooves 114, which are in an inverted U-shape. A guide rod 112 is provided through each guide groove, and a pressure plate spring 113 is provided on the portion of each guide rod 112 located between the guide groove 114 and the lower pressure plate 115.
[0029] When the upper cover 4 is pressed together, the lower surface of the lower pressure plate 115 contacts the upper surface of the chip, and the pressure plate spring 113 is in a compressed state. At this time, the elastic force of the pressure plate spring 113 can press the lower pressure plate 115 against the chip to achieve compression and positioning of the chip.
[0030] The guide rod 112 can provide guidance for the movement of the lower pressing plate 115 under the elastic force of the pressing plate spring 113.
[0031] The clamping and limiting assembly 10 includes a first clamping plate 102 and a second clamping plate 103, positioned on opposite sides of the mounting slot 8. The second clamping plate 103 is fixed to the upper surface of the base 3. After the chip is placed on the base 3, its two sides are clamped between the first and second clamping plates 102 and 103, initially limiting the chip's position. This prevents the chip from shifting when the upper cover 4 is subsequently closed and tightened, potentially affecting contact between the chip's pins and the contact pad 7.
[0032] In some embodiments, a chip placement groove 13 is defined on the upper surface of the base 3 , which is coaxial with the mounting groove 8 and covers the mounting groove 8 , for initial positioning of the chip to be programmed when placed on the base 3 .
[0033] The clamping plate 102 is movable relative to the clamping plate 2 103. The clamping limit assembly 10 also includes a limiting groove 101 and a push plate spring 106 which are recessed from the upper surface of the base 3. A telescopic rod 104 is vertically arranged in the limiting groove 101. A guide sleeve 105 is horizontally fixed to the lifting end of the top of the telescopic rod 104. One end of the push plate spring 106 is fixedly connected to the inside of the guide sleeve 105, and the other end is connected to the clamping plate 102. When the chip is placed on the base 3, one side of the chip abuts against the side of the clamping plate 2 103, and the telescopic rod 104 rises, which drives the guide sleeve 105 and the clamping plate 1 102 elastically connected to the guide sleeve 105 to move upward to disengage from the limiting groove 101. At this time, the push plate spring 106 is no longer under the pressure of the side of the limiting groove 101. The push plate spring 106 is in an extended state and drives the clamping plate 1 102 to move toward the chip and clamp the chip between the clamping plate 102 and the clamping plate 2 103.
[0034] The clamping and limiting mechanism is suitable for preliminary clamping and positioning of chips of different types and sizes, facilitating the subsequent closing of the upper cover 4 and the top-down pressing of the lower pressing plate 115 , and effectively improving the applicability of the burning fixture.
[0035] A convex guide seat 107 is provided at the bottom of the first clamping plate 102. A guide groove 108 is provided at the top of the limiting groove 101 near the mounting groove 8, for guiding the guide seat 107 to move toward the second clamping plate 103. The first guide groove 108 cooperates with the guide seat 107 to guide the movement of the first clamping plate 102 toward the second clamping plate 103, thereby ensuring more stable movement and clamping of the first clamping plate 102.
[0036] It also includes a bottom plate 1, the base 3 is screwed to the bottom plate 1, and the electrical pin 14 at the bottom end of the electrical connection plate 7 is also set through the bottom plate 1, and a PCB board is installed on the lower surface of the bottom plate 1.
[0037] Specifically, the pins 14 of the chip pass through the bottom plate 1 and are connected to the PCB. The bottom plate 1 is also provided with connecting posts 2 at the four corners of its lower surface for supporting it.
[0038] The openable side of the upper cover 4 is hingedly connected to a snap plate 5 via a support pin 6. When the upper cover 4 is closed on the base 3, the snap plate 51 on the snap plate 5 engages with the snap-in surface on the base 3. During chip programming, the upper cover 4 and base 3 are in a snap-in state, ensuring that the chip is pressed down and firmly against the contact plate 7, ensuring an electrical connection between the chip and the PCB. After chip programming is complete, the upper cover 4 can be opened by pulling away the snap plate 5, which also allows staff to quickly remove the programmed chip, making chip installation and removal convenient.
[0039] A fixing block 9 is disposed within the mounting groove 8. Both the mounting groove 8 and the fixing block 9 are square in shape, and the interior of the mounting groove 8 and the outer wall of the fixing block 9 form a confined space for the fixed installation of the power strip 7. This provides installation space for the power strip 7, allowing it to be securely installed in the programming fixture.
[0040] In some embodiments, a plurality of electrical connection plates 7 are arranged in a rectangular array within the above-mentioned limited space to ensure that the pins on the chip can contact the corresponding electrical connection plates 7, thereby ensuring the subsequent electrical connection between the chip and the PCB board.
[0041] In some embodiments, the lower surface of the upper cover 4 is provided with a clearance groove 12 corresponding to the position of the clamping and limiting assembly 10. This prevents interference between the upper cover 4 and the clamping and limiting assembly 10 when the upper cover 4 is closed, thereby affecting the positioning and burning of the chip.
[0042] The above implementation methods are only for illustrating the technical concept and features of the utility model. Its purpose is to enable people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.
Claims
1. A chip burning fixture, characterized by: It includes a base and an upper cover hinged to one side and openable and closable; a mounting groove is provided on the upper surface of the base, and a plurality of electrical connection plates are vertically arranged in the mounting groove. The top of each electrical connection plate contacts the pins on the chip, and the electrical pins at the bottom extend out of the lower surface of the base and are electrically connected to the PCB board below the base. A downward pressing component is provided on the side of the upper cover close to the base, and a clamping limit component corresponding to the position of the chip placed thereon is provided on the base.
2. A chip burning fixture according to claim 1, characterized in that: The downward pressure assembly includes at least one guide groove 2 opened along the height direction of the upper cover and a guide rod at least partially located in the guide groove 2. The guide rod extends out of the upper surface of the upper cover at one end away from the base and is provided with a limit block. A lower pressure plate is provided at the end close to the base. The part of the guide rod located between the guide groove 2 and the lower pressure plate is sleeved with a pressure plate spring.
3. The chip burning fixture according to claim 1, characterized in that: The clamping and limiting assembly includes a clamping plate 1 and a clamping plate 2 arranged on opposite sides of the installation groove, and the clamping plate 2 is fixedly arranged on the upper surface of the base.
4. A chip burning fixture according to claim 3, characterized in that: The clamping plate 1 is movable relative to the clamping plate 2. The clamping limit assembly also includes a limiting groove recessed from the upper surface of the base and a push plate spring. A telescopic rod is vertically arranged in the limiting groove. A guide sleeve is horizontally fixed to the lifting end of the top of the telescopic rod. One end of the push plate spring is fixedly connected to the inside of the guide sleeve, and the other end is connected to the clamping plate 1.
5. A chip burning fixture according to claim 4, characterized in that: A convex guide seat is provided at the bottom of the clamping plate 1, and a guide groove 1 is provided at the top of one side of the limiting groove close to the installation groove for the guide seat to move toward the clamping plate 2.
6. The chip programming fixture according to claim 1, characterized in that: It also includes a bottom plate, the base is screwed to the bottom plate, and the electric pins at the bottom end of the electric plate are also set through the bottom plate, and a PCB board is installed on the lower surface of the bottom plate.
7. The chip programming fixture according to claim 1, characterized in that: A snap plate is hinged to the openable side of the upper cover through a support pin. When the upper cover is closed on the base, the snap opening on the snap plate can be snapped with the snap surface on the base.
8. The chip programming fixture according to claim 1, characterized in that: A fixing block is arranged in the installation groove. Both the installation groove and the fixing block are arranged in a square shape, and a limited space is formed inside the installation groove and around the outer wall of the fixing block for fixing and installing the power strip.