Heat dissipation waistcoat of micro compressed solid state disk module

Abstract

The utility model relates to the technical field of solid state disk installation, in particular to a heat dissipation waistcoat of a miniature compressed solid state disk module, which comprises screw holes, and the screw holes are processed by a radial punching process and then are punched downwards to form funnel-shaped structures for installing flat head screws; the positioning column avoiding structure is arranged on the side face of the position corresponding to the positioning plate groove of the miniature compressed solid state disk module, a notch is formed through stamping, and the positioning column avoiding structure is used for observing the alignment condition of the positioning column and the positioning plate groove in the installation process; the heat dissipation silica gel is used for enhancing the heat conduction efficiency between the heat dissipation waistcoat and the micro compressed solid state disk module; the hemming foot is formed by bending through a secondary stamping process and is matched with the limiting hemming of the heat dissipation waistcoat; the limiting curled edge is designed to be used for cooperating with the curled edge feet to jointly limit the mounting position of the micro compressed solid state disk module in the heat dissipation vest; and the heat dissipation holes are uniformly distributed on the surface of the heat dissipation waistcoat.

Description

Technical Field

[0001] The utility model relates to the technical field of solid-state hard disk installation, in particular to a heat dissipation vest of a micro-compressed solid-state hard disk module. Background Art

[0002] In the field of module connection and assembly technology, the three most common connection methods are embedded welding, connector slots, and board-to-board pin connection. Each method has its own unique application scenarios and advantages and disadvantages.

[0003] Embedded soldering technology achieves a compact design by directly soldering the module to the device's motherboard. This technique is commonly used in storage modules such as eMMC and UFS. This approach offers the advantages of small size and light weight, effectively improving device portability and space utilization. However, once the module is secured by soldering, subsequent upgrades or replacements become extremely inconvenient, a significant drawback for users seeking high flexibility and scalability.

[0004] The connector slot method uses a spring connector to connect the module to the motherboard and is fixed with screws and other structures, such as conventional memory modules and solid-state drives with M.2 interfaces. This method makes upgrading and replacing modules simple and easy, greatly improving the user experience. However, the structure and material of the spring pin limit its performance in higher frequency applications, such as conductivity, equal length, impedance matching, and shielding protection. In addition, the connector structure itself takes up a certain amount of space, which is not conducive to the lightweight and small-size high-density design of the device. Especially for micro storage hard drive modules, their seismic stability may also be weakened due to structural limitations, making it difficult to meet the needs of next-generation technologies.

[0005] The board-to-board pin connection method, with its high-precision, tiny spring-type pins, has been widely used in high-frequency products such as CPUs. Because the pins are short and highly consistent, this method is more suitable for high-frequency applications. In the memory module field, the board-to-board pin connection method has been pioneered, leading to the development of two mainstream compression-attached memory modules: LPCAMM2 (Low Power DDR VCAMM2 module) and CAMM2 (Compression Attached Memory Module). These modules not only offer excellent performance, but also further improve space utilization through their compact design.

[0006] However, in the flash storage sector, despite the numerous advantages of board-to-board pin connections, standardized module designs and supporting peripheral accessories such as heat sinks have yet to be established. For miniature compression storage hard drive modules, achieving efficient heat dissipation within their limited size has become a pressing challenge. The current lack of ultra-thin cooling solutions for these modules limits their application in miniaturized devices such as Mini PCs, thin and light notebooks, tablets, all-in-one computers, and game consoles, particularly in applications requiring a thin and lightweight design. Utility Model Content

[0007] In order to overcome the shortcomings of the existing technology, the present application provides a heat dissipation vest for a micro-compressed solid-state hard drive module, which aims to solve the problems in the existing technology of poor heat dissipation effect, complex installation and inability to meet the requirements of lightness and thinness of micro-compressed storage hard drive modules.

[0008] The technical means adopted by the utility model to solve its technical problems are: a heat dissipation vest for a micro-compressed solid-state hard disk module, the improvement of which is that it includes: screw holes, which are processed by a radial punching process and then formed into a funnel-shaped structure by downward punching for installing flat-head screws and realizing full coverage shielding of the micro-compressed solid-state hard disk module; a positioning column avoidance structure, which is arranged on the side of the position corresponding to the positioning plate slot of the micro-compressed solid-state hard disk module, and a notch is formed by punching for observing the alignment of the positioning column and the positioning plate slot during the installation process; heat dissipation silicone, which is used to enhance the heat conduction efficiency between the heat dissipation vest and the micro-compressed solid-state hard disk module; a curling foot, which is bent and formed by a secondary stamping process and cooperates with the limiting curling of the heat dissipation vest to limit and fix the upper and lower positions of the micro-compressed solid-state hard disk module in the vertical direction; a limiting curling, which is designed to cooperate with the curling foot to jointly limit the installation position of the micro-compressed solid-state hard disk module in the heat dissipation vest; and heat dissipation holes, which are evenly distributed on the surface of the heat dissipation vest.

[0009] The shape and size of the notch in the positioning post avoidance structure in the above technical solution match the positioning post and positioning plate slot of the micro-compression solid-state hard disk module.

[0010] The heat dissipation silica gel described in the above technical solution is filled in the tiny gap between the micro-compressed solid-state hard disk module and the heat dissipation vest.

[0011] The positioning column avoidance structure in the above technical solution also includes at least one visual window, the size and position of which are designed to allow the alignment status of the positioning column and the positioning plate groove to be directly observed from the outside during the installation process, and alignment inspection can be performed without disassembling or moving the heat dissipation vest.

[0012] The material and thickness of the heat dissipating silicone described in the above technical solution are adjustable. According to the specific heat generation and heat dissipation requirements of the micro-compressed solid-state hard drive module, silicone materials with different thermal conductivity coefficients can be selected and their coating thickness can be adjusted.

[0013] The design of the curling foot and the limiting curling described in the above technical solution also includes an elastic element, which enables the curling foot to produce a certain deformation when subjected to external force, thereby adapting to micro-compressed solid-state hard drive modules of different sizes, and returning to its original shape after releasing the external force, ensuring effective fixation of the module.

[0014] The heat dissipation vest described in the above technical solution is made of lightweight and high-strength alloy.

[0015] The heat dissipation vest described in the above technical solution also includes at least one detachable heat dissipation fan installation position, which is designed with a standardized interface and fixing mechanism, allowing the user to install additional heat dissipation fans as needed.

[0016] The beneficial effects of the present invention are: in response to the application needs of the next generation of micro storage hard drives, the heat dissipation vest is not only efficient and practical, but also cost-controlled. It aims to accelerate the standardization process of board-pin connected storage hard drive modules and promote the rapid development of related technologies; through a highly stable design, it is suitable for portable application equipment that may experience vibration, such as mobile office, outdoor adventure and other scenarios. This innovation not only improves the user experience, but also promotes the further development of related products and industries. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of a heat dissipation vest for a micro-compressed solid-state hard disk module according to an embodiment of the present utility model;

[0018] Figure 2 This is a schematic diagram of a screw hole shown in an embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of a curling foot and a limiting curling shown in an embodiment of the present utility model. DETAILED DESCRIPTION

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.

[0022] In light of the above background, this utility model proposes an ultra-thin heat sink for a micro-compression storage hard drive module. This design aims to address the existing issues of poor heat dissipation, complex installation, and the inability to meet the requirements for lightweight and thin designs. The heat sink is directly mounted on the micro-compression storage hard drive module as a passive heat dissipation component, forming a tight integration with the module to achieve the goals of small size, lightweight, low cost, and efficient heat dissipation.

[0023] like Figure 1-3 As shown, the present application provides a heat dissipation vest for a micro-compression solid-state hard drive module, comprising:

[0024] Screw hole 1 is processed through a radial punching process and then punched downward to form a funnel-shaped structure for installing a flat-head screw, thereby achieving full coverage and shielding of the micro-compact solid-state drive module A. The funnel-shaped structure of screw hole 1 also has a self-aligning function. When installing a flat-head screw, the screw head can automatically center and slide into the bottom of the funnel-shaped structure, thereby simplifying the installation process and reducing the possibility of installation errors.

[0025] The positioning column avoidance structure 2 is arranged on the side of the position corresponding to the positioning plate slot of the micro-compressed solid-state hard disk module A, and a notch is formed by stamping to observe the alignment of the positioning column and the positioning plate slot during the installation process.

[0026] Optionally, the shape and size of the notch in the positioning post avoidance structure 2 match the positioning post and positioning plate slot of the micro-compression solid-state hard disk module A.

[0027] The heat dissipation silica gel is used to enhance the heat conduction efficiency between the heat dissipation vest and the micro-compressed solid-state hard disk module A; the heat dissipation silica gel is filled in the tiny gap between the micro-compressed solid-state hard disk module A and the heat dissipation vest.

[0028] Optionally, the material and thickness of the heat dissipating silica gel are adjustable. According to the specific heat generation and heat dissipation requirements of the micro-compressed solid-state hard disk module A, silica gel materials with different thermal conductivity coefficients can be selected and their coating thickness can be adjusted.

[0029] The curling foot 3 is formed by bending through a secondary stamping process and cooperates with the limiting curling edge 4 of the heat dissipation vest to limit and fix the micro-compression solid-state hard disk module A in the vertical direction;

[0030] The limiting curling edge 4 is designed to cooperate with the curling foot 3 to jointly limit the installation position of the micro-compressed solid-state hard disk module A in the heat dissipation vest;

[0031] The heat dissipation holes 5 are evenly distributed on the surface of the heat dissipation vest; the shape, size and distribution of the heat dissipation holes are designed through fluid mechanics optimization to maximize air flow efficiency and heat dissipation area, while reducing air flow resistance, ensuring the best heat dissipation performance within a limited heat dissipation space; the design of the heat dissipation holes optimizes the air flow path, and by forming air convection, effectively improves the heat dissipation performance of the heat dissipation vest and reduces the operating temperature of the micro-compressed solid-state hard drive module A.

[0032] In one possible implementation, the positioning column avoidance structure 2 also includes at least one visual window, the size and position of which are designed to allow the alignment status of the positioning column and the positioning plate groove to be directly observed from the outside during the installation process, and alignment inspection can be performed without disassembling or moving the heat dissipation vest.

[0033] In one possible implementation, the design of the curling foot 3 and the limiting curling edge 4 also includes an elastic element, which enables the curling foot 3 to produce a certain deformation when subjected to external force, thereby adapting to micro-compressed solid-state hard disk modules A of different sizes, and returning to its original shape after the external force is released, ensuring effective fixation of the module.

[0034] In one possible implementation, the heat dissipation vest is made of a lightweight high-strength alloy.

[0035] In one possible implementation, the heat dissipation vest further includes at least one detachable heat dissipation fan mounting position, which is designed with a standardized interface and fixing mechanism, allowing the user to install additional heat dissipation fans as needed.

[0036] This heat sink is designed for compact devices like tablets and thin laptops, offering lightweight yet efficient heat dissipation. Its flat top allows for easy, close contact with the device's metal casing or heat sink components, further enhancing heat dissipation. Advanced stamping technology enables high-precision, consistent production, ensuring the highest quality for each product. This process also significantly improves production efficiency and reduces costs.

[0037] The sides and tail of the heat sink are designed with heat dissipation holes. These holes can form effective air convection, thereby significantly improving heat dissipation efficiency and ensuring that the device maintains stable performance after long-term use. A unique screw punching and stamping process is used to create a three-dimensional fully shielded structure. This design not only enhances electrostatic protection and electromagnetic interference shielding capabilities, but also achieves secondary fixation of the heat sink while fixing the module with screws. This double fixing method not only improves overall stability, but also further improves thermal conductivity by compressing the contact surface between the heat sink and the module.

[0038] In terms of installation, an innovative curling limit and installation fixing method is adopted, which can be easily assembled without using screws. This design not only simplifies the installation steps, but also greatly reduces the overall size of the product, making it more suitable for the needs of miniaturized equipment.

[0039] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A heat dissipation vest for a micro-compressed solid-state hard disk module, characterized in that: include: Screw holes, which are processed by a radial punching process and then punched downward to form a funnel-shaped structure for installing flat head screws and achieving full coverage shielding of the micro-compressed solid-state drive module; A positioning post avoidance structure is provided on the side of the position corresponding to the positioning plate slot of the micro-compressed solid-state hard drive module, and a notch is formed by stamping to observe the alignment of the positioning post and the positioning plate slot during installation; Heat dissipation silicone rubber is used to enhance the heat conduction efficiency between the heat dissipation vest and the micro-compressed solid-state drive module; The curling foot is formed by bending through a secondary stamping process and cooperates with the limiting curling of the heat dissipation vest to limit and fix the upper and lower positions of the micro-compressed solid-state hard disk module in the vertical direction; The limited curling edge is designed to work in conjunction with the curling foot to jointly limit the installation position of the micro-compressed solid-state drive module in the heat sink; The heat dissipation holes are evenly distributed on the surface of the heat dissipation vest.

2. The heat dissipation vest of the micro-compression solid-state hard disk module according to claim 1, characterized in that: The shape and size of the notch in the positioning post avoidance structure match the positioning post and the positioning plate slot of the micro-compression solid-state hard disk module.

3. The heat dissipation vest of the micro-compression solid-state hard disk module according to claim 1, characterized in that: The heat dissipation silica gel is filled in the tiny gap between the micro-compressed solid-state hard disk module and the heat dissipation vest.

4. The heat dissipation vest of the micro-compression solid-state hard disk module according to claim 1, characterized in that: The positioning column avoidance structure also includes at least one visual window, the size and position of which are designed to allow the alignment status of the positioning column and the positioning plate groove to be directly observed from the outside during the installation process, and alignment inspection can be performed without disassembling or moving the heat dissipation vest.

5. The heat dissipation vest of the micro-compression solid-state hard disk module according to claim 1, characterized in that: The material and thickness of the heat dissipating silicone are adjustable. According to the specific heat generation and heat dissipation requirements of the micro-compressed solid-state hard drive module, silicone materials with different thermal conductivity coefficients can be selected and their coating thickness can be adjusted.

6. The heat dissipation vest of the micro-compression solid-state hard disk module according to claim 1, characterized in that: The design of the curling foot and the limiting curling also includes an elastic element, which enables the curling foot to produce a certain deformation when subjected to external force, thereby adapting to micro-compressed solid-state hard drive modules of different sizes, and returning to its original shape after the external force is released, ensuring effective fixation of the module.

7. The heat dissipation vest of the micro-compression solid-state hard disk module according to claim 1, characterized in that: The heat dissipation vest is made of a lightweight and high-strength alloy.

8. The heat dissipation vest of the micro-compression solid-state hard disk module according to claim 1, characterized in that: The heat dissipation vest also includes at least one detachable heat dissipation fan installation position, which is designed with a standardized interface and fixing mechanism, allowing the user to install an additional heat dissipation fan as needed.

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