Information acquisition module and battery pack

Abstract

The utility model relates to the technical field of battery systems, and discloses an information acquisition module and a battery pack, a circuit board of the information acquisition module is provided with a first wire harness bonding pad, a second wire harness bonding pad, a third wire harness bonding pad and a fourth wire harness bonding pad; the third wire harness bonding pad is electrically connected with the fourth wire harness bonding pad; the first information acquisition sheet is arranged on the circuit board, and the first wire harness bonding pad and the second wire harness bonding pad are electrically connected with the positive electrode and the negative electrode of the first information acquisition sheet respectively; the second information acquisition sheet is arranged on the circuit board; the two ends of the first fuse are electrically connected with the third wire harness bonding pad and the second information acquisition sheet respectively; the two first welding spots are sequentially arranged at intervals, and one first welding spot is electrically connected with the fourth wire harness bonding pad; one end of the second fuse is electrically connected with the second information acquisition sheet, and the other end of the second fuse is electrically connected with the other first welding spot. Advantages of a circuit board type sampling mode and a wire harness type sampling mode are integrated, and objectives of maximizing cost benefit, shortening development period and remarkably improving safety and reliability are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of battery systems, in particular to an information acquisition module and a battery pack. Background Art

[0002] Real-time monitoring of battery pack temperature and voltage is crucial for the operation of secondary battery systems. Voltage monitoring relies on direct physical circuitry connected to the battery's positive and negative terminals to measure and transmit battery voltage information. To ensure system safety, fuses are incorporated into the physical circuitry to prevent the risk of short circuits between cells within the battery pack.

[0003] Traditionally, temperature and voltage sampling methods are categorized into three main types: flexible printed circuit (FPC), printed circuit board (PCB), and wiring harness. While FPC sampling offers superior performance, its high cost and long production cycle limit its widespread adoption. While PCB sampling is a mature technology, its weak vibration resistance makes it difficult to meet the requirements of high-vibration environments, making it difficult to generalize to all application scenarios.

[0004] In contrast, wiring harness sampling has traditionally been the preferred method due to its high reliability, low cost, and flexibility without the need for mold development. However, traditional wiring harnesses cannot efficiently integrate fuses, making the wiring harness solution less secure. Utility Model Content

[0005] In view of this, the present invention provides an information acquisition module and a battery pack to solve the problem that fuses cannot be efficiently integrated into traditional wiring harnesses, resulting in low safety of the wiring harness solution.

[0006] In the first aspect, the utility model provides an information acquisition module, including a circuit board, a first information acquisition piece, a second information acquisition piece, a first fuse, two first solder joints and a second fuse; the circuit board is provided with a first wiring harness pad, a second wiring harness pad, a third wiring harness pad and a fourth wiring harness pad; the third wiring harness pad and the fourth wiring harness pad are electrically connected; the first information acquisition piece is arranged on the circuit board, and the first wiring harness pad and the second wiring harness pad are electrically connected to the positive and negative poles of the first information acquisition piece respectively; the second information acquisition piece is arranged on the circuit board; the two ends of the first fuse are electrically connected to the third wiring harness pad and the second information acquisition piece respectively; the two first solder joints are arranged in sequence, and one of the first solder joints is electrically connected to the fourth wiring harness pad; one end of the second fuse is electrically connected to the second information acquisition piece, and the other end is electrically connected to the other first solder joint.

[0007] Beneficial effects: By integrating and fixing the first information acquisition piece and the second information acquisition piece on the circuit board, and by arranging the first wiring harness soldering pad and the second wiring harness soldering pad on the circuit board and electrically connecting the positive and negative poles of the first information acquisition piece respectively, the temperature acquisition of the wiring harness on the battery pack is realized; by arranging the third wiring harness soldering pad and the fourth wiring harness soldering pad to be electrically connected to the second information acquisition piece, the voltage acquisition of the wiring harness on the battery pack is realized; by electrically connecting the third wiring harness soldering pad and the fourth wiring harness soldering pad, and arranging the first fuse, the two first welding points and the second fuse, when the first fuse blows during use, the two first welding points can be made conductive, so that the second fuse is connected to the circuit to play a repair role; the temperature and voltage sampling circuits of the traditional circuit board sampling method are introduced into the wiring harness sampling method through modular design, which concentrates the advantages of the circuit board sampling method and the wiring harness sampling method, and achieves the goals of maximizing cost-effectiveness, shortening the development cycle, and significantly improving safety and reliability.

[0008] In an optional embodiment, the circuit board includes a first side surface and a second side surface, and the first side surface and the second side surface are respectively located on both sides of the thickness direction of the circuit board; there are two first wiring harness pads, and the two first wiring harness pads are respectively arranged on the first side surface and the second side surface; there are two second wiring harness pads, and the two second wiring harness pads are respectively arranged on the first side surface and the second side surface; the third wiring harness pad is arranged on the first side surface, and the fourth wiring harness pad is arranged on the second side surface.

[0009] Beneficial effect: Since the first wiring harness pad and the second wiring harness pad are provided on both the first side and the second side, the third wiring harness pad is arranged on the first side, and the fourth wiring harness pad is arranged on the second side, during use, the first side can be selected to face upward, or the second side can be selected to face upward, which enhances the applicability of the present application.

[0010] In an optional embodiment, two first connecting pads are provided on the circuit board, and the two first connecting pads are arranged at intervals. The positive and negative poles of the first information acquisition piece are fixedly connected to the two first connecting pads respectively, the first wiring harness pad on the first side is electrically connected to one of the first connecting pads, and the second wiring harness pad on the second side is electrically connected to the other first connecting pad.

[0011] Beneficial effect: Through the setting of the first connecting pad, while achieving a stable connection between the first information acquisition piece and the circuit board, an electrical connection between the positive and negative poles of the first information acquisition piece and the circuit board is also achieved, thereby achieving an efficient and stable electrical connection between the first information acquisition piece and the circuit board, ensuring the accuracy of temperature signal and power transmission; and enhancing the stability of the circuit, reducing the loosening of components caused by vibration or impact, and improving the overall performance and reliability of the information acquisition module.

[0012] In an optional embodiment, a second connecting pad is provided on the circuit board, the second information acquisition sheet is fixedly connected to the second connecting pad, and the first fuse and the second fuse are both electrically connected to the second connecting pad.

[0013] Beneficial effect: Through the setting of the second connecting pad, a stable connection between the second information acquisition piece and the circuit board is achieved. At the same time, an electrical connection between the second information acquisition piece and the circuit board is achieved, and an efficient connection between the second information acquisition piece and the circuit board is achieved, ensuring the accuracy of voltage signal and power transmission; and enhancing the stability of the circuit, reducing the loosening of components caused by vibration or impact, and improving the overall performance and reliability of the information acquisition module.

[0014] In an optional embodiment, the second connecting pad, the first fuse and the second information acquisition piece are all arranged on the first side surface, the second fuse is arranged on the second side surface, a first via group is provided on the circuit board, and the second fuse is electrically connected to the second connecting pad through the first via group.

[0015] Beneficial effect: Through the setting of the first via group, an electrical connection is achieved between the second information acquisition piece on the first side of the circuit board and the second fuse on the second side. Compared with the traditional method of using connecting wires, the stability of the electrical connection between the second fuse and the second information acquisition piece is improved, and the risk of short circuit caused by the contact between the traditional connecting wire and the second information acquisition piece is avoided, thereby enhancing the electrical performance; and the setting of the first via group optimizes the wiring space, reduces the impedance change in the signal path, and helps to maintain signal integrity.

[0016] In an optional embodiment, the second information collection piece is provided with an avoidance hole, the first information collection piece is located in the avoidance hole, and is connected to the circuit board.

[0017] Beneficial effect: By setting an avoidance hole on the second information acquisition sheet, setting the first information acquisition sheet in the avoidance hole, and connecting it to the circuit board, interference between the first information acquisition sheet and the second information acquisition sheet is avoided, the space occupied by the second information acquisition sheet and the first information acquisition sheet on the circuit board is reduced, and the connection layout between the second information acquisition sheet, the first information acquisition sheet and the circuit board is optimized.

[0018] In an optional embodiment, the two first wiring harness pads are electrically connected, and the two second wiring harness pads are electrically connected; the first information acquisition sheet is fixed on the first side; two groups of second via groups are provided on the circuit board, and the first wiring harness pad and the second wiring harness pad on the second side are electrically connected to the first information acquisition sheet through the two groups of second via groups respectively.

[0019] Beneficial effect: Since the first information acquisition piece is arranged in the avoidance hole, the setting of the avoidance hole limits the electrical connection between the first wiring harness pad and the second wiring harness pad on the first side and the first information acquisition piece; through the setting of the two second via groups, the electrical connection between the first information acquisition piece on the first side and the first wiring harness pad and the second wiring harness pad on the second side is realized, and since the two first wiring harness pads are electrically connected and the two second wiring harness pads are electrically connected, the electrical connection between the first wiring harness pad and the second wiring harness pad on the first side and the first information acquisition piece is realized.

[0020] In an optional embodiment, a protective component is further provided on the second information acquisition piece, and the protective component is protrudingly arranged on a side of the second information acquisition piece away from the circuit board, and the protective component includes at least two baffles, and the two baffles are respectively arranged on opposite sides of the avoidance hole.

[0021] Beneficial effect: By setting up at least two baffles, a protective barrier is formed around the first information collection piece, which effectively resists damage such as bumps and scratches that may be caused to the first information collection piece by the outside world, thereby improving the stability and safety of the first information collection piece during use.

[0022] In an optional embodiment, a glue layer is further included, and the glue layer is arranged between the first information collection piece and the hole wall of the avoidance hole.

[0023] Beneficial effects: The setting of the glue layer not only greatly enhances the stability of the first information acquisition piece, effectively preventing it from shifting or falling off under long-term use or harsh environmental conditions, thereby ensuring the continuity and accuracy of temperature data acquisition; and the glue layer plays a role in isolating the air, forming a relatively closed environment, reducing the interference of outside air on the temperature acquisition process, and further improving the accuracy and stability of temperature acquisition.

[0024] In a second aspect, the present invention further provides a battery pack including the above-mentioned information acquisition module.

[0025] Because the battery pack includes an information acquisition module, it has the same effect as the information acquisition module and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in related technologies, the following briefly introduces the drawings required for use in the specific implementation methods or related technical descriptions. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is an exploded view of the information acquisition module of an embodiment of the present utility model;

[0028] Figure 2 This is a front structural diagram of the information acquisition module according to an embodiment of the present utility model;

[0029] Figure 3 This is a schematic diagram of the back structure of the information acquisition module according to an embodiment of the present utility model;

[0030] Figure 4 This is a schematic structural diagram of a first side of a circuit board according to an embodiment of the present invention;

[0031] Figure 5 This is a schematic structural diagram of the second side of the circuit board according to an embodiment of the present invention.

[0032] Description of reference numerals:

[0033] 1. Circuit board; 101. First wiring harness pad; 102. Second wiring harness pad; 103. Third wiring harness pad; 104. Fourth wiring harness pad; 105. First side; 106. Second side; 107. First connection pad; 108. Second connection pad; 109. First via group; 110. Second via group; 111. Third via group; 112. Fourth via group; 113. Fifth via group; 2. First information acquisition sheet; 3. Second information acquisition sheet; 301. Avoidance hole; 302. Protection component; 4. First fuse; 5. First solder joint; 6. Second fuse; 7. Second solder joint. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0035] The following combination Figures 1 to 5 , describing the embodiments of the present utility model.

[0036] According to an embodiment of the present utility model, on the one hand, an information acquisition module is provided, including a circuit board 1, a first information acquisition sheet 2, a second information acquisition sheet 3, a first fuse 4, two first welding points 5 and a second fuse 6; the circuit board 1 is provided with a first wiring harness pad 101, a second wiring harness pad 102, a third wiring harness pad 103 and a fourth wiring harness pad 104; the third wiring harness pad 103 and the fourth wiring harness pad 104 are electrically connected; the first information acquisition sheet 2 is arranged on the circuit board 1, and the first wiring harness pad 101 and the second wiring harness pad 102 are electrically connected to the positive and negative poles of the first information acquisition sheet 2 respectively; the second information acquisition sheet 3 is arranged on the circuit board 1; the two ends of the first fuse 4 are electrically connected to the third wiring harness pad 103 and the second information acquisition sheet 3 respectively; the two first welding points 5 are arranged in sequence at intervals, and one of the first welding points 5 is electrically connected to the fourth wiring harness pad 104; one end of the second fuse 6 is electrically connected to the second information acquisition sheet 3, and the other end is electrically connected to the other first welding point 5.

[0037] In the embodiment of the present application, the first information acquisition piece 2 is a temperature acquisition piece, and the first information acquired is temperature information; the second information acquisition piece 3 is a voltage acquisition piece, and the second information acquired is voltage information.

[0038] By integrating and fixing the first information acquisition piece 2 and the second information acquisition piece 3 on the circuit board 1, and by setting a first wiring harness soldering pad 101 and a second wiring harness soldering pad 102 on the circuit board 1 to be electrically connected to the positive and negative poles of the first information acquisition piece 2 respectively, the temperature acquisition of the wiring harness on the battery pack is realized; by setting a third wiring harness soldering pad 103 and a fourth wiring harness soldering pad 104 to be electrically connected to the second information acquisition piece 3, the voltage acquisition of the wiring harness on the battery pack is realized; by the electrical connection of the third wiring harness soldering pad 103 and the fourth wiring harness soldering pad 104, and the setting of the first fuse 4, the two first welding points 5 and the second fuse 6, when the first fuse 4 blows during use, the two first welding points 5 can be connected, so that the second fuse 6 is connected to the circuit to play a repair role; the temperature and voltage sampling circuit of the traditional circuit board type sampling method is introduced into the wiring harness type sampling method through modular design, which concentrates the advantages of the circuit board type sampling method and the wiring harness type sampling method, and achieves the goals of maximizing cost-effectiveness, shortening the development cycle, and significantly improving safety and reliability.

[0039] In a specific embodiment, after the first fuse 4 is blown during use, the two first welding points 5 can be connected to each other by manual soldering, so that the second fuse 6 is connected to the circuit.

[0040] Specifically, when the external voltage sampling harness is connected to the third harness pad 103, the first fuse 4 is connected to the circuit, and the external voltage sampling harness can be electrically connected to the second information acquisition piece 3 through the third harness pad 103 and the first fuse 4; since the third harness pad 103 and the fourth harness pad 104 are electrically connected, when the first fuse 4 blows during use, after the second fuse 6 is connected to the circuit by connecting the two first welding points 5, the external voltage sampling harness can be electrically connected to the second information acquisition piece 3 through the third harness pad 103, the fourth harness pad 104 and the second fuse 6 in sequence.

[0041] like Figure 4 As shown, the information acquisition module further includes two second soldering points 7, which are spaced apart on the circuit board 1, and one of the second soldering points 7 is electrically connected to the third wiring harness pad 103. In another embodiment of this embodiment, one end of the second fuse 6 is electrically connected to the second information acquisition piece 3, and the other end is electrically connected to the fourth wiring harness pad 104 via one of the first soldering points 5. The two ends of the first fuse 4 are respectively electrically connected to the second information acquisition piece 3 and another of the second soldering points 7. Moreover, the other second soldering point 7 is adapted to electrically connect to one of the second soldering points 7 when the second fuse 6 is disconnected, thereby enabling conduction between the two second soldering points 7 and connecting the first fuse 4 to the circuit, thus performing a repair function.

[0042] In one embodiment, the circuit board 1 includes a first side 105 and a second side 106, and the first side 105 and the second side 106 are respectively located on both sides of the thickness direction of the circuit board 1; there are two first wiring harness pads 101, and the two first wiring harness pads 101 are respectively arranged on the first side 105 and the second side 106; there are two second wiring harness pads 102, and the two second wiring harness pads 102 are respectively arranged on the first side 105 and the second side 106; the third wiring harness pad 103 is arranged on the first side 105, and the fourth wiring harness pad 104 is arranged on the second side 106.

[0043] Since the first wiring harness pad 101 and the second wiring harness pad 102 are provided on both the first side 105 and the second side 106, the third wiring harness pad 103 is provided on the first side 105, and the fourth wiring harness pad 104 is provided on the second side 106, during use, the first side 105 can be selected to face upward, or the second side 106 can be selected to face upward, which enhances the applicability of the present application.

[0044] In one implementation of this embodiment, the circuit board 1 can be selected with the first side 105 facing upward, and the positive and negative poles of the temperature sampling harness are respectively connected to the first harness pad 101 and the second harness pad 102 on the first side 105 by soldering; the voltage sampling harness is connected to the third harness pad 103 by soldering; at this time, the second fuse 6 can be connected to the circuit first. When the second fuse 6 blows during use, it helps to connect the two second welding points 7 on the first side 105 by soldering, etc., so that the first fuse 4 is connected to the circuit to play a repair role.

[0045] In another implementation of this embodiment, the circuit board 1 can be selected with the second side 106 facing upward, and the positive and negative poles of the temperature sampling harness are respectively connected to the first harness pad 101 and the second harness pad 102 on the second side 106 by soldering; the voltage sampling harness is connected to the fourth harness pad 104 by soldering; at this time, the first fuse 4 can be connected to the circuit first. When the first fuse 4 blows during use, it helps to connect the two first welding points 5 on the second side 106 by soldering, etc., so that the second fuse 6 is connected to the circuit to play a repair role.

[0046] In one embodiment, two first connecting pads 107 are provided on the circuit board 1, and the two first connecting pads 107 are arranged at intervals. The positive and negative poles of the first information acquisition sheet 2 are fixedly connected to the two first connecting pads 107 respectively, the first wiring harness pad 101 on the first side 105 is electrically connected to one of the first connecting pads 107, and the second wiring harness pad 102 on the second side 106 is electrically connected to the other first connecting pad 107.

[0047] By setting the first connecting pad 107, a stable connection is achieved between the first information acquisition piece 2 and the circuit board 1, and an electrical connection is also achieved between the positive and negative poles of the first information acquisition piece 2 and the circuit board 1, thereby achieving an efficient and stable electrical connection between the first information acquisition piece 2 and the circuit board 1, ensuring the accuracy of temperature signal and power transmission; and enhancing the stability of the circuit, reducing the loosening of components due to vibration or impact, and improving the overall performance and reliability of the information acquisition module.

[0048] In one embodiment, a second connecting pad 108 is provided on the circuit board 1 , the second information acquisition sheet 3 is fixedly connected to the second connecting pad 108 , and the first fuse 4 and the second fuse 6 are both electrically connected to the second connecting pad 108 .

[0049] By setting the second connecting pad 108, a stable connection is achieved between the second information acquisition piece 3 and the circuit board 1. At the same time, an electrical connection is achieved between the second information acquisition piece 3 and the circuit board 1, and an efficient connection is achieved between the second information acquisition piece 3 and the circuit board 1, ensuring the accuracy of voltage signal and power transmission; and enhancing the stability of the circuit, reducing the loosening of components caused by vibration or impact, and improving the overall performance and reliability of the information acquisition module.

[0050] In a specific embodiment, the tail of the second information acquisition sheet 3 and the second connection pad 108 are electrically connected by soldering.

[0051] In one embodiment, the second connecting pad 108, the first fuse 4 and the second information acquisition piece 3 are all arranged on the first side 105, the second fuse 6 is arranged on the second side 106, and a first via group 109 is provided on the circuit board 1, and the second fuse 6 is electrically connected to the second connecting pad 108 through the first via group 109.

[0052] By setting the first via group 109, an electrical connection is achieved between the second information acquisition piece 3 on the first side 105 of the circuit board 1 and the second fuse 6 on the second side 106. Compared with the traditional method of using connecting wires, the stability of the electrical connection between the second fuse 6 and the second information acquisition piece 3 is improved, and the risk of short circuit caused by contact between the traditional connecting wires and the second information acquisition piece 3 is avoided, thereby enhancing the electrical performance. In addition, the setting of the first via group 109 optimizes the wiring space, reduces the impedance change in the signal path, and helps to maintain signal integrity.

[0053] In a specific embodiment, the first via group 109 includes at least two vias that are sequentially spaced apart to increase the reliability of the via connection.

[0054] Specifically, the first via group 109 includes three or four or more vias, which can be set according to the layout and connection conditions of the circuit board 1.

[0055] In one embodiment, a avoidance hole 301 is provided on the second information acquisition sheet 3 , and the first information acquisition sheet 2 is located in the avoidance hole 301 and connected to the circuit board 1 .

[0056] By providing an avoidance hole 301 on the second information acquisition sheet 3, placing the first information acquisition sheet 2 in the avoidance hole 301 and connecting it to the circuit board 1, interference between the first information acquisition sheet 2 and the second information acquisition sheet 3 is avoided, the space occupied by the second information acquisition sheet 3 and the first information acquisition sheet 2 on the circuit board 1 is reduced, and the connection layout between the second information acquisition sheet 3, the first information acquisition sheet 2 and the circuit board 1 is optimized.

[0057] In one embodiment, the two first wiring harness pads 101 are electrically connected, and the two second wiring harness pads 102 are electrically connected; the first information acquisition sheet 2 is fixed on the first side 105; two groups of second via groups 110 are provided on the circuit board 1, and the first wiring harness pad 101 and the second wiring harness pad 102 on the second side 106 are electrically connected to the first information acquisition sheet 2 through the two groups of second via groups 110 respectively.

[0058] Since the first information acquisition sheet 2 is arranged in the avoidance hole 301, the setting of the avoidance hole 301 limits the electrical connection between the first wiring harness pad 101 and the second wiring harness pad 102 on the first side 105 and the first information acquisition sheet 2; through the setting of the two second via groups 110, the electrical connection between the first information acquisition sheet 2 on the first side 105 and the first wiring harness pad 101 and the second wiring harness pad 102 on the second side 106 is realized. Since the two first wiring harness pads 101 are electrically connected and the two second wiring harness pads 102 are electrically connected, the first wiring harness pad 101 and the second wiring harness pad 102 on the first side 105 are electrically connected to each other through the first wiring harness pad 101 and the second wiring harness pad 102 on the second side 106 and the two second via groups 110 and the first information acquisition sheet 2 in sequence. Among them, the first wiring harness pad 101 on the second side 106 and its corresponding group of second via groups 110 can be electrically connected through a wire, or the first wiring harness pad 101 can be directly welded to the second via group 110. The embodiment of the present application does not impose any restrictions on this, and the specific selection can be made according to actual conditions. Similarly, the connection method between the second wiring harness pad 102 on the second side 106 and its corresponding group of second via groups 110 is also not restricted.

[0059] In a specific embodiment, a group of second via groups 110 corresponds to the position of a first connecting pad 107, and a first connecting pad 107 and the first wiring harness pad 101 on the second side 106 are both electrically connected to a group of second via groups 110; another group of second via groups 110 corresponds to the position of another first connecting pad 107, and another first connecting pad 107 and the second wiring harness pad 102 on the second side 106 are both electrically connected to another group of second via groups 110, thereby realizing the electrical connection between the first information acquisition piece 2 on the first side 105 and the first wiring harness pad 101 and the second wiring harness pad 102 on the second side 106.

[0060] In a specific embodiment, the second via group 110 includes at least two vias that are sequentially spaced apart to increase the reliability of the via connection.

[0061] Specifically, the second via group 110 includes three or four or more vias, which can be set according to the layout and connection conditions of the circuit board 1.

[0062] In a specific embodiment, the two first wiring harness pads 101 are electrically connected through a third via group 111. Since the first wiring harness pad 101 on the second side 106 is electrically connected to the first information acquisition piece 2 through a group of second via groups 110, both first wiring harness pads 101 are electrically connected to the first information acquisition piece 2.

[0063] In a specific embodiment, the two second wiring harness pads 102 are electrically connected through the fourth via group 112. Since the second wiring harness pad 102 on the second side 106 is electrically connected to the first information acquisition piece 2 through another group of second via groups 110, both second wiring harness pads 102 are electrically connected to the first information acquisition piece 2.

[0064] In a specific embodiment, the third wiring harness pad 103 and the fourth wiring harness pad 104 are electrically connected through the fifth via group 113 .

[0065] In one embodiment, a protective component 302 is further provided on the second information acquisition piece 3. The protective component 302 is protrudingly arranged on a side of the second information acquisition piece 3 away from the circuit board 1, and the protective component 302 includes at least two baffles, which are respectively arranged on opposite sides of the avoidance hole 301.

[0066] By setting up at least two baffles, a protective barrier is formed around the first information collection piece 2, which effectively prevents damage such as bumps and scratches that may be caused to the first information collection piece 2 by the outside world, thereby improving the stability and safety of the first information collection piece 2 during use.

[0067] In one implementation of this embodiment, the protection assembly 302 includes two baffles, which are respectively arranged on opposite sides of the avoidance hole 301. In another implementation of this embodiment, the protection assembly 302 includes four baffles, which are connected end to end around the four sides of the avoidance hole 301.

[0068] In one embodiment, a glue layer is further included, and the glue layer is provided between the first information collection sheet 2 and the hole wall of the avoidance hole 301 .

[0069] The provision of the glue layer not only greatly enhances the stability of the first information acquisition sheet 2, effectively preventing it from shifting or falling off during long-term use or in harsh environmental conditions, thereby ensuring the continuity and accuracy of temperature data acquisition; the glue layer also serves to isolate the air, forming a relatively closed environment, reducing the interference of outside air on the temperature acquisition process, and further improving the accuracy and stability of temperature acquisition.

[0070] In a specific embodiment, the space between the first information collection sheet 2 and the hole wall of the avoidance hole 301 is filled with ultraviolet curing glue (UV glue) to form a glue layer.

[0071] In one embodiment, the first information acquisition chip 2 is an NTC chip.

[0072] Since the NTC chip can accurately sense and feedback temperature changes, by setting the first information acquisition piece 2 as an NTC chip, not only the sensitivity of the first information acquisition piece 2 to ambient temperature changes is significantly improved, but also the instant and accurate collection and feedback of temperature data is ensured.

[0073] In one embodiment, the second information acquisition sheet 3 is a nickel sheet.

[0074] By setting the second information acquisition sheet 3 as a nickel sheet, the electrical conductivity and thermal conductivity of the second information acquisition sheet 3 are made more excellent, which facilitates the acquisition of the voltage of the battery pack.

[0075] According to an embodiment of the present invention, on the other hand, a battery pack is provided, comprising the above-mentioned information acquisition module.

[0076] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. An information collection module, characterized in that: include: A circuit board (1) is provided with a first wiring harness pad (101), a second wiring harness pad (102), a third wiring harness pad (103) and a fourth wiring harness pad (104); the third wiring harness pad (103) and the fourth wiring harness pad (104) are electrically connected; A first information acquisition sheet (2) is provided on the circuit board (1), and the first wiring harness pad (101) and the second wiring harness pad (102) are electrically connected to the positive and negative electrodes of the first information acquisition sheet (2), respectively; A second information acquisition sheet (3) is arranged on the circuit board (1); A first fuse (4), two ends of which are electrically connected to the third wiring harness pad (103) and the second information acquisition piece (3) respectively; Two first welding points (5) are sequentially arranged at intervals, and one of the first welding points (5) is electrically connected to the fourth wiring harness pad (104); A second fuse (6) has one end electrically connected to the second information acquisition piece (3) and the other end electrically connected to another of the first welding points (5).

2. The information acquisition module according to claim 1, characterized in that: The circuit board (1) comprises a first side surface (105) and a second side surface (106), wherein the first side surface (105) and the second side surface (106) are respectively located on both sides of the thickness direction of the circuit board (1); two first wiring harness pads (101) are provided, and the two first wiring harness pads (101) are respectively arranged on the first side surface (105) and the second side surface (106); two second wiring harness pads (102) are provided, and the two second wiring harness pads (102) are respectively arranged on the first side surface (105) and the second side surface (106); the third wiring harness pad (103) is provided on the first side surface (105), and the fourth wiring harness pad (104) is provided on the second side surface (106).

3. The information acquisition module according to claim 1, characterized in that: Two first connection pads (107) are provided on the circuit board (1), the two first connection pads (107) are spaced apart, the positive and negative electrodes of the first information acquisition sheet (2) are fixedly connected to the two first connection pads (107), respectively, the first wiring harness pad (101) is electrically connected to one of the first connection pads (107), and the second wiring harness pad (102) is electrically connected to the other of the first connection pads (107).

4. The information acquisition module according to claim 2, characterized in that: A second connecting pad (108) is provided on the circuit board (1); the second information acquisition sheet (3) and the second connecting pad (108) are fixedly connected; and the first fuse (4) and the second fuse (6) are both electrically connected to the second connecting pad (108).

5. The information acquisition module according to claim 4, characterized in that: The second connecting pad (108), the first fuse (4) and the second information acquisition sheet (3) are all arranged on the first side surface (105), the second fuse (6) is arranged on the second side surface (106), a first via hole group (109) is provided on the circuit board (1), and the second fuse (6) is electrically connected to the second connecting pad (108) through the first via hole group (109).

6. The information acquisition module according to any one of claims 1 to 5, characterized in that: The second information collection piece (3) is provided with an avoidance hole (301), and the first information collection piece (2) is located in the avoidance hole (301) and is connected to the circuit board (1).

7. The information collection module according to claim 6, characterized in that: The second information acquisition sheet (3) is further provided with a protection component (302), the protection component (302) being protrudingly arranged on a side of the second information acquisition sheet (3) away from the circuit board (1), and the protection component (302) comprising at least two baffles, the two baffles being respectively arranged on opposite sides of the avoidance hole (301).

8. The information collection module according to claim 6, characterized in that: It also includes a glue layer, which is arranged between the first information collection sheet (2) and the hole wall of the avoidance hole (301).

9. The information collection module according to claim 2, characterized in that: The two first wiring harness pads (101) are electrically connected, and the two second wiring harness pads (102) are electrically connected; the first information acquisition sheet (2) is fixed on the first side surface (105); two groups of second via hole groups (110) are provided on the circuit board (1), and the first wiring harness pad (101) and the second wiring harness pad (102) on the second side surface (106) are electrically connected to the first information acquisition sheet (2) through the two groups of second via hole groups (110).

10. A battery pack, characterized in that: The invention comprises the information acquisition module according to any one of claims 1 to 9.

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