High-density multilayer interconnection circuit board

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a high-density multilayer interconnection circuit board, which comprises a circuit board. The two ends of the circuit board are provided with switching frames, the outer hook plates and the inner hook plates between the adjacent switching frames are combined, the adjacent circuit boards are layered up and down and combined into a whole, and the multilayer interconnected circuit board is formed. Side grooves are formed in the two ends of the circuit board and are in butt joint with plug grooves in the transfer frame, and the side grooves make contact with heat conduction blocks in the plug grooves, so that the contact area of the circuit board and an external mechanism is increased, and the effect of accelerating heat dissipation is achieved. According to the utility model, the multi-layer combination function of the circuit board can be realized at any time, the effect that each layer can be independently assembled and disassembled is achieved, fixed-point maintenance is facilitated, the working difficulty during production is reduced, internal heat can be promoted to be discharged outwards after combination, the effect of efficient heat dissipation is achieved, and the use safety of the circuit board is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, in particular to a high-density multi-layer interconnected circuit board. Background Art

[0002] With the continuous development of the electronic equipment industry, circuit board manufacturing technology has also been greatly improved. The use of circuit boards can make circuits more miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Especially with the rapid development of electronic equipment today, the requirements for circuit boards are getting higher and higher. If a single multi-layer circuit board cannot meet the design function requirements, it is necessary to combine multiple multi-layer circuit boards to achieve it.

[0003] Chinese patent CN220823360U discloses a multi-layer circuit board with interconnected inner layers. The device comprises a connecting block, a spring, an inclined block, and a pressing plate. The spring allows the inclined block to be clamped and fixed to the circuit board body, facilitating the fixed installation of the circuit board body and the removal of a single circuit board body. This solves the problem of difficult installation using bolts and facilitates removal of a single-layer circuit board when damaged, reducing economic losses and enhancing practicality.

[0004] During the use of the above device, it was found from its technical solution and the accompanying drawings that the mounting frame used had a fixed structure and a fixed number of circuit boards to be installed. This caused poor adaptability and caused local closure of the circuit boards, resulting in poor heat dissipation performance and was not conducive to long-term stable operation.

[0005] To solve the above problems, this application proposes a high-density multi-layer interconnection circuit board. Utility Model Content

[0006] The purpose of the utility model is to provide a high-density multi-layer interconnection circuit board, which solves the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0008] The utility model discloses a high-density multi-layer interconnected circuit board, comprising: a circuit board; adapter frames are provided at both ends of the circuit board, and adjacent circuit boards are layered and integrated into one by combining outer hook plates and inner hook plates between adjacent adapter frames to form a multi-layer interconnected circuit board; side grooves are provided at both ends of the circuit board, which are connected to the plug grooves inside the adapter frames; the side grooves increase the contact area between the circuit board and external mechanisms by contacting the heat-conducting blocks inside the plug grooves, thereby achieving the effect of accelerating heat dissipation.

[0009] Furthermore, an upper groove is provided on the upper portion of the adapter frame to connect to the lower end surface of the inner hook plate, and a lower groove is provided on the lower portion of the adapter frame to connect to the upper end surface of the outer hook plate.

[0010] Furthermore, positioning holes are provided at both ends of the circuit board, which are connected to the limiting pads inside the slot.

[0011] Furthermore, the upper and lower surfaces of the adapter frame are provided with protruding rubber pads aligned with the limit pads.

[0012] Furthermore, when the outer hook plate is combined with the inner hook plate, the top plate on one side of the inner hook plate is driven to squeeze the rubber pad to strengthen the connection between the limiting pad and the positioning hole.

[0013] Furthermore, the assembly method of the adapter frame, the outer hook plate and the inner hook plate is used to increase or decrease the number of used layers of the circuit board at any time to adapt to different work requirements.

[0014] Furthermore, the upper end surface of the outer hook plate and the lower end surface of the inner hook plate are fixed to the inside of the lower groove and the upper groove by applying glue.

[0015] The utility model has the following beneficial effects:

[0016] The utility model adopts a segmented combination mode of circuit boards and adapter frames. When in use, the outer hook plate and the inner hook plate are connected to form an upper and lower multi-layer assembly. Compared with the existing multi-layer structure, it has the effects of simple operation and adjustable number of layers. It is adaptable to various working environments and can also disassemble the circuit boards of a certain layer separately, which is convenient for fixed-point inspection and repair of faults.

[0017] The utility model provides a side groove so that the protruding portion of one end of the circuit board can be inserted into the interior of the groove to support the heat conductive block, thereby increasing the contact area and improving the heat transfer efficiency. At the same time, the outer hook plate and the inner hook plate are assembled so that the limit pad is inserted into the interior of the positioning hole to form a connection. After this arrangement, a multi-layer circuit board structure with efficient heat dissipation can be obtained, thereby improving the practical performance of the device.

[0018] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1This is a schematic diagram of the overall appearance structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the multi-layer circuit board in the assembled plane state of the utility model;

[0022] Figure 3 This is a schematic diagram of the exploded structure of the circuit board and adapter frame of the utility model;

[0023] Figure 4 This is a schematic diagram of the exploded structure of the adjacent adapter frame of the present invention;

[0024] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0025] In the figure: 1. Circuit board; 2. Adapter frame; 3. Upper groove; 4. Rubber pad; 5. Outer hook plate; 6. Inner hook plate; 7. Top plate; 8. Side groove; 9. Positioning hole; 10. Plug slot; 11. Heat conducting block; 12. Limit pad; 13. Lower groove. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0028] See also Figure 1-4 As shown, the utility model is a high-density multi-layer interconnected circuit board, comprising: a circuit board 1; adapter frames 2 are provided at both ends of the circuit board 1, and the outer hook plates 5 and inner hook plates 6 between adjacent adapter frames 2 are combined to combine adjacent circuit boards 1 in layers to form a multi-layer interconnected circuit board 1;

[0029] Both ends of the circuit board 1 are provided with side grooves 8, which are connected to the plug grooves 10 inside the adapter frame 2. The side grooves 8 increase the contact area between the circuit board 1 and the external mechanism by contacting the heat conducting block 11 inside the plug groove 10 to achieve the effect of accelerating heat dissipation;

[0030] This embodiment provides a multi-layer interconnected circuit board 1 that can conveniently add or subtract layers. By utilizing the combination of the outer hook plate 5 and the inner hook plate 6 and the assembly of the adapter frame 2, the circuit board 1 can conveniently add or subtract layers according to usage requirements, while reducing the difficulty of working during the production of the circuit board 1. The strong adaptability facilitates large-scale production operations. Secondly, when implementing multi-layer assembly, the contact range between the circuit board 1 and the external mechanism can be increased to promote the discharge of internal heat to achieve the effect of efficient heat dissipation.

[0031] Among them, an upper groove 3 is opened on the top of the adapter frame 2 to connect to the lower end surface of the inner hook plate 6, and a lower groove 13 is opened on the bottom of the adapter frame 2 to connect to the upper end surface of the outer hook plate 5, and the inner protruding structures of the outer hook plate 5 and the inner hook plate 6 connect to each other's groove parts.

[0032] Among them, positioning holes 9 are also opened at both ends of the circuit board 1, which are connected to the limiting pads 12 inside the plug slots 10, and the positioning is formed by the guide slope structure of the outer circle of the limiting pads 12 to prevent dislocation and facilitate assembly and disassembly.

[0033] The upper and lower surfaces of the adapter frame 2 are both provided with protruding rubber pads 4 aligned with the limiting pads 12 .

[0034] When the outer hook plate 5 is combined with the inner hook plate 6 , the top plate 7 on one side of the inner hook plate 6 is driven to squeeze the rubber pad 4 to strengthen the connection between the limit pad 12 and the positioning hole 9 to ensure the stability of the combined structure during use.

[0035] Among them, the assembly method of the adapter frame 2, the outer hook plate 5 and the inner hook plate 6 is used to increase or decrease the number of layers of the circuit board 1 at any time to adapt to different work requirements, get rid of the limitation of the number of layers during production, and reduce the difficulty of work during production.

[0036] The upper end surface of the outer hook plate 5 and the lower end surface of the inner hook plate 6 are fixed to the interior of the lower groove 13 and the upper groove 3 by applying glue.

[0037] It can be understood that the present invention can realize the function of adding and subtracting multiple layers of the circuit board 1 at any time, so that each layer can be assembled and disassembled separately, which is convenient for fixed-point maintenance and reduces the difficulty of work during production. Secondly, it can also promote the discharge of internal heat to the outside after assembly, achieve the effect of efficient heat dissipation to ensure the safe use of the circuit board 1.

[0038] A specific application of the operation process of this embodiment is as follows: when in use, the end of the circuit board 1 with the side groove 8 is first inserted into the inside of the plug groove 10 to form a docking, and the limiting pad 12 located on the inside of the plug groove 10 is docked with the positioning holes 9 at both ends of the circuit board 1 to form a fixation, thereby increasing the contact area between the circuit board 1 and the external mechanism, so as to quickly transfer the internal heat to the outside during operation; further, when it is necessary to combine multiple layers of circuit boards 1, the sides of the outer hook plate 5 and the inner hook plate 6 coated with glue are respectively inserted into the lower groove 13 and the upper groove 3, and then the outer hook plate 5 and the inner hook plate 6 are docked with each other to obtain the upper and lower layered circuit boards 1. Secondly, as the outer hook plate 5 and the inner hook plate 6 are docked, the rubber pad 4 will be squeezed through the top plate 7 to make the docking of the limiting pad 12 and the positioning hole 9 more stable, thereby achieving the effect of strengthening the connection. After this arrangement, not only can the effect of multi-layer combination be achieved, but it can also be added or subtracted at any time to adapt to different working environments, thereby improving the use effect of the device.

[0039] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0040] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A high-density multi-layer interconnection circuit board, characterized in that: include: Circuit board (1); Adapter frames (2) are provided at both ends of the circuit board (1), and adjacent circuit boards (1) are combined by combining outer hook plates (5) and inner hook plates (6) between adjacent adapter frames (2) to form a multi-layer interconnected circuit board (1) by combining the adjacent circuit boards (1) in layers. Both ends of the circuit board (1) are provided with side grooves (8) that are connected to the plug groove (10) inside the adapter frame (2). The side grooves (8) increase the contact area between the circuit board (1) and the external mechanism by contacting the heat conduction block (11) inside the plug groove (10) to achieve the effect of accelerating heat dissipation.

2. A high-density multi-layer interconnection circuit board according to claim 1, characterized in that: An upper groove (3) is provided on the upper side of the adapter frame (2) and is connected to the lower end surface of the inner hook plate (6); a lower groove (13) is provided on the lower side of the adapter frame (2) and is connected to the upper end surface of the outer hook plate (5).

3. The high-density multi-layer interconnection circuit board according to claim 1, characterized in that: Positioning holes (9) are also provided at both ends of the circuit board (1) and dock with the limiting pads (12) inside the plug slot (10).

4. The high-density multi-layer interconnection circuit board according to claim 1, characterized in that: The upper and lower surfaces of the adapter frame (2) are both provided with protruding rubber pads (4) aligned with the limiting pads (12).

5. The high-density multi-layer interconnection circuit board according to claim 1, characterized in that: When the outer hook plate (5) is combined with the inner hook plate (6), the top plate (7) on one side of the inner hook plate (6) is driven to squeeze the rubber pad (4) to reinforce the connection between the limiting pad (12) and the positioning hole (9).

6. The high-density multi-layer interconnection circuit board according to claim 1, characterized in that: The assembly method of the adapter frame (2), the outer hook plate (5) and the inner hook plate (6) is used to increase or decrease the number of layers of the circuit board (1) at any time to adapt to different work requirements.

7. The high-density multi-layer interconnection circuit board according to claim 1, characterized in that: The upper end surface of the outer hook plate (5) and the lower end surface of the inner hook plate (6) are fixed to the interior of the lower groove (13) and the upper groove (3) by applying glue.

Images