Spraying device of large-size silicon wafer degumming machine

Abstract

The utility model discloses a spraying device of a large-size silicon wafer degumming machine, which relates to the technical field of large-size silicon wafer degumming, and comprises a spraying tank, and supporting legs are arranged at the bottom of the spraying tank; the left side of the bottom of the spraying groove communicates with a water drainage pipe. Fixing pipes are arranged on the inner walls of the front side and the rear side of the spraying groove correspondingly, and spraying heads are evenly arranged on the opposite sides of the fixing pipes on the two sides. A connecting pipe communicated with the fixed pipe is arranged on the spraying groove; an electric telescopic rod drives a connecting rod to move downwards, so that a supporting rod can drive a silicon wafer positioned by an inserting groove to enter a spraying groove downwards, the surface of the silicon wafer is comprehensively sprayed and washed from bottom to top, and the problem that the large-size silicon wafer is inconvenient to be comprehensively sprayed and washed due to the fact that the spraying range of a spraying head is limited is solved; and the silicon wafer placing frame is positioned above the spraying groove, so that workers are inconvenient to clean impurities accumulated on the surface of the silicon wafer in the spraying groove.

Description

Technical Field

[0001] The utility model relates to the technical field of large-size silicon wafer degumming, in particular to a spray device for a large-size silicon wafer degumming machine. Background Art

[0002] Silicon wafers need to be sprayed and cleaned during degumming. The current spray head on the spray device has a limited spray range, which makes it inconvenient to fully spray clean large-size silicon wafers. In addition, the silicon wafer placement rack is above the spray tank, which makes it inconvenient for workers to clean the impurities accumulated on the surface of the silicon wafers in the spray tank. Therefore, we propose a spray device for large-size silicon wafer degumming machine. Utility Model Content

[0003] The purpose of the utility model is to provide a spray device for a large-size silicon wafer degumming machine to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned object, the present invention provides the following technical solutions: A spray device for a large-size silicon wafer degumming machine, comprising a spray trough, wherein the bottom of the spray trough is provided with supporting legs;

[0005] The left side of the bottom of the spray tank is connected to a drain pipe;

[0006] The front and rear inner walls of the spray tank are both provided with fixed pipes, and the opposite sides of the fixed pipes on both sides are evenly provided with spray heads;

[0007] The spray tank is provided with a connecting pipe connected to the fixed pipe;

[0008] Electric guide rails are provided on both sides of the top of the spray trough, and an electric telescopic rod is provided on the output end of the electric guide rail. A connecting rod is provided on the output end of the electric telescopic rod. The opposite sides of the connecting rods on both sides are connected to the support rods, and slots are evenly provided on the support rods.

[0009] As a preferred solution of the spray device of the large-size silicon wafer degumming machine described in the utility model, a controller is provided on the front side of the spray tank.

[0010] As an optimal solution of the spray device of a large-size silicon wafer degumming machine described in the utility model, wherein: a push plate is fittedly connected to the bottom of the inner wall of the spray tank, and the front and rear sides of the push plate are in contact with the inner wall of the spray tank.

[0011] As a preferred solution of the spray device of the large-size silicon wafer degumming machine described in the utility model, a handle extending to the top of the spray tank is provided on the top of the push plate.

[0012] As a preferred solution of the spray device of the large-size silicon wafer degumming machine described in the utility model, wherein: a convex block is provided on the spray trough, and a rod inserted into the top of the push plate vertically penetrates the convex block.

[0013] As a preferred solution of the spray device of the large-size silicon wafer degumming machine described in the utility model, baffles are provided on both the front and rear sides of the top of the spray tank.

[0014] As a preferred solution of the spray device of the large-size silicon wafer degumming machine described in the utility model, convex plates are provided at both ends of the baffle.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. The electric telescopic rod drives the connecting rod to move downward, so that the support rod can drive the silicon wafer positioned in the slot downward into the spray tank, so as to fully spray the surface of the silicon wafer from bottom to top. This solves the problem that the spray range of the spray head is limited, making it inconvenient to fully spray large-sized silicon wafers. In addition, the silicon wafer placement rack is located above the spray tank, making it inconvenient for workers to clean impurities accumulated on the surface of the silicon wafers in the spray tank.

[0017] 2. When it is necessary to clean the impurities accumulated inside the spray tank, the electric guide rail drives the electric telescopic rod to move backward, so that the support rod is no longer directly above the inner wall of the bottom of the spray tank. Then remove the plug rod and move the push plate to the left through the handle to push the impurities to the left end, making it easier for workers to clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of a spray device for a large-size silicon wafer degumming machine according to the present invention;

[0019] Figure 2 This is an enlarged schematic diagram of the partial structure of a spray device of a large-size silicon wafer degumming machine of the present invention.

[0020] In the figure: 1. Spray trough; 2. Support legs; 3. Drain pipe; 4. Fixed pipe; 5. Sprinkler; 6. Connecting pipe; 7. Support rod; 8. Slot; 9. Connecting rod; 10. Electric telescopic rod; 11. Electric guide rail; 12. Push plate; 13. Handle; 14. Bump; 15. Insert rod; 16. Baffle; 17. Bump plate; 18. Controller. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] As mentioned in the background technology, the spray head on the existing spray device has a limited spray range, making it inconvenient to fully spray clean large-sized silicon wafers. In addition, the silicon wafer rack is located above the spray tank, making it inconvenient for workers to clean impurities accumulated on the surface of the silicon wafers in the spray tank. The present utility model provides a spray device for a large-sized silicon wafer degumming machine.

[0023] Example 1

[0024] Reference Figures 1 to 2 A spraying device for a large-size silicon wafer degumming machine includes a spraying tank 1, and a support leg 2 is provided at the bottom of the spraying tank 1;

[0025] The left side of the bottom of the spray tank 1 is connected to a drain pipe 3 for draining the cleaning water;

[0026] Fixed pipes 4 are provided on the inner walls of both front and rear sides of the spray tank 1, and nozzles 5 are evenly provided on the opposite sides of the fixed pipes 4 on both sides;

[0027] The spray tank 1 is provided with a connecting pipe 6 connected to the fixed pipe 4, so that the external water source is pressurized and sent into the fixed pipe 4 through the connecting pipe 6;

[0028] Electric guide rails 11 are provided on both sides of the top of the spray tank 1, and an electric telescopic rod 10 is provided on the output end of the electric guide rail 11. A connecting rod 9 is provided on the output end of the electric telescopic rod 10. The opposite sides of the connecting rods 9 on both sides are connected to the support rod 7. Slots 8 are evenly provided on the support rod 7. The silicon wafers are inserted into the slots 8 on both sides, and the bottom is supported by the support rod 7.

[0029] A controller 18 for controlling the electrical components is provided on the front side of the spray tank 1 .

[0030] The electric telescopic rod 10 drives the connecting rod 9 to move downward, so that the support rod 7 can drive the silicon wafer positioned in the slot 8 downward into the spray tank 1, so as to fully spray the surface of the silicon wafer from bottom to top through the nozzles 5 on both sides.

[0031] A push plate 12 is attached to the bottom of the inner wall of the spray tank 1 , and both the front and rear sides of the push plate 12 are in contact with the inner wall of the spray tank 1 .

[0032] In order to facilitate the horizontal movement of the push plate 12 , a handle 13 extending to the top of the spray tank 1 is provided on the top of the push plate 12 .

[0033] The spray tank 1 is provided with a protrusion 14, and a rod 15 is vertically penetrated through the protrusion 14 and inserted into the top of the push plate 12, so that the rod 15 can position the push plate 12 so that the push plate 12 is attached to the right inner wall of the spray tank 1 when not in use.

[0034] When it is necessary to clean the impurities accumulated inside the spray tank 1, the electric guide rail 11 drives the electric telescopic rod 10 to move backward, so that the support rod 7 is no longer directly above the bottom inner wall of the spray tank 1. Then, the insertion rod 15 is removed upward, and the push plate 12 can be moved to the left by the handle 13, so that the impurities are pushed to the left end of the inside of the spray tank 1, thereby making it easier for workers to clean.

[0035] Example 2

[0036] Reference Figures 1 to 2 Baffles 16 are provided on both the front and rear sides of the top of the spray tank 1, and convex plates 17 are provided at both ends of the baffle 16, so that the water droplets and impurities splashed during spray cleaning can be blocked by the baffles 16 and the convex plates 17, and then flow into the spray tank 1.

[0037] The rest of the structure is the same as that of Example 1.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A spray device for a large-size silicon wafer degumming machine, characterized by: include, A spray trough (1), wherein the bottom of the spray trough (1) is provided with supporting legs (2); The left side of the bottom of the spray tank (1) is connected to a drain pipe (3); Fixed pipes (4) are provided on both the front and rear inner walls of the spray tank (1), and spray heads (5) are evenly provided on the opposite sides of the fixed pipes (4). The spray tank (1) is provided with a connecting pipe (6) communicating with the fixed pipe (4); Electric guide rails (11) are provided on both sides of the top of the spray trough (1), an electric telescopic rod (10) is provided on the output end of the electric guide rail (11), a connecting rod (9) is provided on the output end of the electric telescopic rod (10), and the opposite sides of the connecting rods (9) on both sides are connected to the support rod (7), and the support rod (7) is evenly provided with slots (8).

2. The spraying device for a large-size silicon wafer degumming machine according to claim 1, characterized in that: A controller (18) is provided on the front side of the spray tank (1).

3. The spraying device for a large-size silicon wafer degumming machine according to claim 1, characterized in that: The bottom of the inner wall of the spray trough (1) is fitted with a push plate (12), and the front and rear sides of the push plate (12) are in contact with the inner wall of the spray trough (1).

4. The spraying device for a large-size silicon wafer degumming machine according to claim 3, characterized in that: The top of the push plate (12) is provided with a handle (13) extending to the top of the spray trough (1).

5. The spraying device for a large-size silicon wafer degumming machine according to claim 3, characterized in that: The spray trough (1) is provided with a protrusion (14), and the protrusion (14) is vertically penetrated by an insertion rod (15) inserted into the top of the push plate (12).

6. The spray device for a large-size silicon wafer degumming machine according to claim 1, characterized in that: Baffles (16) are provided on both the front and rear sides of the top of the spray trough (1).

7. The spraying device for a large-size silicon wafer degumming machine according to claim 6, characterized in that: Both ends of the baffle (16) are provided with convex plates (17).

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