Semiconductor part step surface polishing equipment

Abstract

The utility model belongs to semiconductor part step surface polishing equipment in the technical field of semiconductor parts. The semiconductor part (1) is provided with a step part (2), the rotating part (11) is connected with a rotating platform (3), the upper surface of the rotating platform (3) is provided with a plurality of positioning screw holes (4), the plurality of positioning screw holes (4) are arranged at intervals along a circle close to the outer ring position of the rotating platform (3), the part positioning clamp (5) is provided with a kidney-shaped hole (6), and the thickness of the part positioning clamp (5) is smaller than that of the semiconductor part (1). The semiconductor part step surface polishing equipment is simple in structure, low in cost, convenient and fast to use and capable of flexibly machining a plurality of surfaces of a step part and completing step surface polishing treatment at a time, and the polishing efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor parts, and more specifically relates to a step surface polishing device for semiconductor parts. Background Art

[0002] Semiconductor components, such as silicon wafers, require polishing for the following reasons: 1. Removing damaged layers: During semiconductor manufacturing, silicon wafers undergo processes such as cutting and grinding, which can leave microscopic damaged layers on the wafer surface, including cracks, scratches, and contaminants. This damage not only affects chip performance and reliability but can also hinder subsequent processes such as lithography, etching, and doping. Polishing effectively removes this damaged layer, ensuring high-quality silicon wafer surfaces. 2. Improving surface flatness: The performance of semiconductor devices depends significantly on the flatness and cleanliness of their surfaces. Polishing can achieve atomic-level flatness on the silicon wafer surface, which is crucial for fabricating the tiny features in modern integrated circuits. Higher flatness helps improve lithography accuracy and reduce defects, thereby increasing circuit integration and performance. 3. Optimizing lattice structure: Chemical mechanical polishing (CMP) is a commonly used polishing technique that combines chemical etching and mechanical grinding. While removing material, it optimizes the surface lattice structure through chemical reactions, reduces surface defects, and improves the electrical properties of semiconductor materials. 4. Promote good chip bonding: During the packaging process, the flatness of the chip surface directly affects the adhesion between the chip and the packaging material. The smoother surface of the polished silicon wafer helps enhance the bonding force during packaging and ensure that the chip maintains good electrical connection and heat dissipation performance even in harsh environments. 5. Meet high-precision requirements: With the development of semiconductor technology, the requirements for wafer surface quality and dimensional accuracy are becoming increasingly higher. Polishing is a necessary step to achieve these high standards. It can ensure the uniformity of wafer thickness, which is crucial for the performance consistency of chips. In summary, polishing is an indispensable part of the semiconductor manufacturing process and is directly related to the performance, reliability and manufacturing cost of semiconductor devices. However, polishing in the existing technology is mainly completed by large polishing machines. Large polishing machines can only polish flat surfaces and cannot polish step surfaces. The step surfaces of products with circular steps cannot be accurately positioned and processed. Therefore, specific products cannot be effectively polished.

[0003] The prior art includes a technology entitled "Polishing Tool" and publication numbered "CN1218813C," which relates to a polishing tool and a composition for manufacturing the tool. The present invention can be used in various industries to process micro and large items made of sapphire, crystal, ceramics, glassware, semiconductors, and other difficult-to-process materials. The tool can be processed on double-sided machining centers without pre-attaching the parts to be processed. The tool comprises a planar chuck to which are fixed a number of small spherical grinding elements, with abrasive placed between the gaps between the grinding elements. The density and particle size of the abrasive are 0.2-0.8 and 0.01-0.5, respectively, depending on the density and particle size of the grinding elements. The composition comprises an epoxy resin, a diamond-containing abrasive, a hardener, a filler, and polysiloxane. The polysiloxane is present to react with the hardener to form bubbles during tool manufacturing. The present invention can produce a polishing tool with high cutting performance and excellent processing quality.

[0004] However, this technology does not involve the technical problems and technical solutions of the present application. Utility Model Content

[0005] The technical problem to be solved by the utility model is: in view of the shortcomings of the existing technology, a semiconductor part step surface polishing device is provided, which has a simple structure, low cost, and is easy to use, can flexibly process multiple surfaces of the step portion, complete the step surface polishing process at one time, and improve the polishing efficiency.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is:

[0007] The utility model is a semiconductor part step surface polishing device. A step portion is provided on the semiconductor part. A rotating platform is connected to a rotating component. A plurality of positioning screw holes are provided on the upper surface of the rotating platform. The plurality of positioning screw holes are arranged at intervals along a circle close to the outer ring of the rotating platform. A waist hole is provided on the part positioning clamp. The thickness of the part positioning clamp is less than the thickness of the semiconductor part.

[0008] The semiconductor part step surface polishing equipment also includes a polishing component, which includes a fixed shaft 7 and a polishing disc body. The polishing sheet is adhered to the lower part of the polishing disc body, and the fixed shaft is configured to be connected to a hand drill.

[0009] Each screw is configured to be capable of passing through a waist hole of a part positioning clamp and being screwed and connected to a corresponding positioning screw hole on the rotating platform.

[0010] The distances between the plurality of positioning screw holes and the rotating platform are set to be equal.

[0011] The rotating component is a motor, and the rotating shaft of the motor is connected to the lower part of the rotating platform 3.

[0012] The rotating platform is configured as a horizontally arranged structure.

[0013] The step portion on the semiconductor component is arranged along the upper surface of the semiconductor component, and the step portion on the semiconductor component is a ring structure.

[0014] The polishing sheet adhered to the lower part of the polishing disc body is a wool polishing sheet.

[0015] When the step surface of the semiconductor part is polished, the semiconductor part is configured to fit on the upper surface of the rotating platform, and the multiple part positioning clips are configured to abut against different positions on the side of the semiconductor part.

[0016] The technical solution of this utility model is adopted, and the working principle and beneficial effects are as follows:

[0017] The semiconductor component step surface polishing apparatus disclosed herein is targeted at semiconductor components with a special structure having a stepped portion. The stepped portion is formed by both horizontal and vertical surfaces, with the vertical surface being the most difficult to polish. A rotating platform is connected to a rotating component. Driven by the rotating component, the rotating platform can rotate at a set speed and can be stopped at will, thereby rotating or stopping the semiconductor component positioned on the upper surface of the rotating platform. The upper surface of the rotating platform is provided with multiple positioning screw holes. These holes are spaced apart along a circumference of the rotating platform. The positioning holes are used to tighten screws, which are used to secure each component positioning clamp to the upper surface of the rotating platform at the corresponding positioning screw hole. The component positioning clamps are positioned outside the semiconductor component to be positioned, positioning the semiconductor component from the outside. Loosening the screws releases the component positioning clamps, facilitating the placement of the semiconductor component to be polished or the removal of the polished semiconductor component. The component positioning clamps are provided with waist holes, allowing the position of the component positioning clamps to be adjusted within a certain range. This allows the distance between the component positioning clamps and the center of the rotating platform to be adjusted within a certain range, meeting the polishing requirements of semiconductor components of varying diameters and thicknesses and improving the versatility of the apparatus. The thickness of the part positioning clamp is smaller than that of the semiconductor part, so that the part positioning clamp will not interfere with the operation of the polishing machine when polishing the upper surface in the middle of the step portion of the semiconductor part or the upper surface of the outer circle of the step portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following is a brief description of the contents and symbols in the drawings of this specification:

[0019] Figure 1 This is a schematic structural diagram of the semiconductor part step surface polishing equipment described in the present invention;

[0020] Figure 2This is a schematic structural diagram of the polishing components of the semiconductor part step surface polishing equipment according to the present invention;

[0021] Figure 3 This is a structural schematic diagram of the part positioning clamp of the semiconductor part step surface polishing equipment described in the present utility model;

[0022] The marks in the accompanying drawings are: 1. semiconductor parts; 2. step part; 3. rotating platform; 4. positioning screw hole; 5. part positioning clamp; 6. waist hole; 7. fixed shaft; 8. polishing disc; 9. polishing sheet; 10. screw; 11. rotating part; 12. polishing part. DETAILED DESCRIPTION

[0023] The following is a detailed description of the embodiments of the present invention, such as the shapes, structures, positions and connections of the various components involved, the functions and working principles of the various components, etc., by referring to the accompanying drawings.

[0024] As attached Figure 1 -Attached Figure 3As shown, the utility model is a semiconductor part step surface polishing device, wherein a step portion 2 is provided on the semiconductor part 1, a rotating platform 3 is connected to the rotating component 11, a plurality of positioning screw holes 4 are provided on the upper surface of the rotating platform 3, and the plurality of positioning screw holes 4 are arranged at intervals along a circle close to the outer ring of the rotating platform 3, a waist hole 6 is provided on the part positioning clamp 5, and the thickness of the part positioning clamp 5 is less than the thickness of the semiconductor part 1. The above structure proposes an improved technical solution to the deficiencies in the existing technology. A step portion 2 is provided on the semiconductor part 1, and the semiconductor part is a component that needs to be polished, while the utility model is aimed at a semiconductor part with a special structure provided with a step portion, and the step portion has two surfaces, a horizontal surface and a vertical surface. The rotating component 11 is connected to the rotating platform 3, and the rotating platform can rotate at a set speed under the drive of the rotating component 11, and can stop rotating conveniently, so as to drive the semiconductor part positioned on the upper surface of the rotating platform 3 to rotate or stop. The upper surface of the rotating platform 3 is provided with multiple positioning screw holes 4, which are arranged at intervals along a circle near the outer circle of the rotating platform 3. The positioning holes are used to tighten screws, which are used to secure each part positioning clamp to the upper surface of the rotating platform at the corresponding positioning screw hole position. Multiple part positioning clamps are located outside the semiconductor part to be positioned, positioning the semiconductor part 1 from the outside. Loosening the screws loosens the part positioning clamps, facilitating the placement of the semiconductor part 1 to be polished or the removal of the polished semiconductor part 1. The part positioning clamp 5 is provided with a waist hole 6, which allows the position of the part positioning clamp 5 to be adjusted within a certain range. In other words, the distance between the part positioning clamp and the center of the rotating platform can be adjusted within a certain range, meeting the polishing requirements of semiconductor parts of different diameters and thicknesses and improving the versatility of the device. The thickness of the part positioning clamp 5 is less than that of the semiconductor part 1. When polishing the upper surface of the middle of the step portion of the semiconductor part or the upper surface of the outer circle of the step portion, the part positioning clamp will not interfere with the operation of the polishing machine. The semiconductor part step surface polishing equipment described in the utility model has a simple structure, low cost, and is easy to use. It can flexibly process multiple surfaces of the step portion, complete the step surface polishing process at one time, and improve the polishing efficiency.

[0025] The semiconductor component step surface polishing apparatus further includes a polishing unit 12, which includes a fixed shaft 7 and a polishing plate 8. A polishing pad 9 is adhered to the lower portion of the polishing plate 8, and the fixed shaft 7 is configured to be connected to a hand drill. In this structure, the polishing unit is connected to the hand drill, which is then held by an operator to polish the step surface. During polishing, the operator controls the polishing pad 9 by holding the hand drill to contact the step surface of the semiconductor component. The rotating platform rotates, driving the semiconductor component in rotation. Therefore, as long as the polishing pad approaches the surface to be polished, the operator can complete the polishing process without any movement.

[0026] Each screw 10 is configured to pass through a waist hole 6 of a part positioning clamp 5 and be screwed into a corresponding positioning screw hole 4 on the rotating platform 3. In the above structure, the screw 10 is tightened to fix the corresponding part positioning clamp 5, and the screw 10 is loosened to loosen the corresponding part positioning clamp 5.

[0027] The multiple positioning screw holes 4 are arranged at equal distances from the rotating platform 3. With this structure, after multiple component positioning clips are installed, adjacent component positioning clips are arranged at an angle, allowing the semiconductor component to be positioned from different locations. This ensures that the semiconductor component 1 is securely attached to the rotating platform 3.

[0028] The rotating component 11 is a motor, whose shaft is connected to the lower portion of the rotating platform 3. The rotating platform 3 is arranged horizontally. With this structure, the rotating platform 3 rotates under the control of the rotating component. The horizontal arrangement of the rotating platform facilitates the reliable placement of semiconductor components on the upper surface of the rotating platform, and the horizontal position ensures that the semiconductor components will not be thrown out.

[0029] The step 2 on the semiconductor component 1 is provided along the circumference of the upper surface of the semiconductor component 1 and has an annular structure. With this structure, as the rotating platform rotates the semiconductor component, an operator uses a hand drill to control the polishing pad 9 to contact the stepped surface of the semiconductor component to perform polishing. The polishing is completed without the operator having to move.

[0030] The polishing sheet 9 adhered to the lower part of the polishing disc 8 is a wool polishing sheet. With the above structure, before the semiconductor parts are polished, the polishing area of ​​the product needs to be smeared with polishing emulsion to ensure quality.

[0031] When the stepped surface of the semiconductor component 1 is polished, the semiconductor component 1 is configured to fit snugly on the upper surface of the rotating platform 3, and the multiple component positioning clamps 5 are configured to abut against different positions on the side of the semiconductor component 1. With this structure, the multiple component positioning clamps can reliably clamp and position the semiconductor component, and the component rotates synchronously with the rotating platform.

[0032] When using the device of this utility model, the part locating clamps can be manufactured in various thicknesses, corresponding to different product thicknesses. The clamp height should not exceed the product height, so the appropriate height of the part locating clamp must be selected. The part locating clamps are secured to the rotating platform with screws passing through the waist holes. The position of the part locating clamps can be adjusted for ease of use. The rotating platform, controlled by the rotating components, drives the product to rotate, facilitating the polishing process. Multiple part locating clamps are used to secure the product to the rotating platform. Care should be taken to avoid bumping the product during securing. The product center must be manually aligned with the rotating platform center. After securing the product, check that it is securely fixed and free of any movement or shaking. Control the rotating platform's rotation. Apply polishing lotion to the polishing area of ​​the product. Tilt the hand drill approximately 20 degrees. Polish the rounded corners of the product first. Rotate the product 4-5 times to complete the polishing. Reapply polishing lotion and polish the stepped areas using the polishing pads of the polishing components. Rotate the product 8-10 times to complete the polishing. The fixed shaft is fixed to the hand drill, and the drill speed is controlled by the hand drill for convenient processing. The polishing pad is a special wool polishing pad that is attached to the polishing disc with glue. During polishing, it is used to interact with the small molecules in the emulsion on the product surface to achieve efficient and high-quality polishing of semiconductor parts.

[0033] The semiconductor part step surface polishing equipment described in the present invention is aimed at semiconductor parts with a special structure provided with a step portion, and the step portion has two surfaces, a horizontal surface and a vertical surface. The rotating component 11 is connected to the rotating platform 3. Driven by the rotating component 11, the rotating platform can rotate at a set speed and can stop rotating conveniently, so as to drive the semiconductor parts positioned on the upper surface of the rotating platform 3 to rotate or stop. A plurality of positioning screw holes 4 are provided on the upper surface of the rotating platform 3. The plurality of positioning screw holes 4 are arranged with gaps along a circle near the outer ring position of the rotating platform 3. The positioning holes are used to screw in screws, and the screws are used to fix each part positioning clamp on the upper surface of the rotating platform at the corresponding positioning screw hole position. The plurality of part positioning clamps are located on the outside of the semiconductor part to be positioned, and the semiconductor part 1 is positioned from the outside. When the screws are loosened, the part positioning clamps are loosened, so that the semiconductor part 1 to be polished is conveniently placed or the polished semiconductor part 1 is removed. The part positioning clamp 5 is provided with a waist hole 6. This allows the position of the part positioning clamp 5 to be adjusted within a certain range. This allows the distance between the part positioning clamp 5 and the center of the rotating platform 3 to be adjusted within a certain range, meeting the polishing requirements of semiconductor parts of varying diameters and thicknesses and improving the versatility of the device. The thickness of the part positioning clamp 5 is less than that of the semiconductor part 1. This ensures that the part positioning clamp 5 does not interfere with the polishing machine operation when polishing the upper surface of the middle or outer edge of the step portion of the semiconductor part.

[0034] The above is an exemplary description of the present invention in conjunction with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the scope of protection of the present invention.

Claims

1. A semiconductor part step surface polishing device, characterized by: A step portion (2) is provided on the semiconductor part (1), a rotating platform (3) is connected to the rotating component (11), a plurality of positioning screw holes (4) are provided on the upper surface of the rotating platform (3), the plurality of positioning screw holes (4) are arranged at intervals along a circle near the outer ring of the rotating platform (3), a waist hole (6) is provided on the part positioning clamp (5), and the thickness of the part positioning clamp (5) is less than the thickness of the semiconductor part (1).

2. The semiconductor component step surface polishing device according to claim 1, characterized in that: The semiconductor part step surface polishing device further comprises a polishing component (12), the polishing component (12) comprising a fixed shaft (7) and a polishing disc (8), the lower part of the polishing disc (8) is adhered to a polishing sheet (9), and the fixed shaft (7) is configured to be connected to a hand electric drill.

3. The semiconductor component step surface polishing device according to claim 1 or 2, characterized in that: Each screw (10) is configured to be capable of passing through a waist hole (6) of a part positioning clamp (5) and being screwed and connected to a corresponding positioning screw hole (4) on the rotating platform (3).

4. The semiconductor component step surface polishing device according to claim 1 or 2, characterized in that: The multiple positioning screw holes (4) are arranged at equal distances from the rotating platform (3).

5. The semiconductor component step surface polishing device according to claim 1 or 2, characterized in that: The rotating component is a motor, and the rotating shaft of the motor is connected to the lower part of the rotating platform (3).

6. The semiconductor component step surface polishing device according to claim 5, characterized in that: The rotating platform (3) is configured as a horizontally arranged structure.

7. The semiconductor component step surface polishing device according to claim 1 or 2, characterized in that: The step portion (2) on the semiconductor component (1) is arranged along a circle of the upper surface of the semiconductor component (1), and the step portion (2) on the semiconductor component (1) is a ring structure.

8. The semiconductor component step surface polishing device according to claim 2, characterized in that: The polishing sheet (9) adhered to the lower part of the polishing disc body (8) is a wool polishing sheet.

9. The semiconductor component step surface polishing device according to claim 1 or 2, characterized in that: When the step surface of the semiconductor component (1) is polished, the semiconductor component (1) is configured to be placed in a structure that can be fitted on the upper surface of the rotating platform (3), and the plurality of component positioning clamps (5) are configured to be positioned against different positions on the side of the semiconductor component (1).

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