Circuit board stacking supporting leg piece

Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board stacking supporting foot piece which comprises a folding portion and a foot pad portion, the foot pad portion is arranged on the folding portion, the folding portion comprises a first silica gel strip, a second silica gel strip and a silica gel rotating shaft, the first silica gel strip and the second silica gel strip are arranged in a crossed mode, and the silica gel rotating shaft is arranged on the first silica gel strip. And the middle parts of the first silica gel strip and the second silica gel strip are rotationally connected through a silica gel rotating shaft. Through the assembly composed of the folding part and the foot pad part, a set of supporting foot parts for stacking is provided for the circuit boards, so that a plurality of groups of stacked and transferred circuit boards are well protected from falling, contact friction of the upper circuit board and the lower circuit board in the transferring process is avoided, and therefore, static electricity and friction are reduced; and the stability of circuit board processing and transferring is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board stacking support foot. Background Art

[0002] As the core carrier of electronic equipment, circuit board substrates are widely used and important. Substrates not only support circuit components, but also undertake key functions such as signal transmission and interconnection components to ensure the stability and performance of the circuit. In the fields of electronics, semiconductors, optoelectronics, etc., substrates are the basic materials for manufacturing PCBs, chips, semiconductor devices and optoelectronic devices, and play a vital role in the miniaturization, integration and high-performance development of electronic products.

[0003] During the centralized stacking and transportation of existing special-shaped circuit boards, static electricity is easily generated between the circuit boards due to contact friction, and the contact friction causes wear on the coating and pads, affecting the yield rate of circuit board processing. Therefore, a circuit board stacking support foot is proposed. Utility Model Content

[0004] In response to the problems in the existing technology, the utility model provides a circuit board stacking support foot to provide a set of stacking support feet for the circuit boards, so that the circuit boards stacked and transported in an array can be better protected from overlapping, avoiding contact friction between the upper and lower circuit boards during the transportation process, thereby reducing static electricity and friction, and improving the stability of circuit board processing and transportation.

[0005] The technical solution adopted by the utility model to solve the technical problem is a circuit board stacking support foot, comprising a folding portion and a pad portion, wherein the pad portion is arranged on the folding portion;

[0006] The folding portion includes a first silicone strip, a second silicone strip and a silicone rotating shaft. The first silicone strip and the second silicone strip are arranged crosswise, and the middle part between the first silicone strip and the second silicone strip is rotatably connected through the silicone rotating shaft.

[0007] By adopting the above technical solution, a set of supporting feet for stacking circuit boards is provided through the assembly consisting of the folding part and the padding part, so that the circuit boards stacked and transported in an array are better protected from overlapping, and contact friction between the upper and lower circuit boards during the transportation process is avoided, thereby reducing the generation of static electricity and friction, and improving the stability of circuit board processing and transportation.

[0008] Specifically, through holes for assembling the foot pads are provided at equal distances on the first silicone strip and the second silicone strip.

[0009] Specifically, at least one group of the foot pads is provided and arranged along the through holes of the first silicone strip and the second silicone strip.

[0010] By adopting the above technical solution, the through holes on the first silicone strip and the second silicone strip provide an assembly position for the foot pad, so that the foot pads can be assembled in an integrated manner, avoiding the scattered state of the foot pads during support use.

[0011] Specifically, the foot pad includes a silicone pad and a silicone top plate, the silicone top plate is connected to the top of the silicone pad, and an annular groove with the same diameter as the through hole is opened between the outer periphery of the top of the silicone pad and the silicone top plate.

[0012] By adopting the above technical solution, the distance between the stacked circuit boards is increased by the pads, so that the circuit boards cannot touch each other, thereby reducing static electricity and friction between the pads and circuits.

[0013] Specifically, the silicone top plate of the foot pad passes through the top of the through hole, and the silicone pad is located at the bottom of the through hole.

[0014] The beneficial effects of the present invention are as follows: through the assembly consisting of the folding part and the pad part, a set of supporting feet for stacking is provided for the circuit board, so that the circuit boards stacked and transported in an array are better protected from stacking, and contact friction between the upper and lower circuit boards is avoided during the transportation process, thereby reducing static electricity and friction, and improving the stability of circuit board processing and transportation. After use, it can be conveniently folded and stored, and the pad part can be flexibly installed and adjusted on the folding part based on the point requirements of the circuit board support, so that the pad part can support the circuit board in a more fitting state, solving the problem that during the stacking and centralized transportation of existing special-shaped circuit boards, static electricity is easily generated between the circuit boards due to contact friction, and contact friction causes wear on the coating and the pad, thereby affecting the yield rate of circuit board processing and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1 It is an overall schematic diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the folding portion of the utility model;

[0018] Figure 3 This is a schematic diagram of the silicone shaft of the present invention;

[0019] Figure 4 This is a schematic diagram of the foot pad of the utility model;

[0020] In the figure: folding part 1, first silicone strip 101, second silicone strip 102, silicone shaft 103, through hole 104, foot pad 2, silicone pad 201, silicone top plate 202, annular groove 203. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] like Figure 1-4 As shown, the circuit board stacking support foot member of the present invention comprises a folding portion 1 and a pad portion 2, wherein the pad portion 2 is arranged on the folding portion 1;

[0023] The folding portion 1 includes a first silicone strip 101 , a second silicone strip 102 and a silicone shaft 103 . The first silicone strip 101 and the second silicone strip 102 are arranged crosswise, and the middle portion between the first silicone strip 101 and the second silicone strip 102 is rotatably connected by the silicone shaft 103 .

[0024] When in use, the folding portion 1 and the foot pad 2 provide a set of supporting feet for stacking the circuit boards, so that the stacked and transported circuit boards in an array are better protected from overlapping, avoiding contact friction between the upper and lower circuit boards during the transportation process, thereby reducing static electricity and friction, and improving the stability of circuit board processing and transportation.

[0025] The present invention also includes that the first silicone strip 101 and the second silicone strip 102 are provided with through holes 104 at equal distances for assembling the foot pad 2 .

[0026] The present invention also includes that at least one group of the foot pads 2 is provided and arranged along the through holes 104 of the first silicone strip 101 and the second silicone strip 102 .

[0027] When in use, the through holes 104 on the first silicone strip 101 and the second silicone strip 102 provide an assembly position for the foot pad 2, so that the foot pad 2 can be assembled in an integrated manner, thereby avoiding the scattered state of the foot pad 2 during support use;

[0028] The number and length of the first silicone strip 101 and the second silicone strip 102 are set according to actual use requirements. A third silicone strip and a fourth silicone strip can be added based on the support requirements of the circuit board, and the lengths of the first silicone strip 101 and the second silicone strip 102 can be unequal.

[0029] The height of the foot portion 2 is set according to actual use requirements, and foot portions 2 of different heights can be installed on the folding portion 1 in combination to meet the support requirements of various types of circuit boards.

[0030] The present invention also includes that the pad portion 2 includes a silicone pad 201 and a silicone top plate 202, the silicone top plate 202 is connected to the top of the silicone pad 201, and an annular groove 203 with the same diameter as the through hole 104 is opened between the outer periphery of the top of the silicone pad 201 and the silicone top plate 202.

[0031] When in use, the foot portion 2 increases the distance between the stacked circuit boards, preventing the circuit boards from contacting each other, thereby reducing static electricity and friction between the pads and circuits.

[0032] The present invention further includes that the silicone top plate 202 of the foot portion 2 passes through the top of the through hole 104 , and the silicone pad 201 is located at the bottom of the through hole 104 .

[0033] When the present invention is in use, the first silicone strip 101 and the second silicone strip 102 are cross-rotated by the silicone rotating shaft 103, so that the width of the opening between the first silicone strip 101 and the second silicone strip 102 is close to the bottom width of the circuit board, and then the required number and height of the foot pads 2 are selected, and the silicone top plate 202 of the foot pad 2 is inserted from bottom to top into the through hole 104 of the required support position, so that the foot pad 2 completes the assembly of the folding part 1, and then the folding part 1 is placed between the circuit boards to be supported, so that the circuit boards cannot contact each other, reducing static electricity and friction between the pads and circuits, and ensuring the stability of the circuit boards during stacking and transportation. When facing different batches of circuit boards, the assembly position of the foot pad 2 on the first silicone strip 101 and the second silicone strip 102 can be further adjusted to meet the usage requirements of different batches of circuit boards.

[0034] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board stacking support foot, characterized in that: It comprises a folding portion (1) and a footing portion (2), wherein the footing portion (2) is arranged on the folding portion (1); The folding portion (1) comprises a first silicone strip (101), a second silicone strip (102) and a silicone rotating shaft (103), wherein the first silicone strip (101) and the second silicone strip (102) are arranged crosswise, and the middle portion between the first silicone strip (101) and the second silicone strip (102) is rotatably connected via the silicone rotating shaft (103).

2. The circuit board stacking support leg according to claim 1, characterized in that: Through holes (104) for assembling the foot pad (2) are provided at equal distances on the first silicone strip (101) and the second silicone strip (102).

3. The circuit board stacking support leg according to claim 2, characterized in that: At least one group of the foot pads (2) is provided, and is arranged along the through holes (104) of the first silicone strip (101) and the second silicone strip (102).

4. The circuit board stacking support leg according to claim 3, characterized in that: The pad portion (2) comprises a silicone pad (201) and a silicone top plate (202), wherein the silicone top plate (202) is connected to the top of the silicone pad (201), and an annular groove (203) having the same diameter as the through hole (104) is provided between the outer periphery of the top of the silicone pad (201) and the silicone top plate (202).

5. The circuit board stacking support leg according to claim 4, characterized in that: The silicone top plate (202) of the footing portion (2) passes through the top of the through hole (104), and the silicone pad (201) is located at the bottom of the through hole (104).

Images