Electroplating device

Abstract

The utility model discloses an electroplating device, which comprises an electroplating component, an electroplating component, a first electrode and a second electrode, the electroplating component is used for electroplating foils, the electroplating component comprises an electroplating bath, and the electroplating bath is used for placing electroplating liquid; the roller assembly comprises a mounting bracket and at least one conductive roller, the mounting bracket is erected outside the electroplating bath, and the conductive roller is arranged on the mounting bracket; at least part of the first conveying roller is located in the electroplating bath, and the conductive roller and the first conveying roller are arranged in the Z direction; and the at least one deplating assembly is arranged on the mounting bracket, the deplating assembly is located on one side of the conductive roller and abuts against the conductive roller, and the deplating assembly is used for removing a metal coating located on the conductive roller. According to the technical scheme provided by the invention, metal particles formed when the deplating assembly removes the plating layer can be prevented from falling on the plating layer of the foil, and the electroplating quality is further improved.

Description

Technical Field

[0001] The present application belongs to the field of electroplating technology, and in particular relates to an electroplating device. Background Art

[0002] In the prior art, the metal coating on the conductive roller is usually removed by electroplating using an electrolyte. However, when the current electroplating device removes the metal coating on the conductive roller, the peeled metal particles are easily dropped onto the foil during the removal process, causing damage to the metal coating on the foil. Utility Model Content

[0003] The purpose of the embodiment of the present application is to provide an electroplating device.

[0004] According to a first aspect of an embodiment of the present application, there is provided an electroplating device, comprising:

[0005] An electroplating assembly, wherein the electroplating assembly is used to electroplate the foil, and the electroplating assembly includes an electroplating tank, wherein the electroplating tank is used to place the electroplating solution;

[0006] A roller assembly, the roller assembly comprising a mounting bracket and at least one conductive roller, the mounting bracket being mounted outside the electroplating tank, and the conductive roller being mounted on the mounting bracket;

[0007] a first conveying roller, wherein the first conveying roller is at least partially located inside the electroplating tank, and the conductive roller and the first conveying roller are arranged along the Z direction;

[0008] At least one deplating component is provided on the mounting bracket, the deplating component is located on one side of the conductive roller and abuts against the conductive roller, and the deplating component is used to remove the metal plating on the conductive roller.

[0009] Optionally, the first conveying roller is partially located inside the electroplating tank, and the first conveying roller is arranged on the mounting bracket.

[0010] Optionally, the roller assembly includes two conductive rollers, namely a first conductive roller and a second conductive roller, and the first conductive roller and the second conductive roller are staggered on the mounting bracket in the Z direction and the X direction;

[0011] The electroplating device includes two deplating components, namely a first deplating component and a second deplating component. The first deplating component abuts against the side of the first conductive roller away from the second conductive roller, and the second deplating component abuts against the side of the second conductive roller away from the first conductive roller.

[0012] Optionally, the deplating component includes a main tank, a connecting pipe is provided in the main tank, a flow channel is formed inside the connecting pipe, and a liquid inlet and multiple liquid outlets connected to the flow channel are opened on the connecting pipe. The deplating liquid enters the flow channel from the liquid inlet and flows out from the multiple liquid outlets.

[0013] Optionally, the deplating assembly further includes a drainage trough, which is communicated with the main trough and has a drainage port.

[0014] Optionally, the deplating assembly includes a first side plate and a second side plate, the first side plate and the second side plate are arranged along the Y direction, the main groove is located between the first side plate and the second side plate, and a contact portion is provided between the first side plate and the second side plate, and the contact portion abuts against the conductive roller.

[0015] Optionally, the contact portion includes a brush or a flexible scraper.

[0016] Optionally, the deplating assembly further includes a conductive bar, and the conductive bar is arranged in the main tank.

[0017] Optionally, the electroplating device further includes a frame, and the electroplating tank and the roller assembly are both arranged on the frame.

[0018] Optionally, the electroplating device further includes a protective component, which is disposed on the frame and covers the electroplating tank and the roller assembly.

[0019] Optionally, the protective assembly includes a first mounting plate, a second mounting plate, a first protective cover, and a second protective cover. The first mounting plate and the second mounting plate are arranged on both sides of the electroplating tank along the Y direction. The first mounting plate is provided with a first guide rail and a second guide rail extending along the X direction. The second mounting plate is provided with a third guide rail and a fourth guide rail extending along the X direction. In the Y direction, the first guide rail, the second guide rail, the third guide rail, and the fourth guide rail are arranged in sequence.

[0020] Both sides of the first protective cover are respectively slidably connected to the first guide rail and the fourth guide rail, and both sides of the second protective cover are respectively slidably connected to the second guide rail and the fourth guide rail. The second protective cover can be located inside the first protective cover.

[0021] Optionally, an inspection window is provided on the first mounting plate.

[0022] Optionally, an exhaust port is provided on the first mounting plate.

[0023] Optionally, the electroplating device further includes a driving mechanism and a transmission belt, the transmission belt is sleeved on the conductive roller and the first conveying roller, and the driving end of the driving mechanism can drive the conductive roller and the first conveying roller to rotate.

[0024] Optionally, the driving mechanism is arranged on a side of the frame away from the electroplating tank, a driving wheel is provided at the driving end of the driving mechanism, and the transmission belt is sleeved on the driving wheel, the conductive roller and the first conveying roller.

[0025] One technical effect of the embodiment of the present application is that the deplating component is arranged on one side of the conductive roller and abuts against the conductive roller, and the side of the conductive roller that is not in abutment with the deplating component is used to convey the foil, thereby preventing metal particles formed by the deplating component when removing the plating layer from falling on the plating layer of the foil, thereby further improving the quality of electroplating.

[0026] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0028] Figure 1 Schematic diagram of the structure of the electroplating device in an embodiment of the present application;

[0029] Figure 2 Schematic diagram of the structure of the electroplating device in an embodiment of the present application;

[0030] Figure 3 Schematic diagram of the structure of the electroplating device in an embodiment of the present application;

[0031] Figure 4 Schematic diagram of the structure of the electroplating device in an embodiment of the present application;

[0032] Figure 5 Schematic diagram of the structure of the electroplating assembly in an embodiment of the present application;

[0033] Figure 6 Schematic diagram of the structure of the electroplating device in an embodiment of the present application;

[0034] Figure 7 Schematic diagram of the structure of the electroplating device in an embodiment of the present application;

[0035] Figure 8 Schematic diagram of the structure of the deplating assembly in the embodiment of the present application;

[0036] Figure 9 Schematic diagram of the structure of the deplating assembly in the embodiment of the present application;

[0037] Figure 10 Schematic diagram of the structure of the deplating assembly in the embodiment of the present application;

[0038] Figure 11 2 is a cross-sectional view of a deplating assembly and a conductive roller in an embodiment of the present application;

[0039] Figure 12 Schematic diagram of the structure of the roller assembly and the deplating assembly in the embodiment of the present application;

[0040] Figure 13 Schematic diagram of the structure of the roller assembly in the embodiment of the present application.

[0041] Explanation of the reference numerals: electroplating assembly 1; anode tank 11; electroplating tank 12; roller assembly 2; mounting bracket 21; conductive roller 22; first conductive roller 221; second conductive roller 222; first conveyor roller 23; second conveyor roller 24; deplating assembly 3; first deplating assembly 31; second deplating assembly 32; main tank 33; connecting pipe 34; flow channel 341; liquid inlet 342; liquid outlet 343; drainage tank 35; drainage outlet 351; first side plate 36; second side plate 37; contact portion 38; conductive bar 39; frame 4; mounting end face 41; protective assembly 5; first mounting plate 51; first guide rail 511; second guide rail 512; second mounting plate 52; third guide rail 521; fourth guide rail 522; first protective cover 53; second protective cover 54; exhaust port 55; inspection window 56; driving mechanism 6; transmission belt 7; driving wheel 8. DETAILED DESCRIPTION

[0042] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0043] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0044] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0045] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0046] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0047] First, the X direction, Y direction and Z direction mentioned in the embodiment of the present application are shown in the attached drawings. Figure 1 、 Figure 3 and Figure 4 The marked directions. Among them, the X direction, Y direction and Z direction intersect each other.

[0048] like Figures 1-13 As shown, according to the first aspect of an embodiment of the present application, there is provided an electroplating device, comprising an electroplating component 1, a roller component 2, a first conveyor roller 23 and at least one deplating component 3; the electroplating component 1 is used to electroplate a foil, the electroplating component 1 comprises a plating tank 12, the plating tank 12 is used to place a plating solution; the roller component 2 comprises a mounting bracket 21 and at least one conductive roller 22, the mounting bracket 21 is mounted on the outside of the plating tank 12, the conductive roller 22 is arranged on the mounting bracket 21; the first conveyor roller 23 is at least partially located inside the plating tank 12, the conductive roller 22 and the first conveyor roller 23 are arranged along the Z direction; the deplating component 3 is arranged on the mounting bracket 21, the deplating component 3 is located on one side of the conductive roller 22 and abuts against the conductive roller 22, and the deplating component 3 is used to remove the metal plating on the conductive roller 22.

[0049] like Figure 1-Figure 5 As shown, the electroplating device includes an electroplating assembly 1 , a roller assembly 2 , a first conveying roller 23 and at least one deplating assembly 3 .

[0050] The electroplating assembly 1 further includes an anode tank 11 , which is disposed in the electroplating tank 12 . The anode tank 11 includes an anode plate, which provides anode electricity during the electroplating process.

[0051] To further explain, the roller assembly 2 includes a mounting bracket 21 and at least one conductive roller 22. The mounting bracket 21 is mounted on both sides of the electroplating tank 12. Both ends of the conductive roller 22 are rotatably connected to the mounting bracket 21. The conductive roller 22 is located above the electroplating tank 12. The conductive roller 22 is the cathode electricity for electroplating. The foil contacts the conductive roller 22, and the conductive roller 22 conducts the cathode electricity to the foil. The first conveying roller 23 is located in the electroplating tank 12 to convey the foil. During the tape conveying process, after the foil enters the electroplating tank 12, the anode electricity in the electroplating tank 12 and the cathode electricity on the foil and the electroplating solution form an electroplating circuit, which deposits metal cations on the foil to form a metal coating on the foil.

[0052] During the electroplating process of the foil, after a metal coating is formed on the foil, the foil passes through the conductive roller 22 , and a metal coating is formed on the outer wall of the conductive roller 22 , which affects the quality of the coating on the foil.

[0053] Further explanation, such as Figure 2 and Figure 12 As shown, the deplating component 3 is arranged on the mounting bracket 21, and the deplating component 3 is used to remove the metal coating formed on the outer wall of the conductive roller 22 to improve the quality of the foil coating; specifically, the deplating component 3 is located on one side of the conductive roller 22 and abuts against the conductive roller 22, and the side of the conductive roller 22 that is not abutted against the deplating component 3 is used to convey the foil, thereby preventing the metal particles formed by the deplating component 3 when removing the coating from falling on the foil coating, thereby further improving the quality of the electroplating.

[0054] The deplating assembly 3 is located on one side of the conductive roller 22 and abuts against the conductive roller 22 . Abutting means that the deplating assembly 3 is in contact with and / or connected to the conductive roller 22 .

[0055] In an optional embodiment, a plurality of sub-receiving tanks are provided in the electroplating tank 12. The foil will be electroplated once when passing through a sub-receiving tank, and will be electroplated multiple times after passing through multiple sub-receiving tanks, so that the metal coating on the foil is more uniform; each sub-receiving tank is correspondingly provided with a roller assembly 2 and a first conveying roller 23 or two roller assemblies 2 and two first conveying rollers 23 for conveying the foil.

[0056] In a specific embodiment, the first conveying roller 23 is disposed in the electroplating tank 12 , and both ends of the first conveying roller 23 are fixed to the inner wall of the electroplating tank 12 through bearings. The first conveying roller 23 can rotate relatively to convey the foil.

[0057] In another specific embodiment, the first conveyor roller 23 is partially located inside the electroplating tank 12 and is mounted on the mounting bracket 21. Specifically, both ends of the first conveyor roller 23 pass through the electroplating tank 12 and are rotatably connected to the mounting bracket 21, and the conveying portion of the first conveyor roller 23 is located inside the electroplating tank 12. The first conveyor roller 23 and the mounting bracket 21 are detachably connected to facilitate inspection and maintenance of the first conveyor roller 23.

[0058] In an optional embodiment, the roller assembly 2 includes two conductive rollers 22, namely a first conductive roller 221 and a second conductive roller 222, and the first conductive roller 221 and the second conductive roller 222 are staggered on the mounting bracket 21 in the Z direction and the X direction; the electroplating device includes two deplating components 3, namely a first deplating component 31 and a second deplating component 32, and the first deplating component 31 abuts against the side of the first conductive roller 221 away from the second conductive roller 222, and the second deplating component 32 abuts against the side of the second conductive roller 222 away from the first conductive roller 221.

[0059] like Figure 2 and Figure 12 As shown, the two conductive rollers 22 are respectively the first conductive roller 221 and the second conductive roller 222, and the two deplating components 3 are respectively the first deplating component 31 and the second deplating component 32. In the Z direction, the first conductive roller 221 and the second conductive roller 222 are spaced apart, and in the X direction, the two first conductive rollers 221 and the second conductive roller 222 are spaced apart, so the first conductive roller 221 and the second conductive roller 222 are staggered in the Z direction and the X direction; wherein, the electroplating device includes two deplating components 3, namely the first deplating component 31 and the second deplating component 32, the first deplating component 31 is arranged on a side of the first conductive roller 221 away from the side of the second conductive roller 222, and the second deplating component 32 is arranged on a side of the second conductive roller 222 away from the first conductive roller 221, and the first deplating component 31 and the second deplating component 32 are spaced apart along the X direction; in an embodiment, when the foil passes through the first conductive roller 221 and the second conductive roller 222, the first deplating component 31 and the second deplating component 32 can be avoided from affecting the foil running.

[0060] In an alternative embodiment, Figures 8-11 As shown, the deplating component 3 includes a main tank 33, a connecting pipe 34 is provided in the main tank 33, a flow channel 341 is formed inside the connecting pipe 34, and a liquid inlet 342 and a plurality of liquid outlets 343 connected to the flow channel 341 are opened on the connecting pipe 34. The deplating liquid enters the flow channel 341 from the liquid inlet 342 and flows out from the plurality of liquid outlets 343.

[0061] like Figures 8-11As shown, the deplating component 3 includes a main tank 33, a connecting pipe 34 is arranged in the main tank 33, the connecting pipe 34 is arranged along the Y direction, and the length direction of the connecting pipe 34 is the same as the axial direction of the conductive roller 22; a flow channel 341 is formed inside the connecting pipe 34, and the connecting pipe 34 is provided with a liquid inlet 342 and a liquid outlet 343 connected to the flow channel 341. The deplating liquid enters the flow channel 341 from the liquid inlet 342 and flows out through the liquid outlet 343 in the flow channel 341, thereby contacting the outer wall of the conductive roller 22 to remove the metal plating on the conductive roller 22.

[0062] To further illustrate, the connecting pipe 34 is provided with a plurality of liquid outlets 343 , which are evenly arranged along the Y direction. The plating removal liquid can evenly flow out and contact the conductive roller 22 , thereby improving the removal effect of the metal plating of the conductive roller 22 .

[0063] In an alternative embodiment, Figures 8-11 As shown, the deplating component 3 also includes a drainage trough 35, which is connected to the main tank 33 and has a drainage port 351. After the deplating liquid flows out from the liquid outlet 343, it flows into the drainage trough 35 through the main tank 33 and is discharged through the drainage port 351, thereby avoiding the excessive deplating liquid from contacting the conductive roller 22 again.

[0064] In an alternative embodiment, Figures 8-11 As shown, the deplating assembly 3 includes a first side plate 36 and a second side plate 37, which are arranged along the Y direction. The main groove 33 is located between the first side plate 36 and the second side plate 37. A contact portion 38 is provided between the first side plate 36 and the second side plate 37, and the contact portion 38 abuts against the conductive roller 22. When the conductive roller 22 is subjected to the metal plating removal operation, the deplating liquid enters the flow channel 341 of the deplating assembly 3 through the liquid inlet 342 and is then sprayed onto the surface of the conductive roller 22 through the liquid outlet 343, thereby decomposing the metal plating on the surface of the conductive roller 22 into metal particles. The decomposed metal particles may float on the surface of the conductive roller 22. The contact portion 38 contacts the conductive roller 22 to remove the metal particles floating on the surface of the conductive roller 22 and cause them to fall into the main groove 33 and be discharged through the drainage groove 35, thereby preventing the metal particles from damaging the metal plating on the foil and improving the electroplating quality.

[0065] In an optional embodiment, the contact portion 38 includes a brush or a flexible scraper.

[0066] In a specific embodiment, the contact portion 38 includes a brush, which contacts the conductive roller 22. When the conductive roller 22 removes the metal coating, the fallen metal particles are discharged into the drainage trough 35 under the action of the brush. The contact between the brush and the conductive roller 22 can avoid scratching the outer wall of the conductive roller 22.

[0067] In another specific embodiment, the contact portion 38 includes a flexible scraper that contacts the conductive roller 22. When the conductive roller 22 removes the metal coating, the brush can cause the metal particles to fall into the drain trough 35 for discharge. The flexible scraper contacts the conductive roller 22 to avoid scratching the outer wall of the conductive roller 22. The flexible scraper can be made of rubber or other flexible materials.

[0068] In an alternative embodiment, Figures 8-11 As shown, the deplating assembly 3 further includes a conductive strip 39, which is provided in the main tank 33. When the conductive roller 22 is removing the metal coating, the conductive roller 22 is electrically anode, and the conductive strip 39 is electrically cathode. After the deplating solution flows out of the liquid outlet 343, the metal is dissolved from the anode into metal ions and moves toward the cathode, where electrons are obtained and metal is precipitated, thereby completing the stripping of the metal coating on the conductive roller 22 and ultimately removing the metal coating from the conductive roller 22.

[0069] In an optional embodiment, the electroplating device further includes a frame 4 , and the electroplating assembly 1 and the roller assembly 2 are both arranged on the frame 4 .

[0070] like Figure 1-Figure 7 As shown, the frame 4 includes a mounting end surface 41, the electroplating component 1 is arranged on the mounting end surface 41, the mounting bracket 21 of the roller assembly 2 is arranged on the mounting end surface 41, and the mounting bracket 21 is located on both sides of the electroplating component 1 in the Y direction; its frame 4 provides an installation position for the electroplating component 1 and the roller assembly 2, and improves the stability of the electroplating device.

[0071] In an optional embodiment, the electroplating device further includes a protective component 5 , which is disposed on the frame 4 and covers the electroplating component 1 and the roller component 2 .

[0072] like Figure 6 and Figure 7 As shown, the electroplating device also includes a protective component 5, which is arranged on the mounting end surface 41 of the frame 4. The protective component 5 can cover the electroplating component 1 and the roller assembly 2, thereby preventing external impurities from falling into the electroplating component 1 and preventing the electroplating liquid in the electroplating component 1 from splashing to the outside.

[0073] In an optional embodiment, the protective assembly 5 includes a first mounting plate 51, a second mounting plate 52, a first protective cover 53 and a second protective cover 54. The first mounting plate 51 and the second mounting plate 52 are arranged on both sides of the electroplating assembly 1 along the Y direction. The first mounting plate 51 is provided with a first guide rail 511 and a second guide rail 512 extending along the X direction, and the second mounting plate 52 is provided with a third guide rail 521 and a fourth guide rail 522 extending along the X direction. In the Y direction, the first guide rail 511, the second guide rail 512, the third guide rail 521 and the fourth guide rail 522 are arranged in sequence; the two sides of the first protective cover 53 are respectively slidably connected to the first guide rail 511 and the fourth guide rail 522, and the two sides of the second protective cover 54 are respectively slidably connected to the second guide rail 512 and the fourth guide rail 522, and the second protective cover 54 can be located inside the first protective cover 53.

[0074] like Figure 3 、 Figure 5 、 Figure 6 and Figure 7 As shown, the protection assembly 5 includes a first mounting plate 51 , a second mounting plate 52 , a first protection cover 53 and a second protection cover 54 .

[0075] Specifically, the first mounting plate 51 and the second mounting plate 52 are both arranged on the mounting end surface 41, and the first mounting plate 51 and the second mounting plate 52 are spaced apart along the Y direction, and the electroplating assembly 1 is located between the first mounting plate 51 and the second mounting plate 52; the first mounting plate 51 is provided with a first guide rail 511 and a second guide rail 512 at one end away from the mounting end surface 41, and the length direction of the first guide rail 511 is the same as the X direction, and the length direction of the second guide rail 512 is the same as the X direction; the second mounting plate 52 is provided with a third guide rail 521 and a fourth guide rail 522 at one end away from the mounting end surface 41, and the length direction of the third guide rail 521 is the same as the X direction, and the length direction of the fourth guide rail 522 is the same as the X direction; and In the Y direction, the first guide rail 511, the second guide rail 512, the third guide rail 521 and the fourth guide rail 522 are arranged in sequence; the two sides of the first protective cover 53 are respectively slidably connected to the first guide rail 511 and the fourth guide rail 522, and the two sides of the second protective cover 54 are respectively slidably connected to the second guide rail 512 and the third guide rail 521, so the first protective cover 53 can move along the X direction, the second anti-slip cover can move along the X direction, and the second protective cover 54 can be located inside the first protective cover 53; when it is necessary to check the status of the electroplating assembly 1 and the roller assembly 2, the second protective cover 54 can be slid so that it is located inside the first protective cover 53, so that the status of the electroplating assembly 1 and the roller assembly 2 can be checked.

[0076] In a preferred embodiment, a first compression strip is provided at the edge of the first protective cover 53, and a second compression strip is provided at the edge of the second protective cover 54. When the first protective cover 53 is separated from the second protective cover 54, the second compression strip of the second protective cover 54 will squeeze the first compression strip of the first protective cover 53, thereby sealing the gap between the first protective cover 53 and the second protective cover 54.

[0077] In an alternative embodiment, Figure 7 As shown, an inspection window 56 is provided on the first mounting plate 51. When the electroplating device needs to be maintained or serviced, the inspection window 56 can be removed to perform maintenance or repair work on the components inside the electroplating device.

[0078] In an alternative embodiment, Figure 7 As shown, an exhaust port 55 is provided on the first mounting plate 51. When the electroplating device is working, if gas is generated inside, it can be discharged through the exhaust port 55, thereby improving the working safety of the electroplating device.

[0079] In an alternative embodiment, Figure 4 As shown, the electroplating device also includes a driving mechanism 6 and a transmission belt 7. The transmission belt 7 is sleeved on the conductive roller 22 and the first conveying roller 23. The driving end of the driving mechanism 6 can drive the conductive roller 22 and the first conveying roller 23 to rotate; by setting the driving mechanism 6 and the transmission belt 7, the conductive roller 22 and the first conveying roller 23 can be driven simultaneously, thereby driving the foil to move.

[0080] In an alternative embodiment, Figure 13 As shown, the roller assembly 2 also includes a second conveyor roller 24, which is mounted on a mounting bracket 21. The mounting bracket 21 provides a mounting location for the second conveyor roller 24. In the Z direction, the second conveyor roller 24 is located between the conductive roller 22 and the first conveyor roller 23. The second conveyor roller 24 is made of an insulating material and is used to convey the foil. One or two conveyor rollers can be provided as needed. In this embodiment, the transmission belt 7 is sleeved around the conductive roller 22, the first conveyor roller 23, and the second conveyor roller 24. The driving end of the drive mechanism 6 can drive the conductive roller 22, the first conveyor roller 23, and the second conveyor roller 24 to rotate, thereby driving the foil to travel.

[0081] In an optional embodiment, the driving mechanism 6 is arranged on the side of the frame 4 away from the electroplating assembly 1, and the driving end of the driving mechanism 6 is provided with a driving wheel 8, and the transmission belt 7 is sleeved on the driving wheel 8, the conductive roller 22 and the first conveying roller 23.

[0082] like Figure 4As shown, the driving mechanism 6 is arranged at the end of the frame 4 away from the electroplating component 1, that is, it is arranged below the mounting end surface 41. The driving end of the driving mechanism 6 is provided with a driving wheel 8, and the transmission belt 7 is sleeved on the driving wheel 8, the conductive roller 22 and the first conveying roller 23, thereby driving the conductive roller 22 and the first conveying roller 23 to rotate; in this embodiment, the driving mechanism 6 is arranged at the end of the frame 4 away from the electroplating component 1, which can reduce the space occupied by the electroplating device and make the structure of the electroplating device more compact.

[0083] The driving mechanism 6 may be a servo motor.

[0084] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. An electroplating device, characterized in that: include: An electroplating assembly, the electroplating assembly is used to electroplate the foil, the electroplating assembly includes an electroplating tank, and the electroplating tank is used to place the electroplating solution; A roller assembly, the roller assembly comprising a mounting bracket and at least one conductive roller, the mounting bracket being mounted outside the electroplating tank, and the conductive roller being mounted on the mounting bracket; a first conveying roller, wherein the first conveying roller is at least partially located inside the electroplating tank, and the conductive roller and the first conveying roller are arranged along the Z direction; At least one deplating component is provided on the mounting bracket, the deplating component is located on one side of the conductive roller and abuts against the conductive roller, and the deplating component is used to remove the metal plating on the conductive roller.

2. The electroplating device according to claim 1, characterized in that The first conveying roller is partially located inside the electroplating tank, and the first conveying roller is arranged on the mounting bracket.

3. The electroplating device according to claim 1, wherein: The roller assembly includes two conductive rollers, namely a first conductive roller and a second conductive roller, and the first conductive roller and the second conductive roller are staggered on the mounting bracket in the Z direction and the X direction; The electroplating device includes two deplating components, namely a first deplating component and a second deplating component. The first deplating component abuts against the side of the first conductive roller away from the second conductive roller, and the second deplating component abuts against the side of the second conductive roller away from the first conductive roller.

4. The electroplating device according to claim 1, wherein: The deplating component includes a main tank, a connecting pipe is provided in the main tank, a flow channel is formed inside the connecting pipe, and a liquid inlet and multiple liquid outlets connected to the flow channel are opened on the connecting pipe. The deplating liquid enters the flow channel from the liquid inlet and flows out from the multiple liquid outlets.

5. The electroplating device according to claim 4, characterized in that: The deplating assembly further includes a drainage trough, which is communicated with the main trough and has a drainage port.

6. The electroplating device according to claim 4, characterized in that: The deplating assembly includes a first side plate and a second side plate, the first side plate and the second side plate are arranged along the Y direction, the main groove is located between the first side plate and the second side plate, and a contact portion is provided between the first side plate and the second side plate, and the contact portion abuts against the conductive roller.

7. The electroplating device according to claim 6, characterized in that: The contact portion includes a brush or a flexible scraper.

8. The electroplating device according to claim 4, characterized in that: The deplating assembly further includes a conductive bar, which is arranged in the main tank.

9. The electroplating device according to claim 1, wherein: The electroplating device further comprises a frame, and the electroplating tank and the roller assembly are both arranged on the frame.

10. The electroplating device according to claim 9, characterized in that: The electroplating device further comprises a protection component, which is arranged on the frame and covers the electroplating tank and the roller assembly.

11. The electroplating device according to claim 10, characterized in that: The protective assembly includes a first mounting plate, a second mounting plate, a first protective cover, and a second protective cover. The first mounting plate and the second mounting plate are arranged on both sides of the electroplating tank along the Y direction. The first mounting plate is provided with a first guide rail and a second guide rail extending along the X direction. The second mounting plate is provided with a third guide rail and a fourth guide rail extending along the X direction. In the Y direction, the first guide rail, the second guide rail, the third guide rail, and the fourth guide rail are arranged in sequence. Both sides of the first protective cover are respectively slidably connected to the first guide rail and the fourth guide rail, and both sides of the second protective cover are respectively slidably connected to the second guide rail and the fourth guide rail. The second protective cover can be located inside the first protective cover.

12. The electroplating device according to claim 11, characterized in that: An inspection window is provided on the first mounting plate.

13. The electroplating device according to claim 11, characterized in that: An exhaust port is provided on the first mounting plate.

14. The electroplating device according to claim 9, characterized in that The electroplating device further includes a driving mechanism and a transmission belt. The transmission belt is sleeved on the conductive roller and the first conveying roller. The driving end of the driving mechanism can drive the conductive roller and the first conveying roller to rotate.

15. The electroplating device according to claim 14, characterized in that: The driving mechanism is arranged on a side of the frame away from the electroplating tank, a driving wheel is provided at the driving end of the driving mechanism, and the transmission belt is sleeved on the driving wheel, the conductive roller and the first conveying roller.

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