Silicon wafer drying tank structure

Abstract

The utility model discloses a silicon wafer drying groove structure which comprises a groove body, a flower basket and a telescopic ejector rod. An airflow channel is arranged on the side wall of the tank body; the flower basket is arranged in the groove body and is used for bearing a silicon wafer to be dried; and the telescopic ejector rod is arranged at the bottom of the tank body, changes the inclination angle of the flower basket by stretching out and drawing back, and performs draining and drying on drying by utilizing air flow of the air flow channel. According to the utility model, the inclination angle of the basket is changed by using the telescopic ejector rod, so that the inclination angle of the silicon wafer on the basket can be adjusted, the rapid collection of water on the surface of the silicon wafer is accelerated, the drying efficiency of the silicon wafer can be greatly improved by cooperating with airflow drying, and the device has the characteristics of simple structure and convenience in operation.

Description

Technical Field

[0001] The utility model relates to the field of drying devices, in particular to a silicon wafer drying tank structure. Background Art

[0002] In the production of silicon solar cells, wet processing is a series of steps involving liquid chemical treatments primarily used to clean the silicon wafer surface, remove impurities, and prepare the cell for other manufacturing steps. In silicon solar cell production, the cleanliness of the silicon wafer surface significantly impacts cell efficiency and quality. After the wet processing, the wafer basket and wafers need to be dried, a time-consuming process that carries the risk of residual water. If the drying time is too long, an oxide layer can form on the wafer surface, affecting cell efficiency. If the drying time is too short, some water can remain on the wafer and wafer basket.

[0003] Existing drying trough designs all place the silicon wafer carrier flat in the trough. The water remaining between the teeth and the silicon wafer, and on the basket crossbar and side panels can only be removed by drying, resulting in low drying efficiency for the silicon wafers and certain defects. Utility Model Content

[0004] The purpose of the utility model is to provide a silicon wafer drying tank structure to achieve rapid drying of silicon wafers and improve the drying efficiency of silicon wafers.

[0005] In order to solve the above technical problems, the utility model provides a silicon wafer drying tank structure, comprising a tank body, a flower basket and a telescopic top rod;

[0006] An air flow channel is provided on the side wall of the tank body;

[0007] The flower basket is arranged inside the tank body, and the flower basket is used to carry the silicon wafers to be dried;

[0008] The telescopic top rod is arranged at the bottom of the trough body. The telescopic top rod changes the inclination angle of the flower basket by telescoping, and utilizes the airflow of the airflow channel to drain and dry the flowers.

[0009] Furthermore, there are two air flow channels, which are respectively arranged on the top side wall of the trough body and the bottom surface of the trough body.

[0010] Furthermore, a heating wire and a first fan are provided outside the air flow channel on the top side wall of the tank body, and the heating wire is located on one side of the air outlet of the first fan.

[0011] Furthermore, a temperature sensor is provided on the side of the heating wire, and the temperature sensor is used to monitor the temperature of the heating wire in real time.

[0012] Furthermore, a filter screen is provided on the air flow channel located on the top side wall of the tank body.

[0013] Furthermore, a tank cover is movably provided on the top of the tank body.

[0014] Furthermore, a second fan is provided below the air flow channel at the bottom of the tank body.

[0015] Furthermore, the telescopic push rod passes through the bottom surface of the trough body, and the telescopic push rod is threadedly connected to the bottom surface of the trough body.

[0016] Furthermore, the telescopic top rod is arranged in an arc shape near one end of the flower basket.

[0017] Furthermore, an adjustment handle is provided at one end of the telescopic top rod away from the flower basket.

[0018] Compared with the prior art, the present invention has at least the following beneficial effects:

[0019] The utility model utilizes a telescopic top rod to change the tilt angle of the flower basket, thereby being able to adjust the tilt angle of the silicon wafers on the flower basket, accelerating the rapid collection of moisture on the surface of the silicon wafers, and cooperating with airflow drying to greatly improve the drying efficiency of the silicon wafers. It has the characteristics of simple structure and convenient operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer drying tank structure of the present invention. DETAILED DESCRIPTION

[0021] The following schematic diagrams provide a more detailed description of the silicon wafer drying tank structure of the present invention. These schematic diagrams illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art may modify the present invention as described herein while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as a general guide for those skilled in the art and not as a limitation of the present invention.

[0022] The following paragraphs describe the present invention in more detail by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description and claims. It should be noted that the drawings are greatly simplified and not to exact scale, and are intended solely to facilitate and clearly illustrate the embodiments of the present invention.

[0023] like Figure 1 As shown, an embodiment of the present utility model proposes a silicon wafer drying tank structure, including a tank body 2, a flower basket 1 and a telescopic top rod 3.

[0024] Specifically, an air flow channel 4 is provided on the side wall of the tank body 2 .

[0025] The flower basket 1 is arranged inside the tank body 2 and is used for carrying silicon wafers to be dried.

[0026] The telescopic top rod 3 is arranged at the bottom of the trough body 2. The telescopic top rod 3 changes the tilt angle of the flower basket 1 by telescoping, and utilizes the airflow of the airflow channel 4 to drain and dry the flowers.

[0027] In this embodiment, when silicon wafers need to be dried, a basket 1 loaded with silicon wafers is placed into a trough 2. The basket's tilt angle is then adjusted using a telescopic push rod 3. Water on the wafers flows down the wafer's slope due to gravity and to the bottom of the wafer. Simultaneously, airflow through airflow channel 4 accelerates the collection of water and removes it from the wafers, significantly accelerating the drying process and effectively improving the wafer drying efficiency.

[0028] In a specific embodiment, a slot cover 5 is movably provided on the top of the tank body 2. The slot cover 5 is rotatably mounted on the tank body 2 by a hinge, and a lock is provided between the slot cover 5 and the tank body 2 to prevent the slot cover 5 from being lifted up during the airflow heating process.

[0029] Furthermore, two air flow channels 4 are provided, and the two air flow channels 4 are respectively provided on the top side wall of the trough body 2 and the bottom surface of the trough body 2 .

[0030] Specifically, a heating wire 6 and a first fan 7 are provided outside the air flow channel 4 located on the top side wall of the tank body 2 , and the heating wire 6 is located on the air outlet side of the first fan 7 .

[0031] When the silicon wafer surface is moist, the heating wire 6 and first blower 7 operate, injecting a hot air flow into the tank 2. This hot air flow accelerates the collection of moisture from the silicon wafer surface to the bottom of the wafer, blowing water droplets off the wafer, and rapidly removing most of the moisture from the wafer surface. Furthermore, the hot air flow accelerates the evaporation of any remaining moisture on the wafer surface. The combination of these two processes rapidly removes most of the moisture from the wafer surface, significantly improving the drying efficiency of the wafer.

[0032] In a specific embodiment, in order to prevent the formation of an oxide layer on the surface of the silicon wafer due to excessively high drying temperature, thereby affecting the battery efficiency, a temperature sensor 8 is provided on the side of the heating wire 6 , and the temperature sensor 8 is used to monitor the temperature of the heating wire 6 in real time.

[0033] Temperature sensor 8 monitors the temperature of heating wire 6 in real time and works in conjunction with a controller. Upon receiving the temperature signal from sensor 8, the controller compares it with a set temperature threshold. When the detected temperature exceeds the set temperature, the controller controls heating wire 6 to reduce its power to prevent the formation of an oxide layer on the silicon wafer surface due to excessive temperature. When the detected temperature falls below the set temperature, the controller controls heating wire 6 to increase its power to accelerate the drying of the silicon wafer by the hot air flow.

[0034] In order to prevent the hot air flow from blowing external foreign matter into the tank body 2 , a filter is provided on the air flow channel 4 located on the top side wall of the tank body 2 .

[0035] It should be noted that the controller controls the heating power of the heating wire 6 based on the temperature signal detected by the temperature sensor 8, which is a negative feedback control. This ensures that the heating wire 6 is at the set temperature to dry the silicon wafer. While ensuring the drying efficiency of the silicon wafer, it also prevents the formation of an oxide layer on the silicon wafer surface due to excessive temperature.

[0036] In addition, the controller collects the temperature detection value of the heating wire 6 through the temperature sensor 8 and controls the heating power of the heating wire 6, which belongs to the existing technology. The specific models of the circuit structure and electronic components are not described here.

[0037] Furthermore, a second fan 9 is provided below the air flow channel 4 at the bottom of the tank body 2 .

[0038] Specifically, the second fan 9 can be set separately from the tank body 2. When the first fan 7 is working, the second fan 9 is moved out. The first fan 7 cooperates with the hot air flow generated by the heating wire 6 to blow off the water droplets on the silicon wafer and generate water vapor at the same time. It can be discharged from the air flow channel 4 located at the bottom of the tank body 2, thereby improving the cleanliness of the tank body 2.

[0039] After first fan 7 has removed most of the moisture from the wafer surface, it shuts down and second fan 9 turns on. Second fan 9 uses the naturally warm airflow to evaporate and dry the wafer surface, effectively preventing surface oxidation caused by excessive temperatures. This combination of airflow and drying ensures wafer drying efficiency while also effectively preventing the effects of high temperatures on wafer quality.

[0040] Furthermore, the telescopic push rod 3 passes through the bottom surface of the trough body 2 , and the telescopic push rod 3 is threadedly connected to the bottom surface of the trough body 2 .

[0041] Specifically, the telescopic push rod 3 is threadedly mounted on the bottom surface of the trough body 2 , and the extension height of the telescopic push rod 3 in the trough body 2 can be adjusted by rotating it forward or backward.

[0042] When the telescopic push rod 3 extends into the trough body 2, the telescopic push rod 3 continuously pushes the end of the flower basket 1 upward, and the inclination angle of the flower basket 1 increases, thereby accelerating the rapid collection of moisture on the surface of the silicon wafer along its inclined surface.

[0043] When the telescopic push rod 3 extends out of the tank body 2 , the telescopic push rod 3 continuously levels the flower basket 1 , and the tilt angle of the flower basket 1 decreases, making it easier to take the flower basket 1 carrying the silicon wafers out of the tank body 2 .

[0044] In one embodiment, the telescopic top rod 3 is configured to have an arc-shaped surface at one end thereof near the flower basket 1. To reduce wear between the top end of the telescopic top rod 3 and the flower basket 1 during sliding contact, the top end of the telescopic top rod 3 is configured to have an arc-shaped surface.

[0045] In addition, an adjustment handle 10 is provided at one end of the telescopic top rod 3 away from the flower basket 1 , which can facilitate an operator to rotate the telescopic top rod 3 , thereby facilitating adjustment of the tilt angle of the flower basket 1 .

[0046] Compared with the prior art, the present invention has at least the following beneficial effects:

[0047] The utility model utilizes a telescopic top rod to change the tilt angle of the flower basket, thereby being able to adjust the tilt angle of the silicon wafers on the flower basket, accelerating the rapid collection of moisture on the surface of the silicon wafers, and cooperating with airflow drying to greatly improve the drying efficiency of the silicon wafers. It has the characteristics of simple structure and convenient operation.

[0048] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A silicon wafer drying tank structure, characterized in that: It includes a trough body, a flower basket and a telescopic top rod; An air flow channel is provided on the side wall of the tank body; The flower basket is arranged inside the tank body, and the flower basket is used to carry the silicon wafers to be dried; The telescopic top rod is arranged at the bottom of the trough body. The telescopic top rod changes the inclination angle of the flower basket by telescoping, and utilizes the airflow of the airflow channel to drain and dry the flowers.

2. The silicon wafer drying tank structure according to claim 1, wherein: There are two air flow channels, which are respectively arranged on the top side wall of the trough body and the bottom surface of the trough body.

3. The silicon wafer drying tank structure according to claim 2, wherein: An electric heating wire and a first fan are arranged outside the air flow channel on the top side wall of the tank body, and the electric heating wire is located on one side of the air outlet of the first fan.

4. The silicon wafer drying tank structure according to claim 3, wherein: A temperature sensor is provided on the side of the heating wire, and the temperature sensor is used to monitor the temperature of the heating wire in real time.

5. The silicon wafer drying tank structure according to claim 2, wherein: A filter screen is provided on the air flow channel located on the top side wall of the tank body.

6. The silicon wafer drying tank structure according to claim 1, wherein: A tank cover is movably provided on the top of the tank body.

7. The silicon wafer drying tank structure according to claim 1, wherein: A second fan is provided below the air flow channel at the bottom of the tank body.

8. The silicon wafer drying tank structure according to claim 1, wherein: The telescopic push rod passes through the bottom surface of the trough body, and the telescopic push rod is threadedly connected to the bottom surface of the trough body.

9. The silicon wafer drying tank structure according to claim 1, wherein: The telescopic top rod is arranged in an arc shape near one end of the flower basket.

10. The silicon wafer drying tank structure according to claim 1, wherein: An adjustment handle is provided at one end of the telescopic top rod away from the flower basket.

Images