Silicon wafer product circle processing thickness measuring device

Abstract

The utility model discloses a silicon wafer product circle processing thickness measuring device, and relates to the technical field of silicon wafer product circle processing, the silicon wafer product circle processing thickness measuring device comprises a measuring instrument body, the upper surface of the measuring instrument body is fixedly connected with a workbench, the workbench is internally and rotatably connected with a screw rod, the right surface of the screw rod is fixedly connected with a handle, and the handle is fixedly connected with the measuring instrument body. When the measuring instrument body needs thickness measurement, a silicon wafer to be detected is placed on the objective table, at the moment, the handle is rotated to drive the screw rod fixed with the handle to rotate together, the two connecting blocks sleeved on the screw rod move towards opposite surfaces under the action of threads in the rotating process of the screw rod, and the thickness of the silicon wafer to be detected is measured. The two connecting blocks can drive the clamping blocks clamped on the two connecting blocks to move together in the moving process, rubber blocks are fixed to the opposite faces of the two clamping blocks, the two rubber blocks can clamp and fix a silicon wafer in the moving process, and the friction force in the clamping process is improved through the materials of the rubber blocks.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer round processing, in particular to a silicon wafer round processing thickness measuring device. Background Art

[0002] A silicon wafer thickness gauge is a special instrument used to measure the thickness of silicon wafers. It usually uses optical or mechanical methods to determine the thickness of silicon wafers through precise measurement technology.

[0003] At present, an existing silicon wafer round processing thickness measuring device (such as patent number: CN202321191025.5) discloses a silicon wafer thickness measuring device, which belongs to the field of silicon wafer processing technology, including a measuring table, a storage seat arranged on the measuring table and a measuring mechanism located on the measuring table, wherein a silicon wafer storage groove is formed on the storage seat, and an inverted U-shaped receiving frame is fixedly welded on the top wall of the measuring table. The silicon wafer thickness measuring device obtains its thickness value while ensuring that the silicon wafer remains horizontal, so that the measured thickness value is more accurate.

[0004] However, during the implementation of the above technical solution, the following technical problems were found: the above solution lacks a clamping structure for the silicon wafer during implementation, resulting in instability when the driving cylinder drives the storage table and the silicon wafer thereon to move. The silicon wafer may fall and be damaged, causing unnecessary losses. Utility Model Content

[0005] (1) Technical problems solved

[0006] In response to the shortcomings of the existing technology, the utility model provides a silicon wafer round processing thickness measurement device, which solves the problem that the lack of a clamping structure for the silicon wafer causes instability when the driving cylinder drives the placement table and the silicon wafer thereon to move, and the silicon wafer may fall and be damaged.

[0007] (2) Technical solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: a silicon wafer round processing thickness measuring device, including a measuring instrument body, the upper surface of the measuring instrument body is fixedly connected to a workbench, a screw is rotatably connected in the workbench, a handle is fixedly connected to the right surface of the screw, the upper surface of the workbench is fixedly connected to a loading platform, two connecting bars are fixedly connected to the annular side of the loading platform, two clamping blocks are arranged above the workbench, and connecting blocks are arranged below the two clamping blocks, the upper surfaces of the two clamping blocks are provided with a slot three, the inner walls of the two slots three are provided with a limiting slot two, the two limiting slots two are movably engaged with the limiting blocks, the opposite surfaces of the two connecting blocks are penetrated by a slot two, and the two slots two are slidably connected to the two connecting bars respectively.

[0009] As an optimal technical solution of the present invention, two card slots are provided on the upper surface of the workbench, and the two card slots are respectively slidably connected to the two connecting blocks. Threaded holes are provided on the opposite surfaces of the two connecting blocks, and the two threaded holes are threadedly connected to the screw rods.

[0010] As an optimal technical solution of the present invention, the front surfaces of the two limit blocks are fixedly connected with springs, the two springs are respectively fixedly connected to the two limit slots, the opposite back surfaces of the two limit blocks are fixedly connected with clamping blocks, and the opposite surfaces of the two clamping blocks are fixedly connected with rubber blocks.

[0011] As a preferred technical solution of the present invention, the front surfaces of the two clamping blocks are fixedly connected with a connecting rod, and the two clamping slots three are movably connected with the two connecting blocks respectively.

[0012] As a preferred technical solution of the present invention, a group of limiting grooves 1 are respectively provided on the front surfaces of the two connecting blocks, and each group of limiting grooves 1 is movably engaged with the two limiting blocks.

[0013] (3) Beneficial effects

[0014] 1. Rubber blocks are fixed on the opposite sides of the two clamping blocks. When moving, the two rubber blocks will clamp and fix the silicon wafer. The material of the rubber blocks themselves increases the friction during the clamping process. At this time, the measuring instrument body can be started to perform thickness detection. This structure can ensure that the silicon wafer remains stable during the measurement process to prevent it from moving or shaking, thereby ensuring the accuracy and repeatability of the measurement results.

[0015] 2. The two clamping blocks can move up and down, and after being adjusted to the appropriate position, they are reset by the elastic force of the spring. At this time, the two clamping blocks and the two connecting blocks are in a limited fixed state. This structure improves the flexibility of the measuring instrument body. The operator can adjust the clamping height according to the specific measurement requirements and the thickness of the silicon wafer to ensure the best measurement effect and clamping stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings.

[0017] Figure 1 This is the overall structural diagram of the utility model;

[0018] Figure 2 This is a structural diagram of the workbench in the utility model;

[0019] Figure 3This is a structural diagram of the connection block in the utility model;

[0020] Figure 4 This is a structural diagram of the clamping block in the utility model.

[0021] Legend: 1. Measuring instrument body; 2. Workbench; 3. Handle; 4. Loading platform; 5. Connecting rod; 6. Slot 1; 7. Screw; 8. Connecting block; 9. Clamping block; 10. Block; 11. Connecting strip; 12. Threaded hole; 13. Limiting slot 1; 14. Slot 2; 15. Rubber block; 16. Slot 3; 17. Limiting slot 2; 18. Spring; 19. Limiting block. DETAILED DESCRIPTION

[0022] The embodiment of the present application provides a silicon wafer round processing thickness measuring device, which effectively solves the problem that the lack of a clamping structure for the silicon wafer causes instability when the driving cylinder drives the storage table and the silicon wafer thereon to move, and the silicon wafer may fall and be damaged. Rubber blocks 15 are fixed on the opposite surfaces of the two clamping blocks 9. When moving, the two rubber blocks 15 will clamp and fix the silicon wafer. The material of the rubber blocks 15 themselves increases the friction during the clamping process. At this time, the measuring instrument body 1 can be started to perform thickness detection. This structure can ensure that the silicon wafer remains stable during the measurement process and prevent it from moving or shaking, thereby ensuring the accuracy and repeatability of the measurement results.

[0023] Example

[0024] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, the technical solution in the embodiment of the present application effectively solves the problem that the lack of a clamping structure for the silicon wafer causes instability when the driving cylinder drives the placement table and the silicon wafer thereon to move, and the silicon wafer may fall and be damaged. The overall idea is as follows:

[0025] In response to the problems existing in the prior art, the utility model provides a silicon wafer roundness processing thickness measuring device, including a measuring instrument body 1, a workbench 2 is fixedly connected to the upper surface of the measuring instrument body 1, a screw 7 is rotatably connected to the workbench 2, a handle 3 is fixedly connected to the right surface of the screw 7, a loading platform 4 is fixedly connected to the upper surface of the workbench 2, two connecting bars 11 are fixedly connected to the annular side of the loading platform 4, two clamping blocks 9 are provided above the workbench 2, and connecting blocks 8 are provided below the two clamping blocks 9. Three card slots 16 are provided on the upper surfaces of the two clamping blocks 9. The inner walls of the two card slots 3 16 are both provided with limiting grooves 2 17, and the limiting blocks 19 are movably engaged in the two limiting grooves 2 17. The opposite surfaces of the two connecting blocks 8 are penetrated by card slots 2 14, and the two card slots 2 14 are respectively slidably connected to the two connecting strips 11. The two connecting blocks 8 will drive the clamping blocks 9 engaged thereon to move together during the movement. The opposite surfaces of the two clamping blocks 9 are fixed with rubber blocks 15. When moving, the two rubber blocks 15 will clamp and fix the silicon wafer. The material of the rubber block 15 itself increases the friction during the clamping process.

[0026] Two card slots 6 are provided on the upper surface of the workbench 2, and the two card slots 6 are slidably connected to the two connecting blocks 8 respectively. The opposite surfaces of the two connecting blocks 8 are penetrated by threaded holes 12, and the two threaded holes 12 are threadedly sleeved with the screw rod 7. The front surfaces of the two limit blocks 19 are fixedly connected with springs 18, and the two springs 18 are fixedly connected with the two limit slots 2 17 respectively. The opposite back surfaces of the two limit blocks 19 are fixedly connected with card blocks 10, and the opposite surfaces of the two clamping blocks 9 are fixedly connected with rubber blocks 15. When the measuring instrument body 1 needs to measure the thickness, the silicon wafer to be tested is placed on the stage 4. At this time, the handle 3 is rotated to drive the screw rod 7 fixed thereto to rotate together. During the rotation of the screw rod 7, the two connecting blocks 8 sleeved on it are moved toward the opposite surface by the action of the thread. At this time, the measuring instrument body 1 can be started to perform thickness detection. This structure can ensure that the silicon wafer remains stable during the measurement process and prevent it from moving or shaking, thereby ensuring the accuracy and repeatability of the measurement results.

[0027] The front surfaces of the two clamping blocks 9 are fixedly connected with a connecting rod 5, and the two card slots 3 16 are movably connected with the two connecting blocks 8 respectively. A group of limit grooves 13 are opened on the front surfaces of the two connecting blocks 8, and each group of limit grooves 13 is movably connected with the two limit blocks 19 respectively. After adjusting to the appropriate position, they are reset by the elastic force of the spring 18. At this time, the two clamping blocks 9 and the two connecting blocks 8 are in a limited and fixed state. This structure improves the flexibility of the measuring instrument body 1. The operator can adjust the clamping height according to the specific measurement requirements and the thickness of the silicon wafer to ensure the best measurement effect and clamping stability.

[0028] Working principle:

[0029] When the measuring instrument body 1 needs to measure the thickness, the silicon wafer to be tested is placed on the stage 4. At this time, the handle 3 is turned to drive the screw 7 fixed thereto to rotate together. During the rotation of the screw 7, the two connecting blocks 8 sleeved thereon are moved toward the opposite surfaces by the action of the thread. The two connecting blocks 8 will drive the clamping blocks 9 clamped thereon to move together during the movement. Rubber blocks 15 are fixed to the opposite surfaces of the two clamping blocks 9. During the movement, the two rubber blocks 15 will clamp and fix the silicon wafer. The material of the rubber blocks 15 themselves increases the friction during the clamping process. At this time, the measuring instrument body 1 can be started to perform thickness detection. This structure can ensure that the silicon wafer remains stable during the measurement process and prevent it from moving or shaking, thereby ensuring the accuracy and repeatability of the measurement results. When testing silicon wafers of the same thickness, it is necessary to adjust the height of the two clamping blocks 9 to ensure that they are in the optimal clamping position. The two clamping blocks 9 are fixed by the connecting rod 5. Pulling the two clamping blocks 10 drives the limit blocks 19 fixed thereto to move together, compressing the two springs 18. At this time, the two limit blocks 19 will be disengaged from the engagement with a set of limit grooves 13 opened on the two connecting blocks 8, opening the limit. At this time, the two clamping blocks 9 can move up and down, and after adjusting to the appropriate position, they are reset by the elastic force of the spring 18. At this time, the two clamping blocks 9 and the two connecting blocks 8 are in a limited and fixed state. This structure improves the flexibility of the measuring instrument body 1. The operator can adjust the clamping height according to the specific measurement requirements and the thickness of the silicon wafer to ensure the best measurement effect and clamping stability.

[0030] Finally, it should be noted that the above embodiments are merely examples for the purpose of illustrating the present invention and are not intended to limit the embodiments. Those skilled in the art will readily appreciate that other variations or modifications based on the above description are possible. It is not necessary and impossible to provide an exhaustive list of all possible embodiments. However, any obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A silicon wafer roundness processing thickness measuring device, comprising a measuring instrument body (1), characterized in that: The upper surface of the measuring instrument body (1) is fixedly connected to a workbench (2), a screw (7) is rotatably connected inside the workbench (2), a handle (3) is fixedly connected to the right surface of the screw (7), and a loading platform (4) is fixedly connected to the upper surface of the workbench (2); The workbench (4) is fixedly connected to the annular side with two connecting bars (11), two clamping blocks (9) are arranged above the workbench (2), and connecting blocks (8) are arranged below the two clamping blocks (9). The upper surfaces of the two clamping blocks (9) are provided with a third card slot (16), and the inner walls of the two third card slots (16) are provided with a second limiting slot (17), and the two second limiting slots (17) are movably connected to the limiting blocks (19).

2. The device for measuring the thickness of a silicon wafer during round processing according to claim 1, wherein: Two card slots (14) are provided through the opposing surfaces of the two connecting blocks (8); The two second card slots (14) are respectively connected to the two connecting bars (11) in a sliding manner.

3. The device for measuring the thickness of a silicon wafer during round processing according to claim 1, wherein: The upper surface of the workbench (2) is provided with two card slots (6); The two card slots (6) are respectively connected in a sliding manner to the two connecting blocks (8).

4. The device for measuring thickness of a silicon wafer during round processing according to claim 1, wherein: The two opposite surfaces of the two connecting blocks (8) are both provided with threaded holes (12); Wherein, the two threaded holes (12) are both threadedly sleeved with the screw rod (7).

5. The device for measuring the thickness of a silicon wafer during round processing according to claim 1, wherein: The front surfaces of the two limit blocks (19) are both fixedly connected with springs (18); Wherein, the two springs (18) are fixedly connected to the two second limiting grooves (17) respectively.

6. The device for measuring the thickness of a silicon wafer during round processing according to claim 1, wherein: The back surfaces of the two limit blocks (19) are both fixedly connected with a clamping block (10); Wherein, the opposite surfaces of the two clamping blocks (9) are fixedly connected with rubber blocks (15).

7. The device for measuring thickness of a silicon wafer during round processing according to claim 1, wherein: The front surfaces of the two clamping blocks (9) are fixedly connected with a connecting rod (5); The two card slots (16) are respectively movably connected to the two connecting blocks (8).

8. The silicon wafer round processing thickness measuring device according to claim 1, characterized in that: The front surfaces of the two connecting blocks (8) are each provided with a set of limiting grooves (13); Wherein, each group of the limiting grooves (13) is movably connected to two limiting blocks (19).

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