Cabinet temperature monitoring device

Abstract

The utility model discloses a cabinet temperature monitoring device, which relates to the technical field of data acquisition and comprises a temperature acquisition host, a temperature acquisition unit and an RS485 communication module which are distributed and mounted in a cabinet. The temperature acquisition host provides a plurality of RS485 communication acquisition channels; the temperature acquisition unit provides independent temperature acquisition data conversion; networking communication is established between the RS485 communication module and the communication host; the temperature acquisition host is respectively connected with the temperature acquisition unit and the RS485 communication module so as to realize real-time acquisition of the temperature of each cabinet and sequentially perform data conversion and data uploading; the temperature acquisition host is connected with the RS485 communication module through an RS485 bus and sends measured temperature data; the device has the functions of independent temperature acquisition and RS485 bus communication centralized monitoring, the miniaturization design does not occupy equipment space, and each cabinet is independently monitored in a large scale, so that a manager can monitor the running temperature condition of equipment in the cabinet, monitor the equipment state and the environment state according to a temperature change curve, and provide a data basis for equipment management.

Description

Technical Field

[0001] The utility model relates to the technical field of data acquisition, in particular to a cabinet temperature monitoring device. Background Art

[0002] A substation is a place in the power system that transforms voltage and current, receives electrical energy, and distributes it. The substation within a power plant is a step-up substation, whose function is to boost the voltage of the electricity generated by the generator and feed it into the high-voltage power grid. The cabinet temperature used in the substation must be within an appropriate range to ensure normal and stable operation of the equipment.

[0003] Traditional temperature monitoring is limited by quantity and cannot provide feedback on temperature changes in each cabinet. There is no parameter comparison for small changes inside the cabinet, which makes it impossible to accurately manage the temperature of the equipment, which is not conducive to the long-term stable operation of the equipment.

[0004] In order to improve the online rate of equipment, increase measurement accuracy and reduce maintenance costs, the utility model device is developed. Utility Model Content

[0005] The purpose of the utility model is to provide a cabinet temperature monitoring device with overall planning, which improves the online rate of equipment, ensures measurement accuracy, and reduces maintenance costs.

[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0007] A cabinet temperature monitoring device, comprising:

[0008] The temperature acquisition host, temperature acquisition unit and RS485 communication module are distributed and installed in the cabinet;

[0009] The temperature acquisition host provides multiple RS485 communication acquisition channels;

[0010] The temperature acquisition unit provides independent temperature acquisition data conversion;

[0011] The RS485 communication module establishes network communication with the communication host;

[0012] The temperature acquisition host is connected to the temperature acquisition unit and the RS485 communication module respectively to realize real-time temperature acquisition of each cabinet and perform data conversion and data upload in sequence.

[0013] Furthermore, the temperature acquisition unit and the RS485 communication module are installed together in one module;

[0014] The temperature acquisition unit and the RS485 communication module measure the temperature and convert it into a digital value.

[0015] Furthermore, the temperature acquisition host is connected to the RS485 communication module via an RS485 bus and transmits the measured temperature data.

[0016] Furthermore, the temperature acquisition unit adopts a K-type thermocouple probe or a semiconductor integrated sensor;

[0017] The K-type thermocouple probe collects the tiny electromotive force of the thermocouple to form a digital signal and calculates the temperature value through digital filtering and operation by the CPU;

[0018] The semiconductor integrated sensor acts as a CPU to read the register of the chip according to a predetermined time sequence to obtain temperature data and control heating or cooling according to temperature control parameters.

[0019] Furthermore, a circuit of a group of the K-type thermocouple probes includes a first chip, a first interface, a first resistor, an eighth resistor, a ninth resistor, a tenth resistor, a third capacitor, an eighth capacitor, and a tenth capacitor;

[0020] Another group of K-type thermocouple probe circuits includes a first chip, a second interface, a twelfth resistor, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a fourteenth capacitor, a fifteenth capacitor, and a sixteenth capacitor;

[0021] The ninth resistor and the fourteenth resistor are grounded, one end of the eighth resistor is connected to the fourth pin of the first chip, the tenth resistor is connected to the fifth pin of the power chip, and the other ends of the eighth resistor and the tenth resistor are connected to the first resistor and the ninth resistor respectively;

[0022] The thirteenth resistor is connected to the sixth pin of the first chip, the fifteenth resistor is connected to the seventh pin of the first chip, and the other ends of the thirteenth resistor and the fifteenth resistor are connected to the twelfth resistor and the fourteenth resistor;

[0023] An RC circuit is formed by the third capacitor, the eighth capacitor, the tenth capacitor, the fourteenth capacitor, the fifteenth capacitor, and the sixteenth capacitor;

[0024] A first interface, a second interface, a third interface, and a fourth interface are formed on the other side of the first chip, and the first chip is connected to the CPU chip through the first interface, the second interface, the third interface, and the fourth interface.

[0025] Furthermore, the circuit of the semiconductor integrated sensor includes a fifth interface and a sixth interface;

[0026] One end of the fifth interface and the sixth interface is grounded;

[0027] The fifth interface is connected to a second resistor, and the other end of the second resistor is connected to a temperature sensor;

[0028] The sixth interface is connected to a third resistor, and the other end of the third resistor is connected to a temperature sensor.

[0029] Furthermore, the temperature acquisition circuit includes:

[0030] The seventh and eighth interfaces for heating or cooling;

[0031] The seventh interface is connected to the first relay and the sixth resistor;

[0032] The eighth interface is connected to the second relay and the seventh resistor;

[0033] One end of the sixth resistor and the seventh resistor is grounded.

[0034] Furthermore, the temperature acquisition circuit includes a first communication interface and a second communication interface;

[0035] The first communication interface is respectively connected to a sixteenth resistor and a seventeenth resistor, one end of the seventeenth resistor is grounded, the other ends of the sixteenth resistor and the seventeenth resistor are commonly connected to a first receiver, the other end of the first receiver is connected to a first serial port and a second serial port, and the first receiver is connected to the CPU chip through the first serial port and the second serial port;

[0036] The second communication interface is connected to a second receiver, the second receiver is connected to a fifth capacitor, a sixth capacitor, a twelfth capacitor, and a thirteenth capacitor, one end of the fifth capacitor is grounded, and one end of the second receiver is connected to the third serial port and the fourth serial port, and the second receiver is connected to the CPU chip through the third serial port and the fourth serial port.

[0037] Furthermore, the temperature acquisition circuit includes a first power supply, a second power supply and a third power supply;

[0038] One end of the first power supply is connected to the ninth interface, and the other end is grounded and connected to the fourth capacitor, the seventeenth capacitor, the eighteenth capacitor, and the nineteenth capacitor;

[0039] One end of the second power supply is connected to the first power supply, and the other end of the second power supply is grounded;

[0040] One end of the third power supply is connected to the first power supply and the second power supply respectively, and the other end of the third power supply is grounded.

[0041] Furthermore, the first chip specifically adopts ADS1118IDGSR-C55347;

[0042] The CPU chip specifically uses STC8A8K64S4-QFP44;

[0043] The first receiver specifically uses 75LBC184;

[0044] The second receiver specifically uses MAX3232E;

[0045] The first relay and the second relay specifically adopt G6C1114P;

[0046] The first power supply specifically adopts LED02-23B05;

[0047] The second power supply specifically adopts HLK-2M05;

[0048] The third power supply specifically adopts HLK-PM01.

[0049] In the above technical solution, the cabinet temperature monitoring device of the present invention has the following beneficial effects:

[0050] The utility model provides a cabinet temperature monitoring device with independent temperature collection and RS485 bus communication centralized monitoring functions. The miniaturized design does not occupy equipment space, and each cabinet is independently monitored on a large scale, so that management personnel can monitor the operating temperature of the equipment in the cabinet, monitor the equipment status and environmental status according to the temperature change curve, and provide data basis for equipment management. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0052] Figure 1 This is a block diagram of the overall circuit principle of a cabinet temperature monitoring device provided by an embodiment of the utility model;

[0053] Figure 2 A circuit diagram of K-type thermocouple probes X9 and X7 in a cabinet temperature monitoring device provided by an embodiment of the present utility model;

[0054] Figure 3 A circuit diagram of the CPU chip U1 in a cabinet temperature monitoring device provided by an embodiment of the present utility model;

[0055] Figure 4 A circuit diagram of a semiconductor integrated sensor interface X2 in a cabinet temperature monitoring device provided by an embodiment of the present utility model;

[0056] Figure 5 A circuit diagram of a semiconductor integrated sensor interface X6 in a cabinet temperature monitoring device provided by an embodiment of the present utility model;

[0057] Figure 6A circuit diagram of a heating interface X5 in a cabinet temperature monitoring device provided by an embodiment of the present utility model;

[0058] Figure 7 A circuit diagram of a cooling interface X8 of a cabinet temperature monitoring device provided in an embodiment of the present utility model;

[0059] Figure 8 A circuit diagram of the communication interface X3 in a cabinet temperature monitoring device provided by an embodiment of the present utility model;

[0060] Figure 9 A circuit diagram of the communication interface X4 in a cabinet temperature monitoring device provided by an embodiment of the present utility model;

[0061] Figure 10 This is a circuit diagram of power supplies P1, P2, and P3 in a cabinet temperature monitoring device provided by an embodiment of the present invention.

[0062] Description of reference numerals:

[0063] 1. Temperature acquisition host; 2. Temperature acquisition unit; 3. RS485 communication module. DETAILED DESCRIPTION

[0064] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0065] See also Figures 1-10 As shown;

[0066] A cabinet temperature monitoring device, comprising:

[0067] The temperature acquisition host 1, temperature acquisition unit 2 and RS485 communication module 3 are distributed and installed in the cabinet;

[0068] Temperature acquisition host 1 provides multiple RS485 communication acquisition channels;

[0069] Temperature acquisition unit 2 provides independent temperature acquisition data conversion;

[0070] RS485 communication module 3 establishes network communication with the communication host;

[0071] The temperature acquisition host 1 is connected to the temperature acquisition unit 2 and the RS485 communication module 3 respectively to realize real-time temperature acquisition of each cabinet and perform data conversion and data upload in sequence.

[0072] The temperature acquisition unit 2 and the RS485 communication module 3 are installed together in one module;

[0073] The temperature acquisition unit 2 and the RS485 communication module 3 measure the temperature and convert it into a digital value.

[0074] The temperature acquisition host 1 is connected to the RS485 communication module 3 via the RS485 bus and transmits the measured temperature data.

[0075] Specifically, a cabinet temperature monitoring device is an integrated structure with a miniaturized design that does not occupy equipment space, and has independent temperature acquisition and RS485 bus communication centralized monitoring functions. The designed temperature acquisition system collects the temperature of each cabinet in the substation and the main station room in real time through the above-mentioned boards, unit circuits and modules, and at the same time uses the MODBUS communication protocol through the field bus to communicate with the temperature acquisition host 1 and send data. The temperature acquisition host 1 organizes the information and sends it to the management machine background.

[0076] Among them, the temperature acquisition host 1 is connected to the temperature acquisition unit 2 and the RS485 communication module 3 to measure the temperature;

[0077] The temperature acquisition unit 2 and the RS485 communication module 3 are in a small module and are independently installed in the cabinet to measure the temperature and convert it into a digital value;

[0078] The RS485 communication module 3 is connected to the temperature acquisition host 1 through the RS485 bus, and the measured temperature data is sent to the host, and the device address is used as the physical location;

[0079] Among them, the physical lines of the field network include twisted pair cables, network cables, optical fibers, etc.

[0080] The interface type of the field network can be RS485;

[0081] The on-site communication protocol is MODBUS.

[0082] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention.

[0083] Two types of sensors are used for temperature collection, one is a K-type thermocouple probe and the other is a semiconductor integrated sensor.

[0084] like Figure 2-10 As shown, temperature acquisition uses two sets of K-type thermocouple probes, and the specific performance is as follows:

[0085] The first interface X9 and the second interface X7 are interfaces for K-type thermocouple probes, including a first chip U8, a first resistor R1, an eighth resistor R8, a ninth resistor R9, and a tenth resistor R10 of a group of K-type thermocouple probes, a twelfth resistor R12, a thirteenth resistor R13, a fourteenth resistor R14, and a fifteenth resistor R15 of another group of K-type thermocouple probes, and also including a third capacitor C3, an eighth capacitor C8, a tenth capacitor C10, a fourteenth capacitor C14, a fifteenth capacitor C15, and a sixteenth capacitor C16;

[0086] Wherein the ninth resistor R9 and the fourteenth resistor R14 are grounded, one end of the eighth resistor R8 is connected to the fourth pin 4 of the first chip U8, the tenth resistor R10 is connected to the fifth pin 5 of the first chip U8, and the other ends of the eighth resistor R8 and the tenth resistor R10 are connected to the first resistor R1 and the ninth resistor R9 respectively; the thirteenth resistor R13 is connected to the sixth pin 6 of the first chip U8, the fifteenth resistor R15 is connected to the seventh pin 7 of the first chip U8, and the other ends of the thirteenth resistor R13 and the fifteenth resistor R15 are connected to the twelfth resistor R12 and the fourteenth resistor R14, and an RC circuit is formed through the third capacitor C3, the eighth capacitor C8, the tenth capacitor C10, the fourteenth capacitor C14, the fifteenth capacitor C15, and the sixteenth capacitor C16;

[0087] The other side of the first chip U8 is formed with interfaces D0, D1, D2 and D3. The chip U8 is connected to the CPU chip U1 through the first interface D0, D1, D2 and D3.

[0088] The K-type thermocouple probe is used for data collection. The chip U8 is used to collect the tiny electromotive force of the thermocouple into a digital signal, which is then filtered and calculated by the CPU chip U1 to calculate the temperature value.

[0089] Temperature acquisition uses semiconductor integrated sensors, which are as follows:

[0090] The semiconductor integrated sensor is a CPU that reads the chip register according to a certain timing, obtains temperature data, and controls heating or cooling according to the set temperature control parameters;

[0091] The fifth interface X2 and the sixth interface X6 are semiconductor integrated sensor interfaces. The fifth interface X2 is connected to the second resistor R2, and the other end of the second resistor R2 is connected to the temperature sensor. The sixth interface X6 is connected to the third resistor R3, and the other end of the third resistor R3 is connected to the temperature sensor. One end of the fifth interface X2 and the sixth interface X6 is grounded.

[0092] The seventh interface X5 and the eighth interface X8 are heating or cooling interfaces. The seventh interface X5 is connected to the first relay J1 and the sixth resistor R6. The eighth interface X8 is connected to the second relay J2 and the seventh resistor R7. One end of the sixth resistor R6 and the seventh resistor R7 is grounded.

[0093] Furthermore, the first communication interface X3 and the second communication interface X4 are communication interfaces. The first communication interface X3 is respectively connected to the sixteenth resistor R16 and the seventeenth resistor R17. One end of the seventeenth resistor R17 is grounded. The other ends of the sixteenth resistor R16 and the seventeenth resistor R17 are commonly connected to the first receiver U5. The other end of the first receiver U5 is connected to the first serial port RXD2 and the second serial port TXD2. The first receiver U5 is connected to the CPU chip U1 through the first serial port RXD2 and the second serial port TXD2.

[0094] The second communication interface X4 is connected to the second receiver U7, and the second receiver U7 is connected to the fifth capacitor C6, the sixth capacitor C6, the twelfth capacitor C12, and the thirteenth capacitor C13. One end of the fifth capacitor C6 is grounded, and one end of the second receiver U7 is connected to the third serial port RXD1 and the fourth serial port TXD1. The second receiver U7 is connected to the CPU chip U1 through the third serial port RXD1 and the fourth serial port TXD1.

[0095] The first power supply P1, the second power supply P2, and the third power supply P3 are the power supply parts. One end of the first power supply P1 is connected to the ninth interface X1, and the other end is grounded and connected to the fourth capacitor C4, the seventeenth capacitor C17, the eighteenth capacitor C18, and the nineteenth capacitor C19. One end of the second power supply P2 is connected to the first power supply P1 and the other end is grounded. One end of the third power supply P3 is connected to the first power supply P1 and the second power supply P2, and the other end of the third power supply P3 is grounded.

[0096] Chip U8 uses ADS1118IDGSR-C55347, CPU chip U1 uses STC8A8K64S4-QFP44, receiver U5 uses 75LBC184, receiver U7 uses MAX3232E, relay J1 and relay J2 use G6C1114P respectively, P1 uses LED02-23B05, P2 uses HLK-2M05, and P3 uses HLK-PM01.

[0097] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A cabinet temperature monitoring device, characterized in that: include: The temperature acquisition host, temperature acquisition unit and RS485 communication module are distributed and installed in the cabinet; The temperature acquisition host provides multiple RS485 communication acquisition channels; The temperature acquisition unit provides independent temperature acquisition data conversion; The RS485 communication module establishes network communication with the communication host; The temperature acquisition host is connected to the temperature acquisition unit and the RS485 communication module respectively to realize real-time temperature acquisition of each cabinet and perform data conversion and data upload in sequence.

2. The cabinet temperature monitoring device according to claim 1, characterized in that: The temperature acquisition unit and the RS485 communication module are installed together in a module; The temperature acquisition unit and the RS485 communication module measure the temperature and convert it into a digital value.

3. The cabinet temperature monitoring device according to claim 2, characterized in that: The temperature acquisition host is connected to the RS485 communication module via the RS485 bus and transmits the measured temperature data.

4. The cabinet temperature monitoring device according to claim 3, characterized in that: The temperature acquisition unit adopts a K-type thermocouple probe or a semiconductor integrated sensor; The K-type thermocouple probe collects the tiny electromotive force of the thermocouple to form a digital signal and calculates the temperature value through digital filtering and operation by the CPU; The semiconductor integrated sensor acts as a CPU to read the register of the chip according to a predetermined time sequence to obtain temperature data and control heating or cooling according to temperature control parameters.

5. The cabinet temperature monitoring device according to claim 4, characterized in that: A circuit of a group of K-type thermocouple probes includes a first chip, a first interface, a first resistor, an eighth resistor, a ninth resistor, a tenth resistor, a third capacitor, an eighth capacitor, and a tenth capacitor; Another group of K-type thermocouple probe circuits includes a first chip, a second interface, a twelfth resistor, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a fourteenth capacitor, a fifteenth capacitor, and a sixteenth capacitor; The ninth resistor and the fourteenth resistor are grounded, one end of the eighth resistor is connected to the fourth pin of the first chip, the tenth resistor is connected to the fifth pin of the power chip, and the other ends of the eighth resistor and the tenth resistor are connected to the first resistor and the ninth resistor respectively; The thirteenth resistor is connected to the sixth pin of the first chip, the fifteenth resistor is connected to the seventh pin of the first chip, and the other ends of the thirteenth resistor and the fifteenth resistor are connected to the twelfth resistor and the fourteenth resistor; An RC circuit is formed by the third capacitor, the eighth capacitor, the tenth capacitor, the fourteenth capacitor, the fifteenth capacitor, and the sixteenth capacitor; A first interface, a second interface, a third interface, and a fourth interface are formed on the other side of the first chip, and the first chip is connected to the CPU chip through the first interface, the second interface, the third interface, and the fourth interface.

6. The cabinet temperature monitoring device according to claim 4, characterized in that: The circuit of the semiconductor integrated sensor includes a fifth interface and a sixth interface; One end of the fifth interface and the sixth interface is grounded; The fifth interface is connected to a second resistor, and the other end of the second resistor is connected to a temperature sensor; The sixth interface is connected to a third resistor, and the other end of the third resistor is connected to a temperature sensor.

7. The cabinet temperature monitoring device according to claim 6, characterized in that: include: The seventh and eighth interfaces for heating or cooling; The seventh interface is connected to the first relay and the sixth resistor; The eighth interface is connected to the second relay and the seventh resistor; One end of the sixth resistor and the seventh resistor is grounded.

8. A cabinet temperature monitoring device according to claim 5 or 6, characterized in that: include: a first communication interface and a second communication interface; The first communication interface is respectively connected to a sixteenth resistor and a seventeenth resistor, one end of the seventeenth resistor is grounded, the other ends of the sixteenth resistor and the seventeenth resistor are commonly connected to a first receiver, the other end of the first receiver is connected to a first serial port and a second serial port, and the first receiver is connected to the CPU chip through the first serial port and the second serial port; The second communication interface is connected to a second receiver, the second receiver is connected to a fifth capacitor, a sixth capacitor, a twelfth capacitor, and a thirteenth capacitor, one end of the fifth capacitor is grounded, and one end of the second receiver is connected to the third serial port and the fourth serial port, and the second receiver is connected to the CPU chip through the third serial port and the fourth serial port.

9. A cabinet temperature monitoring device according to claim 5 or 6, characterized in that: include: a first power source, a second power source, and a third power source; One end of the first power supply is connected to the ninth interface, and the other end is grounded and connected to the fourth capacitor, the seventeenth capacitor, the eighteenth capacitor, and the nineteenth capacitor; One end of the second power supply is connected to the first power supply, and the other end of the second power supply is grounded; One end of the third power supply is connected to the first power supply and the second power supply respectively, and the other end of the third power supply is grounded.

10. A cabinet temperature monitoring device according to claim 5 or 6, characterized in that: The first chip specifically uses ADS1118IDGSR-C55347; The CPU chip specifically uses STC8A8K64S4-QFP44; The first receiver specifically uses 75LBC184; The second receiver specifically uses MAX3232E; The first relay and the second relay specifically adopt G6C1114P; The first power supply specifically adopts LED02-23B05; The second power supply specifically adopts HLK-2M05; The third power supply specifically adopts HLK-PM01.

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