Temperature pre-control device and heat conductivity coefficient tester
By introducing a pre-temperature control device into the thermal conductivity measurer, the sample to be tested is heated to the preset temperature before measurement, which solves the problems of long test time and large fluctuations in the results, and efficient and accurate thermal conductivity measurement is achieved.
Patent Information
- Application Number
- CN202422159240.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-09-02
AI Technical Summary
The existing thermal conductivity measurement devices have problems such as long test time and large fluctuations in the test results, especially when quickly measuring ultra-low thermal conductivity samples, the accuracy and repeatability are insufficient.
The pre-temperature control device is adopted to set up two relatively set temperature control boards and temperature control systems to form a temperature control space that accommodates the sample to be tested. The sample is first heated to the preset temperature, and then the thermal conductivity coefficient is measured to reduce the measurement time of the sample in the measuring instrument.
It improves the testing efficiency of the thermal conductivity measurer, while ensuring the accuracy and repeatability of the measurement results, shortening the test time without affecting the measurement structure.
Smart Images
Figure CN223295919U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of detection equipment, and particularly relates to a pre-temperature control device and a thermal conductivity coefficient measuring instrument. Background Art
[0002] As a key parameter characterizing a material's thermal properties, accurate assessment of thermal conductivity is crucial for the development and production of composite materials. Currently, the guarded hot plate method, based on Fourier's one-dimensional heat transfer law, is the most widely used method both domestically and internationally. However, this method has drawbacks such as strict requirements on the shape and thickness of the test piece, a limited measurement range, and prolonged measurement time. Therefore, this method is primarily used to measure the thermal insulation properties of building materials and is inadequate for rapidly determining samples with ultra-low thermal conductivity, such as vacuum insulation panels.
[0003] In order to meet the demand for rapid measurement of ultra-low thermal conductivity samples, a rapid thermal conductivity measuring instrument using the hot wire method has been developed on the market. The rapid thermal conductivity measuring instrument only takes tens of seconds to obtain the result, which is highly efficient. However, since the hot wire method is a non-steady-state test, there is no protection during the heat transfer process, and heat dissipates rapidly. Therefore, the rapid thermal conductivity measuring instrument lacks control over accuracy and repeatability. If the thermal conductivity of the test sample is lower than 1.8mW / mk or the thickness is greater than 20mm, the result error is large, so the accuracy of the measurement result cannot be guaranteed.
[0004] Therefore, in view of the above shortcomings, the present invention is proposed. Utility Model Content
[0005] The purpose of the utility model is to provide a pre-temperature control device and a thermal conductivity tester to solve the problems of long test time and large fluctuation of test results in the thermal conductivity test device in the prior art.
[0006] The first aspect of the present invention provides a pre-temperature control device for protecting a hot plate method thermal conductivity tester, comprising a temperature control plate and a temperature control system, wherein the number of the temperature control plates is two and they are arranged opposite to each other to form a temperature control space for accommodating a sample to be tested; the temperature control system is connected to the two temperature control plates respectively for adjusting the temperature of the temperature control plates; wherein
[0007] The sample to be tested is placed in a temperature-controlled space and heated to a preset temperature by the pre-temperature control device, and then the thermal conductivity is measured by the guarded hot plate method thermal conductivity tester.
[0008] The pre-temperature control device provided by the utility model may also have the following additional technical features:
[0009] In a specific embodiment of the present invention, the temperature control system is a water-cooled temperature control system or a semiconductor temperature control system.
[0010] In a specific embodiment of the present invention, the temperature adjustment range of the temperature control plate is 0-80°C.
[0011] In a specific embodiment of the present invention, flame-retardant thermal insulation cotton is further provided on the temperature control plate, and the flame-retardant thermal insulation cotton is arranged on the sides of the temperature control plate that are away from each other.
[0012] In a specific embodiment of the present invention, the temperature control plate is any one of a flat temperature control plate, a curved temperature control plate, a mesh temperature control plate, a tubular temperature control plate, a spherical temperature control plate or a flexible temperature control plate.
[0013] In a specific embodiment of the present invention, it further comprises a guide rail and two mounting racks, the temperature control plate is respectively mounted on the two mounting racks, and at least one of the mounting racks is slidably mounted on the guide rail.
[0014] In a specific implementation manner of the present invention, the temperature control plates are arranged in parallel up and down, and the mounting frame located above is slidably mounted on the guide rail.
[0015] In a specific implementation manner of the present invention, the two temperature control plates are arranged in series.
[0016] In a specific embodiment of the present invention, a temperature sensor is further included. The temperature sensor is arranged on the temperature control plate and is used to detect the temperature of the sample to be tested.
[0017] The second aspect of the present invention further provides a thermal conductivity coefficient measuring instrument, comprising any one of the pre-temperature control devices described above.
[0018] The present invention takes the thermal conductivity measuring instrument as its starting point, and provides two temperature control plates that are arranged opposite to each other to form a temperature control space for accommodating the test sample, and a temperature control system that is connected to the temperature control plates to adjust the temperature of the temperature control plates. In this way, when performing thermal conductivity measurement, the test sample can first be placed in the temperature control space between the two temperature control plates and heated to a preset temperature, and then moved to the thermal conductivity measuring instrument for thermal conductivity measurement. This can reduce the measurement time of the test sample in the thermal conductivity measuring instrument, that is, improve the test efficiency of the thermal conductivity measuring instrument. That is, the present invention shares the work of heating the test sample to the specified temperature by providing a pre-temperature control device, thereby minimizing the time of the pre-heating stage of the test sample while keeping the thermal conductivity measurement process unchanged, thereby shortening the test time of the thermal conductivity measuring instrument and improving the test efficiency of the thermal conductivity measuring instrument. At the same time, since the test process of the thermal conductivity measuring instrument remains unchanged, the accuracy of the test structure of the thermal conductivity measuring instrument is not affected. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0020] Figure 1 It is a structural schematic diagram of the pre-temperature control device in the utility model.
[0021] Description of reference numerals:
[0022] 100-pre-temperature control device;
[0023] 10-temperature control board, 20-temperature control system, 30-flame retardant insulation cotton, 40-guide rail, 50-mounting rack. DETAILED DESCRIPTION
[0024] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.
[0025] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.
[0026] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.
[0027] For ease of description, spatially relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "below" another element or feature would then be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein are interpreted accordingly.
[0028] An embodiment of the present invention provides a pre-temperature control device 100, which is mainly used in a thermal conductivity measuring instrument, specifically, a thermal conductivity measuring instrument that uses a guarded hot plate method to measure thermal conductivity, and is used to preheat a sample to be tested, thereby minimizing the time of the pre-heating stage during the testing of the sample to be tested, thereby improving the measurement efficiency of the thermal conductivity measuring instrument.
[0029] Specifically, refer to Figure 1 The pre-temperature control device 100 provided in an embodiment of the present invention includes a temperature control plate 10 and a temperature control system 20. There are two temperature control plates 10, which are arranged opposite to each other to form a temperature control space for accommodating the sample to be tested; the temperature control system 20 is connected to the two temperature control plates 10 respectively, and is used to adjust the temperature of the temperature control plates 10; wherein the sample to be tested is placed in the temperature control space and heated to a preset temperature by the pre-temperature control device 100, and then the thermal conductivity is measured by a thermal conductivity coefficient tester using a guarded hot plate method.
[0030] This embodiment takes the thermal conductivity measuring instrument's method of slowly heating a test sample to a specified temperature as its starting point. By providing two temperature control plates 10 disposed opposite to each other to form a temperature-controlled space for accommodating the test sample, and a temperature control system 20 connected to the temperature control plates 10 to adjust the temperature of the temperature control plates 10, when performing thermal conductivity measurement, the test sample can first be placed in the temperature-controlled space between the two temperature control plates 10 and heated to a preset temperature. Thereafter, the test sample can be moved to the thermal conductivity measuring instrument for thermal conductivity measurement. This reduces the measurement time of the test sample in the thermal conductivity measuring instrument, thereby improving the test efficiency of the thermal conductivity measuring instrument while maintaining the accuracy of the test results obtained by the thermal conductivity measuring instrument. That is, this embodiment shares the work of heating the sample to be tested to the specified temperature by providing the pre-temperature control device 100, thereby minimizing the time of the pre-heating stage of the sample to be tested while keeping the thermal conductivity measurement process unchanged, thereby shortening the test time of the thermal conductivity measuring instrument and improving the test efficiency of the thermal conductivity measuring instrument. At the same time, since the test process of the thermal conductivity measuring instrument has not changed, the accuracy of the test structure of the thermal conductivity measuring instrument is not affected.
[0031] In a specific embodiment of the present invention, the temperature control system 20 is a water-cooled temperature control system 20 or a semiconductor temperature control system 20. Thus, the pre-temperature control setting in this embodiment can match both water-cooled and semiconductor mode thermal conductivity testers.
[0032] The water-cooling temperature control system 20 includes a precision constant temperature water tank, which is composed of a refrigeration circuit, a water tank, a water pump, a stirring system, a heating temperature control device, and a water temperature display. The refrigeration circuit is used to cool the water in the water tank to reduce the water temperature, the heating temperature control device is used to heat the water to increase the water temperature in the water tank, and the stirring system is used to stir to accelerate the reduction of the water temperature in the water tank. The refrigeration circuit and the heating control device are supplemented by the stirring system to achieve precise control of the water temperature in the water tank. Specifically, the water temperature stability in the water tank is required to be better than ±0.005°C. The water temperature display is used to display the water temperature in the water tank in real time. A liquid circuit is formed between the water tank and the temperature control plate 10. The water pump is arranged on the liquid circuit and is used to drive the water source to flow between the temperature control plate 10 and the water tank, thereby achieving temperature control of the temperature control plate 10.
[0033] The liquid circuit on the temperature control plate 10 can be a water pipe or a circulation groove opened on the temperature control plate 10, and the water pipe or circulation groove is arranged in a spiral to cover the entire area of the temperature control plate 10, thereby providing temperature uniformity on the temperature control plate 10.
[0034] Alternatively, the temperature control system 20 adopts a semiconductor temperature control system 20. In this case, the semiconductor temperature control system 20 includes a main control board circuit and multiple semiconductor refrigerators. The semiconductor refrigerators are installed on the insulation board and can be driven by the main control circuit to achieve temperature control.
[0035] In a specific embodiment of the present invention, the temperature control plate 10 has a temperature adjustment range of 0-80°C.
[0036] Specifically, the test results of the guarded hot plate method thermal conductivity tester vary by approximately 2% to 3% between -20°C and 80°C, indicating high accuracy within this range. In this embodiment, the temperature adjustment range of the temperature control plate 10 is set based on the optimal test range of the thermal conductivity tester. This not only ensures compatibility with the thermal conductivity tester, ensuring its practicality, but also avoids the waste of materials and components caused by setting an excessively large temperature range. This reduces the material cost of the pre-temperature control device 100 and facilitates its widespread application.
[0037] In a specific embodiment of the present invention, flame retardant heat-insulating cotton 30 is further provided on the temperature control plate 10 , and the flame retardant heat-insulating cotton 30 is provided on the side surfaces of the temperature control plate 10 that are away from each other.
[0038] Specifically, the flame-retardant insulation cotton 30 is primarily made from inorganic non-metallic materials such as glass fiber, rock wool, and aluminum silicate fiber through a special process. It exhibits excellent high-temperature resistance, low thermal conductivity, superior thermal insulation, and outstanding flame retardancy. In this embodiment, there are two flame-retardant insulation cottons 30. The outer contour of each flame-retardant insulation cotton 30 is substantially the same as that of the temperature control plate 10, and the flame-retardant insulation cotton 30 is slightly larger than the temperature control plate 10. The flame-retardant insulation cotton 30 is positioned on opposing sides of the two temperature control plates 10 to provide insulation for each.
[0039] In this embodiment, by providing a flame retardant insulation layer on the opposite sides of the temperature control plate 10, the temperature control plate 10 can be well insulated, thereby reducing heat loss on the temperature control plate 10, improving the heating efficiency of the temperature control plate 10, and improving the temperature accuracy of the temperature control plate 10.
[0040] In a specific embodiment of the present invention, the temperature control plate 10 is any one of a flat temperature control plate 10, a curved temperature control plate 10, a mesh temperature control plate 10, a tubular temperature control plate 10, a spherical temperature control plate 10, or a flexible temperature control plate 10. This allows for a variety of structures of the temperature control plate 10, allowing it to be used to heat test samples of different shapes, thereby expanding its application range.
[0041] The shapes of the two temperature control plates 10 can be the same or different. Even if they have the same shape, the two temperature control plates 10 can be arranged bilaterally symmetrically or centrally symmetrically, which can be determined according to the shape of the sample to be tested.
[0042] Optionally, the same pre-temperature control device 100 may be provided with one or more of a flat temperature control plate 10, a curved temperature control plate 10, a mesh temperature control plate 10, a tubular temperature control plate 10, a spherical temperature control plate 10 or a flexible temperature control plate 10, so that when used, a temperature control plate 10 of a suitable shape can be selected according to the shape of the sample to be tested.
[0043] Optionally, the size of the flat temperature control board 10 is approximately (100-500) mm×(100-500) mm, and optionally, the size of the flat temperature control board 10 is approximately 300 mm×300 mm. The thickness of the flat temperature control board 10 ranges from 10 mm to 100 mm, wherein the thickness of the flame retardant insulation layer ranges from 5 mm to 40 mm.
[0044] In a specific embodiment of the present invention, a guide rail 40 and two mounting racks 50 are further included. The temperature control plate 10 is respectively mounted on the two mounting racks 50 , and at least one mounting rack 50 is slidably mounted on the guide rail 40 .
[0045] Specifically, the pre-temperature control device 100 also includes a fixture frame, a guide rail 40 mounted on the fixture frame, and a mounting bracket 50 mounted on the fixture frame or the guide rail 40. After installation, the two mounting brackets 50 are arranged in parallel. A mounting bracket 50 is connected to each of the opposing sides of the temperature control plate 10, so that the two temperature control plates 10 are arranged relative to each other via the mounting brackets 50. Because at least one mounting bracket 50 is slidably mounted on the guide rail 40, the position of the temperature control plate 10 on the corresponding mounting bracket 50 can be adjusted by adjusting the position of the mounting bracket 50 on the guide rail 40, thereby adjusting the relative distance between the two temperature control plates 10. This allows the pre-temperature control device 100 to be used for heating test pieces with varying thicknesses.
[0046] In a specific embodiment of the present invention, the temperature control plates 10 are arranged in parallel up and down, and the mounting bracket 50 located above is slidably mounted on the guide rail 40. In this way, the mounting bracket 50 located below is fixedly connected to the tooling frame, that is, the temperature control plate 10 located below is fixedly arranged, and because it is arranged horizontally, it can be used to support the sample to be tested; while the mounting bracket 50 located above is slidably mounted on the guide rail 40, that is, the position of the temperature control plate 10 located above can be relatively adjusted. In this way, the relative distance between the two temperature control plates 10 can be adjusted by adjusting the position of the upper mounting bracket 50. After adjustment, the temperature control plate 10 located above will be attached to the upper surface of the sample to be tested under the action of gravity. In this way, the two temperature control plates 10 are respectively attached to the upper and lower surfaces of the sample to be tested, thereby ensuring heating uniformity.
[0047] It should be noted that the temperature control plate 10 can also be set vertically. In this case, the two temperature control plates 10 can be stably clamped to the sample to be tested by limiting the mounting frame 50. For example, a block is set on the tooling frame, or the mounting frame 50 and the guide rail 40 are set as a slider screw, or a robotic arm is set and the position of the mounting frame 50 is adjusted by the robotic arm, etc., which will not be repeated here.
[0048] In one embodiment of the present invention, two temperature control plates 10 are arranged in series. Specifically, by arranging the two temperature control plates 10 in series, the temperature uniformity of the two temperature control plates 10 can be improved, the temperature difference between the two temperature control plates 10 can be reduced, and the temperature uniformity of the heated sample to be tested can be improved.
[0049] In one embodiment of the present invention, a temperature sensor is further included. The temperature sensor is located on the temperature control plate 10 and is used to detect the temperature of the sample to be tested. The temperature sensor can be used to obtain temperature information of the sample to be tested, and based on this temperature information, it can be determined whether the sample to be tested has been preheated. When the sample to be tested is preheated, a prompt is provided to remove it for subsequent measurement.
[0050] That is, this embodiment can control the temperature of the sample to be tested in real time by providing a temperature sensor, thereby facilitating the control of the heating progress and prompting the user to remove the sample to be tested when the temperature reaches a preset temperature.
[0051] A second aspect of the present invention further provides a thermal conductivity measuring instrument comprising any of the above-described pre-temperature control devices 100. The structure of the pre-temperature control device 100 is similar to that of the above-described embodiments. Since the thermal conductivity measuring instrument of this embodiment includes the pre-temperature control device 100 of all of the above-described embodiments, it also exhibits at least the beneficial effects of the above-described embodiments, which will not be further elaborated here.
[0052] Optionally, the thermal conductivity meter is also provided with a transmission device, and the conveying device is arranged between the temperature control plate 10 and the test platform of the thermal conductivity meter. When the temperature of the sample to be tested reaches a predetermined value, the conveying device automatically opens and conveys the sample to be tested to the test platform of the thermal conductivity meter for thermal conductivity testing.
[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A pre-temperature control device, characterized in that: A thermal conductivity tester for a guarded hot plate method, comprising a temperature control plate and a temperature control system, wherein the temperature control plates are two in number and are arranged opposite to each other to form a temperature control space for accommodating the sample to be tested; the temperature control system is connected to the two temperature control plates respectively to adjust the temperature of the temperature control plates; The sample to be tested is placed in a temperature-controlled space and heated to a preset temperature by the pre-temperature control device, and then the thermal conductivity is measured by the guarded hot plate method thermal conductivity tester.
2. The pre-temperature control device according to claim 1, characterized in that: The temperature control system is a water cooling temperature control system or a semiconductor temperature control system.
3. The pre-temperature control device according to claim 1, characterized in that: The temperature adjustment range of the temperature control plate is 0-80°C.
4. The pre-temperature control device according to claim 1, characterized in that: The temperature control plate is also provided with flame retardant heat-insulating cotton, and the flame retardant heat-insulating cotton is arranged on the sides of the temperature control plate that are away from each other.
5. The pre-temperature control device according to claim 1, characterized in that: The temperature control plate is any one of a flat temperature control plate, a curved temperature control plate, a mesh temperature control plate, a tubular temperature control plate, a spherical temperature control plate or a flexible temperature control plate.
6. The pre-temperature control device according to claim 1, characterized in that: It also includes a guide rail and two mounting racks. The temperature control plate is respectively mounted on the two mounting racks, and at least one mounting rack is slidably mounted on the guide rail.
7. The pre-temperature control device according to claim 6, characterized in that: The temperature control plates are arranged in parallel up and down, and the mounting frame located above is slidably mounted on the guide rail.
8. The pre-temperature control device according to claim 1, characterized in that: The two temperature control plates are arranged in series.
9. The pre-temperature control device according to claim 1, characterized in that: It also includes a temperature sensor, which is arranged on the temperature control plate and is used to detect the temperature of the sample to be tested.
10. A thermal conductivity measuring instrument, characterized in that: The invention comprises the pre-temperature control device according to any one of claims 1 to 9.