Automatic calibration type test tool for packaging device

Abstract

The utility model discloses an automatic calibration type test tool for a packaging device. Comprising a test base provided with a test circuit, a switching device used for electrically connecting a to-be-tested packaging device with the test circuit in the test base, and a pressing mechanism used for pressing the to-be-tested packaging device to enable the to-be-tested packaging device to be in good contact with the switching device. The pressing mechanism comprises a three-axis linear module fixedly arranged on the test base, a pressing force application assembly assembled at the output end of the three-axis linear module, and a pressure sensor which is assembled on the pressing force application assembly and is used as a force application end to be in contact with the to-be-tested packaging device, and further comprises a controller which is in signal connection with the three-axis linear module and the pressure sensor. According to the utility model, automatic pressing test of the to-be-tested packaging device is realized, good contact between the to-be-tested packaging device and the switching device and the test circuit can be ensured, accurate test data is further ensured, and damage to the to-be-tested packaging device, the switching device, the test circuit and the like is avoided.

Description

Technical Field

[0001] The utility model relates to an auxiliary tool used for performance evaluation and function verification of a packaged device, in particular to an automatic calibration test fixture for the packaged device. Background Art

[0002] Packaged device test fixtures are specialized equipment or tools used to evaluate and verify the performance and functionality of electronic packages. These tools help engineers conduct tests during production and R&D to ensure that packaged devices meet design specifications and quality standards.

[0003] Because traditional test fixtures require engineers to manually press the components, they often experience insufficient, excessive, or uneven pressure. Insufficient pressure can cause poor contact between the packaged device under test and the underlying adapter, resulting in inaccurate test data. Excessive pressure can damage the packaged device under test, the adapter, and the test circuitry of the test fixture. Generally, the pin contact surfaces of the packaged device under test are designed to be parallel to the adapter. Uneven pressure, resulting in excessive pressure on one portion of the packaged device under test and insufficient pressure on another, can lead to both poor contact and mechanical damage.

[0004] To solve the problem of pressing force, mechanical limiters are currently used. That is, mechanical limits are added to traditional test fixtures to limit the pressing stroke in order to accurately apply pressure to the packaged device under test. However, the actual effect is not ideal, because the debugging of the mechanical limiter is aimed at a brand new adapter. As the adapter is used more and more times, the adapter will produce mechanical deformation and varying degrees of wear. At this time, using the mechanical limit position determined in the early debugging will cause poor contact between the packaged device under test and the adapter. Utility Model Content

[0005] The utility model provides an automatic calibration test fixture for packaged devices, which aims to solve the problems of inaccurate test data and damage to the adapter, test circuit and packaged device to be tested caused by uneven, excessive or insufficient pressing force in traditional test fixtures.

[0006] To achieve the above-mentioned objectives, the technical solution adopted by the present invention is as follows: an automatic calibration test fixture for packaged devices, comprising a test base provided with a test circuit, an adapter device for electrically connecting the packaged device to be tested to the test circuit in the test base, and a pressing mechanism for pressing the packaged device to be tested to ensure good contact between the packaged device to be tested and the adapter device;

[0007] The pressing mechanism includes a three-axis linear module fixed on the test base, a pressing force component installed on the output end of the three-axis linear module, and a pressure sensor installed on the pressing force component for serving as a force end in contact with the packaged device to be tested. It also includes a controller connected to the three-axis linear module and the pressure sensor signals respectively.

[0008] As a limitation of the present invention, the pressing force applying component is assembled on the output end of the three-axis linear module through a spherical connector.

[0009] As a further limitation of the present invention, the pressing force applying assembly includes a bracket fixed to the bottom end of the spherical connector and a pressing plate assembled below the bracket by a screw;

[0010] The pressure sensor is assembled at the force-applying portion of the pressing cover.

[0011] As a further limitation of the present invention, the pressing force applying assembly further includes a trapezoidal pressing block for being placed between the pressure sensor and the packaged device to be tested.

[0012] As another limitation of the present invention, the pressing mechanism further includes a display connected to the pressure sensor signal.

[0013] As a further limitation of the present invention, the display and the pressure sensor are connected by plugging.

[0014] As a further limitation of the present invention, a signal transmission line with a shielding effect is used between the display and the pressure sensor.

[0015] As other limitations of the present invention, the test base includes a base and a test circuit board fixed on the base; a groove for placing the adapter device is provided on the central upper surface of the base, and a through hole is provided in the center of the test circuit board for the adapter device to extend from the groove to the upper surface of the test circuit board.

[0016] Due to the adoption of the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0017] (1) The utility model utilizes a three-axis linear module and a pressing force component to realize automatic pressing test of the packaged device to be tested, and realizes real-time monitoring of the pressing state by adding a pressure sensor. When the relevant monitoring data is fed back to the controller, the controller can control the action of the three-axis linear module according to the monitoring data, so as to automatically level the pressing force component and automatically adjust the pressing force, thereby realizing precise force application on the packaged device to be tested, ensuring good contact between the packaged device to be tested and the adapter and test circuit, ensuring the accuracy of the test data, and avoiding damage to the packaged device to be tested, the adapter and the test circuit, etc., thereby making up for the shortcomings of traditional test tooling in this regard.

[0018] (2) For micro-sized packaged devices, the present invention compensates for the problem of lack of suitable sensors by adding a trapezoidal pressure block.

[0019] (3) The present invention can intuitively feed back relevant monitoring data to engineers by providing a display connected to the pressure sensor signal, so that engineers can make corresponding adjustments to the equipment based on the monitoring data when necessary.

[0020] (4) The display of the present invention adopts a plug-in design, which can be removed for storage when not in use. It can also be removed or replaced with a longer signal transmission line during high and low temperature environment testing, so that the display can be kept away from high and low temperature environments and have stronger adaptability.

[0021] (5) The transmission part between the pressure sensor and the display in the present invention adopts a signal shielding design (the signal transmission line has a shielding effect), which can prevent crosstalk with the signal of the packaged device to be tested and affect the accuracy of the test data. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0023] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0024] Figure 2 This is a front view of the structural relationship of an embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the split structure of an embodiment of the utility model;

[0026] Figure 4 Schematic diagram of the contact position of the pressure sensor, the packaged device to be tested, and the adapter in the embodiment of the present utility model;

[0027] Figure 5 This is a schematic structural diagram of an embodiment of the present invention when a trapezoidal pressing block is used;

[0028] Figure: 1. Test base; 2. Adapter; 3. Three-axis linear module; 4. Press force component; 5. Pressure sensor; 6. Ball connector; 7. Trapezoidal pressure block; 8. Packaged device under test;

[0029] 101. Base; 102. Test circuit board; 103. Groove; 104. Through hole;

[0030] 201. Bracket; 202. Pressing plate; 203. Screw. DETAILED DESCRIPTION

[0031] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and understand the present invention and are not intended to limit the present invention.

[0032] Embodiment An automatic calibration test tool for packaging devices

[0033] like Figures 1 to 3 As shown, this embodiment includes a test base 1, a switching device 2 and a pressing mechanism.

[0034] The test base 1 includes a base 101 for stably placing on a workbench, and a test circuit board 102 fixed on the base 101. In this embodiment, the base 101 and the test circuit board 102 are both rectangular structures, but they can also be set to circular or other shapes according to the situation. Figure 3 As shown, a recess 103 is provided at the center of the upper surface of the base 101 for accommodating the adapter 2. A through-hole 104 is provided at the center of the test circuit board 102, corresponding to the recess 103. A test circuit corresponding to the packaged device 8 under test is soldered onto the test circuit board 102. Depending on the actual situation, the test circuit can also be provided on the test circuit board 102 using non-soldering methods, such as press-fitting, PCB (printed circuit board), 3D printing, etc.

[0035] The adapter 2 is used to electrically connect the packaged device 8 to be tested with the test circuit in the test circuit board 102 to successfully complete the test. Figure 4 As shown, the adapter 2 is placed in the groove 103 of the base 101 and extends through the central through hole 104 of the test circuit board 102 to the upper surface of the test circuit board 102. When subjected to downward pressure, it can effectively contact the test circuit soldered on the upper surface of the test circuit board 102. The adapter 2 in this embodiment is a conventional structure, such as a probe, an interposer, a spring, etc.

[0036] The pressing mechanism is used to press the packaged device 8 to be tested stacked on the adapter 2, so as to ensure good contact between the packaged device 8 to be tested and the test circuit through the adapter 2. Figure 1 and Figure 3 As shown, the pressing mechanism includes a three-axis linear module 3, a pressing force assembly 4, a pressure sensor 5, and a controller. The three-axis linear module 3 is fixed to the test base 1 and is a conventional structure capable of movement in the X, Y, and Z directions. In this embodiment, the output end of the three-axis linear module 3 is located directly above the test base 1.

[0037] The pressing force component 4 is assembled on the output end of the three-axis linear module 3 through the ball connector 6. Figure 3As shown, the pressure-applying assembly 4 includes a bracket 201 fixed to the bottom end of the spherical connector 6 (the top end of the spherical connector 6 is fixed to the output end of the three-axis linear module 3) and a pressure plate 202 assembled below the bracket 201 via multiple screws 203. In actual use, the screws 203 can be used to adjust the distance between the pressure plate 202 and the bracket 201, thereby adjusting the distance between the force-applying portion at the bottom of the pressure plate 202 and the upper surface of the test base 1.

[0038] The pressure sensor 5 is mounted on the force-applying portion of the pressing plate 202 in the pressing force-applying assembly 4. It can act as the force-applying end of the pressing plate 202 to contact the packaged device 8 to be tested or the adapter 2, thereby monitoring the magnitude of the pressing force applied to the packaged device 8 to be tested. In this embodiment, a plurality of pressure sensors 5 are distributed on the pressing plate 202. When pressing against the packaged device 8 to be tested, the bottom ends of all the pressure sensors 5 contact different positions of the packaged device 8 to be tested and the adapter 2, specifically, Figure 4 shown.

[0039] The controller is connected to the three-axis linear module 3 and the pressure sensor 5. When the packaged device 8 is pressed, the controller analyzes the pressure signal from the pressure sensor 5 and adjusts the movement of the three-axis linear module 3 in real time to precisely apply force to the packaged device 8. This embodiment also integrates an information transmission module into the controller to enable wired or wireless data transmission (transmitting information to external devices or receiving instructions from external devices), facilitating large-scale data aggregation and automated control. This information transmission module can be a Si24R1 module integrated into the controller.

[0040] To display relevant data monitored by pressure sensor 5 to engineers, this embodiment also includes a display (not shown in the accompanying drawings) connected to the pressure sensor 5. The display uses a conventional structure, with a shielded signal transmission line between the display and the pressure sensor 5. The connection between the display and the pressure sensor 5 is pluggable, meaning a shielded pluggable structure, such as an SMA connector, is provided on the signal transmission line. To enhance the intuitiveness of the displayed data, the display can be programmed to provide a judgment function: abnormal data will display a different color, alerting the engineer to the current status.

[0041] In order to solve the problem that there is no suitable pressure sensor 5 for the micro-miniature packaged device, this embodiment also configures a trapezoidal pressure block 7. Figure 5 As shown, when testing a micro-packaged device, after the pressing plate 202 is raised by adjusting the screw 203, the trapezoidal pressing block 7 is placed between the pressure sensor 5 and the packaged device 8 to be tested, and the force applied by the pressure sensor 5 is transmitted to the packaged device 8 to be tested through the trapezoidal pressing block 7.

[0042] When using this embodiment, first place the packaged device 8 to be tested on the central through hole 104 of the test circuit board 102, so that the packaged device 8 to be tested and the adapter device 2 are stacked up and down; then start the equipment, the controller controls the three-axis linear module 3 to press down along the Z axis, and controls the pressure sensor 5 to press the packaged device 8 to be tested and the adapter device 2, so that the packaged device 8 to be tested is in good contact with the test circuit through the adapter device 2 to complete the corresponding test; during this period, the pressure sensor 5 transmits the pressure signal to the controller, and the controller analyzes it in real time. When it is determined that the pressing force on the packaged device 8 to be tested and the adapter device 2 is uneven, the three-axis linear module 3 is controlled to move along the X axis and the Y axis, and the displacement is transmitted to the bracket 201, the pressing plate 202 and the pressure sensor 5 in sequence through the spherical connector 6 to achieve the purpose of adjusting the uneven pressing force.

[0043] In actual use, this embodiment can be used alone or installed in automatic testing equipment for combined use.

[0044] It should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art may still modify the technical solutions described in the above embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An automatic calibration test fixture for packaged devices, characterized by: It includes a test base provided with a test circuit, a switching device for electrically connecting the packaged device to be tested with the test circuit in the test base, and a pressing mechanism for pressing the packaged device to be tested to ensure good contact between the packaged device to be tested and the switching device; The pressing mechanism includes a three-axis linear module fixed on the test base, a pressing force component installed on the output end of the three-axis linear module, and a pressure sensor installed on the pressing force component for serving as a force end in contact with the packaged device to be tested. It also includes a controller connected to the three-axis linear module and the pressure sensor signals respectively.

2. The automatic calibration test fixture for packaged devices according to claim 1, characterized in that: The pressing force component is assembled on the output end of the three-axis linear module through a spherical connector.

3. The automatic calibration test fixture for packaged devices according to claim 2, characterized in that: The pressing force applying assembly includes a bracket fixed to the bottom end of the spherical connector and a pressing plate assembled below the bracket through a screw rod; The pressure sensor is assembled at the force-applying portion of the pressing cover.

4. The automatic calibration test fixture for packaged devices according to claim 3, characterized in that: The pressing force applying assembly further includes a trapezoidal pressing block for being placed between the pressure sensor and the packaged device to be tested.

5. An automatic calibration test fixture for packaged devices according to any one of claims 1 to 4, characterized in that: The pressing mechanism also includes a display connected to the pressure sensor signal.

6. The automatic calibration test fixture for packaged devices according to claim 5, characterized in that: The display and pressure sensor are connected by plug-in.

7. The automatic calibration test fixture for packaged devices according to claim 6, characterized in that: A shielded signal transmission line is used between the display and the pressure sensor.

8. An automatic calibration test fixture for packaged devices according to any one of claims 1-4, 6, and 7, characterized in that: The test base includes a base and a test circuit board fixed on the base; a groove for placing the adapter is provided on the central upper surface of the base, and a through hole is provided in the center of the test circuit board for the adapter to extend from the groove to the upper surface of the test circuit board.

Images