Power semiconductor multi-station detection device

Abstract

The utility model relates to the technical field of power semiconductor detection, and discloses a power semiconductor multi-station detection device, which comprises a base on which a turntable driven by a transmission assembly to rotate intermittently is arranged, and the base is provided with a detection station for installing a detection assembly and a blanking station; a bearing plate; a main clamping block; the lifting rod is slidably mounted at the position, corresponding to the lower part of the detection position, of the base; the power semiconductor is moved towards the bearing plate and squeezed into the position between the two main clamping blocks until the power semiconductor is located below the rolling wheels and is clamped by the elastic force recovered by the two main clamping blocks, and therefore pressing type automatic clamping can be achieved, the main clamping blocks do not need to be moved repeatedly, and automatic clamping can be achieved by pressing the power semiconductor downwards. Therefore, automatic feeding of the power semiconductor during inspection is realized. And the power semiconductor on the bearing plate rotating to the discharging position is lifted by the lifting rod which is driven by the first driving source to ascend, so that automatic discharging of the power semiconductor after detection can be realized.

Description

Technical Field

[0001] The utility model specifically relates to the technical field of power semiconductor detection, in particular to a power semiconductor multi-station detection device. Background Art

[0002] Power semiconductor devices are one of the important research topics in the semiconductor field. They are mainly used in power processing units of modern electronic systems. In power-driven high-voltage and power integrated circuits and systems, it is necessary to test the input / output performance and load conditions of high-voltage and power integrated circuits to achieve real-time protection of circuits and systems, meet the intelligentization of integrated circuits and systems, and effectively ensure the normal and reliable operation of the system.

[0003] The existing multi-station inspection device for power semiconductors requires workers to manually adjust the separation of the clamping parts until the power semiconductor is placed between them, and then release the push on the clamping parts, or move the clamping parts again to load the power semiconductor. After the inspection is completed, the above steps need to be repeated to unload the power semiconductor. In addition, the time waiting for the clamping parts to move for clamping during inspection and loading is long, and the power semiconductor needs to be held for a long time, which can easily cause the surface of the power semiconductor to be worn or generate water vapor under the temperature of the hand. That is, it is impossible to achieve automatic loading and unloading while realizing multi-station inspection, which is inconvenient to use. The automatic unloading of power semiconductor multi-station inspection devices on the market is mostly achieved by directly pushing away the power semiconductor in the clamping state. This method will cause wear on the surface of the power semiconductor. Utility Model Content

[0004] The purpose of the present invention is to provide a power semiconductor multi-station detection device to address the deficiencies in the prior art, so as to solve the technical problem that automatic loading and unloading cannot be achieved during multi-station detection.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A multi-station detection device for power semiconductors, comprising:

[0007] A base is provided with a turntable which is driven to rotate intermittently by a transmission assembly, and the base is provided with a detection position for installing a detection assembly and a material unloading position;

[0008] A plurality of carrying plates are arranged in a circle on the turntable. When the turntable rotates, the detection position and the material discharge position are aligned with two carrying plates respectively.

[0009] A main clamping block, elastically connected to the carrier plate, wherein the main clamping blocks are two in number and arranged opposite to each other on the carrier plate, and are used to clamp the power semiconductor, and each main clamping block is rotatably mounted with a roller that contacts the power semiconductor; and

[0010] The lifting rod is slidably mounted on a position below the base corresponding to the detection position and slidably cooperates with a through hole on the bearing plate located on the detection position. The lifting rod is driven to rise and fall by a first driving source.

[0011] As a further solution of the present invention: the two rollers are rotatably mounted on the top surface of each main clamping block respectively, and the two rollers are located at the interval between the two main clamping blocks.

[0012] As a further solution of the present invention: several auxiliary clamping blocks are arranged between the two main clamping blocks, and the surfaces of the auxiliary clamping blocks in contact with the power semiconductors are rotatably installed with rollers. A limiting ring is fixed on the supporting plate, and the limiting ring is respectively connected to the two main clamping blocks and multiple auxiliary clamping blocks through several elastic parts.

[0013] As a further solution of the present invention: a push plate is slidably installed on the lifting rod, and the push plate is driven to move in translation by a second driving source installed on the lifting rod, so as to laterally push the power semiconductor after the lifting rod is lifted.

[0014] As a further solution of the present invention: the transmission assembly includes:

[0015] A cam is rotatably mounted on the base and driven to rotate by an output source, wherein a sliding post is provided on a protruding portion of the cam; and

[0016] The driven wheel is rotatably mounted on the base and coaxially fixedly connected to the turntable. The driven wheel is circumferentially provided with a plurality of sliding grooves that slide with the sliding columns, and the plurality of sliding grooves correspond to the plurality of bearing plates respectively.

[0017] As a further solution of the present invention: a loading position is also provided on the base, and the detection position is provided between the loading position and the unloading position. A loading assembly installed on the base is provided at the loading position, which is used to clamp the power semiconductor and lower it to the loading assembly on the supporting plate. When the turntable finishes rotating, the loading position is aligned with a supporting plate.

[0018] Beneficial effects of the utility model:

[0019] (1) In the present invention, the power semiconductor is moved toward the carrier plate and squeezed between the two main clamping blocks, and the roller rotates until the power semiconductor is located under the roller and is clamped by the elastic force of the two main clamping blocks. In this way, press-type automatic clamping can be achieved, and there is no need to repeatedly move the main clamping blocks. The power semiconductor can be automatically clamped by pressing it downward, thereby realizing automatic loading during power semiconductor inspection. The power semiconductor on the carrier plate that has been turned to the unloading position is lifted by the lifting rod driven by the first driving source. During this process, the power semiconductor contacts the roller and drives it to rotate until the power semiconductor is lifted above the roller. Automatic unloading of the power semiconductor after inspection can be realized without manually releasing the clamping of the power semiconductor again.

[0020] (2) In the present invention, the use of a plurality of auxiliary clamping blocks can achieve adaptive clamping according to the size and specific surface shape of the power semiconductor, thereby improving the applicability of the present invention;

[0021] (3) In the present invention, when the lifting rod is used to lift the power semiconductor at the unloading position, the push plate rises synchronously, and when the lifting rod rises to the top of its moving path, the second driving source drives the push plate to move horizontally to push the power semiconductor into the collection box, thereby realizing automatic unloading and collection of the power semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0024] Figure 2 It is a structural diagram of the turntable in the utility model;

[0025] Figure 3 This is a schematic diagram of the structure of the push plate in the utility model;

[0026] Figure 4 This utility model Figure 1 A local enlarged structural diagram of point A;

[0027] Figure 5 It is a structural diagram of the transmission component in the utility model.

[0028] In the figure: 1. base; 2. turntable; 3. bearing plate; 4. transmission assembly; 401. cam; 402. slide column; 403. driven wheel; 404. slide groove; 5. limit ring; 6. main clamping block; 7. roller; 8. elastic member; 9. through hole; 10. lifting rod; 11. first driving source; 12. push plate; 13. second driving source; 14. collection box; 15. auxiliary clamping block. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] See also Figures 1-4 As shown, the utility model is a power semiconductor multi-station detection device, comprising:

[0031] A base 1 is provided with a turntable 2 which is driven to rotate intermittently by a transmission component 4. The base 1 is provided with a detection position for installing a detection component and a material discharge position;

[0032] A plurality of carrying plates 3 are arranged in a circle on the turntable 2. When the turntable 2 finishes rotating, the detection position and the material discharge position are aligned with two carrying plates 3 respectively.

[0033] A main clamping block 6 is elastically connected to the carrier plate 3. There are two main clamping blocks 6 arranged opposite to each other on the carrier plate 3 for clamping the power semiconductor. A roller 7 is rotatably mounted on each main clamping block 6 for contacting the power semiconductor.

[0034] The lifting rod 10 is slidably mounted on the base 1 at a position below the corresponding detection position, and is slidably engaged with the through hole 9 on the bearing plate 3 located at the detection position. The lifting rod 10 is driven to rise and fall by the first driving source 11 .

[0035] Among them, each of the supporting plates 3 is provided with a through hole 9. When the supporting plate 3 moves to align with the unloading position, the through hole 9 thereon is coaxially aligned with the lifting rod 10; the first driving source 11 can be selected from hydraulic cylinders, air cylinders and other components, and can also be selected from other mechanisms that can achieve linear motion. This embodiment does not make specific limitations here.

[0036] In one case of this embodiment, the two rollers 7 are rotatably mounted on the top surface of each main clamping block 6 , and the two rollers 7 are located at the interval between the two main clamping blocks 6 .

[0037] Specifically, a loading position is also provided on the base 1, and the detection position is provided between the loading position and the unloading position. A loading assembly installed on the base 1 is provided at the loading position, which is used to clamp the power semiconductor and lower it to the loading assembly on the supporting plate 3. When the turntable 2 finishes rotating, the loading position is aligned with a supporting plate 3.

[0038] It should be noted that the detection component, loading component, first drive source 11 and other electrical components described in this application are all connected to the external controller. The detection component, loading component and external controller are all existing technologies, and this application does not improve them. Therefore, there is no need to disclose their specific mechanical structure and circuit structure, which does not affect the integrity of this application.

[0039] In actual application of this embodiment, in the initial state, the distance between the two main clamping blocks 6 is the smallest; the power semiconductor is moved toward the carrier plate 3 and squeezed between the two main clamping blocks 6, and the roller 7 rotates until the power semiconductor is located under the roller 7 and is clamped by the elastic force of the two main clamping blocks 6. In this way, press-type automatic clamping can be achieved, and there is no need to repeatedly move the main clamping blocks 6. The power semiconductor can be automatically clamped by pressing it downward, thereby realizing automatic loading when inspecting the power semiconductor; when in use, the power semiconductor can be lowered by the loading assembly or placed manually; the transmission assembly 4 drives the turntable 2 During the intermittent rotation, the supporting plate 3 that has been rotated to the loading position is loaded with power semiconductors, the supporting plate 3 that has been rotated away from the loading position rotates toward the detection position, the power semiconductors on the supporting plate 3 that has been rotated to the detection position are detected by the detection component, the supporting plate 3 that has been rotated away from the detection position rotates toward the lowering position, and the power semiconductors on the supporting plate 3 that has been rotated to the unloading position are lifted by the lifting rod 10 driven by the first driving source 11. During this process, the power semiconductor contacts the roller 7 and drives it to rotate until the power semiconductor is lifted above the roller 7, so that automatic unloading of the power semiconductor can be realized after detection, and there is no need to manually release the clamping of the power semiconductor again.

[0040] like Figures 1-4 As shown, as a preferred embodiment of the present invention, a plurality of auxiliary clamping blocks 15 are arranged between the two main clamping blocks 6, and the surfaces of the auxiliary clamping blocks 15 that are in contact with the power semiconductor are rotatably mounted with rollers 7, and a limiting ring 5 is fixed on the supporting plate 3, and the limiting ring 5 is respectively connected to the two main clamping blocks 6 and the plurality of auxiliary clamping blocks 15 through a plurality of elastic members 8.

[0041] In one case of this embodiment, the elastic member 8 can be selected from the following Figure 3 The spring shown can also be replaced by other elastic components, such as silicone columns, springs, etc., which are not specifically limited in this embodiment.

[0042] In actual application of this embodiment, the provision of a plurality of auxiliary clamping blocks 15 can achieve adaptive clamping according to the size and specific surface shape of the power semiconductor, thereby improving the applicability of the present invention.

[0043] like Figures 1-4As shown, as a preferred embodiment of the present invention, a push plate 12 is slidably installed on the lifting rod 10, and the push plate 12 is driven to move horizontally by a second driving source 13 installed on the lifting rod 10, and is used to push the power semiconductor laterally after the lifting rod 10 is lifted.

[0044] In one case of this embodiment, a collection box 14 is provided on the base 1 at a position below the material discharge position, and the collection box 14 is located below the turntable 2; the second driving source 13 can be a hydraulic cylinder, a pneumatic cylinder and other components, or other mechanisms capable of achieving linear motion, which is not specifically limited in this embodiment.

[0045] In actual application of this embodiment, when the lifting rod 10 lifts the power semiconductor at the unloading position, the push plate 12 rises synchronously, and when the lifting rod 10 rises to the top of its moving path, the second driving source 13 drives the push plate 12 to move horizontally to push the power semiconductor into the collection box 14, thereby realizing automatic unloading and collection of the power semiconductor.

[0046] like Figure 1-Figure 5 As shown, as a preferred embodiment of the present invention, the transmission assembly 4 includes:

[0047] A cam 401 is rotatably mounted on the base 1 and driven to rotate by an output source, and a sliding post 402 is provided on a protruding portion of the cam 401; and

[0048] The driven wheel 403 is rotatably mounted on the base 1 and coaxially fixedly connected to the turntable 2. The driven wheel 403 is circumferentially provided with a plurality of sliding grooves 404 that slide with the sliding column 402, and the plurality of sliding grooves 404 correspond to the plurality of bearing plates 3 respectively.

[0049] In one case of this embodiment, the output source may be a motor assembly, or a gear assembly or a pulley assembly driven by a motor, as long as it can cause the cam 401 to rotate. This embodiment does not make any specific limitations here.

[0050] When this embodiment is actually used, the output source drives the cam 401 to rotate, driving the slide 402 to rotate. When the slide 402 rotates to the driven wheel 403, the slide 402 continues to rotate and slides into the slide groove 404, and then drives the driven wheel 403 to rotate through the slide groove 404 until the slide 402 rotates away from the slide groove 404. At this time, another slide groove 404 rotates to the position where the slide 402 contacts the driven wheel 403. In this reciprocating manner, the intermittent rotation of the driven wheel 403 can be realized, and then the intermittent rotation of the turntable 2 can be realized, so that the multiple supporting plates 3 can rotate back and forth between the loading position, the detection position and the unloading position.

[0051] Working principle of the present invention: The present invention provides a multi-station detection device for power semiconductors in the above embodiment. The power semiconductor is moved toward the carrier plate 3 and squeezed between the two main clamping blocks 6. Then the roller 7 rotates until the power semiconductor is located under the roller 7 and is clamped by the elastic force restored by the two main clamping blocks 6. In this way, press-type automatic clamping can be achieved. There is no need to repeatedly move the main clamping blocks 6. The power semiconductor can be automatically clamped by pressing it downward, thereby realizing automatic loading when inspecting the power semiconductor. When in use, the power semiconductor can be lowered by clamping the loading component or placed manually. The transmission component 4 carries During the intermittent rotation of the movable turntable 2, the supporting plate 3 that is rotated to the loading position is loaded with power semiconductors, the supporting plate 3 that is rotated away from the loading position rotates toward the detection position, the power semiconductors on the supporting plate 3 that is rotated to the detection position are detected by the detection component, the supporting plate 3 that is rotated away from the detection position rotates toward the lowering position, and the power semiconductors on the supporting plate 3 that is rotated to the unloading position are lifted by the lifting rod 10 driven by the first driving source 11. During this process, the power semiconductor contacts the roller 7 and drives it to rotate until the power semiconductor is lifted above the roller 7, so that automatic unloading of the power semiconductor can be realized after detection, and there is no need to manually release the clamping of the power semiconductor again.

[0052] The above describes an embodiment of the present invention in detail. However, the above content is only a preferred embodiment of the present invention and should not be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent application of the present invention.

Claims

1. A power semiconductor multi-station detection device, characterized in that: include: A base (1) is provided with a turntable (2) which is driven to rotate intermittently by a transmission assembly (4), and a detection position for installing a detection assembly and a material discharge position are provided on the base (1); A plurality of bearing plates (3) are arranged in a circular pattern on the turntable (2); when the turntable (2) finishes rotating, the detection position and the material discharge position are aligned with the two bearing plates (3) respectively; A main clamping block (6) is elastically connected to the carrier plate (3), wherein the number of the main clamping blocks (6) is two and they are arranged opposite to each other on the carrier plate (3) and are used to clamp the power semiconductor, and each of the main clamping blocks (6) is rotatably mounted with a roller (7) that contacts the power semiconductor; and The lifting rod (10) is slidably mounted on the base (1) at a position below the corresponding detection position and is slidably engaged with the through hole (9) on the supporting plate (3) located at the detection position. The lifting rod (10) is driven to rise and fall by the first driving source (11).

2. A power semiconductor multi-station detection device according to claim 1, characterized in that: The two rollers (7) are rotatably mounted on the top surface of each main clamping block (6), and the two rollers (7) are located at the interval between the two main clamping blocks (6).

3. A power semiconductor multi-station detection device according to claim 1, characterized in that: A plurality of auxiliary clamping blocks (15) are provided between the two main clamping blocks (6), and rollers (7) are rotatably mounted on the surfaces of the auxiliary clamping blocks (15) that are in contact with the power semiconductor. A limiting ring (5) is fixed on the supporting plate (3), and the limiting ring (5) is respectively connected to the two main clamping blocks (6) and the plurality of auxiliary clamping blocks (15) through a plurality of elastic members (8).

4. The power semiconductor multi-station detection device according to claim 1, characterized in that: A push plate (12) is slidably mounted on the lifting rod (10), and the push plate (12) is driven to move in translation by a second driving source (13) mounted on the lifting rod (10), and is used to laterally push the power semiconductor after the lifting rod (10) is lifted.

5. The power semiconductor multi-station detection device according to claim 1, characterized in that: The transmission assembly (4) comprises: A cam (401) is rotatably mounted on the base (1) and driven to rotate by an output source, wherein a sliding post (402) is provided on a protruding portion of the cam (401); and The driven wheel (403) is rotatably mounted on the base (1) and coaxially fixedly connected to the turntable (2). The driven wheel (403) is circumferentially provided with a plurality of sliding grooves (404) that are slidably engaged with the sliding column (402), and the plurality of sliding grooves (404) correspond one to one with the plurality of bearing plates (3).

6. The power semiconductor multi-station detection device according to claim 1, characterized in that: The base (1) is also provided with a loading position, and a detection position is provided between the loading position and the unloading position. A loading assembly mounted on the base (1) is provided at the loading position for clamping a power semiconductor and lowering it to the loading assembly on the carrier plate (3). When the turntable (2) finishes rotating, the loading position is aligned with a carrier plate (3).

Images