Three-temperature device for testing integrated circuit chip

Abstract

The utility model discloses a three-temperature device for testing an integrated circuit chip, which relates to the technical field of chip testing and comprises a box body, a testing clamp, an evaporator, a coolant delivery pipe, a temperature control heater and a testing nozzle, a heating device used for heating gas in the box body is arranged in the box body, and an access door is arranged on the box body. An environment nozzle is arranged in the box body, and a conveying track used for conveying integrated circuit chips is arranged on the box body in a penetrating manner; the conveying track can convey the integrated circuit chip to the test fixture; the coolant conveying pipe is also connected with the environment nozzle so as to convey a coolant to the box body through the environment nozzle; the temperature control heater is communicated with the evaporator and is used for heating gas passing through the temperature control heater; and the test nozzle is arranged on the test clamp and is connected with the temperature control heater. According to the utility model, the temperature stability of the integrated circuit chip during testing can be ensured, and the detection accuracy is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a three-temperature device for testing integrated circuit chips. Background Art

[0002] Packaged integrated circuit chips require electrical testing to understand their performance and stability at various temperatures. During packaged chip testing, the integrated circuit chips must be tested at different temperatures to assess their performance and failure rates. In existing technology, high-temperature and low-temperature testing equipment are typically separate. A three-temperature device is a device that performs low-temperature, room-temperature, and high-temperature testing. Currently, three-temperature devices used to test chips at different temperatures experience large temperature fluctuations and take a long time to reach the preset temperature, resulting in low efficiency and an inability to quickly meet test accuracy requirements. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a three-temperature device for testing integrated circuit chips, which can ensure a stable temperature for testing integrated circuit chips and improve detection accuracy.

[0004] According to the first embodiment of the present invention, a three-temperature device for integrated circuit chip testing includes: a box, a test fixture, an evaporator, a coolant delivery pipe, a temperature-controlled heater, and a test nozzle. The box is provided with a heating device for heating the gas in the box, the box is provided with an environmental nozzle, the box is provided with an inspection door, and the box is provided with a conveying track for transporting integrated circuit chips; the test fixture is used to fix the integrated circuit chip under test; the evaporator is provided in the box, and the evaporator is a serpentine tube; the coolant delivery pipe is connected to the evaporator. The coolant enters the evaporator through the coolant delivery pipe to absorb heat and evaporate to cool the gas in the box. The coolant delivery pipe is also connected to the environmental nozzle to deliver the coolant to the box through the environmental nozzle; the temperature control heater is connected to the evaporator, and the temperature control heater is used to heat the gas passing through the temperature control heater; the test nozzle is arranged on the test fixture and connected to the temperature control heater. The coolant evaporated in the evaporator enters the temperature control heater and is heated, and then is sprayed from the test nozzle onto the integrated circuit chip located on the test fixture.

[0005] According to some embodiments of the present invention, an air source for providing compressed air is provided outside the box body, and the air source is connected to an air heater to input compressed air into the air heater. After the compressed air is heated by the air heater, it is transported to the temperature-controlled heater through a compressed air pipeline.

[0006] According to some embodiments of the present invention, a one-way valve is provided on the compressed air pipeline to prevent gas from flowing from the temperature-controlled heater to the air heater.

[0007] According to some embodiments of the present invention, the test fixture is provided with multiple test contact pieces to simultaneously clamp multiple integrated circuit chips, and the temperature control heater and the test nozzle are also provided with multiple to respectively control the temperature of the gas sprayed to each integrated circuit chip.

[0008] According to some embodiments of the present invention, a plurality of temperature sensors are provided on the test fixture to respectively detect the temperature of the gas sprayed from the test nozzle to each of the integrated circuit chips.

[0009] According to some embodiments of the present invention, the temperature sensor is electrically connected to a controller, and the controller adjusts the heating power of the corresponding temperature-controlled heater according to the temperature detected by the temperature sensor, so that the air temperature at the corresponding temperature sensor is maintained at a preset value.

[0010] According to some embodiments of the present invention, a circulating fan is provided in the box to make the temperature of the gas in the box uniform.

[0011] According to some embodiments of the present invention, the circulation fan, the evaporator, the heating device, and the environmental nozzle are symmetrically arranged in two groups within the box.

[0012] According to some embodiments of the present invention, the box body is at least partially made of thermal insulation material to reduce energy consumption.

[0013] A three-temperature device for integrated circuit chip testing according to an embodiment of the present invention has at least the following beneficial effects:

[0014] (1) On the basis of heating and cooling the air in the box, a test nozzle is set to blow high-temperature or low-temperature gas to the integrated circuit chip to be tested, which improves the efficiency of heating and cooling the integrated circuit chip while ensuring temperature stability;

[0015] (2) The coolant entering the temperature control heater is vaporized by the evaporator to ensure the stability of the air flow ejected from the test nozzle;

[0016] (3) The temperature of multiple integrated circuit chips can be controlled separately through multiple temperature-controlled heaters, thereby improving detection efficiency.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 This is a schematic diagram of a box body according to an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram of the installation structure of an embodiment of the utility model;

[0021] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0022] Figure 4 This is a schematic diagram of a coolant delivery pipe and a compressed air pipeline according to an embodiment of the present invention.

[0023] Figure Number:

[0024] Box 100, heating device 110, environmental nozzle 120, feeding hole 130, circulation fan 140, motor 141;

[0025] Integrated circuit chip 200;

[0026] Test fixture 300, test contact piece 310, temperature sensor 320;

[0027] Evaporator 400;

[0028] Coolant delivery pipe 500;

[0029] Temperature controlled heater 600;

[0030] Test nozzle 700;

[0031] Gas source 800;

[0032] Air heater 900 and compressed air pipeline 910. DETAILED DESCRIPTION

[0033] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientation or positional relationship indicated by up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In the description of this utility model, "a plurality" means more than two. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0036] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0037] Reference Figures 1 to 4As shown, an embodiment of the present invention is a three-temperature device for testing integrated circuit chips, comprising: a housing 100, a test fixture 300, an evaporator 400, a coolant delivery pipe 500, a temperature-controlled heater 600, and a test nozzle 700. A heating device 110 for heating the gas within the housing 100 is provided within the housing 100. The heating device 110 can be a finned electric heating tube heater. An environmental nozzle 120 is provided within the housing 100; an inspection door is provided on the housing 100, and opening the inspection door allows for convenient replacement and maintenance of the test fixture 300, evaporator 400, coolant delivery pipe 500, temperature-controlled heater 600, test nozzle 700, etc. within the housing 100. A feed hole 130 is provided at the upper end of the housing 100 for the conveying track 101 to pass through. The integrated circuit chip 200 is an integrated circuit chip. To facilitate the movement of integrated circuit chips 200 in and out of the housing 100, a conveyor track 101 is provided. The conveyor track 101 passes through the housing 100 and guides the integrated circuit chips 200. As expected, the conveyor track 101 is vertically arranged. The specific structures of the conveyor track 101 and the driving mechanism for the movement of the integrated circuit chips 200 are conventional and will not be described in detail. A test fixture 300 is used to secure the integrated circuit chips 200 under test. Located at the bottom of the conveyor track 101, the test fixture 300 secures and positions the integrated circuit chips 200. The integrated circuit chips 200 can slide along the conveyor track 101 into the test fixture 300. An evaporator 400 is located within the housing 100; the evaporator 400 utilizes a serpentine copper tube. A coolant delivery pipe 500 is connected to the evaporator 400 and is also connected to a storage tank for coolant. A valve is provided on the coolant delivery pipe 500 to control the coolant flow rate. Low-temperature air or liquid nitrogen is used as the coolant. The coolant enters the evaporator 400 through the coolant delivery pipe 500, absorbs heat, and evaporates to cool the gas within the cabinet 100. The coolant changes from liquid to gas in the evaporator 400. The coolant delivery pipe 500 is also connected to the ambient nozzle 120 to deliver the coolant to the cabinet 100 through the ambient nozzle 120. After entering the cabinet 100, the coolant cools the air inside the cabinet 100. A temperature-controlled heater 600 is connected to the evaporator 400 and is used to heat the gas passing through it. The temperature-controlled heater 600 uses a heating wire heater with a relatively small heating element mass to reduce temperature regulation lag and improve temperature control sensitivity. The test nozzle 700 is set on the test fixture 300 and connected to the temperature control heater 600. The gaseous coolant evaporated in the evaporator 400 enters the temperature control heater 600 and is heated. It is then sprayed from the test nozzle 700 onto the integrated circuit chip 200 located on the test fixture 300, further cooling the integrated circuit chip 200.Directly heating the liquid coolant can easily cause bumping and pressure fluctuations, so the coolant is first converted to a gaseous state through the evaporator 400 before entering the temperature-controlled heater 600. The heating device 110 heats the air within the housing 100, and the coolant cools the air within the housing 100, allowing the temperature within the housing 100 to switch between high and low temperatures, thereby enabling testing of the integrated circuit chip 200 at three temperatures.

[0038] Reference Figures 1 to 4 As shown, it is understood that an air source 800 for providing compressed air is located outside the housing 100. Air source 800 utilizes an air compressor. Air source 800 is connected to an air heater 900, which feeds compressed air into the air heater 900. The compressed air is heated by the air heater 900 and then delivered to the temperature-controlled heater 600 via a compressed air line 910. During high-temperature testing, the integrated circuit chip 200 requires higher-temperature air for heating. Therefore, the coolant delivery line 500 is closed, and the higher-temperature, heated compressed air is used as the heating source for the integrated circuit chip 200, improving heating efficiency.

[0039] Reference Figures 1 to 4 As shown, it is understood that a one-way valve is provided on the compressed air pipeline 910 to prevent gas from flowing from the temperature control heater 600 to the air heater 900. When performing low-temperature testing, the air source 800 providing compressed air is closed. To prevent the coolant from flowing to the air heater 900 and causing coolant waste, a one-way valve is provided to prevent the gaseous coolant from flowing into the air heater 900.

[0040] Reference Figures 1 to 4 As shown, it is understood that the test fixture 300 is equipped with four or eight test contact pads 310 to simultaneously test four or eight integrated circuit chips 200. Four or eight temperature-controlled heaters 600 and test nozzles 700 are also provided to individually control the temperature of the gas sprayed onto each integrated circuit chip 200. By adjusting the power of the four or eight temperature-controlled heaters 600, the four or eight integrated circuit chips 200 can be tested at different temperatures. It is foreseeable that when performing different temperature tests, the temperature difference between the four or eight integrated circuit chips 200 at the same time will not exceed 200 degrees Celsius. When four or eight integrated circuit chips 200 need to be tested at the same temperature, the separate temperature-controlled heaters 600 prevent uneven heating from causing different temperatures on the integrated circuit chips 200. The specific structure and installation method of the test contact pads 310 are prior art and will not be described in detail.

[0041] Reference Figures 1 to 4As shown, it can be understood that the test fixture 300 is provided with multiple temperature sensors 320 to respectively detect the temperature of the gas blown from the test nozzle 700 to each integrated circuit chip 200 and the test contact pad 310. The temperature sensor 320 is located no more than 2 cm away from the integrated circuit chip 200 so that the temperature detected by the temperature sensor 320 is close to the temperature of the air on the surface of the integrated circuit chip 200.

[0042] Reference Figures 1 to 4 As shown, it is understood that the temperature sensor 320 is electrically connected to the controller. The specific structure of the controller is prior art and will not be described in detail. The controller adjusts the heating power of the corresponding temperature-controlled heater 600 according to the temperature detected by the temperature sensor 320, so that the air temperature at the corresponding temperature sensor 320 is maintained at a preset value. It is foreseeable that the temperature of the gas sprayed onto the integrated circuit chip 200 can also be controlled by adjusting the flow rate of compressed air or coolant. When the power of the temperature-controlled heater 600 is constant, the coolant flow rate is negatively correlated with the temperature of the gas sprayed onto the integrated circuit chip 200, and the compressed air flow rate is negatively correlated with the temperature of the gas sprayed onto the integrated circuit chip 200. When adjusting the temperature of the gas sprayed onto the integrated circuit chip 200, the compressed air or coolant flow rate can be controlled first for coarse adjustment, and then the power of the temperature-controlled heater 600 can be changed for fine adjustment.

[0043] Reference Figures 1 to 4 As shown, it is understood that a circulating fan 140 is provided within the housing 100 to uniformize the temperature of the air within the housing 100. This prevents temperature fluctuations of the integrated circuit chip 200 caused by uneven temperature distribution within the housing 100 during testing, thereby improving detection accuracy. The motor 141 that drives the circulating fan 140 is located outside the housing 100 to prevent damage to the motor 141 due to high temperatures. The circulating fan 140 is a cross-flow fan with uniform air output, and its blades are made of a high-temperature-resistant alloy.

[0044] Reference Figures 1 to 4 As shown, two groups of circulating fans 140, evaporators 400, heating devices 110, and ambient nozzles 120 are symmetrically arranged within the housing 100. This allows for a more uniform temperature distribution of the air within the housing 100. Each evaporator 400 is connected to two temperature-controlled heaters 600 to reduce the operating flow of a single evaporator 400, ensuring that the coolant is fully converted into gas within the evaporator 400.

[0045] Reference Figures 1 to 4 As shown, it is understood that the housing 100 is at least partially made of insulation material to reduce energy consumption. The inner layer of the housing 100 is made of stainless steel, and the outer layer is covered with a high-temperature resistant insulation material such as rock wool. This prevents heat from being lost through the housing 100 during heating and also maintains a stable temperature inside the housing 100.

[0046] Usage: Step S1: Determine the type of test to be performed. If a normal temperature test is performed, proceed to step S2; if a low temperature test is performed, proceed to step S3; if a high temperature test is performed, proceed to step S4;

[0047] Step S2: Four or eight integrated circuit chips 200 to be tested are slid onto the test fixture 300 via the conveyor track 101. The test contact pads 310 on the test fixture 300 are closed to clamp and secure the corresponding integrated circuit chips 200. The integrated circuit chips 200 are tested at room temperature.

[0048] Step S3: Open the valve on the coolant delivery pipe 500 and feed coolant into the evaporator 400 and the ambient nozzle 120 through the coolant delivery pipe 500. After the temperature inside the chamber 100 drops to a preset temperature, slide four or eight integrated circuit chips 200 to be tested onto the test fixture 300 via the delivery track 101. The test contact pads 310 on the test fixture 300 close, clamping and securing the corresponding integrated circuit chips 200. The temperature of the coolant flowing through the temperature-controlled heater 600 is controlled by adjusting the valve opening on the coolant delivery pipe 500 and activating the temperature-controlled heater 600. The coolant is then sprayed onto the surface of the integrated circuit chips 200 through the test nozzle 700, further cooling the integrated circuit chips 200. After the temperature measured by the temperature sensor 320 stabilizes at the preset value for three minutes, a low-temperature test is performed on the integrated circuit chips 200.

[0049] Step S4: Start the heating device 110 to heat the air in the box 100. After the temperature in the box 100 rises to the preset temperature, slide 4 or 8 integrated circuit chips 200 to be tested onto the test fixture 300 through the conveying track 101. The test contact pieces 310 on the test fixture 300 are closed to clamp and fix the corresponding integrated circuit chips 200. Start the air source 800 to input compressed air into the air heater 900. Start the air heater 900 to heat the compressed air flowing through the air heater 900. By adjusting the flow rate of the compressed air output by the air source 800 and starting the temperature control heater 600, the temperature of the air flowing through the temperature control heater 600 is controlled. After the temperature of the integrated circuit chip 200 stabilizes at the preset value for 3 minutes, a high temperature test is performed on the integrated circuit chip 200.

[0050] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A three-temperature device for testing integrated circuit chips, characterized in that: include: A box (100), wherein a heating device (110) for heating the gas in the box (100) is provided in the box (100), an environmental nozzle (120) is provided in the box (100), an access door is provided on the box (100), and a conveying track (101) for transporting integrated circuit chips (200) is passed through the box (100); A test fixture (300) is used to fix the integrated circuit chip (200) under test, and the transport track (101) can transport the integrated circuit chip (200) to the test fixture (300); An evaporator (400) is disposed in the housing (100), and the evaporator (400) is in the shape of a serpentine tube; A coolant delivery pipe (500) is connected to the evaporator (400), and the coolant enters the evaporator (400) through the coolant delivery pipe (500) to absorb heat and evaporate to cool the gas in the box (100). The coolant delivery pipe (500) is also connected to the ambient nozzle (120) to deliver the coolant to the box (100) through the ambient nozzle (120); a temperature-controlled heater (600), connected to the evaporator (400), the temperature-controlled heater (600) being used to heat the gas passing through the temperature-controlled heater (600); A test nozzle (700) is provided on the test fixture (300) and connected to the temperature control heater (600). The coolant evaporated in the evaporator (400) enters the temperature control heater (600) to be heated, and then is sprayed from the test nozzle (700) onto the integrated circuit chip (200) located on the test fixture (300).

2. The three-temperature device for integrated circuit chip testing according to claim 1, characterized in that: An air source (800) for providing compressed air is provided outside the box (100). The air source (800) is connected to an air heater (900) so as to input compressed air into the air heater (900). The compressed air is heated by the air heater (900) and then transported to the temperature-controlled heater (600) through a compressed air pipeline (910).

3. The three-temperature device for integrated circuit chip testing according to claim 2, characterized in that: A one-way valve is provided on the compressed air pipeline (910) to prevent gas from flowing from the temperature-controlled heater (600) to the air heater (900).

4. The three-temperature device for integrated circuit chip testing according to claim 3, characterized in that: The test fixture (300) is provided with a plurality of test contact pieces (310) for simultaneously clamping a plurality of the integrated circuit chips (200), and the temperature control heater (600) and the test nozzle (700) are also provided with a plurality of test contact pieces (310) for respectively controlling the temperature of the gas sprayed onto each of the integrated circuit chips (200).

5. The three-temperature device for integrated circuit chip testing according to claim 4, characterized in that: The test fixture (300) is provided with a plurality of temperature sensors (320) for respectively detecting the temperature of the gas sprayed from the test nozzle (700) to each of the integrated circuit chips (200) and the test contact piece (310).

6. The three-temperature device for integrated circuit chip testing according to claim 5, characterized in that: The temperature sensor (320) is electrically connected to a controller, and the controller adjusts the heating power of the corresponding temperature-controlled heater (600) according to the temperature detected by the temperature sensor (320), so that the air temperature at the corresponding temperature sensor (320) is maintained at a preset value.

7. The three-temperature device for integrated circuit chip testing according to claim 6, characterized in that: A circulating fan (140) is provided in the box (100) to make the temperature of the gas in the box (100) uniform.

8. The three-temperature device for integrated circuit chip testing according to claim 7, characterized in that: The circulation fan (140), the evaporator (400), the heating device (110), and the ambient nozzle (120) are symmetrically arranged in two groups within the box (100).

9. The three-temperature device for integrated circuit chip testing according to claim 8, characterized in that: The box (100) is at least partially made of heat-insulating material to reduce energy consumption and maintain stable temperatures of the integrated circuit chip (200) and the test contact piece (310) during testing.

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