Cassette module and gluing and developing device

Abstract

The utility model relates to the field of gluing and developing in semiconductor manufacturing, and provides a film magazine module, which is applied to a gluing and developing device and comprises a first loading station, a second loading station and a third loading station, the second loading station is used for loading the processed wafer; the second loading station is located on one side of the first loading station. The station entering and exiting robot is used for conveying the wafers on the first loading station to a wafer feeding main station and conveying the wafers on the wafer box wafer returning branch station to the second loading station; the wafer conveying manipulator is used for conveying the wafer on the wafer feeding main station to the wafer box wafer feeding branch station; the wafer box wafer returning branch station is positioned on the bottom side of the wafer box wafer feeding branch station; the wafer conveying mechanical arm is located on the first side or the second side of the wafer box module. And an auxiliary process unit is arranged on the opposite side of the wafer conveying manipulator and is used for carrying out auxiliary processing on the wafer. The wafer box module is used for meeting the production requirements of wafers with high throughput.

Description

Technical Field

[0001] The utility model relates to the field of gluing and developing in semiconductor manufacturing, in particular to a film box module and a gluing and developing device. Background Art

[0002] Currently, wafers are coated and developed using a coating and developing device. The cassette module, which connects the coating and developing modules, integrates a loading station, a main station, a branch station, and a wafer transfer robot. However, the limited space within the coating and developing device makes it difficult to accommodate the high-throughput wafer production requirements. Therefore, a cassette module and coating and developing device are urgently needed to address these issues. Utility Model Content

[0003] The utility model aims to provide a film box module and a glue coating and developing device. The film box module is used to meet the demand of high-throughput wafer production.

[0004] In the first aspect, the utility model provides a film box module, which is applied to a glue coating and developing device, including: a first loading station for loading wafers to be processed; a second loading station for loading processed wafers; an entry and exit robot for transferring the wafers on the first loading station to the main film feeding station, and transferring the wafers on the film box return branch station to the second loading station; a film transfer robot for transferring the wafers on the main film feeding station to the film box film feeding branch station; the film transfer robot is located on the first side or the second side of the film box module; an auxiliary process unit is arranged on the opposite side of the film transfer robot, and the auxiliary process unit is used to perform auxiliary processing on the wafers.

[0005] Optionally, the auxiliary process unit includes a liquid bottle 61 and a liquid pump 62; the liquid pump 62 is used to apply the liquid in the liquid bottle 61 to the wafer surface; the liquid is set to be photoresist or anti-reflective glue.

[0006] Optionally, a wafer transfer area is provided in the wafer box module, and the entry and exit robots and the wafer transfer manipulator are used to transfer wafers in the wafer transfer area.

[0007] Optionally, an air inlet unit is provided at the top of the wafer transfer area for blowing protective gas into the wafer transfer area to keep the wafer clean during the transfer process.

[0008] Optionally, an exhaust unit is provided at the bottom end of the film transmission area for extracting the gas from the film transmission area so that the gas in the film transmission area keeps flowing from top to bottom.

[0009] Optionally, the stacked plurality of cassette return branch stations are all arranged adjacent to the second loading station; the entry and exit robots are used to sequentially transfer the wafers on the plurality of cassette return branch stations to the second loading station.

[0010] In the second aspect, the utility model provides a gluing and developing device, comprising the film box module described in any one of the first aspects, the gluing and developing device also comprising: a gluing module, having a gluing frame and a gluing unit arranged in the gluing frame; the gluing unit is used to perform a gluing process on the wafer; the film box film feeding branch station is arranged in a one-to-one correspondence with the gluing frame in the gluing module; a developing module, having a developing frame and a developing unit arranged in the developing frame; the developing unit is used to perform a developing process on the wafer; the film box film returning branch station is arranged in a one-to-one correspondence with the developing frame in the developing module; the developing module and the gluing module are both arranged on the same side of the film box module; the developing module is located on the bottom side of the gluing module.

[0011] Optionally, the developing module and the gluing module are both located in the film conveying direction of the film box module; a plurality of developing units are symmetrically distributed on the first side and the second side of the developing module with respect to the film conveying direction; a plurality of coating units are symmetrically distributed on the first side and the second side of the gluing module with respect to the film conveying direction.

[0012] Optionally, the glue coating unit is connected to the outlet end of a glue pump, and the inlet end of the glue pump is connected to a glue bottle; the glue bottle contains photoresist; when the glue pump is turned on, it is used to apply the photoresist in the glue bottle to the wafer surface.

[0013] Optionally, an anti-reflection unit is further provided in the gluing frame, and the anti-reflection unit is used to apply an anti-reflection coating to the surface of the wafer; the robot in the gluing frame is used to first send the wafer to the anti-reflection unit, and then transfer the wafer from the anti-reflection unit to the gluing unit.

[0014] Optionally, a heat treatment module is also included; the heat treatment module includes a heat treatment frame; the total number of layers of the glue coating frame and the developing frame is the same as the number of layers of the heat treatment frame; a heat treatment unit is provided in the heat treatment frame for baking wafers; the robot in the heat treatment frame is used to transfer the wafer to the heat treatment unit and to take out the wafer area in the heat treatment unit.

[0015] Optionally, it also includes an interface module; the interface module is provided with a back wash robot and a forward wash robot; the back wash robot is used to move the wafers on the interface wafer feed branch station to the back wash unit; the forward wash robot is used to move the wafers on the forward wash unit to the interface wafer return branch station respectively; the back wash unit is used to clean the back side of the wafer, and the forward wash unit is used to clean the front side of the wafer.

[0016] The beneficial effects of the present invention are: by arranging the second loading station below the first loading station, the wafer transfer robot is located on one side of the wafer box module, and the auxiliary process unit is placed on the opposite side, which makes full use of the space, reduces the equipment footprint, and thus improves the overall processing capacity of the system, which can adapt to the high-throughput wafer production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the top structure of a film box module provided by the utility model;

[0018] Figure 2 A schematic cross-sectional view perpendicular to the Y direction of a film box module provided by the present invention;

[0019] Figure 3 A schematic cross-sectional view perpendicular to the X direction of a film box module provided by the present invention;

[0020] Figure 4 This is a schematic cross-sectional view perpendicular to the X direction of a cassette module with an externally mounted cache location provided by the present invention;

[0021] Figure 5 This is a cross-sectional schematic diagram perpendicular to the Y direction of a glue coating and developing device provided by the present invention;

[0022] Figure 6 This is a schematic top view of a glue coating and developing device provided by the present invention along the Z-reverse direction;

[0023] Figure 7 The utility model provides Figure 6 AA cross-sectional diagram in;

[0024] Figure 8 The utility model provides Figure 6 BB cross-section diagram in;

[0025] Figure 9 The utility model provides Figure 6 DD cross-section diagram in;

[0026] Figure 10 The utility model provides Figure 6 Schematic diagram of CC cross section in ;

[0027] Figure 11 The utility model provides Figure 6 EE cross-sectional diagram in ;

[0028] Figure 12 The utility model provides Figure 6 FF cross-sectional diagram in;

[0029] Figure 13 The utility model provides Figure 6 Schematic diagram of the GG cross section.

[0030] Description of reference numerals in the figures:

[0031] 100, cassette module; 200, liquid processing module; 300, interlayer module; 400, thermal processing module; 500, interface module. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0033] In view of the problems existing in the existing technology, such as Figure 1 and Figure 2 As shown, the utility model provides a film box module, which is applied to a glue coating and developing device, including: a first loading station for loading wafers to be processed; a second loading station for loading processed wafers; the second loading station is located on the bottom side of the first loading station; an entry and exit robot 1, used to transfer the wafers on the first loading station to the main film feeding station, and to transfer the wafers on the film box return branch station to the second loading station; a film transfer robot 2, used to transfer the wafers on the main film feeding station to the film box feed branch station; the film box return branch station is located on the bottom side of the film box feed branch station; the film transfer robot 2 is located on the first side or the second side of the film box module; an auxiliary process unit is arranged on the opposite side of the film transfer robot 2, and the auxiliary process unit is used to perform auxiliary processing on the wafers.

[0034] Reference Figure 2 As shown, in some specific embodiments, the film cassette feeding branch station includes adjacent stacked stations SCPC1, SCPC2 and SCPC3 equipped with cooling units. The film cassette returning branch station includes adjacent stacked stations PSI21, PSI22 and PSI23.

[0035] In some embodiments, the X, Y, and Z directions are perpendicular to each other. The Z direction is set to be vertically upward, and the first loading station LP1 is located in the Z direction of the second loading station LP2. The horizontal Y direction is set to point from the first side to the second side. The wafer transfer robot 2 is located in the Y direction of the auxiliary process unit. The horizontal X direction is set as the wafer feeding direction. Stations SCPC1, SCPC2, and SCPC3 are located in the X direction of the first loading station LP1. Stations PSI21, PSI22, and PSI23 are located in the X direction of the second loading station LP1.

[0036] In some embodiments, several stacked cassette return branch stations are arranged adjacent to the second loading station; the inbound and outbound robot 1 is used to transfer the wafers on the several cassette return branch stations to the second loading station in sequence.

[0037] like Figure 1 As shown, in some embodiments, the auxiliary process unit includes a liquid bottle 61 and a liquid pump 62; the liquid pump 62 is used to apply the liquid in the liquid bottle 61 to the wafer surface; the liquid is set to be photoresist or anti-reflective glue.

[0038] In some specific embodiments, the liquid bottle 61 is used to contain the photoresist, and when the liquid pump 62 is running, the photoresist in the liquid bottle 61 is transported to the wafer surface. In other specific embodiments, the liquid bottle 61 is used to contain the anti-reflective adhesive, and when the liquid pump 62 is running, the anti-reflective adhesive in the liquid bottle 61 is transported to the wafer surface.

[0039] In a more specific embodiment, a temperature control system is added to the liquid bottle 61 or the delivery pipeline to ensure that the liquid can be maintained at a preset constant temperature before being applied to the wafer surface. This helps to improve the uniformity and viscosity of the liquid, thereby ensuring the quality of the coating. In other specific embodiments, the liquid pump 62 can be equipped with a pressure regulating device to ensure that the liquid is delivered to the wafer surface at a stable pressure. This can avoid uneven coating thickness caused by pressure fluctuations. In some other specific embodiments, the liquid bottle 61 is also connected to a flow controller to ensure that the amount of liquid applied to the wafer each time is fixed, thereby improving the repeatability and consistency of the process.

[0040] In some embodiments, the stacked plurality of wafer cassette return branch stations are all arranged adjacent to the second loading station; the inbound and outbound robot 1 is used to sequentially transfer wafers on the plurality of wafer cassette return branch stations to the second loading station.

[0041] In some specific embodiments, the three stacked cassette return branch stations are each positioned adjacent to the second loading station; the inbound / outbound robot 1 is configured to sequentially transfer wafers from the three cassette return branch stations to the second loading station. In some examples, the three cassette return branch stations are designated PSI21, PSI22, and PSI23, respectively. It should be noted that the number of cassette return branch stations may be any positive integer.

[0042] like Figure 1 As shown, in some embodiments, a wafer transfer area 101 is provided in the wafer box module, and the entry and exit robot 1 and the wafer transfer manipulator 2 are used to transfer wafers in the wafer transfer area 101. In some specific embodiments, the boundary of the wafer transfer area 101 is defined as the outer contour of the movement of the entry and exit robot 1 and the wafer transfer manipulator 2 carrying the wafer. By defining the boundary of the wafer transfer area 101, this embodiment can clarify the working range of the manipulator and prevent it from exceeding the preset safety limit. This helps to reduce the probability of the manipulator colliding with other fixed equipment or moving parts. By reducing the occurrence of collisions and other accidents, the wear rate of the manipulator can be reduced, and its service life can be extended, thereby reducing the cost of repair and replacement parts.

[0043] In some examples, an air inlet unit is provided at the top of the wafer transfer area 101 for blowing protective gas into the wafer transfer area 101 to keep the wafers clean during transfer. This example effectively prevents external dust particles from entering the wafer transfer area 101, thereby maintaining the cleanliness of the wafers during transfer, which is crucial for semiconductor manufacturing because any tiny particle can cause defects on the wafer.

[0044] More specifically, the air inlet unit includes: a gas inlet, connected to a high-purity gas supply source, such as a nitrogen tank. A pre-filter, which initially filters out large particles of impurities to protect the back-end precision filtration equipment. A high-efficiency filter (HEPA or ULPA), which is used to filter out particles of 0.3 microns and above to achieve extremely high air quality standards. A regulating valve: controls the gas flow and adjusts the air inlet speed according to actual needs. A distribution pipe network, designed with multiple outlets or nozzles, ensures that the gas is evenly distributed above the entire transmission area. A gas control system, which monitors and automatically adjusts the gas flow and pressure parameters to maintain a stable working state.

[0045] In other examples, an exhaust unit is further provided at the bottom of the wafer transfer area 101 to extract air from the wafer transfer area 101, thereby maintaining a top-to-bottom flow of air within the wafer transfer area 101. In this example, by providing an exhaust unit at the bottom of the wafer transfer area 101, a unidirectional top-to-bottom airflow is created. This airflow direction helps to carry any particles that may enter the wafer transfer area 101 downward, rather than allowing them to remain suspended in the air, thereby reducing the risk of wafer surface contamination.

[0046] More specifically, the exhaust unit includes an exhaust port located at the bottom of the transmission area for collecting and discharging gas; an exhaust fan for generating negative pressure to drive gas flow, ensuring unidirectional flow from bottom to top; and an air duct for guiding gas to discharge smoothly, reducing resistance and noise.

[0047] like Figure 2 In the example shown, the in-and-out robot 1 is used to transfer wafers from the first loading station LP1 to the main wafer loading station. The in-and-out robot 1 is also used to sequentially transfer wafers from stations PSI21, PSI22, and PSI23 to the second loading station. This example directly transfers wafers from stations PSI21, PSI22, and PSI23 to the second loading station, eliminating the need for a main station and robot for transferring wafers in the return direction. This helps accelerate the transfer of wafers to the second loading station and prevents wafer accumulation along the wafer transfer route.

[0048] like Figure 3 and Figure 4 As shown, in some embodiments, a maintenance port is provided within the cassette module 100 to accommodate maintenance personnel entering the cassette module 100. Four loading stations are provided: the first loading station LP1 and the third loading station LP3 are used to load wafers to be processed; the second loading station LP2 and the fourth loading station LP4 are used to load processed wafers; LP1-LP4 are distributed along the edge of the maintenance port. Overhead crane positions ALP1-ALP4 are provided on the top side of the maintenance port to store wafers to be transferred into the first loading station LP1 and the third loading station LP3, and to store wafers removed from the second loading station LP2 and the fourth loading station LP4.

[0049] In some examples, the cassette module 100 is further provided with buffer positions BM1 - BM10 , which are respectively used to accommodate excess wafers in the loading station or the overhead crane station.

[0050] In some other examples, a manual position MLP is further provided in the cassette module 100 for storing wafers to be manually transferred to facilitate debugging of the cassette module. It is worth noting that the manual position MLP can be replaced by the cache position after debugging.

[0051] In some other examples, the overhead crane positions ALP11 - ALP15 may be mounted outside the film box module 100. In some other examples, the buffer position may also be mounted outside the film box module 100.

[0052] like Figure 5 and Figure 6 As shown, the second embodiment provides a glue coating and developing device, including the film box module 100 described in any one of the above embodiments, and the glue coating and developing device also includes: a glue coating module, having a glue coating frame and a glue coating unit arranged in the glue coating frame; the glue coating unit is used to perform a glue coating process on the wafer; the film box feeding branch station is arranged in a one-to-one correspondence with the glue coating frame in the glue coating module; a developing module, having a developing frame and a developing unit arranged in the developing frame; the developing unit is used to perform a developing process on the wafer; the film box returning branch station is arranged in a one-to-one correspondence with the developing frame in the developing module; the developing module and the glue coating module are both arranged on the same side of the film box module; the developing module is located on the bottom side of the glue coating module.

[0053] In some specific embodiments, the developing module and the gluing module are both located in the film conveying direction of the film box module 100; a plurality of developing units are symmetrically distributed on the first side and the second side of the developing module with respect to the film conveying direction; and a plurality of coating units are symmetrically distributed on the first side and the second side of the gluing module with respect to the film conveying direction.

[0054] In one example, the film transport direction is configured along the horizontal X direction. The stacking direction of the film cassette feed branch station and the film cassette return branch station is configured along the vertical Z direction. The X and Z directions form a vertical plane XZ, and the plurality of developing units are symmetrically distributed about the vertical plane XZ. The horizontal Y direction is configured to point from the first side to the second side. The X, Y, and Z directions are perpendicular to each other.

[0055] like Figure 7 In the illustrated embodiment, the wafer transfer robot 2 is used to transfer the wafers on the wafer feed station to the adhesion unit ADB, and to sequentially transfer the wafers on the adhesion unit ADB to the stations SCPC1, SCPC2, and SCPC3. In some more specific embodiments, the inbound and outbound robot 1 is used to transfer the wafers on the first loading station to the wafer feed station. This robot performs a self-test after receiving a start signal from the main control unit. A vacuum suction cup is used as the end effector to absorb the wafer and place it on the wafer feed station. The vision system then verifies that the placement is correct and provides feedback to the control system. After completing the wafer transfer task, it returns to its original position and awaits the next task.

[0056] In other more specific embodiments, the wafer transfer robot 2 is configured to transfer wafers from the main wafer feed station to an adjacent M-layer cassette feed branch station (M is a positive integer). In certain embodiments, the wafers are transferred to a tackification unit for tackification treatment before being transferred to the M-layer cassette feed branch station. Furthermore, the wafer transfer robot 2 is also responsible for transferring wafers that have undergone tackification treatment to a cooling unit for cooling to ensure that the temperature meets the requirements of the adhesive coating process.

[0057] like Figure 8 As shown, in another example, coating assemblies COT are symmetrically provided on both sides of the coating robots 11-16. Specifically, the coating assembly COT is configured as a gluing unit PR and an anti-reflection unit Barc that are symmetrical about the vertical plane XZ. The developing robots DR1-3 are symmetrically provided with developing assemblies on both sides. The developing assemblies are configured as developing units SDC that are symmetrical about the vertical plane XZ.

[0058] In some embodiments, the coating robot is used to transfer wafers located at an M-layer cassette feed branch station to corresponding coating units in an adjacent M-layer coating frame for coating. The coating process includes applying photoresist to the wafer surface and, in some cases, also applying an anti-reflective coating to the wafer surface.

[0059] It is worth noting that an anti-reflective coating is first applied to the surface of the wafer, at which point the surface of the wafer is an anti-reflective coating, and then photoresist is applied onto the anti-reflective coating.

[0060] In some embodiments, the glue coating unit is connected to the outlet end of the glue pump, and the inlet end of the glue pump is connected to a glue bottle; the glue bottle contains photoresist; when the glue pump is turned on, it is used to apply the photoresist in the glue bottle to the wafer surface.

[0061] In some embodiments, the three layers of glue coating frames on the top side and the three layers of developing frames on the bottom side constitute a liquid processing module. Each layer of glue coating frame is provided with a glue coating unit PR.

[0062] In some examples, in the gluing frame, the gluing unit PR and the anti-reflection unit Barc are stacked. In other examples, the gluing unit PR and the anti-reflection unit Barc are symmetrically arranged at the same height with respect to the vertical plane, for example, the gluing unit PR is located on the Y-direction side of the anti-reflection unit Barc. In still other examples, in the same layer of the film feeding liquid processing frame, the gluing unit PR is located on the top side of the anti-reflection unit Barc. In still other examples, in the same layer of the film feeding liquid processing frame, the gluing unit PR is located on the bottom side of the anti-reflection unit Barc. In still other examples, the gluing unit PR and the anti-reflection unit Barc are symmetrically arranged with respect to the vertical plane XZ.

[0063] In some embodiments, an anti-reflection unit is further provided in the gluing frame, and the anti-reflection unit is used to apply an anti-reflection coating to the surface of the wafer; the robot in the gluing frame is used to first send the wafer to the anti-reflection unit, and then transfer the wafer from the anti-reflection unit to the gluing unit.

[0064] In other embodiments, a heat treatment module is further included; the heat treatment module includes a heat treatment frame; the total number of layers of the glue coating frame and the developing frame is the same as the number of layers of the heat treatment frame; a heat treatment unit is provided in the heat treatment frame for baking wafers; the robot in the heat treatment frame is used to transfer the wafers to the heat treatment unit and to take out the wafer area in the heat treatment unit.

[0065] In some embodiments, an interface module is also included; a back wash robot and a forward wash robot are provided in the interface module; the back wash robot is used to move the wafers on the interface wafer feed branch station to the back wash unit; the forward wash robot is used to move the wafers on the forward wash unit to the interface wafer return branch station respectively; the back wash unit is used to clean the back side of the wafer, and the forward wash unit is used to clean the front side of the wafer.

[0066] like Figure 9 In the example shown, the cassette module 100, the liquid processing module 200, the interlayer module 300, the thermal processing module 400, and the interface module 500 are sequentially arranged in the X direction. In another example, corresponding to the liquid processing module 200, the thermal processing module 400 has 6 layers, 21-26 respectively.

[0067] like Figure 10 As shown, in some specific embodiments, the interlayer module 300 is provided with stations PSI2-7, PSI15-20 and stations SCPC4-9 with cooling units.

[0068] In one example, the robot 14 located in the bottom layer of the glue coating frame is used to move the wafer on the workstation SCPC1 to the anti-reflection unit Barc, and move the wafer in the anti-reflection unit Barc to the interface PSI2. The robot 24 located in the bottom layer of the film feeding and heat treatment frame is used to move the wafer from the interface PSI2 to the anti-reflection baking unit BARC Bake, and move the wafer from the anti-reflection baking unit BARC Bake to the interface SCPC4. The robot 14 located in the bottom layer of the glue coating frame is used to move the wafer on the workstation SCPC4 to the glue coating unit PR, and move the wafer in the glue coating unit PR to the workstation PSI3. The robot 24 located in the bottom layer of the film feeding and heat treatment frame is also used to move the wafer from the interface PSI3 to the soft baking unit Soft Bake, move the wafer in the soft baking unit Soft Bake to the edge exposure unit WES, and move the wafer from the edge exposure unit WES to the interface PSI8. In this example, the robots in the bottom glue coating frame and the wafer feeding heat treatment frame have clear division of labor and perform processing in different links simultaneously, which shortens the waiting time of wafers between each process, speeds up the overall production rhythm, and improves production capacity.

[0069] like Figure 11 and Figure 6 As shown, in some specific embodiments, the backwash robot 31 is used to move the wafers on the branch interfaces PSI8, PSI9 and PSI10 to the backwash unit BS. Figure 12 and Figure 6 As shown, the forward cleaning robot 32 is used to move the wafers on the forward cleaning unit PIS to the branch interfaces PSI12, PSI13 and PSI14 respectively.

[0070] like Figure 13 and Figure 6 As shown, in some specific embodiments, the backwash robot 31 is also used to move the backwashed wafers from the backwash unit BS to the buffer unit BF. In some examples, the buffer unit BF is configured as a 25-layer wafer storage rack.

[0071] In some other specific embodiments, the forward cleaning robot 32 is further used to move the wafers on the buffer unit BF to the interface cooling unit CPC, and to move the wafers on the interface PSI11 to the forward cleaning unit PIS.

[0072] In some further specific embodiments, the interface module 500 further includes an interface robot 33 for delivering the wafer on the interface cooling unit CPC into the lithography machine SCAN, and moving the wafer output from the lithography machine SCAN to the interface PSI11.

[0073] In some specific embodiments, the baking robot 23 located in the top-layer heat treatment frame for returning the wafer is used to move the wafer from the interface PSI14 to the post-exposure bake unit PEB, and move the wafer from the post-exposure bake unit PEB to the interface SCPC9. The developing robot 13 moves the wafer from the interface SCPC9 provided with a cooling unit in the interlayer module to the developing unit SDC, and moves the wafer from the developing unit SDC to the interface PSI19. The baking robot 23 located in the top-layer heat treatment frame for returning the wafer is also used to move the wafer from the interface PSI19 to the hard bake unit Hard Bake, transfer the wafer in the hard bake unit Hard Bake to the optical inspection unit AOI, and move the wafer from the optical inspection unit AOI to the interface PSI20. The developing robot 13 is also used to move the wafer from the interface PSI20 to the interface PSI23. The wafers on the branch interfaces PSI21, PSI22, and PSI23 are moved to the second loading station LP2 by the entry and exit robot 1.

[0074] In some embodiments, a processor (not shown) is further included, and the processor is electrically connected to the entry and exit robot 1, the film transfer robot 2, the gluing robot and the developing robot respectively.

[0075] The processor in this embodiment can be an image processing chip or an integrated circuit chip capable of processing image signals. During implementation, each step of the above-described method embodiment can be completed by hardware integrated logic circuits in the processor or by software instructions. The processor can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic device. The methods, steps, and logic block diagrams disclosed in this embodiment can be implemented or executed. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this embodiment can be directly implemented and executed by a hardware decoding processor or by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium well-known in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or registers. The storage medium is located in a memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above-described method.

[0076] In some other embodiments, a memory is further included, which is electrically connected to the processor and is used to store motion data of the entry and exit robot 1, the film transfer robot 2, the glue coating robot, and the developing robot.

[0077] It is understood that the memory in this embodiment may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. The non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate synchronous DRAM (DDR SDRAM), enhanced synchronous DRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM bus RAM (DR RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0078] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations may be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the present invention described herein may have other embodiments and may be implemented or carried out in a variety of ways.

Claims

1. A film box module, used in a coating and developing device, characterized in that: include: A first loading station is used to load wafers to be processed; a second loading station for loading processed wafers; An in-and-out robot is used to transfer the wafers on the first loading station to the main wafer feeding station, and to transfer the wafers on the cassette return branch station to the second loading station; The wafer transfer robot is used to transfer the wafers on the main wafer feeding station to the cassette wafer feeding branch station; The wafer transfer robot is located on the first side or the second side of the wafer box module; an auxiliary process unit is arranged on the opposite side of the wafer transfer robot, and the auxiliary process unit is used to perform auxiliary processing on the wafer.

2. The cassette module according to claim 1, wherein: The auxiliary process unit comprises a liquid bottle (61) and a liquid pump (62); the liquid pump (62) is used to apply the liquid in the liquid bottle (61) to the surface of the wafer; the liquid is set to be photoresist or anti-reflective glue.

3. The cassette module according to claim 1, wherein: A wafer transfer area is provided in the wafer box module, and the entry and exit robots and the wafer transfer manipulator are used to transfer wafers in the wafer transfer area.

4. The cassette module according to claim 1, wherein: The stacked plurality of cassette return branch stations are all arranged adjacent to the second loading station; the entry and exit robots are used to sequentially transfer the wafers on the plurality of cassette return branch stations to the second loading station.

5. A coating and developing device, comprising the film box module according to any one of claims 1 to 4, characterized in that: The glue coating and developing device also includes: The gluing module comprises a gluing frame and a gluing unit arranged in the gluing frame; the gluing unit is used to perform a gluing process on the wafer; the cassette feeding branch station is arranged in a one-to-one correspondence with the gluing frame in the gluing module; The developing module comprises a developing frame and a developing unit disposed in the developing frame; the developing unit is used to perform a developing process on the wafer; the film cassette return branch station is disposed in a one-to-one correspondence with the developing frame in the developing module; The developing module and the gluing module are both arranged on the same side of the film box module; the developing module is located on the bottom side of the gluing module.

6. The device according to claim 5, characterized in that The developing module and the gluing module are both located in the film conveying direction of the film box module; A plurality of developing units are symmetrically distributed on a first side and a second side of the developing module with respect to the film conveying direction; A plurality of coating units are symmetrically distributed on a first side and a second side of the glue coating module with respect to the sheet conveying direction.

7. The device according to claim 5, characterized in that The glue coating unit is connected to the outlet end of the glue pump, and the inlet end of the glue pump is connected to the glue bottle; the glue bottle contains photoresist; when the glue pump is turned on, it is used to apply the photoresist in the glue bottle to the wafer surface.

8. The device according to claim 7, characterized in that An anti-reflection unit is also provided in the gluing frame, and the anti-reflection unit is used to apply an anti-reflection coating to the surface of the wafer; the robot in the gluing frame is used to first send the wafer to the anti-reflection unit, and then transfer the wafer from the anti-reflection unit to the gluing unit.

9. The device according to claim 5, characterized in that Also includes heat treatment module; The heat treatment module includes a heat treatment frame; the total number of layers of the glue coating frame and the developing frame is the same as the number of layers of the heat treatment frame; A heat treatment unit is provided in the heat treatment frame for baking wafers; a robot in the heat treatment frame is used to transfer the wafers to the heat treatment unit and to take out the wafer area in the heat treatment unit.

10. The device according to claim 9, characterized in that Also included is an interface module; The interface module is provided with a back wash robot and a front wash robot; The backwash robot is used to move the wafers on the interface wafer feed branch station to the backwash unit; the forward wash robot is used to move the wafers on the forward wash unit to the interface wafer return branch station respectively; The back cleaning unit is used to clean the back side of the wafer, and the front cleaning unit is used to clean the front side of the wafer.

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