Electronic tag with in-mold tag structure
By designing electronic labels with internal standard structure of the mold, the damage to the labels by easy transfer of self-adhesive labels and high-voltage electrostatic processing is solved, and the effects of anti-transfer, anti-counterfeiting, anti-trapping and efficient data collection are achieved.
Patent Information
- Application Number
- CN202521585517.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-29
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2035-07-29
AI Technical Summary
Existing self-adhesive labels are difficult to prevent transfer and data stolen. The internal standard of the mold is easily damaged during high-voltage static and high-temperature processing, affecting the data acquisition efficiency.
An electronic tag with an internal standard structure is designed, including an internal mold material layer, an inlay layer of an electronic tag and an adhesive layer. The internal mold material layer includes a protective layer, a printing layer 1, an internal mold standard substrate and a printing layer 2 from the outside. The inlay layer of an electronic tag includes a chip layer, an antenna layer and a base film PET layer from the inside to the outside. The adhesive layer is combined to enhance protection and adapt to high-voltage, high-temperature, and electrostatic environments.
It realizes the anti-transfer, anti-counterfeiting and anti-travel of electronic tags, and maintains high data acquisition efficiency in special environments to ensure the stability and data integrity of the tags during high-voltage electrostatic and high-temperature processing.
Smart Images

Figure CN223296384U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic labels, in particular to an electronic label with an in-mold label structure. Background Art
[0002] In anti-counterfeiting and digital marketing applications, data is often carried on self-adhesive labels. However, self-adhesive labels present a significant challenge: preventing label transfer and data theft. In-mold labels, however, offer a natural advantage in preventing transfer due to their lamination process.
[0003] However, during the lamination process, in-mold labels often experience high-voltage static electricity, high temperatures, and high pressures, all of which are fatal to electronic tags. To meet the high data collection efficiency requirements in anti-counterfeiting and anti-channeling applications, electronic tags have irreplaceable advantages.
[0004] In summary, providing an electronic tag with an in-mold label structure that can prevent transfer, anti-counterfeiting, anti-channeling, and high data collection efficiency in application is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content
[0005] The purpose of the utility model is to provide an electronic tag with an in-mold label structure to solve the problems existing in the above-mentioned prior art, and has the advantages of anti-transfer, anti-counterfeiting, anti-channeling and high data collection efficiency in application.
[0006] To achieve the above purpose, the present invention provides the following solutions:
[0007] The utility model provides an electronic label with an in-mold label structure, comprising an in-mold material layer, an inlay layer of the electronic label and an adhesive layer arranged between the two layers of material;
[0008] The in-mold material layer includes, from the outside to the inside, a protective layer, a first printing layer, an in-mold label substrate, and a second printing layer; the information on the first printing layer and the second printing layer corresponds one to one;
[0009] The inlay layer of the electronic tag is arranged on the inner side of the in-mold material layer, and the inlay layer of the electronic tag includes a chip layer, an antenna layer and a base film PET layer in sequence from the inside to the outside.
[0010] Preferably, the printed layer 1 contains variable digital information, and the digital information on the printed layer 1 of each label is different.
[0011] Preferably, the second printing layer contains variable digital information, and the digital information on the second printing layer of each label is different.
[0012] Preferably, the adhesive layer is bonded to the inner surface of the second printing layer and the outer surface of the chip layer.
[0013] Preferably, the protective layer is a coating layer or a varnishing layer, which is used to protect the information on the printed layer.
[0014] Preferably, the inlay layer of the electronic tag is an ultra-high frequency inlay, a high frequency inlay, or a low frequency inlay.
[0015] Compared with the prior art, the utility model has achieved the following technical effects:
[0016] The electronic label with an in-mold label structure in the utility model combines the in-mold label material layer and the inlay layer of the electronic label into one, and has the advantages of both in-mold label and electronic label, and has the advantages of anti-transfer, anti-counterfeiting, anti-channeling and high data collection efficiency in application. A protective layer is provided on the outside of the in-mold material layer to effectively prevent the influence of high pressure, high temperature and static electricity environment on the internal printing layer and inlay layer, ensuring the normal use of the label in special environments. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 This is a structural diagram of the electronic tag with an internal marking structure in the mold of the present invention;
[0019] In the figure: 101, in-mold label substrate; 102, printing layer 1; 103, protective layer; 104, printing layer 2; 201, chip layer; 202, antenna layer; 203, base film PET layer; 3, adhesive layer. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] The purpose of the utility model is to provide an electronic label with an in-mold label structure to solve the problems existing in the prior art.
[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0023] The electronic label of the in-mold label structure in this embodiment is as follows: Figure 1 As shown, it includes an in-mold material layer, an inlay layer of the electronic label and an adhesive layer 3 arranged between the two layers of material. The in-mold material layer includes a protective layer 103, a printing layer 102, an in-mold label substrate 101 and a printing layer 2 104 from the outside to the inside; the information on the printing layer 102 and the printing layer 2 104 corresponds one to one; the printing layer 102 has traceability code information representing the uniqueness of the product for product traceability purposes, and the printing layer 2 104 has a rights code for product authenticity inquiry or marketing interaction with consumers. The two data correspond one to one, so that the logistics and marketing data chains are connected, which makes it convenient for customers to collect marketing activity information and dynamics in a timely manner, evaluate marketing effects and strategies, and monitor whether there is cross-selling through marketing participation information.
[0024] The inlay layer of the electronic tag is arranged on the inner side of the in-mold material layer. The inlay layer of the electronic tag includes a chip layer 201, an antenna layer 202 and a base film PET layer 203 from the inside to the outside.
[0025] In this embodiment, the printing layer 102 includes variable digital information, and the digital information on the printing layer 102 of each label is different.
[0026] In this embodiment, the second printing layer 104 includes variable digital information, and the digital information on the second printing layer 104 of each label is different.
[0027] In this specific embodiment, the adhesive layer 3 is adhered to the inner surface of the second printed layer 104 and the outer surface of the chip layer 201 , and the adhesive layer 3 effectively combines the in-mold material layer and the inlay layer of the electronic tag.
[0028] In this specific embodiment, the protective layer 103 is a coating layer or a varnish layer, which is used to protect the information on the printed layer 102 and can protect the entire label from environmental influences such as high pressure, high temperature, and static electricity.
[0029] In this specific embodiment, the inlay layer of the electronic tag is an ultra-high frequency inlay, a high frequency inlay, or a low frequency inlay.
[0030] Here’s how it works:
[0031] The electronic tag adopts the ultra-high frequency RFID tag as an example for explanation.
[0032] During the label processing, the label's logistics code, equity code, RFID EPC writing information and TID data are associated.
[0033] During the injection molding process of the plastic cover, the in-mold material layer of the label is bonded to the plastic cover, and the electronic label and printed layer information are wrapped between the plastic cover and the in-mold material layer. It has good anti-transfer function and is almost integrated with the cover body and cannot be separated.
[0034] The labeled lids are packaged and boxed as finished products on the customer's production line. During this process or at the warehousing stage, the RFID tag on each product is read by an RFID reader and associated with the corresponding box code and pallet code to build a basic data tree for the product. At the same time, the production information and logistics information are associated to form a complete traceability data information chain.
[0035] Based on the above data chain, we can design marketing strategies and carry out event operations in different channels and for different products using the data background, so as to conduct precise marketing and provide real-time feedback. We can also use marketing data to conduct reverse monitoring to see if there is any behavior such as cross-selling, so as to intervene in time and reduce customer losses.
[0036] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.
Claims
1. An electronic label with an in-mold label structure, characterized by: It includes an in-mold material layer, an inlay layer of the electronic tag, and an adhesive layer disposed between the two layers of material; The in-mold material layer includes, from the outside to the inside, a protective layer, a first printing layer, an in-mold label substrate, and a second printing layer; the information on the first printing layer and the second printing layer corresponds one to one; The inlay layer of the electronic tag is arranged on the inner side of the in-mold material layer, and the inlay layer of the electronic tag includes a chip layer, an antenna layer and a base film PET layer in sequence from the inside to the outside.
2. The electronic label with an in-mold label structure according to claim 1, characterized in that: The printing layer 1 includes variable digital information, and the digital information on the printing layer 1 of each label is different.
3. The electronic label with an in-mold label structure according to claim 1, characterized in that: The second printing layer contains variable digital information, and the digital information on the second printing layer of each label is different.
4. The electronic label with an in-mold label structure according to claim 1, characterized in that: The adhesive layer is adhered to the second inner surface of the printing layer and the outer surface of the chip layer.
5. The electronic label with an in-mold label structure according to claim 1, characterized in that: The protective layer is a coating layer or a glazing layer, which is used to protect the information on the printed layer.
6. The electronic label with an in-mold label structure according to claim 1, characterized in that: The inlay layer of the electronic tag is an ultra-high frequency inlay, a high frequency inlay, or a low frequency inlay.