Internal fixing support for smart phone

Abstract

The utility model relates to an internal fixing support for a smart phone, which is characterized by comprising a steel sheet, plastic wrapping the steel sheet and a fixing hole penetrating through the steel sheet and the plastic, the steel sheet comprises an assembling buckle, the assembling buckle and the steel sheet are integrally formed, one end of the assembling buckle is fixedly connected with the steel sheet, and the other end of the assembling buckle bends and extends downwards and is used for being connected with the interior of a mobile phone in a clamped mode. The plastic cement is provided with an appearance clamping point, one side of the appearance clamping point is fixedly connected with the plastic cement, the other side of the appearance clamping point extends outwards, a plurality of fixing structures are formed by penetrating through a fixing hole formed by the steel sheet and the plastic cement and cooperating with an assembling buckle formed by the steel sheet and the appearance clamping point formed by the plastic cement, and the mobile phone shell is fixed in a mobile phone through the plurality of fixing structures. And the phenomenon of position conflict with the internal elements of the mobile phone is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of mobile phone components, and in particular to an internal fixing bracket of a smart phone. Background Art

[0002] The internal fixing bracket of the mobile phone is used to fix multiple components inside the mobile phone. Today's mobile phones pursue lightness and thinness. In order to maximize the use of the internal space of the mobile phone, many internal components of the mobile phone are made into corresponding shapes according to needs, and new internal fixing brackets of the mobile phone are needed to fix them.

[0003] According to Chinese patent CN220915303U, a hardware bracket for a mobile phone motherboard is disclosed. The bracket includes a fixing plate and screw holes provided on the surface of the fixing plate. An insert block protruding outward is fixedly provided on the surface of the fixing plate. A plurality of circular holes are provided around the fixing plate, and a square opening is provided on the side near the circular holes. The square opening is provided with a bent insert block, so that the bracket can be fitted and pressed into the mobile phone motherboard. By providing the bent insert block, the bracket is inserted into the mobile phone motherboard and fixed to the mobile phone motherboard. However, the fixing method of the bracket is too single. In the face of complex internal components of the mobile phone, it cannot be fixed by a single fixing method, and it is easy to conflict with the position of the internal components of the mobile phone.

[0004] Therefore, it is necessary to develop an internal fixing bracket for a smartphone to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide an internal fixing bracket suitable for a wide range of smart phones.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: an internal fixing bracket for a smartphone, characterized in that it comprises: a steel sheet, plastic wrapping the steel sheet, and a fixing hole formed through the steel sheet and the plastic;

[0007] The steel sheet includes an assembly buckle, which is integrally formed with the steel sheet, one end of which is fixedly connected to the steel sheet, and the other end of which is bent and extended downward for being engaged with the interior of the mobile phone;

[0008] The plastic has an external shape clamping point, one side of the external shape clamping point is fixedly connected to the plastic, and the other side is extended outwards.

[0009] Furthermore, a receiving groove is formed outside the fixing hole, the receiving groove is recessed inward from the surface of the steel sheet, and a plane is formed at the bottom thereof, and the fixing hole passes through the upper and lower surfaces of the plane.

[0010] Furthermore, the bottom plane of the receiving groove forms a convex contact, which is formed by being recessed inward from the upper surface of the steel sheet, and is simultaneously formed by being protruded outward from the lower surface of the steel sheet, and is distributed in a surrounding manner with the fixing hole as the center.

[0011] Furthermore, the steel sheet also includes a grounding conductor, which is integrally formed with the steel sheet, one end of which is fixedly connected to the steel sheet, and the other end of which extends outwardly to be connected to the components inside the mobile phone.

[0012] Furthermore, the steel sheet is made of steel, nickel-plated as a whole, with a thickness of 2 μm. The conductive surface impedance is controlled by a gold-plated ball-tip test pen under a pressure of 0.5N, and the impedance is fully tested, excluding the internal resistance of 0.5Ω.

[0013] Furthermore, the steel sheet is further provided with an etching area, which is one area, and local etching is performed on the surface of the steel sheet with an etching depth of 0.1 mm.

[0014] Furthermore, the steel sheet is also provided with six gold-brushing areas, and gold is brushed locally on the surface of the steel sheet to enhance the conductive performance of the steel sheet.

[0015] Furthermore, the etching area and the gold brushing area overlap.

[0016] Furthermore, the surface of the foam and the steel sheet is adhered to the motherboard area TP conductive foam, the bottom of the motherboard area TP conductive foam is adhered to the etched area and the gold brushing area, and its top extends outward and can be connected to other electronic components inside the mobile phone for transmitting current, signals and other information.

[0017] Furthermore, the other surface of the steel sheet is adhered with the main camera BTB conductive foam, which can be connected to other electronic components inside the mobile phone to transmit current, signals and other information.

[0018] Compared with the existing technology, the beneficial effect of the present invention is that: the present invention is an internal fixing bracket for smart phones, which has the characteristics of adaptability to a wide range of types. It forms a variety of fixing structures by means of fixing holes formed through steel sheets and plastics, and assembly buckles formed by steel sheets and external card points formed by plastics. It is fixed inside the mobile phone through a variety of fixing structures, avoiding the phenomenon of positional conflicts with the internal components of the mobile phone. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. Among them:

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of an internal fixing bracket of a smart phone according to the present invention;

[0021] Figure 2 for Figure 1 Schematic diagram of the steel sheet structure of the internal fixing bracket of the smartphone shown;

[0022] Figure 3 for Figure 1 Schematic diagram of the plastic structure of the internal fixing bracket of the smartphone;

[0023] Figure 4 for Figure 1 Schematic diagram of the other side of the internal fixing bracket of the smartphone.

[0024] In the figure: 1. Steel sheet; 2. Plastic; 3. Foam; 4. Fixing hole; 11. Receiving groove; 12. Bump contact; 13. Assembly clip; 14. Grounding conduction; 15. Etching area; 16. Gold brushing area; 21. Appearance card point; 31. Mainboard area TP conductive foam; 32. Main camera BTB conductive foam; 33. Near light sealing foam; 34. SOC shielding cover pressing foam; 35. Main FPCBTB pressing foam; 36. Main CAM-FPC anti-cut foam; 37. Flash BTB pressing foam; 38. Top plate FPC BTB pressing foam; 39. RCV pressing foam; 310. Mainboard pressing shielding cover foam. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] Please see Figures 1 to 4 The utility model is an internal fixing bracket of a smart phone, which includes a steel sheet 1, a plastic 2 wrapping the steel sheet 1, and a foam 3 attached to the surface of the steel sheet 1 and the plastic 2.

[0027] Please see Figures 1 to 2 , the steel sheet 1 is formed by stamping, and its shape changes according to demand.

[0028] Both the steel sheet 1 and the plastic 2 include fixing holes 4, which pass through the upper and lower surfaces of the steel sheet 1. The shape and position of the fixing holes 4 can be changed according to needs. Screws or bolts are used to pass through the fixing holes 4 and fixedly connected to the mobile phone to fix the steel sheet 1 and the plastic 2 inside the mobile phone. A receiving groove 11 is formed on the outside of the fixing hole 4. The receiving groove 11 is recessed inward from the surface of the steel sheet 1, and its bottom forms a plane. The fixing hole 4 passes through the upper and lower surfaces of the plane. The height of the receiving groove 11 is consistent with the height of the above-mentioned screw or bolt, so that the top of the screw or bolt does not exceed the surface of the steel sheet 1.

[0029] The bottom plane of the receiving groove 11 forms a convex contact 12, which is formed by being recessed inward from the upper surface of the steel sheet 1 and convex outward from the lower surface of the steel sheet 1, and is distributed around the fixing hole 4 as the center.

[0030] Please see Figure 2 The steel sheet 1 also includes an assembly buckle 13 and a grounding conductor 14. The assembly buckle 13 is integrally formed with the steel sheet 1, one end of which is fixedly connected to the steel sheet 1, and the other end is bent downward and extended for being connected to the inside of the mobile phone. The grounding conductor 14 is integrally formed with the steel sheet 1, one end of which is fixedly connected to the steel sheet 1, and the other end extends outward to be connected to the components inside the mobile phone.

[0031] The steel sheet 1 is made of steel, nickel-plated as a whole, with a thickness of 2μm. The conductive surface impedance controls the full detection impedance of the gold-plated ball-tip test pen under a pressure of 0.5N, excluding the internal resistance of 0.5Ω. The steel sheet 1 needs to be stamped twice during formation. The first stamping forms the material strip. The steel sheet 1 is also provided with an etching area 15 and a gold-brushing area 16. In this embodiment, there is one etching area 15 and six gold-brushing areas 16. Specifically, local etching is performed on the surface of the material strip, and the etching 15 depth is 0.1mm to form an etching area 15. Local gold brushing is performed on the surface of the material strip. The etching area 15 and the gold-brushing area 16 are both used to increase the conductive performance of the steel sheet 1.

[0032] Preferably, the etched area 15 and the gold brushed area 16 overlap.

[0033] Please see Figure 3 , the plastic 2 wraps a local area of ​​the steel sheet 1, specifically, the upper surface of the receiving groove 11 formed by the plastic 2 wrapping the steel sheet, exposing the lower surface of the receiving groove 11, the plastic 2 extends into the receiving groove 11, covering the plane formed by the bottom of the receiving groove 11, and the plastic 2 also has an external card point 21, one side of the external card point 21 is fixedly connected to the plastic 2, and the other side extends outward to be fixed inside the mobile phone.

[0034] The etched area 15 and the gold-brushed area 16 are not covered by the plastic 2 .

[0035] Please see Figure 1 and Figure 4The foam 3 includes the mainboard area TP conductive foam 31 and the main camera BTB conductive foam 32. The bottom of the mainboard area TP conductive foam 31 is adhered to the etched area 15 and the gold-brushed area 16, and its top extends outward, which can be connected with other electronic components inside the mobile phone for transmitting current, signals and other information. The main camera BTB conductive foam 32 is adhered to the other side of the steel sheet 1 and can be connected with other electronic components inside the mobile phone for transmitting current, signals and other information.

[0036] The light-sealing foam 33 is close to the surface of the steel sheet 1 and the plastic 2 .

[0037] The SOC shielding cover compresses the foam 34 , and the SOC shielding cover compresses the foam 34 , which is adhered to the surface of the steel sheet 1 and is located on the same surface as the main camera BTB conductive foam 32 .

[0038] The main FPCBTB compresses the foam 35 , which is adhered to the surface of the steel sheet 1 and is located on the same surface as the main BTB conductive foam 32 .

[0039] The main CAM-FPC anti-cut foam 36 is attached to the surface of the steel sheet 1 and is located on the same surface as the main camera BTB conductive foam 32.

[0040] The flash BTB compresses the foam 37 and adheres to the surface of the steel sheet 1 , and is located on the same surface as the main camera BTB conductive foam 32 .

[0041] The top plate FPC BTB compresses the foam 38 and adheres to the surface of the steel sheet 1 , and is located on the same surface as the main camera BTB conductive foam 32 .

[0042] The RCV compression foam 39 is adhered to the surface of the steel sheet 1 and is located on the same surface as the main BTB conductive foam 32.

[0043] The mainboard pressed shielding cover foam 310 is attached to the surface of the steel sheet 1 and is located on the same surface as the main camera BTB conductive foam 32.

[0044] When forming an internal fixing bracket of a smartphone according to the present invention, the steel raw material is stamped twice. The first stamping forms a material strip, which is then etched and gold-brushed. The second stamping is then performed to form the shape of a steel sheet 1. The steel sheet 1 is placed in a mold and injection molding is performed, so that the plastic 2 partially wraps the steel sheet 1. The mainboard area TP conductive foam 31 and the near-light sealing foam 33 are adhered to its surface, and other foams are adhered to the other side.

[0045] The utility model is an internal fixing bracket for smart phones, which has the characteristics of adaptability to a wide range of types. By forming fixing holes through steel sheets and plastic, and coordinating assembly buckles formed by the steel sheets and external card points formed by plastic, a variety of fixing structures are formed. The bracket is fixed inside the mobile phone through the various fixing structures, avoiding position conflicts with internal components of the mobile phone.

[0046] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A smart phone internal fixing bracket, characterized in that: It includes: A steel sheet (1), a plastic (2) wrapping the steel sheet (1), and a fixing hole (4) formed through the steel sheet (1) and the plastic (2); The steel sheet (1) includes an assembly buckle (13), which is integrally formed with the steel sheet (1), one end of which is fixedly connected to the steel sheet (1), and the other end of which is bent and extended downward for being engaged with the interior of the mobile phone; The plastic (2) has an external shape clamping point (21), one side of the external shape clamping point (21) is fixedly connected to the plastic (2), and the other side is formed by extending outward.

2. The internal fixing bracket of a smart phone according to claim 1, characterized in that: A receiving groove (11) is formed outside the fixing hole (4), and the receiving groove (11) is formed by being recessed inward from the surface of the steel sheet 1, with its bottom forming a plane, and the fixing hole (4) passes through the upper and lower surfaces of the plane.

3. The internal fixing bracket of a smart phone according to claim 2, characterized in that: The bottom plane of the receiving groove (11) forms a convex contact (12), and the convex contact (12) is formed by being recessed inward from the upper surface of the steel sheet (1), and at the same time, the convex contact (12) is formed by being protruded outward from the lower surface of the steel sheet (1), and is distributed in a circumferential manner with the fixing hole (4) as the center.

4. The internal fixing bracket of a smart phone according to claim 1, characterized in that: The steel sheet (1) further comprises a grounding conductor (14), which is integrally formed with the steel sheet (1), one end of which is fixedly connected to the steel sheet (1), and the other end of which extends outwardly to be connected to components inside the mobile phone.

5. The internal fixing bracket of a smart phone according to claim 1, characterized in that: The steel sheet (1) is made of steel, is nickel-plated as a whole, has a thickness of 2 μm, and has a conductive surface impedance control, wherein the impedance is fully tested by a gold-plated ball-end test pen under a pressure of 0.5 N, excluding an internal resistance of 0.5 Ω.

6. The internal fixing bracket of a smart phone according to claim 1, characterized in that: The steel sheet (1) is further provided with an etching area (15), which is located at one location and is locally etched on the surface of the steel sheet with an etching depth of 0.1 mm.

7. The internal fixing bracket of a smart phone according to claim 6, characterized in that: The steel sheet (1) is further provided with six gold-brushing areas (16). Gold is brushed locally on the surface of the steel sheet (1) to enhance the conductive performance of the steel sheet (1).

8. The internal fixing bracket of a smart phone according to claim 7, characterized in that: The etching area (15) and the gold brushing area (16) overlap.

9. The internal fixing bracket of a smart phone according to claim 7, characterized in that: The surface of the steel sheet (1) is adhered to a mainboard area TP conductive foam (31), the bottom of the mainboard area TP conductive foam (31) is adhered to the etching area (15) and the gold brushing area (16), and the top thereof extends outwards and can be connected to other electronic components inside the mobile phone for transmitting information such as current and signals.

10. The internal fixing bracket of a smart phone according to claim 7, characterized in that: The other surface of the steel sheet (1) is bonded with a main camera BTB conductive foam (32), which can be connected to other electronic components inside the mobile phone for transmitting information such as current and signals.

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