Microphone assembly and electronic equipment

Abstract

The utility model relates to a microphone assembly and electronic equipment. The microphone assembly comprises a housing, a microphone monomer and a waterproof sealing member. The shell is provided with a sound receiving hole and a sound receiving channel communicated with the sound receiving hole; the microphone monomer is arranged in the shell and is provided with a pickup hole communicated with the sound receiving channel; the waterproof sealing element is arranged in the sound receiving channel, the waterproof sealing element is provided with a waterproof sound transmission structure in the sound receiving channel, and the projection of the waterproof sound transmission structure along the sound receiving channel to the direction of the sound pickup hole is partially or completely staggered with the sound pickup hole. According to the microphone assembly, the risk that the sensitivity of the microphone monomer is reduced or even damaged due to the fact that the crystallized impurities fall into the pickup hole and then reach structures such as a vibrating diaphragm of the microphone monomer can be reduced.

Description

Technical Field

[0001] The present application relates to the field of microphone technology, and in particular to a microphone assembly and electronic equipment. Background Art

[0002] With the rapid development of electronic devices such as smartphones, tablets, and e-readers, more and more devices are equipped with microphone components to enable voice recording, thereby completing related functions such as recording and making calls. Under-board microphones, in which the microphone unit is placed on the back of the printed circuit board, have gained widespread application due to their simple structural design. However, the microphone unit of traditional under-board microphones is easily damaged by moisture, which affects the sensitivity and service life of the microphone unit. Utility Model Content

[0003] Embodiments of the present application provide a microphone assembly and an electronic device to solve the problem that the microphone unit in a traditional under-board microphone is easily damaged by water vapor.

[0004] A microphone assembly comprising:

[0005] The housing is provided with a sound receiving hole and a sound receiving channel connected to the sound receiving hole;

[0006] A microphone unit is provided in the housing and has a sound pickup hole connected to the sound receiving channel; and

[0007] A waterproof seal is provided in the sound receiving channel. The waterproof seal is provided with a waterproof sound-permeable structure in the sound receiving channel. The projection of the waterproof sound-permeable structure along the direction of the sound receiving channel toward the sound pickup hole is partially or completely staggered with the sound pickup hole.

[0008] An electronic device includes the microphone assembly as described above.

[0009] In the above-mentioned microphone assembly, the waterproof and sound-permeable structure can block the passage of liquid between the sound receiving hole and the sound pickup hole, preventing liquid entering the microphone assembly from the sound receiving hole from flowing to the sound pickup hole and causing damage to the diaphragm and other structures of the microphone unit. When the liquid blocked by the waterproof and sound-permeable structure is impure water containing salt or other impurities, such as sweat or soapy water, the water vapor carrying impurities in the water will pass through the waterproof and sound-permeable structure. Since the projection of the waterproof and sound-permeable structure along the sound receiving channel toward the sound pickup hole is partially or completely offset from the sound pickup hole, the crystallization position of the impurities in the water vapor in the substrate after passing through the waterproof and sound-permeable structure is also offset from the sound pickup hole. This can reduce the risk of impurities crystallizing and falling into the sound pickup hole, and then reaching the diaphragm and other structures of the microphone unit, resulting in reduced sensitivity or even damage to the microphone unit. In addition, the partial or complete offset of the waterproof and sound-permeable structure from the sound pickup hole helps reduce the crystallization of impurities carried to the sound pickup hole by the sound flow, helps reduce the risk of clogging the sound pickup hole, and improves the stability of the sound receiving performance of the microphone assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 Schematic diagram of the structure of electronic equipment in some embodiments.

[0012] Figure 2 Schematic cross-sectional view of a microphone assembly in some embodiments.

[0013] Figure 3 Schematic cross-sectional views of microphone assemblies in other embodiments.

[0014] Figure 4 Schematic cross-sectional views of microphone assemblies in some further embodiments.

[0015] Figure 5 This is a schematic structural diagram of an electronic device including other components in some embodiments.

[0016] Reference numerals:

[0017] 10. Electronic device; 11. Middle frame; 20. Microphone assembly; 21. Shell; 211. Sound receiving hole; 212. Sound receiving channel; 2121. Third section; 2122. Fourth section; 22. Microphone unit; 221. Sound pickup hole; 23. Base plate; 231. Board body; 232. Thickened portion; 233. Extension portion; 2341. First section; 2342. Second section; 24. Waterproof seal; 241. Waterproof and sound-permeable structure; 25. Adhesion structure; 26. Buffer structure; 27. Water absorption structure. DETAILED DESCRIPTION

[0018] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0019] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0020] (1) Connection via a wired line, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0021] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0022] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0023] (1) Satellite phone or cellular phone;

[0024] (2) Personal Communications System (PCS) terminals that combine cellular radiotelephones with data processing, fax, and data communications capabilities;

[0025] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0026] (4) conventional laptop and / or palmtop receivers;

[0027] (5) Conventional laptop and / or handheld radio telephone transceivers, etc.

[0028] See Figure 1 and Figure 2 As shown, Figure 1 shows a schematic structural diagram of an electronic device 10 in some embodiments of the present application, Figure 2 A cross-sectional schematic diagram of the microphone assembly 20 in some embodiments of the present application is shown. In some embodiments, the electronic device 10 includes but is not limited to electronic products such as smart phones, tablet computers, and e-readers. The microphone assembly 20 may include a housing 21 and a microphone unit 22 disposed in the housing 21. The housing 21 is provided with a sound receiving hole 211 and a sound receiving channel 212 connected to the sound receiving hole 211. The microphone assembly 20 can collect external sound signals through the sound receiving hole 211 and transmit the sound signals to the microphone unit 22 through the sound receiving channel 212. The sound signal drives the diaphragm of the microphone unit 22 to vibrate and realize the conversion of acoustic and electrical signals, thereby realizing voice recording, and can complete related functions such as recording and calling of the electronic device 10.

[0029] In some embodiments, an electronic device 10 includes a middle frame 11, and a microphone assembly 20 is disposed on the middle frame 11 of the electronic device 10. A sound receiving hole 211 is exposed on the middle frame 11 to facilitate receiving external sound. Microphone assembly 20 also includes a substrate 23, which can be a printed circuit board (PCB). Substrate 23 can be electrically connected to microphone unit 22 to provide power and communication for microphone unit 22. Substrate 23 can also serve as a supporting element for microphone unit 22, used to mount microphone unit 22. It should be noted that when the microphone assembly 20 is provided on the middle frame 11 of the electronic device 10, the shell 21 can be an integral structure with the middle frame 11, that is, the shell 21 is a part of the frame where the middle frame 11 is located. The shell 21 can also be separated from the middle frame 11, that is, it is an additional shell structure provided on the middle frame 11 of the electronic device 10. When the substrate 23 is a printed circuit board, the substrate 23 can be an integral structure with any applicable circuit structure outside the shell 21. The substrate 23 can also be a printed circuit board separately provided in the shell 21 and specifically provided for realizing the communication of the microphone unit 22. Of course, the substrate 23 can also be without a circuit structure and mainly serve as a mounting and supporting structure for the microphone unit 22. The microphone unit 22 can also be electrically connected to the central processor or other components of the electronic device 10 outside the shell 21 through components such as wires and flexible circuit boards.

[0030] Further, refer to Figure 2 As shown, in some embodiments, a substrate 23 is disposed within the housing 21, and a microphone unit 22 is disposed on the substrate 23. The microphone unit 22 has a sound pickup hole 221, and the microphone unit 22 can collect sound signals transmitted to the sound pickup hole 221. The microphone assembly 20 also includes a waterproof seal 24. The waterproof seal 24 is disposed on the side of the substrate 23 facing away from the microphone unit 22. The waterproof seal 24 is disposed in the sound receiving channel 212, and a waterproof sound-permeable structure 241 is provided in the sound receiving channel 212. The waterproof sound-permeable structure 241 is located between the sound pickup hole 221 and the sound receiving hole 211 in the transmission direction of the sound receiving channel 212. The waterproof sound-permeable structure 241 can block the passage of liquid and can also transmit sound signals. The material of the waterproof seal 24 includes, but is not limited to, any suitable material such as rubber material, foam material, plastic film material, etc. The waterproof sound-permeable structure 241 can be a waterproof and breathable membrane disposed in the waterproof seal 24. It will be appreciated that the sound signal entering the sound receiving channel 212 from the sound receiving hole 211 is transmitted through the waterproof seal 24 to the sound pickup hole 221 of the microphone unit 22. The microphone unit 22 can be located on the side of the substrate 23 facing away from the sound receiving hole 211, and the microphone assembly 20 is an under-board microphone. In some embodiments, the projection of the waterproof and sound-permeable structure 241 on the substrate 23 is partially or completely misaligned with the projection of the sound pickup hole 221 on the substrate 23. In other words, the gas and sound signals that pass through the waterproof and sound-permeable structure 241 need to bypass a certain path before being transmitted to the microphone unit 22.

[0031] In some embodiments, the housing 21 can be considered to have a sound receiving channel 212 formed therein, communicating with the sound receiving hole 211 and the sound pickup hole 221. The sound receiving channel 212 can be formed entirely by the housing 21, or partially by other components such as the substrate 23 within the housing 21. The projection of the waterproof, sound-permeable structure 241 along the direction from the sound receiving channel 212 to the sound pickup hole 221 is partially or completely offset from the sound pickup hole 221. Of course, in other embodiments, the microphone unit 22 and waterproof seal 24 can also be located elsewhere within the housing 21, rather than on the substrate 23.

[0032] In the microphone assembly 20, the waterproof seal 24 blocks liquid from passing between the sound receiving hole 211 and the sound pickup hole 221, preventing liquid entering the microphone assembly 20 through the sound receiving hole 211 from flowing to the sound pickup hole 221 and potentially damaging the diaphragm and other structures of the microphone unit 22. However, when the liquid blocked by the waterproof seal 24 is impure water containing salt or other impurities, such as sweat or soapy water, water vapor carrying impurities within the water vapor may pass through the waterproof sound-permeable structure 241. Because the projection of the waterproof sound-permeable structure 241 along the sound receiving channel 212 toward the sound pickup hole 221 is partially or completely offset from the sound pickup hole 221, the impurities within the water vapor crystallize within the substrate 23 at a position offset from the sound pickup hole 221 after passing through the waterproof sound-permeable structure 241. This reduces the risk of impurities crystallizing and falling into the sound pickup hole 221, potentially reaching the diaphragm and other structures of the microphone unit 22, and potentially reducing the sensitivity of the microphone unit 22 or even damaging it. At the same time, the sound flow passing through the waterproof and sound-permeable structure 241 needs to bypass a certain path before it can be transmitted to the microphone unit 22. During the transmission process, it will collide with the inner wall of the substrate 23, which helps to buffer the impact of the sound flow, reducing the impact of the sound flow on the microphone unit 22, thereby reducing the probability of damage to the diaphragm due to the impact of the sound flow, and helping to improve the performance and reliability of the microphone assembly 20. In addition, buffering the impact of the sound flow also helps to reduce the level of noise such as wind noise by buffering, thereby improving the quality of sound signal reception by the microphone unit 22. In addition, the waterproof and sound-permeable structure 241 is partially or completely staggered with the sound pickup hole 221, which helps to reduce the crystallization of impurities carried to the sound pickup hole 221 by the sound flow, helps to reduce the risk of clogging the sound pickup hole 221, and improves the stability of the sound reception performance of the microphone assembly 20.

[0033] In some embodiments, the sound receiving channel 212 includes a first section 2341 and a second section 2342 formed within the substrate 23 and interconnected. The first section 2341 communicates with the waterproof sound-permeable structure 241, and the second section 2342 communicates with the sound pickup hole 221. The first section 2341 and the second section 2342 extend in intersecting directions, for example, substantially perpendicularly. In other words, the sound receiving channel 212 has a corner located between the first section 2341 and the second section 2342. As a result, sound flow passing through the waterproof sound-permeable structure 241 collides with the inner wall of the substrate 23 at the corner between the first section 2341 and the second section 2342, thereby being buffered. This buffers the impact of the sound flow on the microphone unit 22. Furthermore, crystals formed by water vapor tend to remain at the corner between the first section 2341 and the second section 2342 and are less likely to fall into the sound pickup hole 221, thereby reducing the impact of impurity crystals on the microphone unit 22.

[0034] In some embodiments, the substrate 23 includes a board body 231, a thickened portion 232 and an extension portion 233. The waterproof seal 24 is arranged on the board body 231. The first section 2341 passes through the board body 231 to communicate with the waterproof and sound-permeable structure 241. The thickened portion 232 is connected to the side of the board body 231 facing away from the waterproof seal 24. The extension portion 233 is connected to the thickened portion 232 and is spaced apart from the board body 231. A second section 2342 is formed between the extension portion 233 and the board body 231. The side walls of the board body 231 and the thickened portion 232 form the first section 2341. The microphone unit 22 is arranged on the side of the extension portion 233 facing away from the board body 231. In some embodiments, the board body 231, thickened portion 232, and extended portion 233 may all be integrally formed. When the substrate 23 is a printed circuit board, the board body 231, thickened portion 232, and extended portion 233 may collectively form the base material portion of the substrate 23. The substrate 23 may include a base material portion formed by the board body 231, thickened portion 232, and extended portion 233, and a conductive circuit portion disposed on the base material portion. By improving the base material structure of the substrate 23 to form a first section 2341 and a second section 2342 with a corner, and offsetting the sound pickup hole 221 and the waterproof sound-permeable structure 241, while buffering the impact of the sound flow and reducing the risk of impurities crystallizing into the sound pickup hole 221, the microphone body channel layout does not need to be altered by the addition of additional parts. This helps reduce the number of parts in the microphone assembly 20, compresses the volume of the microphone assembly 20, and improves the structural reliability of the sound pickup channel 212.

[0035] In some embodiments, the microphone assembly 20 further includes an adhesive structure 25. The adhesive structure 25 is disposed on the substrate 23 and located within the sound receiving channel 212. The adhesive structure 25 is located between the waterproof sound-permeable structure 241 and the sound pickup hole 221 in the transmission direction of the sound receiving channel 212, and is opposite the waterproof sound-permeable structure 241. For example, the adhesive structure 25 is located at the corner between the first section 2341 and the second section 2342. The adhesive structure 25 has adhesive properties on the side facing the waterproof sound-permeable structure 241. When impurities carried in the sound flow passing through the waterproof sound-permeable structure 241 crystallize at the corner between the first section 2341 and the second section 2342, the adhesive structure 25 has adhesive properties on the side facing the waterproof sound-permeable structure 241, thereby adhering to the impurity crystals and retaining them on the adhesive structure 25. This reduces the probability of the impurity crystals migrating with the sound flow to the sound pickup hole 221, further reducing the impact of the impurity crystals on the performance and service life of the microphone unit 22. The adhesive structure 25 includes but is not limited to any suitable adhesive material such as double-sided tape that can be fixed in the sound receiving channel 212 and has adhesiveness on the side facing the waterproof and sound-permeable structure 241 .

[0036] See Figure 3 In some embodiments, the microphone assembly 20 further includes a buffer structure 26. The buffer structure 26 is disposed within the sound receiving channel 212 and at the corner between the first section 2341 and the second section 2342. For example, the buffer structure 26 is disposed on the substrate 23 and opposite the first section 2341. The buffer structure 26 includes, but is not limited to, any suitable elastically deformable buffer material, such as sponge or rubber. Thus, when the sound flow passing through the waterproof and sound-permeable structure 241 is transmitted from the first section 2341 to the corner between the first section 2341 and the second section 2342, the sound flow collides with the buffer structure 26 due to the change in the transmission path. The buffer structure 26 can buffer the impact of the sound flow, thereby reducing the impact intensity of the sound flow on the diaphragm and other components of the microphone unit 22 when the sound flow is transmitted to the sound pickup hole 221. This also helps to reduce noise levels such as wind noise through buffering, thereby improving the quality of the sound signal reception by the microphone unit 22.

[0037] Furthermore, in some embodiments, the adhesive structure 25 is disposed on the side of the extension 233 facing the plate body 231, opposite the waterproof and sound-permeable structure 241. The buffer structure 26 is disposed on the extension 233, opposite the first section 2341, and located on the side of the adhesive structure 25 facing away from the first section 2341. In this embodiment, the buffer structure 26 and the adhesive structure 25 can be considered to be stacked one on top of the other. When the sound flow passes through the waterproof and sound-permeable structure 241 and is conducted from the first section 2341 to the corner between the first section 2341 and the second section 2342, impurity crystals are adhered to the adhesive structure 25, while the buffer structure 26 also acts as a buffer against the impact of the sound flow. The buffer structure 26 and the adhesive structure 25 function at the same location in the sound receiving channel 212, with the buffer structure 26 located between the microphone unit 22 and the thickened portion 232. This facilitates the compactness of the microphone assembly 20 and reduces the space occupied by the microphone assembly 20. There is no limit to the setting method of the buffer structure 26. The buffer structure 26 can fill the gap between the microphone unit 22 and the thickened portion 232, or fill the part extending from the thickened portion 232 toward the extension portion 233, or be directly set in the hole or groove of the extension portion 233, as long as it can buffer the impact of the sound flow at the corner between the first section 2341 and the second section 2342.

[0038] refer to Figure 4 As shown, in some embodiments, the microphone assembly 20 further includes a water-absorbing structure 27. The water-absorbing structure 27 is disposed within the sound receiving channel 212 and is located between the waterproof sound-permeable structure 241 and the sound pickup hole 221 in the transmission direction of the sound receiving channel 212. For example, the water-absorbing structure 27 is disposed within the substrate 23 and is located at least within the first section 2341. The material of the water-absorbing structure 27 includes, but is not limited to, any suitable dry, water-absorbing material such as a desiccant. The water-absorbing structure 27, located at least within the first section 2341, can absorb water vapor from the sound flow passing through the waterproof sound-permeable structure 241, thereby reducing the risk of water vapor being transmitted from the sound receiving channel 212 to the sound pickup hole 221, thereby improving the waterproof performance of the microphone assembly 20. The specific setting method of the water absorption structure 27 is not limited. It can be set on the inner wall of the plate body 231 and the thickened part 232 for surrounding the first section 2341. For example, it can be filled in the groove or opening area of ​​the inner wall of the plate body 231 and the thickened part 232 for forming the first section 2341, or formed into an independent unit through a packaging structure and set on the inner wall of the plate body 231 and the thickened part 232. As long as the sound flow passing through the first section 2341 can pass through the water absorption structure 27, so that the water absorption structure 27 can absorb the water vapor in the sound flow, it can be used.

[0039] It should be noted that the aforementioned adhesive structure 25, buffer structure 26, and water absorption structure 27 can be provided simultaneously to effectively prevent moisture, impurity crystallization, etc. from being transmitted to the sound pickup hole 221, while also reducing the impact of the sound flow on the microphone unit 22. In other embodiments, only one or two of the adhesive structure 25, buffer structure 26, and water absorption structure 27 may be provided, as long as they can achieve the corresponding functions.

[0040] Please see again Figure 2 In some embodiments, the sound receiving channel 212 further includes a third section 2121 and a fourth section 2122 located between the sound receiving hole and the waterproof sound-permeable structure and communicating with each other. The third section 2121 communicates with the sound receiving hole 211, and the fourth section 2122 communicates with the waterproof sound-permeable structure 241. When the microphone assembly 20 is collecting sound signals, sound flow enters the third section 2121 from the sound receiving hole 211, passes through the third section 2121, the fourth section 2122, the waterproof sound-permeable structure 241, the first section 2341, and the second section 2342, and reaches the sound pickup hole 221, where it is collected by the microphone unit 22. The sound receiving channel 212 has a corner located between the third section 2121 and the fourth section 2122. For example, the extension directions of the third section 2121 and the fourth section 2122 intersect, and the extension directions of the third section 2121 and the fourth section 2122 may be substantially perpendicular. Therefore, the corner between the third section 2121 and the fourth section 2122 also helps to retain some impurity crystals, reducing the number of impurity crystals that enter the sound receiving channel 212 through the sealed waterproof structure. At the same time, it has a buffering effect on the sound flow. In conjunction with the corner between the first section 2341 and the second section 2342, it effectively buffers the impact of the sound flow, reduces the impact of the sound flow impact on the diaphragm and other components of the microphone unit 22, and reduces the impact of noise such as wind noise, thereby improving the sound collection quality. The provision of the third section 2121 and the fourth section 2122 also helps to adjust the spatial layout of the sound receiving hole 211 on the microphone assembly 20, so that the structural layout of the microphone assembly 20 can adapt to the spatial layout of the electronic device 10, improve the flexibility of the spatial design, and reduce the space occupied by the microphone assembly 20 within the electronic device 10.

[0041] refer to Figure 5 , Figure 5 This is a schematic diagram of the structure of an electronic device 10 provided in an embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. It will be understood by those skilled in the art that Figure 5The structure of the electronic device 10 shown in the figure does not constitute a limitation to the electronic device 10, and the electronic device 10 may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0042] The RF circuit 501 can be used to send and receive information, or receive and send signals during a call. Specifically, it receives downlink information from the base station and forwards it to one or more processors 508 for processing. It also sends uplink data to the base station. Typically, the RF circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a low-noise amplifier (LNA), a duplexer, and the like. Furthermore, the RF circuit 501 can communicate with the network and other devices via wireless communication. This wireless communication can utilize any communication standard or protocol, including but not limited to Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Message Service (SMS), and the like.

[0043] Memory 502 can be used to store applications and data. Applications stored in memory 502 contain executable code. Applications can be organized into various functional modules. Processor 508 executes various functional applications and processes data by running applications stored in memory 502. Memory 502 may primarily include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function (such as sound playback or image playback). The data storage area may store data generated during the use of electronic device 10 (such as audio data and a phone book). Memory 502 may also include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, memory 502 may also include a memory controller to provide access to memory 502 by processor 508 and input unit 503.

[0044] The input unit 503 can be used to receive input digital or character information, or user profile information (such as a fingerprint), as well as generate keyboard, mouse, joystick, optical, or trackball signal input related to user settings and function control. Specifically, in one embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. A touch-sensitive surface, also known as a touch display or touchpad, can detect user touch operations on or near it (e.g., operations performed on or near the touch-sensitive surface using a finger, stylus, or any other suitable object or accessory) and activate corresponding connected devices according to a pre-set program. Optionally, the touch-sensitive surface can include a touch detection device and a touch controller. The touch detection device detects the user's touch position and detects signals generated by the touch operation, transmitting these signals to the touch controller. The touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then transmits it to the processor 508. The touch controller can also receive and execute commands from the processor 508.

[0045] The display unit 504 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the electronic device 10, which can be composed of graphics, text, icons, videos, and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like. Furthermore, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides corresponding visual output on the display panel according to the type of touch event. Although in Figure 5 In the embodiment, the touch-sensitive surface and the display panel are used as two independent components to realize input and output functions, but in some embodiments, the touch-sensitive surface and the display panel can be integrated to realize input and output functions.

[0046] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in all directions (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that recognize the posture of the mobile phone (such as switching between horizontal and vertical screens, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that the electronic device 10 can also be configured with, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be described in detail here.

[0047] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 via a speaker and microphone. The audio circuit 506 can convert received audio data into electrical signals, transmit them to the speaker, and then convert them into sound signals for output. The microphone, on the other hand, converts collected sound signals into electrical signals, which are received by the audio circuit 506 and converted into audio data. The audio data is then processed by the processor 508 and then transmitted to, for example, another electronic device 10 via the RF circuit 501. Alternatively, the audio data can be output to the memory 502 for further processing. The audio circuit 506 may also include an earphone jack to provide communication between an external earphone and the electronic device 10.

[0048] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507. It provides users with wireless broadband Internet access. Figure 5 The Wi-Fi module 507 is shown, but it is understandable that it is not an essential component of the electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0049] The processor 508 is the control center of the electronic device 10. It connects the various components of the electronic device 10 using various interfaces and circuits. By running or executing applications stored in the memory 502 and accessing data stored in the memory 502, it performs various functions of the electronic device 10 and processes data, thereby providing overall monitoring of the electronic device 10. Optionally, the processor 508 may include one or more processing cores. Preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor primarily processes the operating system, user interface, and application programs, while the modem processor primarily handles wireless communications. It is understood that the modem processor may not be integrated into the processor 508.

[0050] The electronic device 10 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 via a power management system, thereby enabling the power management system to manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and other arbitrary components.

[0051] although Figure 5 Not shown, the electronic device 10 may further include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can be referred to the previous method embodiment, which will not be described in detail here.

[0052] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A microphone assembly, characterized in that: include: The housing is provided with a sound receiving hole and a sound receiving channel connected to the sound receiving hole; A microphone unit is provided in the housing and has a sound pickup hole connected to the sound receiving channel; and, A waterproof seal is provided in the sound receiving channel. The waterproof seal is provided with a waterproof sound-permeable structure in the sound receiving channel. The projection of the waterproof sound-permeable structure along the direction of the sound receiving channel toward the sound pickup hole is partially or completely staggered with the sound pickup hole.

2. The microphone assembly according to claim 1, wherein: The microphone assembly also includes a substrate disposed in the shell, and the sound receiving channel has a first section and a second section formed in the substrate and connected to each other, the first section is connected to the waterproof and sound-permeable structure, and the second section is connected to the sound pickup hole.

3. The microphone assembly according to claim 1, wherein: The microphone assembly also includes an adhesion structure, which is arranged in the sound receiving channel and is located between the waterproof and sound-permeable structure and the sound pickup hole in the transmission direction of the sound receiving channel. The adhesion structure is opposite to the waterproof and sound-permeable structure.

4. The microphone assembly according to claim 1, wherein: The microphone assembly further includes a water absorption structure, which is disposed in the sound receiving channel and is located between the waterproof and sound-permeable structure and the sound pickup hole in the transmission direction of the sound receiving channel.

5. The microphone assembly according to claim 2, wherein: The sound receiving channel has a corner located between the first section and the second section.

6. The microphone assembly according to claim 5, wherein: The microphone assembly further includes a buffer structure, which is disposed in the sound receiving channel and located at a corner between the first section and the second section.

7. The microphone assembly according to claim 2, wherein: The substrate includes a board body, a thickened portion and an extended portion. The waterproof seal is arranged on the board body. The first section passes through the board body. The thickened portion is arranged on the side of the board body facing away from the waterproof seal. The extended portion is connected to the thickened portion and is spaced apart from the board body. The second section is located between the extended portion and the board body. The microphone unit is arranged on the side of the extended portion facing away from the board body.

8. The microphone assembly according to claim 7, wherein: The microphone assembly further includes an adhesion structure, which is provided on a side of the extension portion facing the plate body and opposite to the waterproof and sound-permeable structure.

9. The microphone assembly according to claim 8, wherein: The microphone assembly further includes a buffer structure, which is disposed on the extension portion and opposite to the first section.

10. The microphone assembly according to claim 9, wherein: The buffer structure is located on a side of the adhesion structure facing away from the first section and between the microphone unit and the thickened portion.

11. The microphone assembly according to claim 7, wherein: The microphone assembly further includes a water absorption structure, which is provided on the plate body and the inner wall of the thickened portion for surrounding and forming the first section.

12. The microphone assembly according to any one of claims 1 to 11, characterized in that: The sound receiving channel also includes a third section and a fourth section located between the sound receiving hole and the waterproof sound-permeable structure and connected to each other, the third section is connected to the sound receiving hole, the fourth section is connected to the waterproof sound-permeable structure, and the sound receiving channel has a corner located between the third section and the fourth section.

13. An electronic device, characterized in that: Comprising the microphone assembly according to any one of claims 1-12.

Images