Inverter heat dissipation structure and inverter

Abstract

The utility model provides an inverter heat dissipation structure and an inverter, the heat dissipation structure is applied to the inverter, the heat dissipation structure comprises a support plate used for being detachably arranged in a mounting shell, and the support plate is used for dividing a mounting cavity into a first assembly cavity and a second assembly cavity; in the first assembling cavity, the side face of the supporting plate and the side wall opposite to the supporting plate are used for arranging an inverter bridge type loop and a boosting loop respectively, and the inverter bridge type loop and the boosting loop are provided with an inverter bridge type loop radiator and a boosting loop radiator respectively. The fan fixing plate is provided with at least one opening, the opening is provided with a fan, and the fan fixing plate is detachably arranged on the supporting plate; and the wind direction of the fan is parallel to the fins of the corresponding radiator. The fan is arranged on the fixing plate, the fixing plate is detachable, when the fan is cleaned, the fan on the fixing plate can be cleaned by detaching the fixing plate, and the fan is more convenient to clean.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the technical field of inverters, and in particular to an inverter heat dissipation structure and an inverter. Background Art

[0002] An inverter is a power regulation device composed of semiconductor devices, mainly used to convert DC power into AC power. It is generally composed of a boost circuit and an inverter bridge circuit. The boost circuit boosts the DC voltage of the solar cell to the DC voltage required for inverter output control, and the inverter bridge circuit converts the boosted DC voltage into an AC voltage of a commonly used frequency.

[0003] Currently, most high-power inverters combine the boost and inverter circuits on a single PCB, resulting in concentrated heat. Fans accelerate internal airflow to dissipate this heat and achieve heat dissipation. However, when the inverter generates significant heat, such as during high-power operation or long-term continuous operation, the fan accelerates, causing increased noise. Furthermore, foreign matter such as dust in the air quickly adheres to the fan blades, reducing heat dissipation. Cleaning this requires the entire fan to be removed from the inverter and completely separated from the inverter, a cumbersome process. Therefore, there is a need for an inverter that is easy to clean. Utility Model Content

[0004] The purpose of the embodiments of the present disclosure is to provide an inverter heat dissipation structure and an inverter, thereby solving the aforementioned problems existing in the prior art.

[0005] In order to achieve the above objectives, the technical solutions adopted in the embodiments of the present disclosure are as follows:

[0006] On the one hand, an embodiment of the present disclosure provides an inverter heat dissipation structure, which is applied to an inverter. The heat dissipation structure includes: a support plate, which is detachably arranged in a mounting shell, the mounting shell having a mounting cavity, and the support plate is used to divide the mounting cavity into a first assembly cavity and a second assembly cavity; in the first assembly cavity, the side surface of the support plate and the side wall of the mounting shell opposite to the support plate are respectively used to set an inverter bridge circuit and a boost circuit, and the inverter bridge circuit and the boost circuit are respectively provided with at least one inverter bridge circuit radiator and an inverter bridge circuit and a boost circuit radiator; a fan fixing plate, which has at least one opening, and a fan is provided in the opening, and the fan fixing plate is detachably arranged on the support plate; the wind direction of the fan is used to be parallel to the fins of the corresponding radiator.

[0007] Exemplarily, when an inverter bridge circuit and a boost circuit are respectively provided on the side surface of the support plate and the side wall of the mounting shell opposite to the support plate, the inverter bridge circuit radiator and the corresponding boost circuit radiator are arranged opposite to each other, and a preset heat dissipation channel is provided between the two oppositely arranged radiators; the wind direction of the fan is used to be parallel to the corresponding preset heat dissipation channel.

[0008] Exemplarily, the height of the first assembly cavity is greater than the total height after the boost circuit, the inverter bridge circuit, the inverter bridge circuit radiator, the inverter bridge circuit and the boost circuit radiator are installed, so that a preset heat dissipation channel is provided between the inverter bridge circuit radiator, the inverter bridge circuit and the boost circuit radiator.

[0009] Exemplarily, the side of the support plate facing away from the first assembly cavity is used to set a low-power control loop.

[0010] Exemplarily, the mounting shell includes: a first outer shell, a second outer shell, a first ventilation plate shell and a second ventilation plate shell that enclose a mounting cavity; the first outer shell includes: three side walls connected in sequence to enclose it, and has three openings, the second outer shell is buckled into the opening enclosed by the two side walls of the first outer shell, and the first ventilation plate shell and the second ventilation plate shell are arranged at two opposite openings enclosed by the three side walls of the first outer shell.

[0011] Exemplarily, the first ventilation plate shell and the second ventilation plate shell are both provided with a plurality of honeycomb holes arranged in a matrix.

[0012] Exemplarily, one end of the support plate is folded toward the second assembly cavity to form a first folded portion, and the first folded portion is evenly provided with a plurality of first installation openings;

[0013] The fan fixing plate includes: an open accommodating cavity, wherein a side wall in a central region of the accommodating cavity is provided with at least one opening; an end portion of an edge side wall of the accommodating cavity is folded outward to form a second folded portion, wherein the second folded portion is evenly provided with a plurality of second mounting openings;

[0014] The first folding portion corresponds to the second folding portion, and the first mounting opening is fastened to the corresponding second mounting opening by means of bolts.

[0015] Exemplarily, a mounting groove for mounting the fan fixing plate is provided on a side wall of the first assembly cavity opposite to one end of the support plate.

[0016] Exemplarily, the height of the first assembly cavity is greater than the height of the second assembly cavity; the side of the support plate facing away from the second shell is used to set up an inverter bridge circuit, and the side wall of the first assembly cavity opposite to the support plate is used to set up a boost circuit; the side of the support plate facing the second shell is used to set up a low-power control circuit.

[0017] Another aspect of the embodiments of the present disclosure provides an inverter, including a boost circuit, a boost circuit radiator arranged in the boost circuit, an inverter bridge circuit, an inverter bridge circuit radiator arranged in the inverter bridge circuit, and the heat dissipation structure as described above.

[0018] Exemplarily, the boost circuit radiator includes: a first fixing plate and heat dissipation fins, wherein a plurality of heat dissipation fins spaced parallel to each other are respectively provided on both sides of one end of the first fixing plate; the other end of the first fixing plate and the heat dissipation fins on both sides opposite to each other form a first installation space; the other end of the first fixing plate is disposed in the boost circuit, and the two first installation spaces respectively accommodate components corresponding to the boost circuit;

[0019] The inverter bridge circuit radiator includes: a second fixing plate and heat dissipation fins, a plurality of heat dissipation fins spaced parallel to each other are provided on one side of the second fixing plate, a plurality of heat dissipation fins spaced parallel to each other are provided on one end of the other side of the second fixing plate, and the other end of the second fixing plate and the opposite heat dissipation fins form a second installation space; the other end of the second fixing plate is provided in the inverter bridge circuit, and the second installation space respectively accommodates the corresponding components of the inverter bridge circuit.

[0020] Exemplarily, the inverter bridge circuit radiator and the boost circuit radiator are used in pairs, and the second installation spaces of the two inverter bridge circuit radiators are combined to accommodate the corresponding components of the inverter bridge circuit;

[0021] The first installation space combination of the two boost circuit radiators accommodates corresponding components of the boost circuit radiators.

[0022] Exemplarily, the inverter bridge circuit radiator is arranged opposite to the corresponding boost circuit radiator, and a preset heat dissipation channel is provided between the two opposite radiators; the wind direction of the fan is used to be parallel to the corresponding preset heat dissipation channel.

[0023] The beneficial effects of the embodiments of the present disclosure are:

[0024] In the inverter heat dissipation structure of the embodiment of the present invention, the fan fixing plate is detachably arranged on the support plate. When cleaning the fan, the fan fixing plate is removed and the fan above is directly cleaned to clean the dust and other foreign matter covering the fan blades; the fan fixing plate is simple and convenient to disassemble and assemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of an inverter heat dissipation structure after assembly provided by an embodiment of the present disclosure;

[0026] Figure 2 This is a schematic diagram of the internal structure of an inverter heat dissipation structure provided by an embodiment of the present disclosure;

[0027] Figure 3 This is an internal schematic diagram of another inverter heat dissipation structure provided by an embodiment of the present disclosure after being assembled with an inverter circuit;

[0028] Figure 4 This is an internal schematic diagram of an inverter heat dissipation structure provided by an embodiment of the present disclosure after an inverter circuit is assembled;

[0029] Figure 5 This is a schematic diagram of a heat dissipation structure frame of an inverter provided in an embodiment of the present disclosure;

[0030] Figure 6 This is a schematic diagram of the internal structure of an inverter heat dissipation structure after assembly, provided by an embodiment of the present disclosure;

[0031] Figure 7 This is a schematic diagram of an assembled fan and a fixing plate in an inverter heat dissipation structure provided by an embodiment of the present disclosure;

[0032] Figure 8 This is a structural diagram of a fan fixing plate and a support plate in an inverter heat dissipation structure provided by an embodiment of the present disclosure;

[0033] Figure 9 The present disclosure provides a schematic structural diagram of an inverter bridge circuit radiator in an inverter;

[0034] Figure 10 The present disclosure provides a schematic structural diagram of a boost circuit radiator in an inverter.

[0035] In the picture:

[0036] 100. Mounting shell; 110. First outer shell; 120. Second outer shell; 130. First ventilation plate shell; 140. Second ventilation plate shell; 150. First assembly cavity; 160. Second assembly cavity; 170. Mounting groove; 200. Support plate; 210. First folding portion; 211. First mounting port; 300. Fan fixing plate; 310. Opening; 320. Accommodating cavity; 330. Second folding portion; 331. Second mounting port; 400. Fan; 500. Boost circuit; 510. Boost circuit radiator; 511. First fixing plate; 512. First mounting space; 600. Inverter bridge circuit; 610. Inverter bridge circuit radiator; 611. Second fixing plate; 612. Second mounting space; 700. Low-power control circuit; 800. Preset heat dissipation channel. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the embodiments of the present disclosure are further described in detail below with reference to the accompanying drawings. It should be understood that the specific implementation methods described herein are only used to explain the embodiments of the present disclosure and are not intended to limit the embodiments of the present disclosure.

[0038] like Figures 1 to 4 As shown, an embodiment of the present disclosure provides an inverter heat dissipation structure, which is applied to an inverter. The heat dissipation structure includes: a support plate 200, which is detachably arranged in a mounting shell 100, and the mounting shell 100 has a mounting cavity. The support plate 200 is used to divide the mounting cavity into a first assembly cavity 150 and a second assembly cavity 160. In the first assembly cavity 150, the side surface of the support plate 200 and the side wall of the mounting shell 100 opposite to the support plate 200 are respectively used to set an inverter bridge circuit 600 and a boost circuit 500, and the inverter bridge circuit 600 and the boost circuit 500 are respectively provided with at least one inverter bridge circuit radiator, an inverter bridge circuit 610 and a boost circuit radiator 510; a fan fixing plate 300, which has at least one opening 310, and a fan 400 is provided in the opening 310. The fan fixing plate 300 is detachably arranged on the support plate 200; the wind direction of the fan 400 is parallel to the fins of the corresponding radiator.

[0039] The heat dissipation structure of the inverter of the embodiment of the present disclosure is provided with a support plate, which divides the mounting shell into layers, realizes layered utilization of the internal space of the mounting shell, disperses the internal air duct, and facilitates heat dissipation. The support plate specifically divides the first assembly cavity 150 and the second assembly cavity 160. Specifically, in the inverter to which the embodiment of the present disclosure is applicable, the inverter bridge circuit 600 and the boost circuit 500 of the inverter are separately provided on corresponding PCB boards, and the side surface of the support plate of the first assembly cavity and the side wall of the mounting shell are respectively installed with the inverter bridge circuit 600 and the boost circuit 500, and the inverter bridge circuit 600 and the boost circuit 500 can be arranged relative to each other.

[0040] like Figure 3 and Figure 4 As shown, the side of the support plate 200 facing away from the first assembly cavity 150 is used to set a low-power control loop 700.

[0041] The inverter heat dissipation structure of the disclosed embodiment includes an independent, removable fan mounting plate, to which a fan is mounted. The fan mounting plate can be provided with multiple fan mounting openings and filter mounting holes, as required, for mounting the fan and filter. The positions of the openings and filter mounting holes can also be adjusted as required. To ensure that the fan mounting plate is removable and secure, and to achieve better heat dissipation, the heat dissipation structure of the disclosed embodiment includes a removable support plate within the inverter housing, that is, within the mounting shell. The two ends of the support plate are respectively adjacent to the two ends of the mounting shell. The support plate divides the mounting cavity within the mounting shell into two assembly chambers. The fan mounting plate is provided with a fan and a filter, and the fan mounting plate is removably mounted on the support plate.

[0042] Generally speaking, in an inverter, two opposite side walls of its shell are provided with ventilation and heat dissipation structures. The ventilation and heat dissipation structure includes multiple heat dissipation holes to facilitate ventilation inside the inverter. One side wall is provided with a fan. When the fan is started, it accelerates the heat dissipation inside the inverter.

[0043] In the embodiment of the present disclosure, a high-power circuit, such as a boost circuit and an inverter bridge circuit, can be arranged in the first assembly cavity, such as Figure 2 As shown, the height of the first assembly cavity is much greater than that of the second assembly cavity. The fan corresponds to the two heat sinks arranged opposite each other in the first assembly cavity. The fan's wind direction is parallel to the fins of the corresponding heat sink, which facilitates the fan to purge the heat sink and blow away the heat. Compared to traditional inverters that require the fan to be removed for cleaning, the inverter heat dissipation structure implemented in this disclosure installs the fan on a removable fan mounting plate. When cleaning the fan, only the fan mounting plate needs to be removed to clean the fan, without having to separate the fan from the mounting plate, making fan cleaning simple and convenient.

[0044] like Figure 3 and Figure 4As shown, when the side surface of the support plate 200 and the side wall of the mounting shell 100 opposite to the support plate 200 are respectively provided with an inverter bridge circuit 600 and a boost circuit 500, the inverter bridge circuit radiator inverter bridge circuit 610 and the corresponding boost circuit radiator 510 are arranged opposite to each other, and a preset heat dissipation channel 800 is provided between the two oppositely arranged heat sinks; the wind direction of the fan 400 is used to be parallel to the corresponding preset heat dissipation channel 800.

[0045] In the embodiment of the present disclosure, when the inverter bridge circuit radiator inverter bridge circuit 610 is arranged opposite to the corresponding boost circuit radiator 510, each fan can correspond to the corresponding two radiators, and the blowing direction is parallel to the preset heat dissipation channel between the two radiators. On the one hand, the heat dissipation channel can be increased, and on the other hand, the heat dissipation efficiency can be improved.

[0046] like Figure 3 and Figure 4 As shown, the height of the first assembly cavity 150 is greater than the total height after the boost circuit 500, the inverter bridge circuit 600, the inverter bridge circuit radiator 610 and the boost circuit radiator 510 are installed, so that a preset heat dissipation channel 800 is provided between the relatively arranged inverter bridge circuit radiator 610 and the corresponding boost circuit radiator 510.

[0047] In the inverter applicable to the embodiment of the present disclosure, since the inverter bridge circuit and the boost circuit are respectively provided with corresponding radiators, the inverter bridge circuit radiator and the corresponding boost circuit radiator can be arranged relative to each other, and there is a certain distance between the two relative radiators to form a preset heat dissipation channel. The fans correspond to the preset heat dissipation channels, and a corresponding number of fans can be set according to the number of preset heat dissipation channels.

[0048] The fan mounting plate has holes for mounting the fan and filter. The outer edge of the middle fixed support plate secures the fan mounting plate. When used independently, the fan mounting plate blows air through the pre-set heat dissipation channel between the boost circuit radiator and the inverter bridge circuit radiator, achieving heat dissipation. The fan mounting plate is removable, making it easy to clean dust and other foreign matter from the fan blades.

[0049] like Figure 1 and Figure 2As shown, as an example of a mounting shell, the mounting shell 100 includes: a first shell 110, a second shell 120, a first ventilation plate shell 130 and a second ventilation plate shell 140 that enclose a mounting cavity; the first shell 110 includes: three side walls connected in sequence to enclose it, and has three openings, the second shell 120 is arranged at the opening enclosed by two side walls, and the first ventilation plate shell 130 and the second ventilation plate shell 140 are arranged at two opposite openings enclosed by the three side walls of the first shell 110.

[0050] The inverter housing of the embodiment of the present disclosure, that is, the mounting housing includes: a first housing, that is, the outer upper shell; a second housing, that is, the outer lower shell; a first ventilation plate shell, that is, the front panel shell; a second ventilation plate shell, that is, the rear panel shell; a middle-layer fixed support plate and an independent fan fixing plate, the middle-layer fixed support plate is referred to as a support plate.

[0051] like Figure 1 and Figure 2 As shown, as a specific example of the first ventilation plate shell and the second ventilation plate shell, the first ventilation plate shell 130 and the second ventilation plate shell 140 are both provided with a plurality of honeycomb holes arranged in a matrix.

[0052] That is to say, the front and rear panel shells both use honeycomb holes arranged in a large-area matrix to facilitate ventilation and heat dissipation.

[0053] like Figure 3 and Figure 4 As shown, as a specific example of a support plate, one end of the support plate 200 is folded toward the second assembly cavity 160 to form a first folded portion 210, and the first folded portion 210 is evenly provided with a plurality of first mounting ports 211; the fan 400 fixing plate 300 includes: an open accommodating cavity 320, and the side wall of the central area of ​​the accommodating cavity 320 is provided with at least one opening 310; the end of an edge side wall of the accommodating cavity 320 is folded outward to form a second folded portion 330, and the second folded portion 330 is evenly provided with a plurality of second mounting ports 331; the first folded portion 210 corresponds to the second folded portion 330, and the first mounting port 211 is fastened to the corresponding second mounting port 331 by bolts.

[0054] The support plate has a simple structure, consisting solely of a metal plate, which facilitates heat dissipation. Each edge of the support plate can be provided with flanges, each with mounting openings, which are removably connected to the mounting housing and fan mounting plate via bolts. The support plate is secured to the fan mounting plate solely by a folding structure and corresponding mounting openings, making it easy to manufacture and form. The first folded portion folds toward the second assembly cavity, without obstructing airflow within the first assembly cavity.

[0055] like Figure 4As shown, as a specific example of the first assembly cavity, the first assembly cavity 150 is opposite to the side wall of the support plate 200 and is provided with an installation groove 170 for installing the fan fixing plate 300 corresponding to one end of the support plate 200.

[0056] Before installing the fan mounting plate, first install the fan into the corresponding opening and connect it to the corresponding circuit board. Insert the fan mounting plate into the mounting slot, aligning the first folded portion with the second folded portion and the corresponding mounting opening, and tighten the bolts to secure the fan mounting plate. To disassemble, remove the bolts between the first and second mounting openings, pull the fan mounting plate out of the mounting slot, and clean the fan. This allows you to clean foreign matter like dust from the fan blades without removing the fan from the fan mounting plate, making the cleaning process quick and convenient.

[0057] like Figure 1 and Figure 2 As shown, the height of the first assembly cavity 150 is greater than the height of the second assembly cavity 160; the side of the support plate 200 facing away from the second housing 120 is used to set the inverter bridge circuit 600, and the side wall of the first assembly cavity 150 opposite to the support plate 200 is used to set the boost circuit 500; the side of the support plate 200 facing the second housing 120 is used to set the low-power control circuit 700.

[0058] The lower casing and the middle fixed support plate of the disclosed embodiment are used to respectively set up a boost circuit and an inverter bridge circuit relative to each other to form a preset air duct, which cooperates with the front and rear panel shells with matrix honeycomb holes to form an independent air duct to effectively disperse heat. An independent detachable fan system is installed on the outer edge of the middle fixed support plate. When in use, the fan adjusts its speed through a controller according to the inverter working conditions to achieve the purpose of blowing air to accelerate heat dissipation and reduce noise. When cleaning, the fixed cover can be removed, and the fan mechanism can be taken out from the inside of the mounting shell to clean foreign matter such as dust on the fan blades. There is no need to completely separate the fan and the fixed plate. The process is relatively convenient and quick.

[0059] On the other hand, an embodiment of the present disclosure provides an inverter, including: a boost circuit 500, a boost circuit radiator 510 arranged in the boost circuit 500, an inverter bridge circuit 600, an inverter bridge circuit radiator 610 arranged in the inverter bridge circuit 600, and the heat dissipation structure as described above.

[0060] The inverter of the disclosed embodiment mainly includes: a boost circuit, an inverter bridge circuit and a low-power control circuit, etc. Among them, the boost circuit and the inverter bridge circuit are large in size, consume a lot of energy, and generate a lot of heat, so the two are arranged in the first assembly cavity. The low-power control circuit is small in size and generates less heat, and is arranged in the second assembly cavity. The height of the first assembly cavity is much greater than that of the second assembly cavity. The boost circuit and the inverter bridge circuit are independently arranged on two different PCB boards. There is an independent inverter bridge circuit fixing plate and an independent fan fixing plate inside the mounting shell. Specifically, the PCBA of the inverter bridge circuit and the low-power control circuit are fixed on both sides of the middle-layer fixed support plate, and the outer lower shell is used to fix the PCBA of the boost circuit.

[0061] like Figure 3 and 4 As shown, the inverter also includes: the boost circuit radiator 510 includes: a first fixing plate 511 and heat dissipation fins, and a plurality of heat dissipation fins spaced parallel to each other are respectively provided on both sides of one end of the first fixing plate 511; the other end of the first fixing plate 511 forms a first installation space 512 with the heat dissipation fins opposite to each other on both sides; the other end of the first fixing plate 511 is provided on the boost circuit 500, and the two first installation spaces 512 respectively accommodate corresponding components of the boost circuit 500; the inverter bridge circuit radiator 610 includes: a second fixing plate 611 and heat dissipation fins, a plurality of heat dissipation fins spaced parallel to each other are provided on one side of the second fixing plate 611, a plurality of heat dissipation fins spaced parallel to each other are provided on one end of the other side of the second fixing plate 611, and the other end of the second fixing plate 611 forms a second installation space 612 with the opposite heat dissipation fins; the other end of the second fixing plate 611 is provided on the inverter bridge circuit 600, and the second installation spaces 612 respectively accommodate corresponding components of the inverter bridge circuit 600.

[0062] like Figure 3 and Figure 4 As shown, the corresponding components of the boost circuit and the inverter bridge circuit are covered with heat sinks, namely the boost circuit radiator 510 and the inverter bridge circuit radiator 610, as shown in FIG. Figure 9 and Figure 10As shown. The radiator has a plurality of heat dissipation fins arranged at intervals, and adjacent heat dissipation fins also form a heat dissipation channel. The shape of the radiator can be set according to actual conditions. By setting independent radiators for the boost circuit and the inverter circuit inside the mounting shell, the heat dissipation area is increased, and the wind direction blown by the fan is parallel to the heat dissipation channel between the heat dissipation fins, and the wind direction blown by the fan is parallel to the preset heat dissipation channel. The wind blown by the fan covers each radiator, and when the wind direction is the same as the heat dissipation fins, the heat dissipation can be better. The material of the two radiators can be metal. The two radiators are symmetrically fixed and can absorb heat together. If one of the circuits generates more heat, the corresponding radiator absorbs more heat. The other circuit generates less heat, and the corresponding radiator absorbs less heat. Since the two radiators are relatively set, the radiator that absorbs less heat will absorb the heat of the radiator that generates more heat. The two work together and the heat is blown out by the fan.

[0063] As a specific example of an inverter, the inverter bridge circuit 610 of the inverter bridge circuit radiator is arranged opposite to the corresponding boost circuit radiator 510, and a preset heat dissipation channel 800 is provided between the two opposite heat sinks; the wind direction of the fan 400 is used to be parallel to the corresponding preset heat dissipation channel 800.

[0064] It should be noted that the boost circuit and the inverter bridge circuit are arranged opposite to each other in the first assembly cavity, and the boost circuit and the inverter bridge circuit are arranged at intervals, with a preset distance between them to form a preset heat dissipation channel for ventilation and heat dissipation; the low-power control circuit is arranged in the second assembly cavity. Figure 9 and Figure 10As shown, the corresponding components of the boost circuit and the inverter bridge circuit are covered with corresponding heat sinks. The same type of heat sinks are neatly arranged at a certain distance on the corresponding PCB board. The heat sink has multiple heat sinks arranged at intervals. Adjacent heat sinks form a heat dissipation channel. The shape of the heat sink can be set according to actual conditions. The neat arrangement of the heat sink is conducive to heat dissipation. The boost circuit and inverter bridge circuit of the embodiment of the present disclosure are respectively provided with multiple heat sinks, specifically three, with a first preset interval between two adjacent heat sinks to form multiple air ducts; the boost circuit PCB and the inverter bridge circuit PCB are arranged relative to each other, and the corresponding heat sinks of the boost circuit and the inverter bridge circuit are also arranged relative to each other. Because the height of the first chamber is greater than the total height of the boost circuit, inverter bridge circuit, boost circuit heat sink 510 and the inverter bridge circuit heat sink 610 on which the inverter is installed, a second preset interval is provided between the boost circuit and the inverter bridge circuit; that is, a second preset interval is provided between the relative heat sinks of the boost circuit and the inverter bridge circuit to form a preset heat dissipation channel. The boost circuit and inverter bridge circuit feature both horizontal and vertical air ducts, increasing the heat dissipation area and enhancing cooling efficiency. Fans are primarily installed in the first assembly chamber of the boost circuit and inverter bridge circuit. A corresponding number of fans can be installed based on the number of radiators facing each pair, ensuring that each fan faces the paired radiator, improving cooling efficiency.

[0065] The inverter of the disclosed embodiment has the following advantages: 1. The boost circuit and the inverter bridge circuit are independently arranged on different PCBs to disperse the heat dissipation area. The PCBA of the boost circuit is fixed on the lower casing, and the inverter circuit is fixed on the middle support plate, and symmetrically fixed on the lower casing and the middle fixed support plate. The middle support plate is fixed on the middle support plate of the chassis, and cooperates with the front and rear honeycomb panels to form an efficient heat dissipation duct; 2. Fans of different numbers or positions are adapted for blowing and exhausting to meet the heat dissipation requirements of inverters of different power ranges; 3. The independent fan fixing plate is convenient for disassembly to clean dust on the fan blades.

[0066] There is a preset distance between the boost circuit and the inverter bridge circuit.

[0067] In the heat dissipation mechanism of the disclosed embodiment, the heat dissipation fan and the filter are fixed on an independent fan fixing plate, and then fixed to the outer edge of the middle fixed support plate. When in use, air is blown or exhausted inside the inverter to achieve the purpose of heat dissipation, and it is convenient to clean and remove dust or other foreign matter on the fan later.

[0068] When in use, apply the layered independent heat dissipation structure to the inverter, connect the fan and inverter circuit together, and after the inverter is turned on, the controller will adjust the fan speed according to the internal operating temperature to achieve the purpose of heat dissipation and noise reduction. During this process, the filter can block larger foreign objects, while some dust and other foreign objects will adhere to the fan. When cleaning, remove the fan fixing plate from the inverter, install it back on the inverter after cleaning, and then continue to use the machine.

[0069] The above is only a preferred implementation of the embodiment of the present disclosure. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiment of the present disclosure. These improvements and modifications should also be considered within the scope of protection of the embodiment of the present disclosure.

Claims

1. An inverter heat dissipation structure, characterized in that: Applied to an inverter, the heat dissipation structure includes: A support plate (200) is used to be detachably arranged in an installation shell (100), wherein the installation shell (100) has an installation cavity, and the support plate (200) is used to divide the installation cavity into a first assembly cavity (150) and a second assembly cavity (160); In the first assembly cavity (150), the side surface of the support plate (200) and the side wall of the mounting shell (100) opposite to the support plate (200) are respectively used to set an inverter bridge circuit (600) and a boost circuit (500), and the inverter bridge circuit (600) and the boost circuit (500) are respectively provided with at least one inverter bridge circuit radiator (610) and a boost circuit radiator (510); A fan fixing plate (300) has at least one opening (310), a fan (400) is provided in the opening (310), and the fan fixing plate (300) is detachably provided on the support plate (200); The wind direction of the fan (400) is used to be parallel to the fins of the corresponding radiator.

2. The heat dissipation structure according to claim 1, characterized in that: When an inverter bridge circuit (600) and a boost circuit (500) are respectively provided on the side surface of the support plate (200) and the side wall of the mounting shell (100) opposite to the support plate (200), the inverter bridge circuit radiator (610) and the corresponding boost circuit radiator (510) are arranged opposite to each other, and a preset heat dissipation channel (800) is provided between the two oppositely arranged heat dissipators; and the wind direction of the fan (400) is used to be parallel to the corresponding preset heat dissipation channel (800).

3. The heat dissipation structure according to claim 1, characterized in that: The side of the support plate (200) facing away from the first assembly cavity (150) is used to set a low-power control loop (700).

4. The heat dissipation structure according to any one of claims 1 to 3, characterized in that: The mounting shell (100) includes: a first shell (110), a second shell (120), a first ventilation plate shell (130) and a second ventilation plate shell (140) that enclose an mounting cavity; the first shell (110) includes: three side walls that are connected in sequence and enclosed, and has three openings, the second shell (120) is buckled into the openings enclosed by the two side walls of the first shell (110), and the first ventilation plate shell (130) and the second ventilation plate shell (140) are arranged at two opposite openings enclosed by the three side walls of the first shell (110).

5. The heat dissipation structure according to any one of claims 1 to 3, characterized in that: One end of the support plate (200) is folded toward the second assembly cavity (160) to form a first folded portion (210), and the first folded portion (210) is evenly provided with a plurality of first installation openings (211); The fan fixing plate (300) comprises: an open accommodating cavity (320), wherein a side wall of a central region of the accommodating cavity (320) is provided with at least one opening (310); an end portion of an edge side wall of the accommodating cavity (320) is folded outward to form a second folding portion (330), and the second folding portion (330) is evenly provided with a plurality of second mounting openings (331); The first folding portion (210) corresponds to the second folding portion (330), and the first mounting opening (211) is fastened to the corresponding second mounting opening (331) by means of bolts.

6. The heat dissipation structure according to claim 5, characterized in that: The first assembly cavity (150) is opposite to the side wall of the support plate (200), and is provided with an installation groove (170) for installing the fan fixing plate (300) at a position opposite to one end of the support plate (200).

7. The heat dissipation structure according to claim 4, characterized in that: The height of the first assembly cavity (150) is greater than the height of the second assembly cavity (160); The side of the support plate (200) facing away from the second housing (120) is used to set an inverter bridge circuit (600), and the side wall of the first assembly cavity (150) opposite to the support plate (200) is used to set a boost circuit (500); The side of the support plate (200) facing the second housing (120) is used for arranging a low-power control loop (700).

8. An inverter, characterized in that: include: A boost circuit (500), a boost circuit radiator (510) provided in the boost circuit (500), an inverter bridge circuit (600), an inverter bridge circuit radiator (610) provided in the inverter bridge circuit (600), and a heat dissipation structure according to any one of claims 1 to 7.

9. The inverter according to claim 8, characterized in that: The boost circuit radiator (510) comprises: a first fixing plate (511) and heat dissipation fins; a plurality of heat dissipation fins spaced parallel to each other are respectively provided on both sides of one end of the first fixing plate (511); and the other end of the first fixing plate (511) forms corresponding first installation spaces (512) with the heat dissipation fins on both sides opposite to each other. The other end of the first fixing plate (511) is arranged on the boost circuit (500), and the two first installation spaces (512) respectively accommodate corresponding components of the boost circuit (500); The inverter bridge circuit radiator (610) comprises: a second fixing plate (611) and heat dissipation fins, wherein a plurality of heat dissipation fins spaced parallel to each other are provided on one side of the second fixing plate (611), a plurality of heat dissipation fins spaced parallel to each other are provided on one end of the other side of the second fixing plate (611), and the other end of the second fixing plate (611) and the opposite heat dissipation fins form a second installation space (612); The other end of the second fixing plate (611) is arranged on the inverter bridge circuit (600), and the second installation space (612) respectively accommodates corresponding components of the inverter bridge circuit (600).

10. The inverter according to claim 8 or 9, characterized in that: The inverter bridge circuit radiator (610) and the corresponding boost circuit radiator (510) are arranged opposite to each other, with a preset heat dissipation channel (800) provided between the two opposite radiators; the wind direction of the fan (400) is parallel to the corresponding preset heat dissipation channel (800).

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