Embedded intelligent control station

Abstract

The utility model discloses an embedded intelligent control station, comprising a housing, the housing comprises a first side plate, a second side plate and a first top plate, the outer side of the first side plate and the outer side of the second side plate are provided with first heat radiation fins extending along a first direction, the outer side of the first top plate is provided with second heat radiation fins extending along a second direction, the first direction is perpendicular to the second direction; the control main board is mounted in the shell; the main control chip is mounted on one side, far away from the first top plate, of the control mainboard; one side of the heat conduction pad abuts against the main control chip, and the other side of the heat conduction pad abuts against the bottom of the shell; and the cooling fan is mounted on the outer side of the first top plate. According to the embedded intelligent control station, the heat dissipation efficiency of the embedded intelligent control station can be effectively improved, so that the working performance of the embedded intelligent control station is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of embedded intelligent control stations, in particular to an embedded intelligent control station. Background Art

[0002] Since embedded intelligent control stations are mostly designed with a smaller size to meet usage requirements, the heat dissipation space of the embedded intelligent control stations is small. The design process cannot dissipate heat for the embedded intelligent control stations by expanding the chassis. The equipment will generate a lot of heat when working for a long time, and the heat generated by the equipment will seriously affect the working performance of the embedded intelligent control station. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an embedded intelligent control station that can effectively improve the heat dissipation efficiency of the embedded intelligent control station, thereby improving the working performance of the embedded intelligent control station.

[0004] According to the first embodiment of the present invention, the embedded intelligent control station includes:

[0005] A housing, the housing comprising a first side plate, a second side plate, and a first top plate, wherein first heat dissipation fins extending in a first direction are provided on outer sides of the first side plate and outer sides of the second side plate, and second heat dissipation fins extending in a second direction are provided on outer sides of the first top plate, wherein the first direction and the second direction are perpendicular to each other;

[0006] A control mainboard, the control mainboard being installed in the housing;

[0007] A main control chip, the main control chip is installed on a side of the control main board away from the first top plate;

[0008] a thermal pad, one side of the thermal pad abutting against the main control chip, and the other side of the thermal pad abutting against the bottom of the housing;

[0009] A heat dissipation fan is installed on the outer side of the first top plate.

[0010] The embedded intelligent control station according to the embodiment of the present invention has at least the following beneficial effects: a highly efficient heat conduction path is established between the main control chip and the metal housing via the thermal pad. Heat generated by the main control chip is rapidly transferred to the entire housing via the thermal pad, with the entire housing acting as a heat sink to dissipate heat, preventing heat accumulation near the chip and thereby reducing the operating temperature of the main control chip. Furthermore, the provision of first and second heat dissipation fins on the exterior of the housing effectively increases the heat dissipation surface area. Furthermore, the cooling fan provides forced airflow, accelerating air flow over the housing surface and improving the heat exchange efficiency of the heat dissipation fins.

[0011] According to some embodiments of the present invention, the first top plate includes a first area, a second area and a third area, the first area and the third area are respectively located on both sides of the second area, the first area and the third area are both provided with the second heat dissipation fins, and the heat dissipation fan is installed in the second area.

[0012] According to some embodiments of the present invention, the first heat dissipation fins are wave-shaped heat dissipation fins.

[0013] According to some embodiments of the present invention, the embedded intelligent control station further includes a temperature control chip, the temperature control chip abuts against a side of the first top plate close to the main control chip, and the temperature control chip is connected to the main control chip.

[0014] According to some embodiments of the present invention, the embedded intelligent control station also includes a power supply, which is installed in the shell and is respectively connected to the cooling fan, the temperature control chip, the main control chip and the control mainboard.

[0015] According to some embodiments of the present invention, the housing further includes a first back plate, the first back plate is provided with a power through hole, and a connecting line between the power supply and the cooling fan is passed through the power through hole.

[0016] According to some embodiments of the present invention, the first back panel is further provided with a fixing through hole, and the embedded intelligent control station further includes a mounting bracket, and the mounting bracket is mounted on the fixing through hole.

[0017] According to some embodiments of the present invention, the mounting bracket includes a first vertical plate, a second vertical plate, a third vertical plate, a fourth vertical plate, a fifth vertical plate, a first horizontal plate and a second horizontal plate, one end of the first vertical plate is connected to one end of the first horizontal plate, the other end of the first horizontal plate is connected to the middle of the second vertical plate, one end of the third vertical plate is connected to the middle of the first horizontal plate, the other end of the third vertical plate is connected to the middle of the second horizontal plate, one end of the second horizontal plate is connected to one end of the fourth vertical plate, and the other end of the second horizontal plate is connected to the middle of the fifth vertical plate.

[0018] According to some embodiments of the present invention, thermal grease is further coated between the thermal pad and the main control chip.

[0019] According to some embodiments of the present invention, the heat dissipation fan includes a fixing bracket, and the fixing bracket is used to fix the heat dissipation fan to the first top plate.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 This is a schematic diagram of the structure of an embedded intelligent control station according to an embodiment of the present utility model;

[0023] Figure 2 This is a structural diagram of an embedded intelligent control station according to another embodiment of the present invention;

[0024] Figure 3 A partial schematic diagram of an embedded intelligent control station according to an embodiment of the present utility model;

[0025] Figure 4 for Figure 3 Schematic diagram of the structure of the mounting bracket. DETAILED DESCRIPTION

[0026] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0027] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0028] In the description of this utility model, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0030] Since embedded intelligent control stations are mostly designed with a smaller size to meet usage requirements, the heat dissipation space of the embedded intelligent control stations is small. The design process cannot dissipate heat for the embedded intelligent control stations by expanding the chassis. The equipment will generate a lot of heat when working for a long time, and the heat generated by the equipment will seriously affect the working performance of the embedded intelligent control station.

[0031] Based on this, an embodiment of the present invention provides an embedded intelligent control station that establishes an efficient heat conduction path between the main control chip and the metal housing via a thermal pad. Heat generated by the main control chip can be quickly transferred to the entire housing via the thermal pad, using the entire housing as a heat sink to dissipate heat, preventing heat accumulation near the chip and thereby reducing the operating temperature of the main control chip. The provision of first and second heat sink fins on the outside of the housing effectively increases the heat dissipation surface area. Furthermore, a cooling fan provides forced airflow, accelerating air flow on the housing surface and improving the heat exchange efficiency of the heat sink fins.

[0032] The following is a further description of the embodiments of the present invention with reference to the accompanying drawings.

[0033] First, refer to Figure 1 , Figure 1 This is a structural diagram of an embedded intelligent control station according to an embodiment of the present utility model.

[0034] It is understood that the embedded intelligent control station includes a housing 100, a control motherboard 400, a main control chip 200, a thermal pad 300, and a cooling fan 500. The housing 100 includes a first side panel 101, a second side panel 102, and a first top panel 103. The outer sides of the first side panel 101 and the second side panel 102 are provided with first heat dissipation fins 110 extending in a first direction, and the outer side of the first top panel 103 is provided with second heat dissipation fins 120 extending in a second direction. The first and second directions are perpendicular to each other. By providing the first and second heat dissipation fins 110, 120 on the outer side of the housing 100, the heat dissipation surface area can be effectively increased. The control motherboard 400, main control chip 200, and thermal pad 300 are all installed within the housing 100. The main control chip 200 is installed on the control motherboard 400. The main control chip 200 establishes an efficient heat conduction path with the housing 100 through the thermal pad 300. This transfers the heat generated by the main control chip 200 to the housing 100, utilizing the entire housing 100 as a heat sink to dissipate heat and prevent heat accumulation. A cooling fan 500 is installed on the first top plate 103 and connected to the main control chip 200. The cooling fan 500 provides forced airflow, accelerating air flow on the surface of the housing 100 and improving the heat exchange efficiency of the heat sink fins.

[0035] Specifically, the housing 100 , the first heat dissipating fins 110 , and the second heat dissipating fins 120 are all made of metal.

[0036] Specifically, in some embodiments, the first heat dissipating fins 110 extend in a vertical direction, and the second heat dissipating fins 120 extend in a horizontal direction.

[0037] It should be noted that the first top plate 103 includes a first area, a second area, and a third area, with the first area and the third area being located on either side of the second area, respectively. The first area and the third area are both provided with second heat sink fins 120, and the heat sink fan 500 is installed in the second area. The heat sink fan 500 has a downward suction and upward exhaust air flow direction, with air being drawn in from the side of the heat sink fan 500 close to the housing 100 and then blown out from the side of the heat sink fan 500 away from the housing 100. Furthermore, multiple ventilation holes are provided on both sides of the heat sink fan 500 close to the second heat sink fins 120, thereby accelerating the air flow rate through the second heat sink fins 120 during operation of the heat sink fan 500, thereby improving heat exchange efficiency.

[0038] Specifically, the first region and the third region are both provided with a plurality of second heat dissipating fins 120. In the first region, the second heat dissipating fins 120 are evenly spaced and any two second heat dissipating fins 120 are parallel to each other. In the third region, the second heat dissipating fins 120 are evenly spaced and any two second heat dissipating fins 120 are parallel to each other. Furthermore, in some embodiments, the spacing between the second heat dissipating fins 120 in the first region is equal to the spacing between the second heat dissipating fins 120 in the third region.

[0039] It should be noted that the embedded intelligent control station also includes a temperature control chip 700, which abuts against the side of the first top plate 103 close to the main control chip 200. The temperature control chip 700 is connected to the main control chip 200. By installing the temperature control chip 700 on the housing 100, the temperature control chip 700 can obtain the temperature of the housing 100. Since the main control chip 200 establishes an efficient heat conduction path with the housing 100 through the thermal pad 300, the temperature obtained by the temperature control chip 700 is the overall temperature of the main control chip 200 and the housing 100. By connecting the main control chip 200 and the temperature control chip 700, the main control chip 200 can obtain the overall temperature of the housing 100, and then control the speed of the cooling fan 500 according to the overall temperature, thereby changing the overall heat dissipation effect of the embedded intelligent control station. For example, when the overall temperature is high, the main control chip 200 can control the cooling fan 500 to operate at a higher speed to increase the air flow rate through the first heat sink fins 110, thereby improving heat exchange efficiency. When the overall temperature is low, the main control chip 200 can control the cooling fan 500 to operate at a lower speed or stop operating to reduce the power consumption of the embedded intelligent control station. The temperature control chip 700 can be a chip with an integrated temperature sensor. The temperature control chip 700 converts the temperature signal into an electrical signal and sends it to the main control chip 200. The main control chip 200 determines the temperature based on the different electrical signals.

[0040] It should be noted that the embedded intelligent control station also includes a power supply, which is installed in the shell 100. The power supply is respectively connected to the cooling fan 500, the temperature control chip 700, the main control chip 200 and the control motherboard 400, so that the power supply can provide the cooling fan 500, the temperature control chip 700, the main control chip 200 and the control motherboard 400 with the working current required for operation.

[0041] It should be noted that thermal grease is also applied between the thermal pad 300 and the main control chip 200 , wherein the thermal pad 300 can be a silicone thermal pad 300 .

[0042] It can be understood that the cooling fan 500 includes a fixing bracket 510, which is used to fix the cooling fan 500 to the first top plate 103. Through the fixing bracket 510, a gap is formed between the cooling fan 500 and the shell 100. After flowing through the second cooling fins 120, the air is sucked into the cooling fan 500 from the side of the cooling fan 500 close to the shell 100.

[0043] Reference Figure 2 , Figure 2 This is a structural diagram of an embedded intelligent control station according to another embodiment of the present invention.

[0044] It is understood that the first heat sink fins 110 are wavy heat sink fins. By providing wavy heat sink fins, the contact area between the fins and the air can be increased. In addition, the control motherboard 400 is also provided with multiple connection ports for connecting to external devices. The side of the housing 100 away from the first back plate 104 is also provided with multiple mounting holes 108. The multiple mounting holes 108 correspond one-to-one with the multiple connection ports. The connection ports include but are not limited to a CAN interface, an HDMI interface, a USB interface, a LAN interface, and a COM interface.

[0045] Reference Figure 3 and Figure 4 , Figure 3 This is a partial schematic diagram of an embedded intelligent control station according to an embodiment of the present invention. Figure 4 for Figure 3 Schematic diagram of the structure of the mounting bracket.

[0046] It can be understood that the shell 100 also includes a first back plate 104, which has a power through hole 106. The connecting line between the power supply and the cooling fan 500 is passed through the power through hole 106. When the main control chip 200 and the cooling fan 500 are connected by a wire, the wire is also passed through the power through hole 106.

[0047] It should be noted that the first back panel 104 further defines a plurality of fixing through-holes 105, and the embedded intelligent control station further includes a mounting bracket 600, which is mounted in the fixing through-holes 105. The mounting bracket 600 includes a first vertical plate 610, a second vertical plate 620, a third vertical plate 630, a fourth vertical plate 640, a fifth vertical plate 650, a first horizontal plate 660, and a second horizontal plate 670. One end of the first vertical plate 610 is connected to one end of the first horizontal plate 660, and the other end of the first horizontal plate 660 is connected to the middle of the second vertical plate 620. One end of the third vertical plate 630 is connected to the middle of the first horizontal plate 660, and the other end of the third vertical plate 630 is connected to the middle of the second horizontal plate 670. One end of the second horizontal plate 670 is connected to one end of the fourth vertical plate 640, and the other end of the second horizontal plate 670 is connected to the middle of the fifth vertical plate 650. The shapes of the second vertical plate 620 and the fifth vertical plate 650 are the same as the shapes of the fixing through holes 105 , and one mounting bracket 600 corresponds to two fixing through holes 105 .

[0048] Specifically, the first vertical plate 610 extends away from the first transverse plate 660, and the fourth vertical plate 640 extends away from the second transverse plate 670. During the installation process, after the second vertical plate 620 and the fifth vertical plate 650 pass through the fixing through-holes 105, the mounting bracket 600 moves downward a distance due to gravity until the housing 100 abuts the first transverse plate 660 and the second transverse plate 670. At the same time, the lower half of the second vertical plate 620 and the lower half of the fifth vertical plate 650 abut the first back plate 104, thereby completing the installation of the mounting bracket 600 and the housing 100.

[0049] It is understandable that a plurality of fixing screw holes are provided on the first vertical plate 610 , the third vertical plate 630 and the fourth vertical plate 640 , and the user can insert fixing bolts through the fixing screw holes to fix the mounting bracket 600 to other objects.

[0050] It should be noted that, in some embodiments, the embedded intelligent control station includes two mounting brackets 600 , and the first back plate 104 is provided with four fixing through holes 105 .

[0051] It can be understood that mounting screw holes 107 are provided on the four corners of the first back panel 104, and mounting studs corresponding to the mounting screw holes 107 are provided in the shell 100. The first back panel 104 can be fixed by passing bolts through the mounting screw holes 107 and then connecting with the mounting studs.

[0052] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An embedded intelligent control station, characterized in that: include: A housing, the housing comprising a first side plate, a second side plate, and a first top plate, wherein first heat dissipation fins extending in a first direction are provided on outer sides of the first side plate and outer sides of the second side plate, and second heat dissipation fins extending in a second direction are provided on outer sides of the first top plate, wherein the first direction and the second direction are perpendicular to each other; A control mainboard, the control mainboard being installed in the housing; A main control chip, the main control chip is installed on a side of the control main board away from the first top plate; a thermal pad, one side of the thermal pad abutting against the main control chip, and the other side of the thermal pad abutting against the bottom of the housing; A heat dissipation fan is installed on the outer side of the first top plate.

2. The embedded intelligent control station according to claim 1, characterized in that: The first top plate includes a first area, a second area and a third area. The first area and the third area are respectively located on both sides of the second area. The first area and the third area are both provided with the second heat dissipation fins. The heat dissipation fan is installed in the second area.

3. The embedded intelligent control station according to claim 1, characterized in that: The first heat dissipation fins are wave-shaped heat dissipation fins.

4. The embedded intelligent control station according to claim 1, characterized in that: The embedded intelligent control station further includes a temperature control chip, which is in contact with a side of the first top plate close to the main control chip and is connected to the main control chip.

5. The embedded intelligent control station according to claim 4, characterized in that: The embedded intelligent control station further includes a power supply, which is installed in the housing and is connected to the cooling fan, the temperature control chip, the main control chip and the control mainboard respectively.

6. The embedded intelligent control station according to claim 5, characterized in that: The housing further includes a first back plate, the first back plate is provided with a power through hole, and a connecting line between the power supply and the cooling fan is passed through the power through hole.

7. The embedded intelligent control station according to claim 6, characterized in that: The first back plate is further provided with a fixing through hole, and the embedded intelligent control station further comprises a mounting bracket, and the mounting bracket is mounted on the fixing through hole.

8. The embedded intelligent control station according to claim 7, characterized in that: The mounting bracket includes a first vertical plate, a second vertical plate, a third vertical plate, a fourth vertical plate, a fifth vertical plate, a first horizontal plate and a second horizontal plate, one end of the first vertical plate is connected to one end of the first horizontal plate, the other end of the first horizontal plate is connected to the middle of the second vertical plate, one end of the third vertical plate is connected to the middle of the first horizontal plate, the other end of the third vertical plate is connected to the middle of the second horizontal plate, one end of the second horizontal plate is connected to one end of the fourth vertical plate, and the other end of the second horizontal plate is connected to the middle of the fifth vertical plate.

9. The embedded intelligent control station according to claim 1, characterized in that: Thermal grease is also applied between the thermal pad and the main control chip.

10. The embedded intelligent control station according to claim 1, characterized in that: The heat dissipation fan includes a fixing bracket, and the fixing bracket is used to fix the heat dissipation fan to the first top plate.

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