High-reliability chip sinking type lamp bead

Abstract

The utility model relates to the technical field of LED light emitting, in particular to a high-reliability chip sinking type lamp bead. The high-reliability chip sinking type lamp bead specifically comprises a substrate, a chip, a first bonding pad, a second bonding pad, a fluorescent sheet fixing layer, a light conversion layer, a transparent layer, a heat dissipation layer and a white glue layer. The substrate is provided with a groove, the chip, the light conversion layer and the transparent layer are located in the groove, the first bonding pad extends into the groove to be connected with the chip, the light conversion layer is located on the upper surface of the chip, the fluorescent sheet fixing layer is located between the chip and the light conversion layer, the transparent layer is located on the upper surface of the light conversion layer, the heat dissipation layer surrounds the chip, and the white glue layer surrounds the light conversion layer and the transparent layer. The second bonding pad is located at the bottom of the substrate and located under the chip. The utility model has the advantages that the direct contact between the white glue and a heat source is avoided, and the cracking of the white glue is fundamentally improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lighting, in particular to a chip-sinking lamp bead with high reliability. Background Art

[0002] Existing high-power ceramic LED products have the problem of poor reliability, especially the cracking problem of white glue which needs to be solved.

[0003] There are currently two mainstream solutions: First, using softer white glue can achieve some results in improving the problem of white glue cracking, but the soft glue solution has the problem of insufficient LED structural strength, which makes the white glue break during the use of terminal devices such as SMDs;

[0004] Secondly, although molding EMC / SMC and other materials with higher hardness can solve the problem of LED structural strength compared with the above solutions, this solution requires too much initial investment in equipment, and the raw materials are more expensive than general white glue products.

[0005] At the same time, the above two solutions also have the disadvantage of a long heat dissipation path for the chip.

[0006] Therefore, to address the deficiencies in the prior art, a high-reliability chip-sinking lamp bead is provided. Utility Model Content

[0007] In order to overcome the deficiencies of the prior art, the utility model provides a high-reliability chip-sinking lamp bead, which aims to solve the problem of white glue cracking caused by direct contact with the heat source.

[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0009] A high-reliability chip-sinking lamp bead, comprising: a substrate, a chip, a first soldering pad, a second soldering pad, a solid fluorescent sheet layer, a light conversion layer, a transparent layer, a heat dissipation layer and a white glue layer;

[0010] The substrate is provided with a groove, the chip, the light conversion layer and the transparent layer are located in the groove, the first solder pad extends into the groove and is connected to the chip, the light conversion layer is located on the upper surface of the chip, the solid fluorescent layer is located between the chip and the light conversion layer, the transparent layer is located on the upper surface of the light conversion layer, the heat dissipation layer is arranged around the chip, the white glue layer surrounds the light conversion layer and the transparent layer, the second solder pad is located at the bottom of the substrate, and the second solder pad is located directly below the chip.

[0011] As a further improvement of the technical solution of the present utility model, the two first pads extend upward from the bottom of the substrate to the top of the substrate, extend along the inner wall of the groove to the bottom of the groove, and are respectively connected to the positive and negative electrodes of the chip;

[0012] The first pad is in a "X" shape.

[0013] As a further improvement of the technical solution of the present utility model, the two first pads extend upward from the bottom of the substrate directly to the bottom of the groove and are respectively connected to the positive and negative electrodes of the chip;

[0014] The first pad is in a Z shape.

[0015] As a further improvement of the technical solution of the present utility model, the width of the second pad is 70%-95% of the width of the chip.

[0016] As a further improvement of the technical solution of the present invention, the distance between the second pad and the chip is 50 μm-200 μm.

[0017] As a further improvement of the technical solution of the present utility model, the heat dissipation layer is made of a highly thermally conductive insulating material, and the height of the heat dissipation layer is greater than the thickness of the chip;

[0018] The chip has a thickness of 50 μm-150 μm.

[0019] As a further improvement of the technical solution of the utility model, the height of the white glue layer is not higher than the upper surface of the transparent layer;

[0020] The thickness of the light conversion layer is 80 μm-150 μm.

[0021] As a further improvement of the technical solution of the present utility model, the depth of the groove is 150 μm-300 μm.

[0022] As a further improvement of the technical solution of the present utility model, the substrate is a ceramic base.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] In this high-reliability chip-sunken lamp bead, the chip, light conversion layer, and transparent layer are stacked sequentially within a groove. The first solder pad extends into the groove to connect to the chip. A heat dissipation layer is placed around the chip to prevent direct contact between the white glue layer and the chip. The first and second solder pads simultaneously ensure heat dissipation from the chip. White glue is injected around the transparent layer to achieve a single-sided light output effect. This high-reliability chip-sunken lamp bead prevents direct contact between the white glue and heat sources, fundamentally improving cracking of the white glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The technology of the utility model is further described in detail below with reference to the accompanying drawings and specific embodiments:

[0026] Figure 1 This is a schematic diagram of the structure of the high-reliability chip-sinking lamp bead of the utility model;

[0027] Figure 2 It is a structural schematic diagram of the high-reliability chip-sinking lamp bead of the utility model.

[0028] In the picture:

[0029] 1. Substrate; 11. Groove; 2. Chip; 3. First solder pad; 4. Solid phosphor layer; 5. Light conversion layer; 6. Transparent layer; 7. Heat dissipation layer; 8. White glue layer; 9. Second solder pad. DETAILED DESCRIPTION

[0030] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other unless there is a conflict. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0031] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. In addition, the terms "upper," "lower," "left," and "right" used in this utility model are only used with respect to the relative positions of the components of the utility model in the accompanying drawings.

[0032] Reference Figures 1 to 2 A high-reliability chip-sinking lamp bead includes: a substrate 1, a chip 2, a first soldering pad 3, a second soldering pad 9, a solid fluorescent sheet layer 4, a light conversion layer 5, a transparent layer 6, a heat dissipation layer 7 and a white glue layer 8;

[0033] The substrate 1 is provided with a groove 11, the chip 2, the light conversion layer 5 and the transparent layer 6 are located in the groove 11, the first solder pad 3 extends into the groove 11 and is connected to the chip 2, the light conversion layer 5 is located on the upper surface of the chip 2, the solid fluorescent layer 4 is located between the chip 2 and the light conversion layer 5, the transparent layer 6 is located on the upper surface of the light conversion layer 5, the heat dissipation layer 7 is arranged around the chip 2, and the white glue layer 8 surrounds the light conversion layer 5 and the transparent layer 6.

[0034] The chip 2, light conversion layer 5, and transparent layer 6 are stacked sequentially within the groove 11. The first solder pad 3 extends into the groove 11 to connect to the chip 2. A heat dissipation layer 7 is filled around the chip 2 to prevent direct contact between the white glue layer 8 and the chip 2. The first and second solder pads 3 and 9 ensure heat dissipation from the chip 2. White glue is injected around the transparent layer 6 to achieve the effect of single-sided light emission. This highly reliable chip 2-sunken lamp bead avoids direct contact between the white glue and the heat source, fundamentally improving the cracking of the white glue.

[0035] In one embodiment, the two first pads 3 extend upward from the bottom of the substrate 1 to the top of the substrate 1, then extend along the inner wall of the groove 11 to the bottom of the groove 11, and are respectively connected to the positive and negative electrodes of the chip 2; the first pads 3 are in the shape of a cross. The structure of the first pads 3 also helps to enhance the strength of the substrate 1.

[0036] In one embodiment, two first solder pads 3 extend directly upward from the bottom of the substrate 1 to the bottom of the groove 11, and are respectively connected to the positive and negative electrodes of the chip 2. The first solder pads 3 are zigzag-shaped. The structure of the first solder pads 3 effectively shortens the heat dissipation path of the chip 2, thereby improving the overall heat dissipation performance of the lamp bead and enhancing reliability.

[0037] In one embodiment, second pad 9 is located at the bottom of substrate 1, directly below chip 2. The width of second pad 9 is 70%-95% of the width of chip 2 to enhance heat dissipation of chip 2. The distance between second pad 9 and chip 2 is 50 μm-200 μm. Preferably, the width of second pad 9 can be adjusted based on the heat dissipation requirements of chip 2; a wider width of second pad 9 provides better heat dissipation.

[0038] In one embodiment, the heat dissipation layer 7 is made of a highly thermally conductive insulating material, and the height of the heat dissipation layer 7 is greater than the thickness of the chip 2; the thickness of the chip 2 is 50 μm-150 μm. Preferably, the chip 2 is a flip chip.

[0039] In one embodiment, the height of the white glue layer 8 is no higher than the upper surface of the transparent layer 6; the thickness of the light conversion layer 5 is 80 μm-150 μm. Preferably, the composition of the white glue layer 8 includes, but is not limited to, a fluid, high-reflectivity material such as a mixture of TiO2 powder and silica gel. The light conversion layer 5 includes, but is not limited to, sheet-like light conversion materials such as fluorescent sheets / films. The thickness of the adhesive layer of the bonding material does not exceed 20 μm.

[0040] In one embodiment, the depth of groove 11 is 150 μm to 300 μm; the thickness of solid phosphor layer 4 is no more than 20 μm; and the thickness of transparent layer 6 is 80 μm to 150 μm. Preferably, groove 11 has an isosceles trapezoidal cross-section, which can be formed by laser cutting or dry / wet etching. The sidewalls are coated with a highly reflective coating, such as a DBR or silver mirror.

[0041] In one embodiment, the substrate 1 is a ceramic substrate. Preferably, the ceramic substrate has high insulation, corrosion resistance and dimensional stability, and serves as the basis of the chip 2, which helps to dissipate the heat generated by the chip 2, improve its performance and extend its service life.

[0042] A method for manufacturing a high-reliability chip-sinking lamp bead, which is applicable to the above-mentioned high-reliability chip-sinking lamp bead, comprises the following steps:

[0043] S1: Fix the chip 2 in the groove 11 of the substrate 1 by eutectic welding or thermocompression welding, fill the heat dissipation layer 7 around the chip 2, and electrically connect the positive and negative electrodes of the chip 2 to the two first pads 3 in the groove 11 by eutectic welding or thermocompression welding respectively;

[0044] S2: Fixing the light conversion layer 5 on the upper surface of the chip 2 through the solid fluorescent sheet layer 4;

[0045] S3: Filling the white glue layer 8 around the light conversion layer 5 and the transparent layer 6 by dispensing.

[0046] For other details of the high-reliability chip-sinking lamp bead described in the present invention, please refer to the prior art and will not be repeated here.

[0047] The above are only preferred embodiments of the present invention and do not constitute any form of limitation to the present invention. Therefore, any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0049] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

Claims

1. A high reliability chip sinking lamp bead, characterized in that, include: Substrate, chip, first solder pad, second solder pad, solid fluorescent sheet layer, light conversion layer, transparent layer, heat dissipation layer and white glue layer; The substrate is provided with a groove, the chip, the light conversion layer and the transparent layer are located in the groove, the first solder pad extends into the groove and is connected to the chip, the light conversion layer is located on the upper surface of the chip, the solid fluorescent layer is located between the chip and the light conversion layer, the transparent layer is located on the upper surface of the light conversion layer, the heat dissipation layer is arranged around the chip, the white glue layer surrounds the light conversion layer and the transparent layer, the second solder pad is located at the bottom of the substrate, and the second solder pad is located directly below the chip.

2. A high reliability chip sinking lamp bead according to claim 1, characterized in that: The two first pads extend upward from the bottom of the substrate to the top of the substrate, extend along the inner wall of the groove to the bottom of the groove, and are respectively connected to the positive and negative electrodes of the chip; The first pad is in a "X" shape.

3. The high reliability chip sinking lamp bead according to claim 1, characterized in that: The two first pads extend upward from the bottom of the substrate directly to the bottom of the groove and are respectively connected to the positive and negative electrodes of the chip; The first pad is in a Z shape.

4. The high-reliability chip-sinking lamp bead according to claim 1, characterized in that: The width of the second pad is 70%-95% of the width of the chip.

5. The high-reliability chip-sinking lamp bead according to claim 4, characterized in that: The distance between the second pad and the chip is 50 μm-200 μm.

6. The high-reliability chip-sinking lamp bead according to claim 1, characterized in that: The heat dissipation layer is made of a highly thermally conductive insulating material, and the height of the heat dissipation layer is greater than the thickness of the chip; The chip has a thickness of 50 μm-150 μm.

7. The high reliability chip sinking lamp bead according to claim 1, characterized in that: The height of the white glue layer is not higher than the upper surface of the transparent layer; The thickness of the light conversion layer is 80 μm-150 μm.

8. The high-reliability chip-sinking lamp bead according to claim 1, characterized in that: The depth of the groove is 150 μm-300 μm.

9. The high-reliability chip-sinking lamp bead according to claim 1, characterized in that: The substrate is a ceramic base.

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