Frame structure for improving reliability of LED support packaging IC wafer

Abstract

The utility model discloses a frame structure for improving the reliability of an IC wafer packaged by an LED support, and the structure comprises a metal bonding pad which is used for being connected with an external circuit; the bottom of the interior of the plastic bowl cup is used for fixing the chip, and a circle of step is arranged at the waist position of the interior of the bowl cup; the chip is fixed at the bottom of the plastic bowl cup; the metal wire is used for connecting the chips and connecting the positive electrode and the negative electrode to the metal bonding pad; the glass sheet is embedded on the inner step of the plastic bowl cup so as to isolate the metal wire from the epoxy glue which is subsequently filled and sealed; and the epoxy glue is filled in the residual space between the glass sheet and the plastic bowl cup and is used for carrying out potting protection on the chip, the metal lead and the metal bonding pad. The utility model has the advantages of high reliability, high yield, high efficiency, flexibility, variability and high realizability, and has a good market application prospect.

Description

Technical Field

[0001] The utility model relates to a frame structure for improving the reliability of an LED bracket encapsulating an IC chip, and belongs to the technical field of LED encapsulation. Background Art

[0002] LED products are widely used in the lighting and display industries due to their energy-saving and power-saving features, high efficiency, fast response time, long life cycle, and environmental friendliness. Demand for LED lamp beads is increasing, particularly in areas such as lighting, LED displays, flexible display films, and LCD backlights. However, in outdoor applications, LED lamp beads must possess excellent airtightness and heat resistance to ensure a long service life.

[0003] Most existing LED packaging technologies utilize soldering, connecting the chip to pads via metal wires. Conventional single-color LEDs (using a single chip) typically require only one or two wires. However, LEDs with integrated IC chips often require more than 10 wires due to the numerous solder joints. When glue is poured into the LED for protection, the space between the glue and the wires is too small. The thermal expansion and contraction of the glue in alternating hot and cold outdoor environments can easily cause wire breakage, impacting the reliability and lifespan of the LED. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a frame structure for improving the reliability of LED bracket packaging IC chips, which includes metal pads, bowl-shaped plastic frames, steps, chips, metal wires and glass sheets.

[0005] The technical solution of the utility model is as follows:

[0006] A frame structure for improving the reliability of an LED bracket packaged IC chip, comprising:

[0007] Metal pad: used to connect to external circuits to achieve current transmission.

[0008] Plastic bowl cup: Its inner bottom is used to fix the chip, and the bowl-shaped design helps protect the chip and wires from the external environment.

[0009] Step: Set at the waist of the plastic bowl, with a width of 0.02mm-0.05mm. The step design provides support for the inlay of glass pieces and also ensures that the epoxy glue does not directly contact the metal wires.

[0010] Chip: Fixed to the bottom of the plastic bowl, this is the core component of the LED lamp bead and is responsible for emitting light. It includes an IC chip, a green chip, a red chip, and a blue chip. The green chip, red chip, and blue chip are connected to the IC chip and metal pads via metal wires.

[0011] Metal wires: Used to connect the positive and negative electrodes of the chip to the metal pads. The wire arc height is 0.1mm-0.18mm. Through the reasonable wire layout and wire arc height design, the stability and reliability of the metal wires are ensured.

[0012] Glass: Inlaid on the inner step of the bowl, it isolates the metal wires from the subsequent epoxy glue potting. The glass design not only improves the reliability of the structure, but also makes the product more beautiful.

[0013] Epoxy glue: Fills the remaining space between the glass and the plastic cup, with the top surface of the epoxy glue flush with the top surface of the plastic cup. This seals and protects the chip, metal wires, and metal pads. Epoxy glue has excellent insulation, weather resistance, and corrosion resistance, effectively extending the life of the LED.

[0014] The beneficial effects of the utility model are:

[0015] 1. High reliability: Since the metal wires do not directly contact the glue, when encountering temperature changes, the internal metal wires are not pulled by the glue stress, thus avoiding the problem of wire breakage and improving the reliability of the LED lamp beads.

[0016] 2. High yield: Since the glue is isolated from the chip and metal wire, it is not easy to generate bubbles during production operations, thereby improving the yield and quality of the product.

[0017] 3. Efficient production: Since the glue is isolated from the chip and metal wire, the glue filling process is simplified, thereby improving production efficiency.

[0018] 4. Flexible and variable: By changing the color of the internal glass, the appearance of the product can be flexibly adjusted, such as achieving a frosted effect, etc., to meet the needs of different customers.

[0019] 5. High feasibility: It can be realized by making appropriate changes to the existing structure without introducing new production equipment and technology, thus reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural diagram of the utility model;

[0021] Figure 2 yes Figure 1 Schematic diagram of the steps in the plastic bowl and cup;

[0022] Figure 3 yes Figure 1 Schematic diagram of the chip. DETAILED DESCRIPTION

[0023] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention.

[0024] like Figure 1 As shown, a frame structure for improving the reliability of LED bracket packaging IC chips includes:

[0025] Metal pad 1: used to connect to an external circuit to achieve current transmission.

[0026] Plastic bowl 2: Its inner bottom is used to fix the chip 4. The bowl-shaped design helps to protect the chip 4 and the metal wire 5 from the influence of the external environment.

[0027] Step 3: Set at the waist position inside the plastic bowl 2, with a width of 0.02mm-0.05mm, such as Figure 2 The step design provides support for the inlay of the glass piece 6 and also ensures that the epoxy glue 7 does not directly contact the metal wire 5.

[0028] Chip 4: fixed at the bottom of the bowl, it is the core component of the LED lamp bead and is responsible for emitting light. Figure 3 As shown, it includes an IC chip 4-1, a green chip 4-2, a red chip 4-3 and a blue chip 4-4; the green chip 4-2, the red chip 4-3 and the blue chip 4-4 are connected to the IC chip 4-1 and the metal pad 1 through metal wires respectively.

[0029] Metal wire 5: used to connect the positive and negative electrodes of chip 4 to metal pad 1. The wire arc height is 0.1mm-0.18mm. The stability and reliability of the wire are ensured through reasonable wire layout and wire arc height design.

[0030] Glass piece 6: embedded in the step inside the plastic bowl 2, it isolates the metal wire 5 from the subsequent epoxy glue 7. The design of the glass piece 6 not only improves the reliability of the structure, but also makes the product look more beautiful.

[0031] Epoxy glue 7 fills the remaining space between glass sheet 6 and plastic cup 2. The top surface of epoxy glue 7 is flush with the top surface of plastic cup 2, protecting chip 3, metal wire 5, and metal pad 1. Epoxy glue 7 has excellent insulation, weather resistance, and corrosion resistance, effectively extending the life of the LED.

[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A frame structure for improving the reliability of LED bracket packaging IC chips, characterized in that: include: Metal pads for connecting to external circuits; The bottom of the plastic bowl is used to fix the chip, and a circle of steps is set at the waist position of the bowl; A chip is fixed to the bottom of the plastic bowl; Metal wires, used to connect the chips and connect the positive and negative electrodes to the metal pads; A glass sheet is embedded in the inner step of the plastic bowl to isolate the metal wire from the subsequent epoxy glue potting; Epoxy glue is filled in the remaining space between the glass sheet and the plastic bowl and is used to encapsulate and protect the chip, metal wires and metal pads.

2. According to the frame structure for improving the reliability of LED bracket packaging IC chips according to claim 1, the upper surface of the epoxy glue is flush with the upper surface of the plastic bowl.

3. A frame structure for improving the reliability of LED bracket packaging IC chips according to claim 1, characterized in that: The chips include an IC chip, a green light chip, a red light chip and a blue light chip, and the green light chip, the red light chip and the blue light chip are respectively connected to the IC chip and the metal pad through metal wires.

4. A frame structure for improving the reliability of LED bracket packaging IC chips according to claim 1, characterized in that: The step width is 0.02mm-0.05mm.

5. The frame structure for improving the reliability of LED bracket packaging IC chips according to claim 1, characterized in that: The arc height of the metal wire is 0.1 mm to 0.18 mm.

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