Glue uniformizing equipment for semiconductor production

Abstract

The utility model discloses glue uniformizing equipment for semiconductor production, which comprises a glue uniformizing machine, the top of the glue uniformizing machine is connected with a wafer bearing table through an output shaft, the top of the glue uniformizing machine is provided with a closed bowl, the closed bowl is connected outside the wafer bearing table in a covering manner, the surface of the closed bowl is fixedly connected with a fixing ring, the surface of the fixing ring is provided with a fixing seat, and the fixing seat is fixedly connected with the wafer bearing table. The interior of the fixed seat is connected with a rotating plate through a rotating shaft, the surface of the rotating plate is fixedly connected with clamping strips, the top of the closed bowl is provided with a cover plate, the surface of the cover plate is fixedly connected with clamping strips, and the clamping strips are mutually clamped. According to the glue uniformizing equipment for semiconductor production, the top of a sealing bowl is fixedly connected with a fixing ring, the surface of the fixing ring is fixedly connected with a fixing seat, the interior of the fixing seat is connected with a rotating plate through a rotating shaft, the surface of the rotating plate is provided with clamping strips, meanwhile, the surface of a cover plate is also provided with clamping strips, and the clamping strips are connected in a clamped mode; in this way, the connectivity of the cover plate and the sealing bowl is enhanced, and the cover plate is not prone to falling off.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, in particular to a glue-spinning device used in semiconductor production. Background Art

[0002] Spin coating equipment refers to a type of rotary coating equipment that drips various types of glue on a high-speed rotating substrate and uses centrifugal force to evenly coat the glue dripped on the substrate. The thickness of the film depends on the rotation speed of the spin coating machine and the viscosity of the sol. This equipment is mainly used for coating wafers with photoresist and is widely used in semiconductor production.

[0003] The current semiconductor production coating equipment on the market has the following problems when in use:

[0004] 1. In the actual use of traditional semiconductor production dispensing equipment, since the dispensing machine is usually equipped with a sealed bowl outside during operation to reduce the impact of the environment on the dispensing, and the top of the sealed bowl is used with a cover, the cover of traditional semiconductor production dispensing equipment is usually placed directly on the top of the sealed bowl to cover it, and the connection between the two is poor and it is easy to fall off;

[0005] 2. Most of the glue-spinning equipment used in semiconductor production has poor stability when in use. Because the glue-spinning process mainly relies on centrifugal force to make the colloid evenly cover the wafer table, it may be displaced by impact, thus affecting the glue-spinning effect. Utility Model Content

[0006] The purpose of the utility model is to provide a coating device for semiconductor production to solve the technical problems raised in the background technology.

[0007] To achieve the above-mentioned purpose, the specific technical solution of the utility model is as follows: A glue spreading equipment for semiconductor production, including a glue spreading machine, the top of the glue spreading machine is connected to the wafer holding table through an output shaft, the top of the glue spreading machine is provided with a closed bowl, the closed bowl cover is connected to the outside of the wafer holding table, the surface of the closed bowl is fixedly connected to a fixing ring, the surface of the fixing ring is provided with a fixing seat, the interior of the fixing seat is connected to a rotating plate through a rotating shaft, the surface of the rotating plate is fixedly connected to a clamping strip, the top of the closed bowl is provided with a cover plate, the surface of the cover plate is fixedly connected to the clamping strip, the clamping strips are clamped to each other, and the surface of the rotating plate is fixedly connected to the fixing strip.

[0008] Preferably, the surface of the glue spreader is connected to the side plate via a rotating shaft, and suction cups are installed on the bottom of the side plate, and the suction cups are symmetrically distributed.

[0009] Preferably, the surface of the cover is connected to the operating window via a rotating shaft, the surface of the operating window is fixedly connected to the baffle, the bottom of the baffle is tightly attached to the top of the cover, a handle is provided on the top of the baffle, and a sealing strip is embedded on the surface of the cover.

[0010] Preferably, the top of the cover is fixedly connected to a handle, and the outside of the handle is sleeved with an anti-slip sleeve.

[0011] Preferably, a rectangular groove is provided at the bottom of the glue spreader, and an anti-slip pad is bonded inside the rectangular groove.

[0012] Preferably, a magnet block is embedded on the surface of the glue spreader, and a metal sheet is embedded on the surface of the side plate, and the metal sheet is adsorbed and connected to the surface of the magnet block.

[0013] The utility model is a kind of coating equipment for semiconductor production, which has the following advantages:

[0014] 1. A dispensing device for semiconductor production comprises a cover plate provided on the top of a sealing bowl, a fixed ring fixedly connected to the top of the sealing bowl, a fixed seat fixedly connected to the surface of the fixed ring, a rotating plate connected to the interior of the fixed seat via a rotating shaft, a clamping strip provided on the surface of the rotating plate, and a clamping strip also provided on the surface of the cover plate, the clamping strips being mutually engaged, thereby enhancing the connection between the cover plate and the sealing bowl and preventing the cover plate from falling off;

[0015] 2. This is a glue spreading device used in semiconductor production. The surface of the glue spreading machine is connected to the side plate through a rotating shaft, and a suction cup is installed at the bottom of the side plate. When placing the glue spreading machine, pressing the side plate can make the suction cup adsorb on the surface of the placement table, thereby improving the placement stability of the glue spreading machine and preventing it from being easily displaced, thereby affecting the glue spreading effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 For the utility model Figure 1 Enlarged view of part A;

[0019] Figure 3 This is a schematic diagram of the cover structure of the utility model;

[0020] Figure 4This is a schematic diagram of the anti-slip mat structure of the utility model;

[0021] Figure 5 This is a schematic diagram of the magnet sheet structure of the present utility model.

[0022] Explanation of the markings in the figure: 1. Glue spreader; 2. Sealed bowl; 3. Fixed ring; 4. Cover plate; 5. Fixed seat; 6. Rotating plate; 7. Card strip; 8. Operating window; 9. Baffle; 10. Sealing strip; 11. Handle; 12. Side panel; 13. Suction cup; 14. Magnet block; 15. Metal sheet; 16. Sheet support platform; 17. Rectangular groove; 18. Anti-slip pad; 19. Fixed strip. DETAILED DESCRIPTION

[0023] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0024] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0026] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0027] The disclosure below provides many different embodiments or examples for implementing different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the components and settings of specific examples are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. In addition, the embodiments of the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0028] In order to better understand the purpose, structure and function of the present invention, the following is a further detailed description of a dispensing device for semiconductor production according to the present invention in conjunction with the accompanying drawings.

[0029] like Figure 1-5 As shown, the utility model is a glue spreading equipment for semiconductor production, including a glue spreading machine 1, the top of the glue spreading machine 1 is connected to the wafer holding table 16 through an output shaft, and a sealed bowl 2 is provided on the top of the glue spreading machine 1, and the sealed bowl 2 is covered on the outside of the wafer holding table 16, so that the influence of smaller humidity changes can be concealed, and the surface of the sealed bowl 2 is fixedly connected to the fixing ring 3, and the surface of the fixing ring 3 is provided with a fixing seat 5, and the interior of the fixing seat 5 is connected to the rotating plate 6 through a rotating shaft, and the surface of the rotating plate 6 is fixedly connected to the clamping strip 7, and the top of the sealed bowl 2 is provided with a cover plate 4, and the surface of the cover plate 4 is fixedly connected to the clamping strip 7, and the clamping strips 7 are clamped with each other, and the surface of the rotating plate 6 is fixedly connected to the fixing strip 19, which enhances the connectivity between the cover plate 4 and the sealing bowl, making the cover plate 4 not easy to fall off.

[0030] The surface of the glue spreader 1 is connected to the side panel 12 via a rotating shaft, and a suction cup 13 is installed at the bottom of the side panel 12. The suction cup 13 is symmetrically distributed. When placing the glue spreader 1, pressing the side panel 12 can make the suction cup 13 adsorbed on the surface of the placement table, thereby improving the placement stability of the glue spreader 1 and preventing it from being easily displaced, thereby affecting the glue spreading effect.

[0031] The surface of the cover plate 4 is connected to the operating window 8 through a rotating shaft. The surface of the operating window 8 is fixedly connected to the baffle 9. The bottom of the baffle 9 is close to the top of the cover plate 4. The top of the baffle 9 is provided with a handle. The surface of the cover plate 4 is embedded with a sealing strip 10. Through the provided operating window 8, operation can be carried out without separating the cover plate 4, and it is convenient to observe the glue spreading situation.

[0032] The top of the cover plate 4 is fixedly connected to a handle 11 , and the outside of the handle 11 is sleeved with an anti-slip sleeve. The cover plate 4 can be easily lifted by the provided handle 11 .

[0033] A rectangular groove 17 is provided at the bottom of the glue spreader 1 , and an anti-skid pad 18 is adhered inside the rectangular groove 17 , which can enhance the friction when in contact with the placement table, making the glue spreader 1 more stable.

[0034] The surface of the glue spreader 1 is inlaid with a magnet block 14, and the surface of the side plate 12 is inlaid with a metal sheet 15. The metal sheet 15 is adsorbed and connected to the surface of the magnet block 14, so that the side plate 12 and the glue spreader 1 can be easily connected when not in use.

[0035] The working principle of the glue spreading equipment for semiconductor production: when in use, the top of the glue spreading machine 1 is connected to the wafer holding platform 16 through the output shaft, and the top of the glue spreading machine 1 is provided with a sealed bowl 2, and the sealed bowl 2 is covered on the outside of the wafer holding platform 16, so as to cover up the influence of smaller humidity changes, the surface of the sealed bowl 2 is fixedly connected to the fixing ring 3, the surface of the fixing ring 3 is provided with a fixing seat 5, the inside of the fixing seat 5 is connected to the rotating plate 6 through a rotating shaft, the surface of the rotating plate 6 is fixedly connected to the clamping strip 7, the top of the sealed bowl 2 is provided with a cover plate 4, the surface of the cover plate 4 is fixedly connected to the clamping strip 7, the clamping strips 7 are clamped with each other, and the surface of the rotating plate 6 is fixedly connected to the fixing strip 19, which enhances the connectivity between the cover plate 4 and the sealing bowl, making it difficult for the cover plate 4 to fall off. When the cover plate 4 needs to be opened, it is only necessary to hold Fix the bar 19, move the rotating plate 6 to make it rotate clockwise around the axis until the strips 7 are separated from each other, then hold the handle 11 to open the cover 4, hold the handle to open the operating window 8, or directly operate the wafer table 16. The surface of the glue machine 1 is connected to the side panel 12 through the axis, and the bottom of the side panel 12 is installed with a suction cup 13, and the suction cup 13 is symmetrically distributed. In this way, when placing it, pressing the side panel 12 can make the suction cup 13 adsorbed on the surface of the placement table, which improves the placement stability of the glue machine 1 and prevents it from easily displacing and affecting the glue spreading effect. A rectangular groove 17 is provided at the bottom of the glue machine 1, and an anti-slip pad 18 is bonded inside the rectangular groove 17, which can enhance the friction when in contact with the placement table, making the glue machine 1 more stable.

[0036] It is understood that the present invention is described by way of certain embodiments, and those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. Furthermore, under the guidance of the present invention, these features and embodiments may be modified to suit specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

Claims

1. A coating device for semiconductor production, comprising a coating machine (1), characterized in that: The top of the glue spreader (1) is connected to the wafer support platform (16) through an output shaft. The top of the glue spreader (1) is provided with a sealed bowl (2). The sealed bowl (2) is covered on the outside of the wafer support platform (16). The surface of the sealed bowl (2) is fixedly connected to the fixed ring (3). The surface of the fixed ring (3) is provided with a fixed seat (5). The interior of the fixed seat (5) is connected to the rotating plate (6) through a rotating shaft. The surface of the rotating plate (6) is fixedly connected to the clamping strip (7). The top of the sealed bowl (2) is provided with a cover plate (4). The surface of the cover plate (4) is fixedly connected to the clamping strip (7). The clamping strips (7) are clamped to each other. The surface of the rotating plate (6) is fixedly connected to the fixing strip (19).

2. The coating equipment for semiconductor production according to claim 1, characterized in that: The surface of the glue-spinning machine (1) is connected to the side plate (12) via a rotating shaft, and the bottom of the side plate (12) is installed with a suction cup (13), and the suction cups (13) are symmetrically distributed.

3. The coating equipment for semiconductor production according to claim 1, characterized in that: The surface of the cover plate (4) is connected to the operating window (8) via a rotating shaft, the surface of the operating window (8) is fixedly connected to a baffle (9), the bottom of the baffle (9) is in close contact with the top of the cover plate (4), a handle is provided on the top of the baffle (9), and a sealing strip (10) is embedded on the surface of the cover plate (4).

4. The coating device for semiconductor production according to claim 1, characterized in that: The top of the cover plate (4) is fixedly connected to a handle (11), and the outside of the handle (11) is sleeved with an anti-slip sleeve.

5. The coating equipment for semiconductor production according to claim 1, characterized in that: A rectangular groove (17) is provided at the bottom of the glue leveling machine (1), and an anti-slip pad (18) is bonded inside the rectangular groove (17).

6. The coating equipment for semiconductor production according to claim 2, characterized in that: The surface of the glue spreader (1) is inlaid with a magnet block (14), and the surface of the side plate (12) is inlaid with a metal sheet (15), and the metal sheet (15) is adsorbed and connected to the surface of the magnet block (14).

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