Electronic detonator production line

Abstract

The utility model discloses an electronic detonator production line. Comprising a first material feeding module, a second material feeding module, a material distribution device, a first chip assembling module, a second chip assembling module, a third chip assembling module, a first material discharging module, a second material discharging module, a third material discharging module, a first air conveying device, a second air conveying device and a third air conveying device. A finished product conveying track; the first material feeding module and the second material feeding module feed materials to the first chip assembling module, the second chip assembling module and the third chip assembling module through material distribution equipment. An air conveying rail of the third air conveying equipment is arranged above the second material discharging module in a crossing manner; the finished product conveying track and the first material discharging module are arranged side by side. The two material feeding modules can be used for three machining production lines to conduct machining, the machining efficiency is high, machining and production diversification is achieved, and production and machining switching is convenient.

Description

Technical Field

[0001] The utility model relates to the field of electronic detonator production technology, in particular to an electronic detonator production line. Background Art

[0002] The electronic detonator is a commonly used detonator that is easy to control. One end of the wire is the base tube that detonates the detonator through the electronic chip, and the other end is a wire clamp that is used to connect to the external control wire.

[0003] The production of electronic detonators includes wire loading process, lower cover installation process, rubber plug injection process, chip welding process, base tube installation process, upper cover installation process, finished product unloading and bagging process, and boxing process.

[0004] In the prior art, a production line for electronic detonators is disclosed, which uses a material feeding module to simultaneously process two chip assembly modules. Its wire feeding equipment includes a wire management mechanism, a stripping and cutting mechanism, and a wire dividing mechanism. Under this structure, the stripping and cutting mechanism first peels off the outer skin of the wire and then cuts the core wire into the desired length. The two-step setting will take longer than the processing time of the wire management mechanism and the wire dividing mechanism, resulting in waiting time for the wire management mechanism and the wire dividing mechanism, thereby affecting the feeding efficiency of the cover installation equipment. The chip assembly module is prone to standby state, affecting the production efficiency of the electronic detonator, and the close connection between the various process equipment makes it very inconvenient to pass through the workshop; and the production line can only meet the processing needs of electronic detonators of the same specification. When processing electronic detonators with larger lengths, the material feeding speed will be further slowed down, and the production line is difficult to meet the processing needs of large-sized electronic detonators.

[0005] Therefore, it is necessary to design a new technical solution to solve the above problems. Utility Model Content

[0006] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide an electronic detonator production line, which is equipped with a material distribution device and a manual die arrangement and loading device. When processing the same type of electronic detonators, two material loading modules can be used to feed three processing production lines for processing, with high processing efficiency. When processing large-sized electronic detonators and small-sized electronic detonators at the same time, the first material loading module can be used to feed large-sized wires to the first chip assembly module alone, and the second material loading module can be used to feed the second chip assembly module and the third chip assembly module at the same time. The module is used to load small-sized wires, realize the diversification of processing and production, and facilitate the switching of production and processing. In addition, the setting of a finished product conveying track and an aerial conveying track is shared. On the one hand, it can provide convenience for the passage in the workshop, and on the other hand, it can make the overall layout of the production line more compact. The third material unloading module is reasonably arranged, and the space utilization rate in the workshop is high. In addition, the setting of the wire pulling mechanism, peeling mechanism, wire dividing mechanism, and wire cutting mechanism first divides the core wire and then cuts it, making the core wire more flat, reducing the waiting time between mechanisms, and thus improving the efficiency of material loading.

[0007] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0008] An electronic detonator production line includes a first material loading module, a second material loading module, a material distribution device, a first chip assembly module, a second chip assembly module, a third chip assembly module, a first material unloading module, a second material unloading module, a third material unloading module, a first aerial conveying device, a second aerial conveying device, a third aerial conveying device, and a finished product conveying track; wherein:

[0009] The first material loading module and the second material loading module are arranged in parallel in front and back, and the first material loading module and the second material loading module each include a wire feeding device and a cover installation device which are arranged in sequence, and the cover installation device includes a wire pulling mechanism, a stripping mechanism, a wire dividing mechanism, a wire cutting mechanism, and a cover installation mechanism which are arranged in sequence;

[0010] The first chip assembly module, the second chip assembly module, and the third chip assembly module are arranged in parallel in a front-to-back manner. The first chip assembly module, the second chip assembly module, and the third chip assembly module all include a plug injection molding device and a chip assembly device arranged in sequence. The first chip assembly module is provided with a manual mold arrangement and loading device, and the manual mold arrangement and loading device is located between the plug injection molding device and the chip assembly device. The manual mold arrangement and loading device is used to load the wire with the plug and the lower cover;

[0011] The first material loading module and the second material loading module load materials to the first chip assembly module, the second chip assembly module, and the third chip assembly module through the material distribution equipment;

[0012] The first material unloading module and the second material unloading module are arranged in parallel in front and back order, and the second material unloading module and the third material unloading module are arranged in parallel in left and right order. The first material unloading module, the second material unloading module, and the third material unloading module all include basic pipe clamping equipment, cover installation equipment, thread removal and bagging equipment, and product box sealing equipment which are arranged in sequence;

[0013] The first chip assembly module, the second chip assembly module, and the third chip assembly module are connected to the first material unloading module, the second material unloading module, and the third material unloading module respectively through the first aerial conveying equipment, the second aerial conveying equipment, and the third aerial conveying equipment. The first aerial conveying equipment, the second aerial conveying equipment, and the third aerial conveying equipment all include a carrier lifting mechanism, an aerial conveying track, and a carrier descending mechanism that are arranged in sequence. The aerial conveying track is connected between the top of the carrier lifting mechanism and the top of the carrier descending mechanism. The carrier descending mechanism of the third aerial conveying equipment is arranged side by side with the second material unloading module, and the aerial conveying track of the third aerial conveying equipment is arranged in a spanning manner above the second material unloading module.

[0014] The finished product conveying track is arranged side by side with the first material unloading module, and the finished product conveying track is provided with a first rotating mechanism and a second rotating mechanism arranged in sequence. The first material unloading module is connected to the finished product conveying track through the first rotating mechanism, and the second material unloading module is connected to the first rotating mechanism through the first transfer track. The third material unloading module is connected to the second rotating mechanism through the second transfer track. The third material unloading module is located on the rear side of the finished product conveying track.

[0015] As a preferred solution, the wire feeding equipment includes a wire-releasing mechanism, a wire-winding mechanism, and a binding mechanism arranged in sequence. There are multiple wire feeding devices, and the multiple wire feeding devices are connected to the wire-pulling mechanism through a carrier conveyor track.

[0016] As a preferred solution, the material distribution equipment includes a first conveying mechanism, a second conveying mechanism, and a third conveying mechanism arranged in parallel in front and back order. The first conveying mechanism connects the first material loading module and the first chip assembly module, and the third conveying mechanism connects the third material loading module and the third chip assembly module. The first conveying mechanism and the third conveying mechanism are both connected to the second conveying mechanism through a diversion mechanism, and the output end of the second conveying mechanism is connected to the second chip assembly module.

[0017] As a preferred solution, the output end of the plug injection molding equipment is provided with an appearance inspection equipment, the output end of the chip assembly equipment is provided with an electrical performance testing equipment, and the manual mold arrangement and loading equipment of the first chip assembly module is located between the plug injection molding equipment and the appearance inspection equipment.

[0018] As a preferred solution, the first material unloading module and the second material unloading module are connected to a first basic pipe distributing device, and the third material unloading module is connected to a second basic pipe distributing device.

[0019] As a preferred solution, an automatic replacement assembly detection device is further provided between the basic pipe bayonet device and the cover installation device.

[0020] As a preferred solution, the wire-removing and bagging equipment includes a wire-removing mechanism and a bagging mechanism that are sequentially arranged, and the wire-removing mechanism is used to remove the assembled electronic detonator from the carrier.

[0021] As a preferred solution, the product box sealing device includes a box packing mechanism and a box sealing mechanism which are arranged in sequence, and the box packing mechanism is used to box the bagged products.

[0022] As a preferred solution, the first transfer track and the second transfer track are respectively provided with a third rotating mechanism and a fourth rotating mechanism, the third rotating mechanism connects the second material unloading module and the first transfer track, and the fourth rotating mechanism connects the third material unloading module and the second transfer track.

[0023] As a preferred solution, the electronic detonator production line further includes an empty carrier return system for providing empty carriers for the first material loading module, the second material loading module, and the manual mold arrangement and loading equipment.

[0024] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0025] Mainly, by setting up material distribution equipment and cooperating with manual mold arrangement and loading equipment, when processing the same type of electronic detonators, two material loading modules can supply three processing production lines for processing, with high processing efficiency. When processing large-sized electronic detonators and small-sized electronic detonators at the same time, the first material loading module can be used to load large-sized wires to the first chip assembly module alone, and the second material loading module can be used to load small-sized wires to the second chip assembly module and the third chip assembly module at the same time, thereby realizing the diversification of processing and production and facilitating the switching of production and processing. In addition, the setting of sharing a finished product conveying track and an aerial conveying track can, on the one hand, provide convenience for passage in the workshop, and on the other hand, make the overall layout of the production line more compact. The third material unloading module is reasonably arranged, and the space utilization rate in the workshop is high. In addition, the setting of the wire pulling mechanism, the peeling mechanism, the wire dividing mechanism, and the wire cutting mechanism first divides the core wire and then cuts it, making the core wire more flat, reducing the waiting time between the mechanisms, and thereby improving the efficiency of material loading.

[0026] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of a preferred embodiment of the present utility model;

[0028] Figure 2 yes Figure 1 A partial enlarged view of point A in the middle;

[0029] Figure 3 yes Figure 1 A partial enlarged view of point B in the middle.

[0030] Description of the accompanying drawings:

[0031] 11. First material loading module 12. Second material loading module

[0032] 13. Carrier conveyor track 101, wire feeding equipment

[0033] 102. Lower cover device 103. Wire pulling mechanism

[0034] 104. Peeling mechanism 105. Wire separation mechanism

[0035] 106. Thread cutting mechanism 107. Cover installation mechanism

[0036] 108. Pay-off mechanism 109. Winding mechanism

[0037] 20. Material distribution equipment 21. First conveying mechanism

[0038] 22. Second conveying mechanism 23. Third conveying mechanism

[0039] 24. Diversion mechanism 31. First chip assembly module

[0040] 32. Second chip assembly module 33. Third chip assembly module

[0041] 301. Rubber plug injection molding equipment 302. Chip assembly equipment

[0042] 303. Manual mold arrangement and loading equipment 304. Appearance inspection equipment

[0043] 305. Electrical performance testing equipment 41. First material unloading module

[0044] 42. Second material unloading module 43. Third material unloading module

[0045] 401. Basic pipe clamping equipment 402. Cover installation equipment

[0046] 403. De-threading and bagging equipment 404. Product sealing equipment

[0047] 405. First basic pipe distribution equipment 406. Second basic pipe distribution equipment

[0048] 407. Automatic replacement assembly and detection equipment 51. First aerial transport equipment

[0049] 52. Second aerial transport equipment 53. Third aerial transport equipment

[0050] 501, Carrier Lifting Mechanism 502, Aerial Transport Track

[0051] 503, carrier lowering mechanism 60, finished product conveying track

[0052] 61. First rotating mechanism 62. Second rotating mechanism

[0053] 70. First transfer track 71. Third rotating mechanism

[0054] 80. Second transfer track 81. Fourth rotating mechanism. DETAILED DESCRIPTION

[0055] First of all, it should be noted that in the description of the present invention, the terms "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as a limitation on the present invention.

[0056] Please refer to Figures 1 to 3 As shown, it shows the specific structure of the preferred embodiment of the utility model, including a first material loading module 11, a second material loading module 12, a material distribution device 20, a first chip assembly module 31, a second chip assembly module 32, a third chip assembly module 33, a first material unloading module 41, a second material unloading module 42, a third material unloading module 43, a first aerial conveying device 51, a second aerial conveying device 52, a third aerial conveying device 53, and a finished product conveying track 60.

[0057] The first material loading module 11 and the second material loading module 12 are arranged in parallel in front and back. The first material loading module 11 and the second material loading module 12 both include a wire loading device 101 and a cover installation device 102 which are arranged in sequence. Figure 2 As shown, the cover-installing device 102 includes a wire pulling mechanism 103, a peeling mechanism 104, a wire dividing mechanism 105, a wire cutting mechanism 106, and a cover-installing mechanism 107, which are arranged in sequence;

[0058] Specifically, the wire feeding equipment 101 includes a wire-releasing mechanism 108, a wire-winding mechanism 109, and a binding mechanism arranged in sequence. The wire feeding equipment 101 is provided with multiple wire feeding equipment 101, and the multiple wire feeding equipment 101 are connected to the wire-pulling mechanism 103 through the carrier conveying track 13. The wire-pulling mechanism 103 is used to straighten the wire, the stripping mechanism 104 is used to remove the outer skin of the wire, the wire-splitting mechanism 105 is used to separate the core wire after the outer skin is cut, and the wire-cutting mechanism 106 is used to cut the exposed core wire to the required length. The wire-releasing mechanism 108, the wire-winding mechanism 109, the binding mechanism, the wire-pulling mechanism 103, the stripping mechanism 104, the wire-splitting mechanism 105, and the wire-cutting mechanism 106 are existing known technologies and will not be elaborated here.

[0059] The first chip assembly module 31, the second chip assembly module 32, and the third chip assembly module 33 are arranged in parallel in a front-to-back manner. The first chip assembly module 31, the second chip assembly module 32, and the third chip assembly module 33 all include a plug injection molding device 301 and a chip assembly device 302 arranged in sequence. The first chip assembly module 31 is provided with a manual mold arrangement and loading device 303, which is located between the plug injection molding device 301 and the chip assembly device 302. The manual mold arrangement and loading device 303 is used to load the wire with the plug and the lower cover, manually load the wire on the carrier, and then transport it back to the production line;

[0060] Specifically, the output end of the plug injection molding equipment 301 is provided with an appearance inspection equipment 304, the output end of the chip assembly equipment 302 is provided with an electrical performance testing equipment 305, and the manual mold arrangement and loading equipment 303 of the first chip assembly module 31 is located between the plug injection molding equipment 301 and the appearance inspection equipment 304; wherein, the plug injection molding equipment 301, the appearance inspection equipment 304, the chip assembly equipment 302, and the electrical performance testing equipment 305 are all existing known technologies and will not be elaborated here.

[0061] The first material loading module 11 and the second material loading module 12 load materials to the first chip assembly module 31, the second chip assembly module 32, and the third chip assembly module 33 through the material distribution device 20;

[0062] Specifically, see Figure 2 As shown, the material distribution equipment 20 includes a first conveying mechanism 21, a second conveying mechanism 22, and a third conveying mechanism 23 which are arranged in parallel in front and back order. The first conveying mechanism 21 connects the first material loading module 11 and the first chip assembly module 31, and the third conveying mechanism 23 connects the third material loading module and the third chip assembly module 33. The first conveying mechanism 21 and the third conveying mechanism 23 are both connected to the second conveying mechanism 22 through the diversion mechanism 24. The output end of the second conveying mechanism 22 is connected to the second chip assembly module 32. The transfer between the mechanisms usually adopts the cooperation of a lifting device and a pushing device. The lifting device lifts the carrier, and the pushing device pushes the lifted carrier to another mechanism.

[0063] The first material unloading module 41 and the second material unloading module 42 are arranged in parallel in front and back order, and the second material unloading module 42 and the third material unloading module 43 are arranged in parallel in left and right order. The first material unloading module 41, the second material unloading module 42, and the third material unloading module 43 all include a basic pipe clamping device 401, a cover installation device 402, a thread removal and bagging device 403, and a product sealing device 404 which are arranged in sequence;

[0064] Specifically, the first material unloading module 41 and the second material unloading module 42 are connected to the first basic tube distribution device 405, and the third material unloading module 43 is connected to the second basic tube distribution device 406. An automatic substitute assembly detection device 407 is also provided between the basic tube bayonet device 401 and the capping device 402. The automatic substitute assembly detection device 407 includes a bayonet detection mechanism, a three-code binding mechanism, and a defective product removal and replenishment mechanism. If the bayonet detection is NG and the three-code binding is NG, the defective product will be removed. The carrier of good products is moved to another workstation, and then the bad products are removed. After the good products are reloaded in the corresponding position, the three codes are bound again. The capping device 402 includes a laser coding mechanism, a capping mechanism, and a code checking mechanism; the thread removal and bagging device 403 includes a thread removal mechanism and a bagging mechanism arranged in sequence. The thread removal mechanism is used to remove the assembled electronic detonator from the carrier; the product sealing device 404 includes a boxing mechanism and a box sealing mechanism arranged in sequence. The boxing mechanism is used to box the bagged products.

[0065] Among them, the basic pipe clamping equipment 401, the cover installation equipment 402, the line removal and bagging equipment 403, the product sealing equipment 404, the automatic replacement assembly detection equipment 407, the first basic pipe distribution equipment 405, and the second basic pipe distribution equipment 406 are all existing known technologies and will not be elaborated here.

[0066] The first chip assembly module 31, the second chip assembly module 32, and the third chip assembly module 33 are connected to the first material unloading module 41, the second material unloading module 42, and the third material unloading module 43 through the first aerial conveying equipment 51, the second aerial conveying equipment 52, and the third aerial conveying equipment 53 respectively. The first aerial conveying equipment 51, the second aerial conveying equipment 52, and the third aerial conveying equipment 53 all include a carrier lifting mechanism 501, an aerial conveying track 502, and a carrier descending mechanism 503 arranged in sequence. The aerial conveying track 502 is connected between the top of the carrier lifting mechanism 501 and the top of the carrier descending mechanism 503. The carrier descending mechanism 503 of the third aerial conveying equipment 53 is arranged side by side with the second material unloading module 42. The aerial conveying track 502 of the third aerial conveying equipment 53 is arranged horizontally above the second material unloading module 42. The carrier lifting mechanism 501 and the carrier descending mechanism 503 can both move up and down.

[0067] The finished product conveying track 60 is arranged side by side with the first material unloading module 41. The finished product conveying track 60 is provided with a first rotating mechanism 61 and a second rotating mechanism 62 arranged in sequence. The first material unloading module 41 is connected to the finished product conveying track 60 through the first rotating mechanism 61. The second material unloading module 42 is connected to the first rotating mechanism 61 through the first transfer track 70. The third material unloading module 43 is connected to the second rotating mechanism 62 through the second transfer track 80. The third material unloading module 43 is located at the rear side of the finished product conveying track 60.

[0068] Specifically, see Figure 3 As shown, the first transfer track 70 and the second transfer track 80 are respectively provided with a third rotating mechanism 71 and a fourth rotating mechanism 81. The third rotating mechanism connects the second material unloading module 42 and the first transfer track 70, and the fourth rotating mechanism connects the third material unloading module 43 and the second transfer track 80. The rotating mechanism drives the box containing the product to rotate and reverse.

[0069] In this embodiment, the electronic detonator production line also includes an empty carrier return system for providing empty carriers for the first material loading module 11, the second material loading module 12, and the manual mold loading equipment 303. The empty carrier return system is arranged below the material conveyor, that is, the material is conveyed from the top of the machine and the empty carrier is conveyed from the inside. The empty carrier return system is an existing known technology and will not be described here.

[0070] The design focus of this utility model is:

[0071] Mainly, by setting up material distribution equipment and cooperating with manual mold arrangement and loading equipment, when processing the same type of electronic detonators, two material loading modules can supply three processing production lines for processing, with high processing efficiency. When processing large-sized electronic detonators and small-sized electronic detonators at the same time, the first material loading module can be used to load large-sized wires to the first chip assembly module alone, and the second material loading module can be used to load small-sized wires to the second chip assembly module and the third chip assembly module at the same time, thereby realizing the diversification of processing and production and facilitating the switching of production and processing. In addition, the setting of sharing a finished product conveying track and an aerial conveying track can, on the one hand, provide convenience for passage in the workshop, and on the other hand, make the overall layout of the production line more compact. The third material unloading module is reasonably arranged, and the space utilization rate in the workshop is high. In addition, the setting of the wire pulling mechanism, the peeling mechanism, the wire dividing mechanism, and the wire cutting mechanism first divides the core wire and then cuts it, making the core wire more flat, reducing the waiting time between the mechanisms, and thereby improving the efficiency of material loading.

[0072] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An electronic detonator production line, characterized by: It includes a first material loading module, a second material loading module, a material distribution device, a first chip assembly module, a second chip assembly module, a third chip assembly module, a first material unloading module, a second material unloading module, a third material unloading module, a first aerial conveying device, a second aerial conveying device, a third aerial conveying device, and a finished product conveying track; wherein: The first material loading module and the second material loading module are arranged in parallel in front and back, and the first material loading module and the second material loading module each include a wire feeding device and a cover installation device which are arranged in sequence, and the cover installation device includes a wire pulling mechanism, a stripping mechanism, a wire dividing mechanism, a wire cutting mechanism, and a cover installation mechanism which are arranged in sequence; The first chip assembly module, the second chip assembly module, and the third chip assembly module are arranged in parallel in a front-to-back manner. The first chip assembly module, the second chip assembly module, and the third chip assembly module all include a plug injection molding device and a chip assembly device arranged in sequence. The first chip assembly module is provided with a manual mold arrangement and loading device, and the manual mold arrangement and loading device is located between the plug injection molding device and the chip assembly device. The manual mold arrangement and loading device is used to load the wire with the plug and the lower cover; The first material loading module and the second material loading module load materials to the first chip assembly module, the second chip assembly module, and the third chip assembly module through the material distribution equipment; The first material unloading module and the second material unloading module are arranged in parallel in front and back order, and the second material unloading module and the third material unloading module are arranged in parallel in left and right order. The first material unloading module, the second material unloading module, and the third material unloading module all include basic pipe clamping equipment, cover installation equipment, thread removal and bagging equipment, and product box sealing equipment which are arranged in sequence; The first chip assembly module, the second chip assembly module, and the third chip assembly module are connected to the first material unloading module, the second material unloading module, and the third material unloading module respectively through the first aerial conveying equipment, the second aerial conveying equipment, and the third aerial conveying equipment. The first aerial conveying equipment, the second aerial conveying equipment, and the third aerial conveying equipment all include a carrier lifting mechanism, an aerial conveying track, and a carrier descending mechanism that are arranged in sequence. The aerial conveying track is connected between the top of the carrier lifting mechanism and the top of the carrier descending mechanism. The carrier descending mechanism of the third aerial conveying equipment is arranged side by side with the second material unloading module, and the aerial conveying track of the third aerial conveying equipment is arranged in a spanning manner above the second material unloading module. The finished product conveying track is arranged side by side with the first material unloading module, and the finished product conveying track is provided with a first rotating mechanism and a second rotating mechanism arranged in sequence. The first material unloading module is connected to the finished product conveying track through the first rotating mechanism, and the second material unloading module is connected to the first rotating mechanism through the first transfer track. The third material unloading module is connected to the second rotating mechanism through the second transfer track. The third material unloading module is located on the rear side of the finished product conveying track.

2. The electronic detonator production line according to claim 1, characterized in that: The wire feeding equipment includes a wire-releasing mechanism, a wire-winding mechanism, and a binding mechanism that are arranged in sequence. There are multiple wire feeding devices, and the multiple wire feeding devices are connected to the wire-pulling mechanism together through a carrier conveying track.

3. The electronic detonator production line according to claim 1, characterized in that: The material distribution equipment includes a first conveying mechanism, a second conveying mechanism, and a third conveying mechanism arranged in parallel in front and back order. The first conveying mechanism connects the first material loading module and the first chip assembly module, and the third conveying mechanism connects the third material loading module and the third chip assembly module. The first conveying mechanism and the third conveying mechanism are both connected to the second conveying mechanism through a diversion mechanism, and the output end of the second conveying mechanism is connected to the second chip assembly module.

4. The electronic detonator production line according to claim 1, characterized in that: The output end of the plug injection molding equipment is provided with an appearance inspection device, the output end of the chip assembly equipment is provided with an electrical performance testing device, and the manual mold arrangement and loading device of the first chip assembly module is located between the plug injection molding equipment and the appearance inspection device.

5. The electronic detonator production line according to claim 1, characterized in that: The first material unloading module and the second material unloading module are connected to a first basic tube distributing device, and the third material unloading module is connected to a second basic tube distributing device.

6. The electronic detonator production line according to claim 1, characterized in that: An automatic substitute assembly detection device is also provided between the basic pipe bayonet device and the cover installation device.

7. The electronic detonator production line according to claim 1, characterized in that: The wire-removing and bagging equipment comprises a wire-removing mechanism and a bagging mechanism which are arranged in sequence. The wire-removing mechanism is used to remove the assembled electronic detonator from the carrier.

8. The electronic detonator production line according to claim 1, characterized in that: The product box sealing device comprises a box packing mechanism and a box sealing mechanism which are arranged in sequence, and the box packing mechanism is used to box the bagged products.

9. The electronic detonator production line according to claim 1, characterized in that: The first transfer track and the second transfer track are respectively provided with a third rotating mechanism and a fourth rotating mechanism. The third rotating mechanism connects the second material unloading module and the first transfer track, and the fourth rotating mechanism connects the third material unloading module and the second transfer track.

10. The electronic detonator production line according to claim 1, characterized in that: The electronic detonator production line also includes an empty carrier return system for providing empty carriers for the first material loading module, the second material loading module, and the manual mold arrangement and loading equipment.

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