Electronic equipment
By setting up a ring-shaped hollow heat dissipation buffer layer and a parallel groove design in the middle frame in the electronic device, the problem of the large thickness of the wearable device is solved, and the device is made lighter and thinner and has an improved screen-to-body ratio.
Patent Information
- Application Number
- CN202422438882.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-10-09
AI Technical Summary
Existing wearable devices are difficult to achieve lightweight and thinness while meeting diverse functional requirements due to their large thickness.
By setting the second structural layer of the heat dissipation buffer layer into a ring-shaped hollow shape, combined with the relatively parallel groove design of the middle frame and the back cover, the accommodating cavity space is increased, the thickness of the entire machine is compressed, and the connection strength and sealing are enhanced through the rubber frame connection.
It achieves the lightweight and thinness of electronic devices, improves the screen-to-body ratio and connection strength, and reduces the thickness of the entire device.
Smart Images
Figure CN223308554U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art
[0002] With the continuous development and progress of science and technology, smart wearable devices have gradually entered people's lives. For example, smart watches, smart bracelets, smart glasses, smart helmets, etc. are becoming more and more popular among consumers. With the continuous development of smart wearable device technology, people have also had higher requirements for the appearance and aesthetics of wearable devices. Among them, features such as light weight, small size and exquisite appearance can bring greater long-term competitiveness to wearable devices. However, with the support of various sensors and functional modules, the functions of electronic devices are also increasing, and the space allocation problem of electronic devices is becoming more and more serious. How to meet the demand for the diversification of electronic devices while maintaining the thinness of electronic devices is one of the main research directions at present. Utility Model Content
[0003] An embodiment of the present application provides an electronic device to solve the problem of large thickness in existing wearable devices.
[0004] In the first aspect, the present application provides an electronic device, comprising a middle frame, a back cover and a display module, wherein the display module and the back cover are respectively arranged on opposite sides of the middle frame, and the middle frame and the back cover are used to fix and seal the display module; the display module comprises a display panel, a heat dissipation buffer layer and an optical film, the display comprises a light-emitting surface and a backlight surface arranged opposite to each other, the optical film is arranged on one side of the light-emitting surface of the display panel and is used to adjust the light emitted by the display panel, the heat dissipation buffer layer is arranged on the backlight side of the display panel, and the heat dissipation buffer layer also includes a first structural layer and a second structural layer stacked in sequence, the first structural layer covers the backlight surface of the display panel, and the second structural layer is a hollow annular hollow shape arranged on the side of the first structural layer away from the display panel, and the orthographic projection of the second structural layer on the display panel is located within the orthographic projection of the first structural layer on the display panel.
[0005] By setting the second structural layer in the heat dissipation buffer layer in a ring-shaped hollow shape, the thickness of the heat dissipation buffer layer can be reduced, that is, the space occupied by the heat dissipation buffer layer can be reduced, which is used to increase the space size of the accommodating cavity, so that the thickness of the entire machine can be further compressed in the thickness direction to achieve lightness and thinness.
[0006] Optionally, the first structural layer is a foam layer, and the second structural layer is a plastic film layer. The first structural layer is configured as a foam layer to block light and provide buffer protection, while the second structural layer is configured as a plastic film layer to prevent deformation caused by temperature changes.
[0007] Optionally, the middle frame includes a middle frame body and a protruding portion, the middle frame body and the protruding portion are both annular hollow structures, the protruding portion is arranged around the inner wall of the middle frame body, the thickness of the middle frame body along the first direction is greater than the thickness of the protruding portion along the first direction, the middle frame body and the protruding portion are arranged in the first direction to form a first groove, and the display module is embedded in the first groove.
[0008] Optionally, the middle frame body and the protruding portion further define a second groove along the first direction, spaced a predetermined distance from and relatively parallel to the first groove, and the back cover is embedded in the second groove. Embedding the display module in the first groove and the back cover in the second groove effectively reduces the thickness of the electronic device.
[0009] Optionally, the display module further includes an optical adhesive layer and a transparent cover plate, wherein the cover plate covers the first groove and is bonded to a side of the optical film away from the display panel through the optical adhesive layer, and the cover plate is used to protect the display panel.
[0010] Optionally, the electronic device further includes a plastic frame, which is arranged around the gap between the display module and the middle frame and is used to bond and fix the middle frame and the display module, wherein the plastic frame includes a first connecting portion and a second connecting portion, the first connecting portion extending along the first direction and arranged between the display module and the middle frame body, and the second connecting portion extending in the second direction and arranged between the second structural layer and the protruding portion, wherein the first direction is perpendicular to the second direction. By arranging the first connecting portion between the display module and the middle frame body to enhance the connection strength and sealing between the display module and the middle frame body, and arranging the second connecting portion between the display module and the protruding portion to further enhance the connection strength between the display module and the middle frame body, the screen-to-body ratio of the display panel can be improved.
[0011] Optionally, the cross-section of the first connecting portion along the second direction has a first length, the cross-section of the second connecting portion along the second direction has a second length, and the cross-section of the protruding portion along the second direction has a third length, wherein the third length is greater than or equal to the sum of the first and second lengths. The sum of the lengths of the first and second connecting portions along the second direction is controlled to be less than or equal to the length of the protruding portion along the second direction to prevent the second connecting portion from extending into the interior of the accommodating cavity, thereby reducing space occupancy.
[0012] Optionally, a cross-section of the second structural layer has a fourth length along the second direction, wherein the sum of the first length and the fourth length is greater than or equal to the third length. The sum of the lengths of the second structural layer and the first connecting portion along the second direction is controlled to be greater than or equal to the length of the protruding portion along the second direction, thereby increasing the space of the accommodating cavity while ensuring the protective effect of the second structural layer.
[0013] Optionally, the fourth length is between 0.5 mm and 8 mm.
[0014] Optionally, the electronic device further includes a battery, the display module, the middle frame and the back cover form a receiving cavity, and the battery is disposed in the receiving cavity.
[0015] Compared with the existing technical problems, the present application can increase the space of the accommodating cavity by setting the second structural layer in the heat dissipation buffer layer in an annular hollow structure, thereby further compressing the overall thickness of the electronic device and achieving lightness and thinness. Moreover, by setting relatively parallel first grooves and second grooves, the overall thickness of the electronic device can be further reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0017] Figure 1 A schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;
[0018] Figure 2 A schematic diagram of the cross-sectional structure of a display module in the related art;
[0019] Figure 3 A schematic cross-sectional view of an electronic device according to an embodiment of the present application;
[0020] Figure 4 for Figure 3 The cross-sectional structure diagram of the module is shown in FIG.
[0021] Figure 5 for Figure 4 Schematic top view of the second structural layer. DETAILED DESCRIPTION
[0022] To facilitate the clear description of the technical solutions of this application, the words "first" and "second" are used to distinguish between identical or similar items with substantially the same functions and effects. Those skilled in the art will understand that the words "first" and "second" do not limit the quantity or order of execution, and the words "first" and "second" do not necessarily mean different.
[0023] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of the present application include a particular feature, structure, or characteristic described in conjunction with that embodiment. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in different places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.
[0024] The embodiments of the present application provide an electronic device, including but not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a driving recorder, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a mobile or fixed terminal with a back cover and a middle frame.
[0025] As an example and not a limitation, in the embodiments of the present application, the electronic device may also be a wearable device. Wearable devices may also be called wearable smart devices, which are a general term for wearable devices that are intelligently designed and developed using wearable technology for daily wear, such as glasses, gloves, watches, shoes, etc. A wearable device is a portable device that is worn directly on the body or integrated into the user's clothes or accessories. Wearable devices are not only hardware devices, but also achieve powerful functions through software support, data interaction, and cloud interaction. Broadly speaking, wearable smart devices include those that are fully functional, large in size, and can achieve complete or partial functions without relying on smartphones, such as watches or smart glasses, as well as those that only focus on a certain type of application function and need to be used in conjunction with other devices such as smartphones, such as various types of smart bracelets and smart jewelry for vital sign monitoring. For the sake of convenience, the following description will take the electronic device as a watch as an example.
[0026] See also Figure 1 , Figure 1A schematic diagram of the three-dimensional structure of an electronic device 100 provided in an embodiment of the present application.
[0027] like Figure 1 As shown, the electronic device 100 includes a display module 101, a middle frame 102, and a back cover. The middle frame 102 and the back cover can be integrally formed or separately formed. The display module 101 and the middle frame 102 form a receiving cavity. The receiving cavity is provided with a printed circuit board (PCB), a processing module, a PPG packaging module, and other structures. The processing module and the PPG packaging module are provided on the PCB.
[0028] See also Figure 2 , Figure 2 It is a schematic diagram of the cross-sectional structure of a display module in the related art.
[0029] The display module 101 includes a display panel 110 , a first backing film 120 , an auxiliary supporting layer 130 , an optical film 160 , an optical adhesive layer 170 and a cover plate 180 .
[0030] The side of the display panel 110 facing the cover plate 180 is the light-emitting side, and the other side opposite the light-emitting side is the backlight side. For example, the display panel 110 may include a substrate, a barrier layer, a drive circuit layer, an OLED light-emitting layer, a TFE (thin film encapsulation) encapsulation layer, and other structures. In this application, the display panel 110 is illustrated as a single structural layer, and the specific structural layers it includes are not shown.
[0031] Among them, the first back film 120 is stacked on the backlight side of the display panel 110, the auxiliary supporting layer 130 is arranged on the side of the first back film 120 away from the display panel 110, the optical film 160 is stacked on the light-emitting side of the display panel 110, the optical adhesive layer 170 is arranged on the side of the optical film 160 away from the display panel 110, and the cover plate 180 covers the side of the optical adhesive layer 170 away from the optical film 160.
[0032] The first back film 120 can be made of a material such as polyethylene terephthalate (PET), and can be attached to the backlight side of the flexible display panel 110 using an adhesive material such as a grid adhesive. PET material has the advantages of a low elastic modulus and is not easily expanded when heated. Therefore, the first back film 120 made of PET material will not deform due to changes in ambient temperature, reducing the possibility of peeling of the film layer connected to the first back film 120, thereby improving the yield and reliability of the display module 101. In addition, the grid adhesive has the advantages of easy bonding and air venting. Using the grid adhesive for bonding can avoid the generation of bubbles, bulging, and other undesirable phenomena during bonding.
[0033] The auxiliary support layer 130 may be a SCF (Super Clean Foam) component, which exemplarily includes a bonding layer, a foam layer, a polyimide layer, and a metal layer stacked in sequence.
[0034] As mentioned above, in order to ensure that the electronic device 100 can achieve the effect of waterproof and anti-collision, it is usually necessary to set up a multi-layer protection structure to protect the display module 101, which leads to the problem that the electronic device is thick and cannot be made thin and lightweight. Based on this, the present invention provides a display module and electronic device that can effectively reduce the thickness of the entire machine.
[0035] See also Figure 3 , Figure 3 This is a schematic cross-sectional structural diagram of an electronic device 100 provided in an embodiment of the present application.
[0036] like Figure 3 As shown, the electronic device 100 includes a display module 101, a middle frame 102, a plastic frame 103, a back cover 104, a battery 105, a speaker 106 and a circuit board 108, wherein the middle frame 102 includes a middle frame body 102a and a protrusion 102b, both of which are annular hollow structures, and the protrusion 102b is arranged on the inner wall of the middle frame body 102a, that is, the protrusion 102b protrudes from the inner wall of the middle frame body 102a and surrounds the inner wall of the middle frame body 102a to form an annular hollow structure. Among them, the cross-section of the middle frame body 102a is trapezoidal, and the cross-section of the protrusion 102b is rectangular, with the lower base of the trapezoid facing the center of the ring and the upper base of the trapezoid facing outward, that is, the protrusion 102b is located on one side of the lower base of the trapezoid and is arranged around it. In the first direction F1, i.e., the thickness direction, the thickness of the middle frame body 102a is greater than the thickness of the protruding portion 102b. Therefore, along the first direction F1, a first groove 107a and a second groove 107b are formed between the middle frame body 102a and the protruding portion 102b, which are spaced a predetermined distance apart and relatively parallel to each other. The display module 101 is embedded in the first groove 107a, and the back cover 104 is embedded in the second groove 107b.
[0037] The plastic frame 103 is disposed within the gap between the display module 101 and the middle frame 102. A potting material can be used to cover the periphery of the display module 101, and the potting material solidifies to form the plastic frame 103. The plastic frame 103 includes a first connecting portion 103a and a second connecting portion 103b. The first connecting portion 103a is disposed between the display module 101 and the middle frame body 102a, and the second connecting portion 103b is disposed between the display module 101 and the protruding portion 102b, for bonding and securing the display module 101.
[0038] By setting part of the plastic frame, that is, the second connecting portion 103b, between the display module 101 and the protruding portion 102b, the frame thickness can be further reduced and the screen-to-body ratio can be improved. At the same time, by setting the display module 101 and the back cover 104 respectively in the first groove 107a and the second groove 107b preset in the middle frame 102, the overall thickness of the electronic device 100 can be effectively reduced.
[0039] The back cover 104 is disposed on a side of the middle frame 102 away from the display module 101 , and forms a receiving cavity with the display module 101 and the middle frame 102 . The battery 105 , the speaker 106 , the circuit board 108 , etc. are disposed in the receiving cavity.
[0040] The circuit board 108 may be a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board. This embodiment is illustrative of the circuit board 108 as a rigid circuit board. Specifically, the circuit board 108 may be a rigid printed circuit board (PCB). A first controller may be provided on the circuit board 108, including but not limited to a microcontroller unit (MCU), which is used to control the sensor for detection. The circuit board 108 may be a main circuit board or other circuit boards, such as a secondary circuit board. The main circuit board is also referred to as a main board, and is the core circuit board within the electronic device 100. The main circuit board generally refers to a circuit board with an integrated processor within the electronic device 100. The processor may include one or more processing units, for example, an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). Different processing units may be independent devices or integrated into one or more processors.
[0041] like Figure 4 and Figure 5 As shown, Figure 4 for Figure 3 FIG. 1 is a schematic diagram of a cross-sectional structure of the display module 101 . Figure 5 for Figure 4 Schematic top view of the second structural layer 142.
[0042] The display module 101 includes a display panel 110, a heat dissipation buffer layer 140, an optical film 160, an optical adhesive layer 170, and a cover plate 180. The side of the display panel 110 facing the cover plate 180 is the light-emitting side, and the other side opposite to the light-emitting side is the backlight side. For example, the display panel 110 may include a substrate, a barrier layer, a drive circuit layer, a light-emitting layer, a TFE (thin film encapsulation) encapsulation layer, and other structures. In the embodiment of this application, the display panel 110 is illustrated as a single structural layer, and the specific structural layers it includes are not shown.
[0043] Exemplarily, the display panel 110 may be a self-luminous display panel. For example, the display panel 110 may be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a mini organic light-emitting diode (MLED) display panel, a micro organic light-emitting diode (MLED) display panel, a micro organic light-emitting diode (MLED) display panel, or a quantum dot light-emitting diode (QLED) display panel. In other embodiments, the display panel 110 may also be a display panel that cannot emit light by itself and needs to be provided with backlight by a backlight module. For example, the display panel 110 may be a liquid crystal display panel (LCD).
[0044] The cover plate 180 is positioned between the middle frame body 102a, and the display panel 110, heat dissipation buffer layer 140, optical film 160, and optical adhesive layer 170 are positioned between the cover plate 180 and the protrusion 102b. The cover plate 180 is used to protect the display panel 110 from water, dust, and scratches. Materials for the cover plate 180 include, but are not limited to, acrylic, glass, and sapphire. In other embodiments, the screen may not have a cover plate 180, but may instead use a polarizer to protect the display panel 110. This is not specifically limited here.
[0045] The optical film 160 is laminated on the light-emitting side of the display panel 110, and the cover plate 180 covers the side of the optical film 160 away from the display panel 110. The optical adhesive layer 170 is disposed between the optical film 160 and the cover plate 180 to securely bond the optical film 160 and the cover plate 180. The optical film 160 may be a polarizer that has an anti-reflective effect, thereby preventing ambient light from negatively affecting the display quality of the display panel 110.
[0046] The heat dissipation buffer layer 140 is laminated on the backlight side of the display panel 110, that is, between the protrusion 102b and the display panel 110. The heat dissipation buffer layer 140 is used to dissipate heat and protect the display panel 110. The first connecting portion 103a is disposed in the gap between the display panel 110, the heat dissipation buffer layer 140, the optical film 160, the optical adhesive layer 170, and the middle frame body 102a. The second connecting portion 103b is disposed between the heat dissipation buffer layer 140 and the protrusion 102b.
[0047] The heat dissipation buffer layer 140 includes a first structural layer 141 and a second structural layer 142 stacked together. The first structural layer 141 is positioned adjacent to the display panel 110, while the second structural layer 142 is positioned on the side of the first structural layer 141 away from the display panel 110. The first structural layer 141 is positioned to cover the entire backlight side of the display panel 110, while the second structural layer 142 is hollowed out and stacked on the side of the first structural layer 141 away from the display panel 110. Alternatively, the second structural layer 142 is stacked on the side of the protrusion 102b adjacent to the display panel 110. The second connecting portion 103b is positioned between the second structural layer 142 and the protrusion 102b.
[0048] The first structural layer 141 may be configured as a foam layer to provide light blocking and buffering protection.
[0049] The second structural layer 142 can be a plastic film layer made of materials such as polyethylene terephthalate (PET). PET has the advantages of a low elastic modulus and is not easily expanded when heated. Therefore, the second structural layer 142 made of PET will not deform due to changes in ambient temperature. The second structural layer 142 is less likely to peel off from the first structural layer 141 and the protrusion 102b to which it is connected, thereby improving the yield and reliability of the display module 101. In addition, the second structural layer 142 and the protrusion 102b are bonded together by the second connecting portion 103b, further improving the stability and reliability of the connection between the display module 101 and the middle frame 102.
[0050] In an exemplary embodiment, the heat dissipation buffer layer 140 may further include an adhesive layer and a metal layer disposed in sequence. The adhesive layer may be located near the non-light-emitting side of the display panel 110 and used to bond the first structural layer 141 to the backlight side of the display panel 110. An example material for the adhesive layer is mesh glue (Embo). The metal layer may be disposed between the second structural layer 142 and the protrusion 102b for heat dissipation. An example material for the metal layer is copper foil.
[0051] In which, the cross-section of the first connecting portion 103a has a first length d1 along the second direction F2, the second connecting portion 103b has a second length d2 along the second direction F2, and the cross-section of the protruding portion 102b has a third length d3 along the second direction F2, wherein the sum of the first length d1 and the second length d2 is less than or equal to the third length d3, that is, the sum of the lengths of the first connecting portion 103a and the second connecting portion 103b along the second direction F2 is less than or equal to the length of the protruding portion 102b along the second direction F2.
[0052] The cross section of the second structural layer 142 has a fourth length d4 along the second direction F2, wherein the sum of the first length d1 and the fourth length d4 is greater than or equal to the third length d3, that is, the sum of the lengths of the first connecting portion 103a and the second structural layer 142 along the second direction F2 is greater than or equal to the length of the protruding portion 102b along the second direction F2. Since the plastic frame 103 and the second structural layer 142 are both annular hollow structures, it can also be said that the sum of the width of the first connecting portion 103a and the width of the second structural layer 142 is less than or equal to the width of the protruding portion 102b. Figure 4 In the embodiment, the first connection portion 103a and the second structure layer 142 may cover the protrusion 102b.
[0053] In an exemplary embodiment, the sum of the first length d1 and the fourth length d4 can be set to be smaller than the third length d3 according to specific needs, that is, the sum of the lengths of the first connecting portion 103a and the second structural layer 142 along the second direction F2 is smaller than the length of the protrusion 102b along the second direction F2.
[0054] The fourth length d4 can be set according to specific needs, for example, it can be set between 0.5 mm and 8 mm.
[0055] By setting the second structural layer 142 as a ring-shaped hollow structure, the accommodating cavity space enclosed between the display module 101, the middle frame 102 and the back cover 104 is made larger, so that the size of the accommodating cavity can be further compressed to reduce the thickness of the electronic device, thereby realizing a lightweight and thin setting of the electronic device 100.
[0056] The above disclosure is only part of the embodiments of the present application, and it is certainly not intended to limit the scope of the rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments and equivalent changes made in accordance with the claims of the present application are still within the scope covered by the present application.
Claims
1. An electronic device, characterized in that: The display module comprises a middle frame, a back cover and a display module, wherein the display module and the back cover are respectively arranged on opposite sides of the middle frame, and the middle frame and the back cover are used to fix and seal the display module; the display module comprises a display panel, a heat dissipation buffer layer and an optical film, the display comprises a light-emitting surface and a backlight surface which are relatively arranged, the optical film is arranged on one side of the light-emitting surface of the display panel and is used to adjust the light emitted by the display panel, the heat dissipation buffer layer is arranged on the backlight surface side of the display panel, the heat dissipation buffer layer also comprises a first structural layer and a second structural layer which are stacked in sequence, the first structural layer covers the backlight surface of the display panel, the second structural layer is in a hollow annular hollow shape and is arranged on the side of the first structural layer away from the display panel, and the orthographic projection of the second structural layer on the display panel is located within the orthographic projection of the first structural layer on the display panel.
2. The electronic device according to claim 1, wherein The first structural layer is a foam layer, and the second structural layer is a plastic film layer.
3. The electronic device according to claim 2, wherein: The middle frame includes a middle frame body and a protruding portion. Both the middle frame body and the protruding portion are annular hollow structures. The protruding portion is arranged around the inner wall of the middle frame body. The thickness of the middle frame body along the first direction is greater than the thickness of the protruding portion along the first direction. The middle frame body and the protruding portion are arranged in the first direction to form a first groove, and the display module is embedded in the first groove.
4. The electronic device according to claim 3, wherein: The middle frame body and the protruding portion further surround and form a second groove along the first direction, which is spaced a preset distance from the first groove and relatively parallel to the first groove, and the back cover is embedded in the second groove.
5. The electronic device according to claim 4, wherein: The display module further includes an optical adhesive layer and a transparent cover plate. The cover plate covers the first groove and is bonded to a side of the optical film away from the display panel through the optical adhesive layer. The cover plate is used to protect the display panel.
6. The electronic device according to claim 5, wherein: The electronic device also includes a plastic frame, which is arranged around the gap between the display module and the middle frame and is used to bond and fix the middle frame and the display module, wherein the plastic frame includes a first connecting portion and a second connecting portion, the first connecting portion extending along the first direction and arranged between the display module and the middle frame body, and the second connecting portion extending along the second direction and arranged between the second structural layer and the protrusion, wherein the first direction is perpendicular to the second direction.
7. The electronic device according to claim 6, wherein: The cross section of the first connecting portion has a first length along the second direction, the cross section of the second connecting portion has a second length along the second direction, and the cross section of the protruding portion has a third length along the second direction, wherein the third length is greater than or equal to the sum of the first length and the second length.
8. The electronic device according to claim 7, wherein: A cross section of the second structural layer has a fourth length along the second direction, wherein a sum of the first length and the fourth length is greater than or equal to the third length.
9. The electronic device according to claim 8, wherein The fourth length is between 0.5 mm and 8 mm.
10. The electronic device according to claim 9, wherein The electronic device further includes a battery. The display module, the middle frame and the back cover are arranged to form a receiving cavity, and the battery is arranged in the receiving cavity.