Packaging shell of discrete conical inductor

Abstract

The utility model relates to the technical field of electronic circuits and communication, in particular to a packaging shell of a discrete conical inductor, which mainly comprises a square shell, the bottom end of the square shell is integrally connected with a substrate, a conical inductor body is arranged on the inner side of the substrate, copper metal layers are arranged at four corners of the bottom end of the substrate, and the bottom end of the conical inductor body is connected with the copper metal layers. A tin ball is welded to the bottom end of the copper metal layer, pin wires are integrally connected to the two ends of the conical inductor body, and an adhesive is arranged at the bottom end of the inner side of the conical inductor body. According to the packaging shell of the discrete type conical inductor, the conical inductor body is glued to the center position of the H-shaped substrate, then the pin wires are welded to the two ends of the substrate, the other two ends of the substrate are welded to the circuit board through the solder balls, it is ensured that all electronic elements are strictly arranged and connected according to design requirements, and the packaging shell is simple in structure and convenient to use. The reliability of the electronic equipment is improved, the surface mounting process is met, the packaging operation process is simplified, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuits and communications, in particular to a packaging shell of a discrete conical inductor. Background Art

[0002] Conical inductors are characterized by excellent consistency across a wide frequency band and are widely used in DC bias circuits, amplifier circuits, and optical wireless communication systems. These include high-frequency devices and modules such as broadband low-noise amplifiers, lithium niobate electro-optical modulators, analog directly modulated lasers, and external bias-tees.

[0003] Existing conical inductors are irregularly tapered, with pins located at the small end and bottom end. This limits their suitability for industrial and large-scale applications and prevents them from meeting the surface mount requirements of integrated circuits. The pins, especially those at the small end, are significantly correlated with the losses at the applicable frequency. Stringent requirements for the installation of the pins are therefore required, requiring optimization and improvement. Utility Model Content

[0004] The purpose of the present invention is to provide a packaging shell for a discrete conical inductor to solve the problem in the above-mentioned background art that the pin lines are located at the small end and the bottom end respectively, thereby limiting its industrial and large-scale applications and failing to meet the surface mounting requirements of integrated circuits.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A package housing for a discrete conical inductor, comprising:

[0007] A cube housing, the bottom end of which is integrally connected to a substrate, and a conical inductor body is provided on the inner side of the substrate.

[0008] A copper metal layer is provided at the four corners of the bottom end of the substrate, and a tin ball is welded to the bottom end of the copper metal layer. Both ends of the conical inductor body are integrally connected with lead wires, and an adhesive is provided at the inner bottom end of the conical inductor body. The connection between the adhesive and the tin ball is used to fix the conical inductor body to the square housing and the substrate.

[0009] Preferably, one side of the cube shell is hollowed out to form a U shape, the substrate is H-shaped, and the four ends of the substrate are plated with a copper metal layer.

[0010] Preferably, the conical inductor body is connected and fixed to the substrate by adhesive, and the angle between the conical inductor body and the substrate is 30-45 degrees, and the small end of the conical inductor body is close to the bottom of the substrate.

[0011] Preferably, the material of the cube shell and the substrate is any one of alumina ceramics, silicon carbide ceramics, resin, and plastic, and the material of the adhesive is any one of epoxy resin glue, hot melt glue, and UV ultraviolet glue.

[0012] Preferably, the copper metal layer is formed by depositing a metallization slurry onto the end surface of the substrate using other coating methods such as screen printing, spraying, electroplating, physical vapor deposition, and chemical vapor deposition.

[0013] Preferably, the material of the solder ball is tin.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] The utility model ensures that all electronic components are laid out and connected in strict accordance with the design requirements by gluing the conical inductor body to the center of the H-shaped substrate, thereby avoiding problems such as wrong or missed connections, significantly improving the reliability of electronic equipment, meeting the requirements of the mounting process, simplifying the packaging operation process, solving the packaging problem in a small space, and effectively protecting it from interference from the external environment.

[0016] The conical inductor body is placed at the center of the H-shaped substrate using adhesive, securing it at a 30-45° angle to the horizontal. The small end of the conical inductor body is positioned near the bottom of the H-shaped substrate. After the entire conical inductor body is assembled, the housing assembly with the solder ball substrate is soldered to the circuit board, ensuring that the small end of the conical inductor body is close to the circuit board (RF end). This layout design ensures that the high-frequency components in the signal spectrum are primarily supported and transmitted by the small end of the conical inductor body. Furthermore, in high-frequency circuits, maintaining this specific mounting angle optimizes impedance matching, reduces electromagnetic interference, improves thermal performance, and ensures structural stability, helping to enhance the performance and reliability of the conical inductor body in high-frequency circuits.

[0017] The shell components made of alumina ceramics, silicon carbide ceramics, resin or plastic are integrated with angled slopes, which have the characteristics of heat resistance and heat insulation, light weight, good insulation performance, high hardness, not easy to be corroded, and good heat dissipation and shielding properties;

[0018] The package assembly with substrate packaging has good structural stability and strong practicality, and provides a good foundation for subsequent automated mounting production, enabling the conical inductor body to be widely used in large-scale and industrial markets. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the housing packaging structure of the discrete conical inductor of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of the conical inductor of the present invention mounted on an H-shaped substrate;

[0021] Figure 3 This is a schematic diagram of the bottom structure of the housing assembly of the present invention.

[0022] Figure: 1. Cube housing; 2. Substrate; 3. Conical inductor body; 4. Adhesive; 5. Lead wire; 6. Copper metal layer; 7. Solder ball. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0025] like Figure 1-3 As shown, the present application provides a package housing for a discrete conical inductor, comprising: a cube housing 1, a substrate 2 being integrally connected to the bottom end of the cube housing 1, and a conical inductor body 3 being provided inside the substrate 2.

[0026] Specifically, such as Figure 3 As shown, one side of the cube shell 1 is hollowed out to form a U shape, the base plate 2 is H-shaped, and the four ends of the base plate 2 are plated with a copper metal layer 6;

[0027] In this embodiment: the cube shell 1 and the substrate 2 are integrally formed, which facilitates improving the connection tightness between the cube shell 1 and the substrate 2 and improving the protective performance. The metallization slurry is evenly coated on the end face of the substrate 2 and a dense copper metal layer 6 is formed through high-temperature sintering treatment.

[0028] Specifically, such as Figure 2 As shown, the conical inductor body 3 and the substrate 2 are connected and fixed by an adhesive 4, and the angle between the conical inductor body 3 and the substrate 2 is 30-45 degrees, and the small end of the conical inductor body 3 is close to the bottom of the substrate 2;

[0029] In this embodiment, the small end of the conical inductor body 3 is soldered to the circuit board close to the bottom end of the substrate 2. The small end of the conical inductor body 3 is the RF end. This angled layout design ensures that the high-frequency components in the signal spectrum are mainly effectively supported and transmitted by the small end area of ​​the conical inductor.

[0030] Copper metal layer 6, copper metal layer 6 is provided at the four corners of the bottom end of substrate 2,

[0031] Specifically, such as Figure 3 As shown, the copper metal layer 6 is deposited onto the end surface of the substrate 2 by metallization paste using other coating methods such as screen printing, spraying, electroplating, physical vapor deposition, chemical vapor deposition, etc.;

[0032] In this embodiment, the printing method can improve the firmness of the connection between the substrate 2 and the copper metal layer 6, and it is not easy to fall off during use.

[0033] The bottom of the copper metal layer 6 is soldered with a tin ball 7.

[0034] Specifically, such as Figure 3 As shown, the material of the solder ball 7 is tin;

[0035] In this embodiment, tin is easily melted during the welding process and has good affinity with metals such as copper. The welding strength is good during the connection process. When used at room temperature, a tin dioxide protective film is formed on the surface, which is not easily oxidized.

[0036] Both ends of the conical inductor body 3 are integrally connected with lead wires 5, and the inner bottom end of the conical inductor body 3 is provided with adhesive 4.

[0037] Specifically, such as Figure 2 As shown, the material of the cube shell 1 and the base plate 2 is any one of alumina ceramics, silicon carbide ceramics, resin, and plastic, and the material of the adhesive 4 is any one of epoxy resin glue, hot melt glue, and UV ultraviolet glue;

[0038] In this embodiment: the cube shell 1 and the base plate 2 made of alumina ceramics, silicon carbide ceramics, resin or plastic are integrated with angled slopes, which have the characteristics of heat resistance and heat insulation, light weight, good insulation performance, high hardness, not easy to be corroded, and good heat dissipation and shielding properties. The adhesive 4 uses epoxy resin glue, which has strong adhesion to a variety of polar materials, especially materials with high surface activity. The cohesive strength of the epoxy cured material is also very large, which makes its bonding strength very high.

[0039] The connection between the adhesive 4 and the solder ball 7 is used to fix the conical inductor body 3 to the combined frame of the cube housing 1 and the substrate 2;

[0040] In this embodiment, the conical inductor body 3 is glued to the center of the H-shaped substrate 2. Then, lead wires 5 are soldered to both ends of the substrate 2. The other two ends are soldered to the circuit board via solder balls 7. This ensures that all electronic components are laid out and connected in strict accordance with the design requirements. This improves the reliability of the electronic device, meets the requirements of the mounting process, simplifies the packaging process, and enhances the practicality of the conical inductor body 3.

[0041] The specific solution is as follows: first, the conical inductor body (3) is fixed to the center of the H-shaped substrate 2 using adhesive 4, with the small end of the conical inductor body 3 facing downward and close to the bottom of the substrate 2, so that the conical inductor body 3 forms a certain angle with the horizontal plane, and then the pins 5 at both ends of the conical inductor body 3 are pulled to the copper metal layer 6 on the corresponding side, and the pins 5 at both ends of the conical inductor body 3 are spot-welded on the copper metal layer 6 on the opposite end surface of the H-shaped substrate 2, and then the pins 5 are reflow-welded on the H-shaped substrate 2 using the solder paste ball planting process. A hemispherical solder ball 7 is formed on the board 2 (during reflow soldering, the soldering temperature is mainly divided into four temperature stages: preheating stage, constant temperature stage, reflow stage and cooling stage. Among them, the temperature in the preheating stage is from room temperature to 150°C; the temperature in the constant temperature stage is 150°C-200°C; the temperature in the reflow stage is 220°C-249°C; and the temperature in the cooling stage is reduced to 150°C). The package shell assembly composed of the cube shell 1 and the substrate 2 is soldered to the circuit board with the help of the solder layer, thus completing the surface mounting of the conical inductor body 3.

[0042] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative; within the spirit of the present invention, the technical features of the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0043] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A package housing for a discrete conical inductor, comprising: A cube housing (1), wherein the bottom end of the cube housing (1) is integrally connected to a substrate (2), and a conical inductor body (3) is provided on the inner side of the substrate (2), characterized in that: A copper metal layer (6) is provided at the four corners of the bottom end of the substrate (2), and a tin ball (7) is welded to the bottom end of the copper metal layer (6). Both ends of the conical inductor body (3) are integrally connected with lead wires (5), and an adhesive (4) is provided at the inner bottom end of the conical inductor body (3). The connection between the adhesive (4) and the tin ball (7) is used to fix the conical inductor body (3) to the square housing (1) and the substrate (2).

2. The package of a discrete conical inductor according to claim 1, wherein: One side of the cubic shell (1) is hollowed out to form a U-shape, the base plate (2) is H-shaped, and the four end points of the base plate (2) are all plated with a copper metal layer (6).

3. The package of a discrete conical inductor according to claim 1, wherein: The conical inductor body (3) and the substrate (2) are connected and fixed by an adhesive (4), and the angle between the conical inductor body (3) and the substrate (2) is 30-45 degrees, and the small end of the conical inductor body (3) is close to the bottom of the substrate (2).

4. The package of a discrete conical inductor according to claim 1, wherein: The material of the cube shell (1) and the base plate (2) is any one of alumina ceramics, silicon carbide ceramics, resin, and plastic, and the material of the adhesive (4) is any one of epoxy resin glue, hot melt glue, and UV glue.

5. The package of a discrete conical inductor according to claim 1, wherein: The copper metal layer (6) is deposited on the end surface of the substrate (2) by metallization slurry using screen printing, spraying, electroplating, physical vapor deposition, chemical vapor deposition or other coating methods.

6. The package of a discrete conical inductor according to claim 1, wherein: The material of the tin ball (7) is tin.

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