Distributor for Internet of Things monitoring equipment
Through the L-shaped bracket and rubber anti-slip sleeve storage power cord, combined with the design of semiconductor refrigeration plate and cooling fan, the problem of easy drag and distraction of the power cord is solved, and the stable storage of the power cord and efficient cooling of the equipment is achieved.
Patent Information
- Application Number
- CN202422558931.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-10-23
AI Technical Summary
The power cord of existing monitoring equipment is prone to drag due to external influences when used or not, and the power cord is in a scattered state, lacking effective storage solutions.
The L-shaped bracket is used to support the fixed support rod and is fixed to the distributor body by bolts. Combined with the rubber anti-slip sleeve and the Velcro suede hook surface to achieve winding and storage of the power cord; at the same time, a semiconductor refrigeration plate and a cooling fan are used to ensure that the equipment is stable within the normal working temperature range.
Effectively avoid leakage and dragging of power cords, improve anti-slip properties, and ensure stable operation of the equipment through cooling and cooling, which facilitates later maintenance.
Smart Images

Figure CN223309919U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of dispensers for monitoring equipment, and in particular to a dispenser for Internet of Things monitoring equipment. Background Art
[0002] A distributor for IoT monitoring equipment is a device that evenly distributes a video signal source into multiple video signals. It is usually used to simultaneously transmit the video signal of a camera to multiple devices, such as video matrix switchers, hard disk recorders and monitors, in order to achieve real-time monitoring of information.
[0003] The power cord of existing monitoring distributors is generally integrated with the body. The power cord is in a messy state when in use and when not in use, and is easily dragged due to external influences. Therefore, a distributor for Internet of Things monitoring equipment is proposed to facilitate the storage of the power source and avoid it being completely exposed to the outside and easily dragged. Utility Model Content
[0004] In response to the problems in the prior art, the utility model provides a distributor for Internet of Things monitoring equipment to facilitate the storage of line sources and avoid problems such as them being completely exposed and easily dragged.
[0005] The technical solution adopted by the utility model to solve the technical problem is a dispenser for Internet of Things monitoring equipment, comprising a dispenser body, a Velcro velvet surface and a Velcro hook surface, the dispenser body comprising a power cord body, a wiring harness assembly provided on one side of the dispenser body corresponding to the position of the power cord body, the wiring harness assembly comprising an L-shaped bracket, a support rod and an anti-slip sleeve;
[0006] A semiconductor refrigeration plate is provided on the top of the distributor body, and a heat dissipation fan is installed at the center position of the top surface of the semiconductor refrigeration plate through a support block and bolts.
[0007] By adopting the above technical solution, an L-shaped bracket is used to support and fix the support rod, and the L-shaped bracket is used to facilitate fixing to one side of the distributor body by bolts. When the power cord is in use or not in use, the support rod is used to facilitate winding and limiting the storage of the power cord, thereby preventing it from being completely exposed and easily dragged. The anti-slip cover on the outer periphery of the support rod is made of rubber material to increase friction between the power cord and the power cord, thereby improving anti-slip performance.
[0008] At the same time, the semiconductor refrigeration plate is located on the top of the distributor body to cool it down efficiently during use, and the heat dissipation fan is located on the top of the semiconductor refrigeration plate to dissipate heat to ensure that it is stable within the normal operating temperature range. The Velcro velvet surface allows the semiconductor refrigeration plate to be glued or disassembled through the Velcro hook surface, so as to facilitate later maintenance operations such as the semiconductor refrigeration plate and the heat dissipation fan.
[0009] Specifically, the L-shaped bracket is fixed to one side of the distributor body by bolts, the support rod is evenly adhered to the inner side of the L-shaped bracket from left to right, and the anti-slip sleeve is clamped on the outer periphery of the support rod, and the anti-slip sleeve is made of rubber material.
[0010] By adopting the above technical solution, the anti-slip sleeve on the periphery of the support rod is made of rubber material to increase the friction between the support rod and the wire body, thereby improving the anti-slip performance.
[0011] Specifically, Velcro velvet is adhered to the bottoms of the semiconductor refrigeration plates on both sides of the top surface of the dispenser body.
[0012] By adopting the above technical solution, the semiconductor refrigeration plate is located on the top of the dispenser body to efficiently cool it when in use.
[0013] Specifically, Velcro hook surfaces are adhered to the Velcro suede positions on both sides of the bottom of the semiconductor refrigeration piece, which are corresponding to the Velcro suede positions. The semiconductor refrigeration piece is adhered to the Velcro suede through the Velcro hook surfaces.
[0014] By adopting the above technical solution, the Velcro velvet surface is used to facilitate the semiconductor cooling plate to be adhered or disassembled through the Velcro hook surface, so as to facilitate the subsequent maintenance of the semiconductor cooling plate and the cooling fan.
[0015] Specifically, the exhaust end of the heat dissipation fan corresponds to the top of the semiconductor refrigeration plate.
[0016] By adopting the above technical solution, the heat dissipation fan is placed on top of the semiconductor refrigeration plate to dissipate heat, thereby ensuring that it is stable within the normal operating temperature range.
[0017] Beneficial effects of the utility model:
[0018] (1) The utility model discloses a distributor for Internet of Things monitoring equipment, which is supported by an L-shaped bracket and fixed to one side of the distributor body by bolts. When the power cord is in use or not in use, the support rod is used to wrap the power cord around and limit the storage, so as to avoid the power cord being completely exposed and easily dragged. The anti-slip sleeve on the outer periphery of the support rod is made of rubber material to increase the friction between the power cord and the body, thereby improving the anti-slip performance.
[0019] (2) The utility model describes a dispenser for Internet of Things monitoring equipment, which efficiently cools down the device during use by placing a semiconductor cooling plate on the top of the dispenser body, and dissipates heat by placing a cooling fan on the top of the semiconductor cooling plate to ensure that the device is stable within the normal operating temperature range, and the semiconductor cooling plate can be easily attached or detached by the Velcro hook surface through the Velcro hook surface, so as to facilitate the maintenance of the semiconductor cooling plate and the cooling fan at a later time. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0021] Figure 1 It is an overall schematic diagram of the utility model;
[0022] Figure 2 This is a schematic diagram of the Velcro suede surface of the utility model;
[0023] Figure 3 This is a schematic diagram of the hook surface of the Velcro of the present invention;
[0024] In the figure: 1. Distributor body; 2. Power cord; 3. Cable harness assembly; 301. L-shaped bracket; 302. Support rod; 303. Anti-slip cover; 4. Semiconductor cooling plate; 5. Cooling fan; 6. Velcro suede surface; 7. Velcro hook surface. DETAILED DESCRIPTION
[0025] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.
[0026] In order to avoid problems such as dragging of the line source due to external influences, such as Figure 1-3 As shown, the present invention discloses a dispenser for IoT monitoring equipment, comprising a dispenser body 1, a Velcro velvet surface 6, and a Velcro hook surface 7. The dispenser body 1 includes a power cord 2. A harness assembly 3 is provided on one side of the dispenser body 1 corresponding to the power cord 2. The harness assembly 3 includes an L-shaped bracket 301, a support rod 302, and an anti-slip sleeve 303.
[0027] A semiconductor cooling plate 4 is provided on the top of the distributor body 1 , and a cooling fan 5 is mounted on the center of the top surface of the semiconductor cooling plate 4 through a support block and bolts.
[0028] When in use, the L-shaped bracket 301 supports and fixes the support rod 302, and the L-shaped bracket 301 is used to fix it to one side of the dispenser body 1 by bolts. When the power cord 2 is in use or not in use, the support rod 302 allows the power cord 2 to be wrapped around and stored in a limited position to prevent it from being completely exposed and easily dragged. The anti-slip cover 303 on the outer periphery of the support rod 302 is made of rubber material to increase friction between the power cord and the power cord, thereby improving anti-slip performance.
[0029] At the same time, the semiconductor refrigeration plate 4 is located on the top of the dispenser body 1 to efficiently cool it when in use, and the heat dissipation fan 5 is located on the top of the semiconductor refrigeration plate 4 to dissipate heat to ensure that it is stable within the normal operating temperature range, and the Velcro velvet surface 6 allows the semiconductor refrigeration plate 4 to be glued or disassembled through the Velcro hook surface 7, so as to facilitate later maintenance operations on the semiconductor refrigeration plate 4 and the heat dissipation fan 5.
[0030] In order to avoid problems such as dragging of the line source due to external influences, for example, Figure 1 、 Figure 2 As shown, the present invention also includes that the L-shaped bracket 301 is fixed to one side of the dispenser body 1 by bolts, the support rod 302 is evenly adhered to the inner side of the L-shaped bracket 301 from left to right, and the anti-slip sleeve 303 is clamped on the outer periphery of the support rod 302, and the anti-slip sleeve 303 is made of rubber material.
[0031] During use, the anti-slip cover 303 on the outer periphery of the support rod 302 is made of rubber material to increase friction with the wire body, thereby improving anti-slip performance.
[0032] For example, Figure 1 、 Figure 2 、 Figure 3 As shown, the present invention also includes that Velcro velvet surfaces 6 are adhered to the bottoms of the semiconductor cooling sheets 4 on both sides of the top surface of the dispenser body 1 .
[0033] When in use, the semiconductor refrigeration plate 4 is located on the top of the dispenser body 1 to efficiently cool it down.
[0034] For example, Figure 1 、 Figure 2 、 Figure 3 As shown, the utility model also includes that Velcro hook surfaces 7 are adhered to the positions of the Velcro velvet surface 6 on both sides of the bottom of the semiconductor refrigeration plate 4, and the semiconductor refrigeration plate 4 is adhered to the Velcro velvet surface 6 through the Velcro hook surfaces 7.
[0035] When in use, the semiconductor cooling sheet 4 can be attached or separated by the Velcro hook surface 7 through the Velcro velvet surface 6, so as to facilitate maintenance and other operations on the semiconductor cooling sheet 4 and the cooling fan 5 in the future.
[0036] For example, Figure 1 、 Figure 3 As shown, the utility model also includes that the exhaust end of the heat dissipation fan 5 corresponds to the top of the semiconductor refrigeration plate 4.
[0037] When in use, the heat dissipation fan 5 is located on top of the semiconductor cooling plate 4 to dissipate heat therefrom, so as to ensure that the semiconductor cooling plate 4 is stable within the normal operating temperature range.
[0038] When the utility model is in use, the L-shaped bracket 301 supports and fixes the support rod 302, and the L-shaped bracket 301 is conveniently fixed to one side of the dispenser body 1 by bolts. When the power cord 2 is in use or not in use, the support rod 302 is convenient for winding and limiting the storage of the power cord 2, so as to prevent it from being completely exposed and easily dragged. The anti-slip cover 303 on the outer periphery of the support rod 302 is made of rubber material to increase the friction between the power cord and the power cord, thereby improving the anti-slip performance.
[0039] At the same time, the semiconductor refrigeration plate 4 is located on the top of the dispenser body 1 to efficiently cool it when in use, and the heat dissipation fan 5 is located on the top of the semiconductor refrigeration plate 4 to dissipate heat to ensure that it is stable within the normal operating temperature range, and the Velcro velvet surface 6 allows the semiconductor refrigeration plate 4 to be glued or disassembled through the Velcro hook surface 7, so as to facilitate later maintenance operations on the semiconductor refrigeration plate 4 and the heat dissipation fan 5.
[0040] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.
Claims
1. A dispenser for Internet of Things monitoring equipment, characterized in that: The invention comprises a dispenser body (1), a Velcro velvet surface (6) and a Velcro hook surface (7), wherein the dispenser body (1) comprises a power cord body (2), a wiring assembly (3) is provided on one side of the dispenser body (1) at a position corresponding to the power cord body (2), and the wiring assembly (3) comprises an L-shaped bracket (301), a support rod (302) and an anti-slip sleeve (303); A semiconductor cooling plate (4) is provided on the top of the distributor body (1), and a cooling fan (5) is installed at the center of the top surface of the semiconductor cooling plate (4) via a support block and bolts.
2. The dispenser for Internet of Things monitoring equipment according to claim 1, characterized in that: The L-shaped bracket (301) is fixed to one side of the dispenser body (1) by means of bolts, the support rod (302) is evenly adhered to the inner side of the L-shaped bracket (301) from left to right, and the anti-slip sleeve (303) is clamped on the outer periphery of the support rod (302), and the anti-slip sleeve (303) is made of rubber material.
3. The dispenser for Internet of Things monitoring equipment according to claim 1, characterized in that: Velcro velvet surfaces (6) are adhered to the bottoms of the semiconductor cooling sheets (4) on both sides of the top surface of the dispenser body (1).
4. The dispenser for Internet of Things monitoring equipment according to claim 1, characterized in that: Velcro hook surfaces (7) are adhered to positions corresponding to the Velcro velvet surface (6) on both sides of the bottom of the semiconductor refrigeration sheet (4), and the semiconductor refrigeration sheet (4) is adhered to the Velcro velvet surface (6) via the Velcro hook surfaces (7).
5. The dispenser for Internet of Things monitoring equipment according to claim 1, characterized in that: The exhaust end of the heat dissipation fan (5) corresponds to the top of the semiconductor refrigeration plate (4).