Air cooling auxiliary heat dissipation device for large and medium-sized liquid cooling data center

Abstract

The utility model discloses an air cooling auxiliary heat dissipation device for a large and medium-sized liquid cooling data center, which belongs to the heat dissipation field of the liquid cooling data center, and comprises an inter-column air conditioner and an air guide pipe, the air guide pipe comprises a pipe body, and an inlet end and an outlet end positioned at two ends of the pipe body; the air guide pipe is arranged in the hot channel of the micro module, the inlet end of the air guide pipe is arranged in the hot channel of the direct current cabinet side of the micro module, and the outlet end of the air guide pipe is arranged at the exhaust inlet of the inter-column air conditioner. The special air guide pipe is designed to connect the heat accumulation position with the air suction opening of the precise air conditioner in the whole machine module, so that the hot air transfer efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation of liquid-cooled data centers, and in particular to an air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers. Background Art

[0002] In large and medium-sized liquid-cooled data centers, the vast majority of heat within liquid-cooled server cabinets is removed from the cabinets by various liquid cooling systems. However, since some components or devices within the liquid-cooled servers and their supporting systems cannot be cooled by the liquid cooling system, a small number of in-row air conditioners are typically deployed within the liquid-cooled server cluster to provide supplemental air cooling. However, it should be noted that due to the low density of in-row air conditioners within a liquid-cooled server cluster, heat accumulation may occur in certain areas of the cluster.

[0003] In large and medium-sized liquid-cooled data centers, most of the heat inside the liquid-cooled server cabinets is removed from the cabinets by various forms of liquid cooling systems. At the same time, since there are still a few components or equipment inside the liquid-cooled servers and their supporting systems that cannot be cooled by the liquid cooling system, a small number of inter-row air conditioners are usually deployed in the liquid-cooled server cluster to achieve auxiliary heat dissipation with air cooling. The structure is as follows: Figure 1 shown.

[0004] exist Figure 1 Because the DC cabinets at both ends of this liquid-cooled computing cluster are located far from the inter-row air conditioners, a heat accumulation area may form at the rear of the DC cabinet during the actual operation of the entire system. If the heat in this area cannot be effectively discharged for a long time, it may have an adverse impact on the safe operation of related equipment. Specifically, if this heat accumulation is not discharged in a timely and effective manner, it may cause the equipment in the DC cabinet to overheat, thereby affecting the safe operation of the equipment and the stability of the entire system. Overheating may not only cause equipment failure and shorten its service life, but may also lead to service interruptions in the data center and cause economic losses. Therefore, in the design and operation of liquid-cooled data centers, how to optimize the synergy between liquid cooling and air cooling has become an important issue that needs to be addressed urgently.

[0005] An effective thermal management strategy requires a comprehensive consideration of the advantages and disadvantages of both liquid and air cooling systems. Liquid cooling, with its efficient heat transfer properties, quickly transfers heat from heat-generating components to the cooling medium, achieving lower operating temperatures. However, since some components cannot rely solely on liquid cooling for heat dissipation, supplementary air cooling becomes particularly important. In this context, designers must carefully plan the location, quantity, and performance of inter-row air conditioners to ensure coverage of all areas where heat accumulation is likely.

[0006] Furthermore, the integrated design of existing liquid and air cooling systems fails to fully account for the dynamic changes in local heat distribution and the thermal load characteristics of equipment. This deficiency can result in insufficient heat dissipation in some areas, while others may be overcooled, resulting in energy waste. Therefore, optimizing the system layout is crucial. This may include reconfiguring equipment location, introducing intelligent temperature monitoring and management systems, and more flexible adjustment of inter-row air conditioning to adapt to real-time load fluctuations.

[0007] Furthermore, equipment selection should also focus on thermal management capabilities, choosing high-efficiency components that effectively dissipate heat to reduce reliance on auxiliary air cooling systems. Innovation in thermal management strategies is also crucial, such as the introduction of advanced heat pipe technology or phase change materials. These new materials can rapidly absorb and release heat under specific conditions, improving heat distribution and dissipation.

[0008] To improve the cooling efficiency of liquid-cooled data centers and mitigate the potential risks of heat concentration, comprehensively considering the synergy between liquid and air cooling, and optimizing system design, layout, equipment selection, and thermal management strategies, have become key to enhancing data center performance and reliability. Through these innovations and improvements, future data centers will be able to maintain high efficiency while ensuring safe equipment operation and system stability.

[0009] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility Model Content

[0010] In order to solve the problems of the prior art, the present invention provides an air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers. The technical solution is as follows:

[0011] An air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers is used in micromodules of large and medium-sized liquid-cooled data centers. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers includes: an inter-row air conditioner and an air duct, the air duct including a tube body and an inlet end and an outlet end located at both ends of the tube body; the air duct is arranged in the heat channel of the micromodule, the inlet end of the air duct is arranged in the heat channel on the DC cabinet side of the micromodule, and the outlet end of the air duct is arranged at the air intake of the inter-row air conditioner.

[0012] Furthermore, the cross section of the tube body is rectangular, and the cross sections of the inlet end and the outlet end are also rectangular structures.

[0013] Furthermore, the axial direction of the inlet end is 90 degrees to the axial direction of the tube body.

[0014] Furthermore, a transition channel is provided between the tube body and the outlet end, which is angled at 45 degrees relative to the tube body.

[0015] Furthermore, the air guide pipe is made of stainless steel.

[0016] Furthermore, the air duct is arranged at the top of the heat channel.

[0017] Furthermore, the transition channel is connected to the tube body and the outlet end by a bend with a large curvature radius, and the curvature radius of the bend is not less than 1.5-2 times the side length of the tube body.

[0018] Furthermore, the curvature radius of the curved pipe is not less than 1.7 times the side length of the pipe body.

[0019] Furthermore, the inner wall of the air duct is polished to have a surface roughness of Ra0.8-Ra1.6 μm.

[0020] Furthermore, the inner wall of the air duct is provided with a Teflon coating.

[0021] The beneficial effect of the technical solution provided by the embodiment of the present utility model is: by designing a special air duct to connect the heat accumulation position with the air intake of the precision air conditioner inside the whole machine module, the hot air transfer efficiency is accelerated, thereby reducing the temperature of the local heat accumulation area by 2 to 5°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of an air-cooled auxiliary heat dissipation device in the prior art;

[0024] Figure 2 This is a top view of an air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers provided by an embodiment of the present utility model;

[0025] Figure 3 yes Figure 2 A rear side schematic diagram of an air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers. DETAILED DESCRIPTION

[0026] The specific implementation of the present invention will be described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific implementation.

[0027] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising", etc., will be understood to include the stated elements or components but not to exclude other elements or other components.

[0028] like Figure 2 As shown, according to one embodiment of the present invention, an air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers is mainly used in micromodules of large and medium-sized liquid-cooled data centers. The air-cooled auxiliary heat dissipation device includes an inter-row air conditioner 3 and an air duct 6.

[0029] The micromodule includes DC cabinet 1, liquid-cooled cabinet 2, liquid-cooled cabinet 2, inter-row air conditioner 3, liquid-cooled cabinet 2, liquid-cooled cabinet 2, inter-row air conditioner 3, liquid-cooled cabinet 2, liquid-cooled cabinet 2, and DC cabinet 1, which are connected in sequence.

[0030] The front side of the micromodule is the cold aisle 4, which is used to transport the cold air output by the inter-row air conditioner 3 to the DC cabinet 1; the rear side of the micromodule is the hot aisle 5, which is used to transport the hot air generated by the DC cabinet 1 to the input port of the inter-row air conditioner 3. The equipment in the data center is cooled by air through the circulation of cold and hot air.

[0031] An air duct 6 is provided in the hot channel 5 , wherein the inlet end 601 of the air duct 6 is provided in the hot channel 5 on the DC cabinet 1 side, and the outlet end 603 of the air duct 6 is provided at the air intake of the inter-row air conditioner 3 , for directly transporting the hot air from the DC cabinet 1 to the inter-row air conditioner 3 .

[0032] To effectively draw heat from the remote heat accumulation area into the inter-row air conditioner, the air duct 6 includes an inlet end 601, a tube body 602, and an outlet end 603. The inlet end 601 and the outlet end 603 are connected to the ends of the tube body 602, respectively. The cross-section of the tube body 602 is rectangular, facilitating fixed installation in the hot aisle 5. The cross-sections of the inlet end 601 and the outlet end 603 of the air duct 6 are also rectangular. The rectangular structure of the inlet end 601 is identical to the rectangular structure of the air intake of the inter-row air conditioner 3, facilitating connection to the air intake of the inter-row air conditioner 3.

[0033] The rectangular shape of tube body 602 better adapts to the spatial configuration of hot aisle 5, facilitating stable installation. Compared to other shapes, rectangular tube bodies can fit more closely to the walls or other supporting structures of hot aisle 5 during installation, not only reducing installation difficulty but also minimizing the risk of heat leakage or poor heat transfer due to spatial mismatch.

[0034] The axial direction of the inlet end 601 is 90 degrees off from the axial direction of the tube body 602, rotating the hot air transmission path and allowing it to enter the inter-row air conditioner 3. A transition channel, angled 45 degrees relative to the tube body 602, is provided between the tube body 602 and the outlet end 603. This transition channel allows the tube body 602 of the air duct to be fixed to the top of the hot aisle 5, facilitating installation and fixation.

[0035] The connection between the transition channel and the pipe body 602 and the inlet end 601 uses a bend with a large curvature radius to change the direction of the air guide pipe. Specifically, the curvature radius of the bend is required to be no less than 1.5-2 times the diameter of the air duct, preferably 1.7 times.

[0036] The inlet 601 and outlet 603 are trumpet-shaped, with the central tube 602 having a parabolic gradient. This streamlined, gradual shape allows air to gradually accelerate or decelerate, reducing resistance to airflow. Specifically, the inlet 601 and outlet 603 employ a gradual transition, with the transition length typically being 3-5 times the difference in tube diameter before and after the change.

[0037] Figure 3 The figure shows the rear structure of the micromodule, where the air duct 6 is located at the top of the hot aisle 5 and is fixedly connected to the internal structure of the micromodule's hot aisle 5. Specifically, the air duct 6 is fixedly connected to the top plate of the hot aisle 5 and the cabinet columns on the back of the cabinet using self-drilling screws.

[0038] The outlet end of the air duct 6 faces the air intake port of the row air conditioner 3 , and the inlet end is located in the heat accumulation area at the rear of the DC cabinet 1 .

[0039] Since the density of hot air is lower than that of cold air, arranging the air duct 6 at the top of the hot channel 5 can more effectively absorb the hot air and perform heat dissipation operations.

[0040] The air duct 6 is made of stainless steel, which is strong, durable and not easy to deform. The structural design should consider reducing wind resistance as much as possible and be compatible with the internal structure of the cabinet of the micro module.

[0041] Specifically, the inner wall of the air duct 6 is polished to reduce its roughness, thereby reducing friction during air flow. Preferably, by high-precision polishing the inner wall of the stainless steel air duct to a surface roughness of Ra0.8-Ra1.6μm, wind resistance can be reduced by approximately 10%-15% compared to an untreated ordinary air duct.

[0042] In addition, a coating with a low friction coefficient, such as a Teflon coating, can be applied to the inner wall of the air duct. These coatings can form a lubricating film between the air and the pipe wall, further reducing frictional resistance. The presence of the coating not only reduces wind resistance, but also facilitates cleaning and maintenance of the air duct. Through the air duct 6 of the present application, the hot air gathered at the rear of the DC cabinet can be more efficiently sucked into the inter-row air conditioner 3 through the special air duct 6, thereby reducing the temperature of the local heat accumulation area by 2 to 5°C, ensuring that the entire computing cluster can operate stably under appropriate temperature conditions.

[0043] Those skilled in the art will appreciate that all or part of the steps in implementing the above embodiments can be accomplished by hardware or by hardware associated with program instructions. This means that the technical solutions described above are flexible and adaptable and can be adjusted to suit different application requirements and implementation environments. Specifically, the programs may include algorithms, control logic, and data processing flows, which may be stored in a computer-readable storage medium.

[0044] The aforementioned storage media can take various forms, including but not limited to read-only memory (ROM), random-access memory (RAM), flash memory, disk drives, and optical disks. Read-only memory is typically used to store immutable data or program code, ensuring that critical system functions and data remain available after a power outage or reboot. Disks and optical disks are suitable for storing and managing large amounts of data, supporting more complex applications and the processing of diverse data types.

[0045] This design enhances the system's scalability and update capabilities. For example, as technology advances or user needs change, new features can be implemented or existing processes optimized by updating the program stored in the storage media without requiring a large-scale hardware replacement. This flexibility allows the system to better adapt to future development trends and reduces maintenance and upgrade costs.

[0046] The foregoing description is merely a preferred embodiment of the present invention and does not limit its scope. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention. Specifically, such modifications and improvements may involve different hardware configurations, software implementations, storage media selections, etc. As long as they do not deviate from the core concept and purpose of the present invention, they shall be considered to be within the scope of protection.

Claims

1. An air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers, used in micromodules of large and medium-sized liquid-cooled data centers, characterized in that: The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers includes: an inter-row air conditioner and an air duct, the air duct including a tube body and an inlet end and an outlet end located at both ends of the tube body; the air duct is arranged in the heat channel of the micromodule, the inlet end of the air duct is arranged in the heat channel on the DC cabinet side of the micromodule, and the outlet end of the air duct is arranged at the air intake of the inter-row air conditioner.

2. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 1, characterized in that: The cross section of the tube body is rectangular, and the cross sections of the inlet end and the outlet end are also rectangular structures.

3. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 1, characterized in that: The axial direction of the inlet end is 90 degrees to the axial direction of the tube body.

4. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 1, characterized in that: A transition channel is provided between the tube body and the outlet end and is angled at 45 degrees relative to the tube body.

5. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 1, characterized in that: The air guide pipe is made of stainless steel.

6. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 1, characterized in that: The air guide duct is arranged at the top of the hot channel.

7. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 4, characterized in that: The transition channel is connected to the pipe body and the outlet end by a bend with a large curvature radius, and the curvature radius of the bend is not less than 1.5-2 times the side length of the pipe body.

8. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 7, characterized in that: The curvature radius of the curved pipe is not less than 1.7 times the side length of the pipe body.

9. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 1, characterized in that: The inner wall of the air duct is polished to have a surface roughness of Ra0.8-Ra1.6 μm.

10. The air-cooled auxiliary heat dissipation device for large and medium-sized liquid-cooled data centers according to claim 1, characterized in that: The inner wall of the air guide pipe is provided with a Teflon coating.

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