Semiconductor laser hair removal therapeutic instrument treatment head
By using a flexible vacuum-assisted kit and deformable ribs in the treatment head of a semiconductor laser hair removal device, the problem of the treatment head fitting well on small areas is solved, effective vacuum sealing of areas of different shapes is achieved, and the treatment effect is guaranteed.
Patent Information
- Application Number
- CN202422805761.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-11-18
AI Technical Summary
When treating smaller areas such as the jaw or fingers, the treatment head of existing semiconductor laser hair removal devices has difficulty in adhering to the skin, resulting in a poor vacuum environment and affecting the treatment effect.
A semiconductor laser hair removal treatment device treatment head is designed. It adopts a vacuum-assisted kit made of flexible airtight material and equipped with deformable ribs. The size and shape of the cavity of the vacuum-assisted kit can be adjusted by the deformation of the ribs to achieve a sealed fit for different areas.
When treating areas of different sizes, it can maintain the airtightness of the vacuum environment, ensuring that the treatment effect is not affected and adapting to areas to be removed of different shapes.
Smart Images

Figure CN223311241U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field related to laser treatment, in particular to a treatment head of a semiconductor laser hair removal treatment device. Background Art
[0002] Laser hair removal is a method based on selective photothermal effect, using melanin as the target color base to convert laser energy into thermal energy, thereby selectively destroying hair follicles to achieve the purpose of hair removal.
[0003] The laser hair removal devices used in the prior art all require professional operators to select a fixed point or sliding mode, and the handheld laser treatment head is evenly and repeatedly contacted with the patient's target hair removal area to achieve the treatment effect.
[0004] The existing semiconductor laser hair removal treatment device treatment head comprises a concave cavity type treatment head body (1), the cavity bottom of the treatment head body (1) is provided with a tip window (2) for transmitting light from a laser source, the cavity bottom of the treatment head body (1) is provided with a vacuum extraction pipeline connected to a vacuum pump, the treatment head body (1) is provided with an auxiliary plug-in (3) for contacting a part to be treated, the auxiliary plug-in (3) is a concave cavity type matching the inner cavity of the treatment head body (1), the cavity opening of the auxiliary plug-in (3) is provided with a flange (301) for contacting the part to be treated, and the cavity bottom of the auxiliary plug-in (3) is provided with a vacuum connector (302) connected to the vacuum extraction pipeline. When in use, the operator holds the treatment head, places the auxiliary plug-in (3) on the part to be depilated, turns on the treatment device, and achieves the effect of hair removal by combining laser with vacuum. When the part to be depilated is a large part, the existing treatment head can well fit the skin, realize a vacuum environment, and achieve the purpose of treatment. However, when the part to be depilated is the mandible (chin), fingers, etc., the auxiliary plug-in (3) of the existing treatment head cannot be fitted with the fingers or mandible, thereby failing to ensure a vacuum environment and achieving the purpose of depilation. Utility Model Content
[0005] The utility model aims to provide a semiconductor laser hair removal treatment device treatment head, which can well fit the treatment head and the part to be hair removed and ensure a vacuum environment.
[0006] To this end, the present invention adopts the following technical solution: a treatment head for a semiconductor laser hair removal therapeutic device, comprising a concave treatment head body, the bottom of the cavity of the treatment head body being provided with a tip window for transmitting light from a laser source, the bottom of the cavity of the treatment head body being provided with two vacuum extraction pipes connected to a vacuum pump, the treatment head body being provided with an auxiliary plug for contacting a treated area, the auxiliary plug being concave and matching the inner cavity of the treatment head body, the cavity opening of the auxiliary plug being provided with a flange for contacting the treated area, the cavity bottom of the auxiliary plug being provided with a vacuum connector connected to the vacuum extraction pipe, the auxiliary plug being provided with a vacuum auxiliary sleeve matching the inner cavity of the auxiliary plug, the auxiliary plug being made of a flexible and airtight material, the inner end of the vacuum auxiliary sleeve being fixed to the inner wall of the auxiliary plug, the cavity opening of the vacuum auxiliary sleeve being provided with a flexible fixed edge matching the flange, and ribs being provided on each of the four fixed edges to enable folding and deformation of the fixed edges, the ribs forming a ring, and the size and shape of the cavity opening of the vacuum auxiliary sleeve being adjusted by deformation of the ribs.
[0007] As a preferred embodiment of the above solution, the vacuum assist kit is made of rubber.
[0008] More preferably, the ribs are flat and are metal strips or polyolefin resin strips.
[0009] Further preferably, the outer periphery of the flange of the auxiliary plug-in is rounded.
[0010] Further preferably, a conduction groove aligned with the tip window is provided on the outer side of the cavity bottom of the auxiliary plug-in, and the conduction groove is provided between the two vacuum connectors.
[0011] Further preferably, the inner end of the vacuum assisting kit extends to around the cavity bottom of the auxiliary plug-in, or the inner end of the vacuum assisting kit is only fixed to a position of the inner wall of the auxiliary plug-in close to the cavity opening.
[0012] The beneficial effects of the present invention are as follows: By providing a vacuum-assisted kit, the present invention does not deform when treating a larger area, and can cooperate with the flange of the auxiliary plug-in to act as a sealing ring, thereby ensuring a vacuum-sealed environment. When treating a smaller area, the ribs (similar to the nose bridge ribs of a mask) can be deformed, and the vacuum-assisted kit can be used to wrap around the smaller area, thereby ensuring a vacuum environment without affecting the treatment effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a structural diagram of the treatment head body and the auxiliary plug-in unit in the utility model.
[0014] Figure 2 It is a structural diagram of the auxiliary plug-in and the vacuum auxiliary kit in the utility model. DETAILED DESCRIPTION
[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0016] like Figure 1-2 As shown, a semiconductor laser hair removal treatment device treatment head includes a concave cavity treatment head body 1, the cavity bottom of the treatment head body 1 is provided with a tip window 2 for transmitting light from a laser source, the cavity bottom of the treatment head body 1 is provided with two vacuum extraction pipes connected to a vacuum pump, and the treatment head body 1 is provided with an auxiliary plug-in 3 for contacting the part to be treated. The auxiliary plug-in 3 is a concave cavity matching the inner cavity of the treatment head body 1, and the cavity opening of the auxiliary plug-in 3 is provided with a flange 301 for contacting the part to be treated. The cavity bottom of the auxiliary plug-in 3 is provided with a vacuum extraction pipe. The auxiliary plug-in 3 is provided with a vacuum auxiliary kit 4 that matches the inner cavity of the auxiliary plug-in 3. The auxiliary plug-in 3 is made of a flexible and airtight material. The inner end of the vacuum auxiliary kit 4 is fixed to the inner wall of the auxiliary plug-in 3. The cavity of the vacuum auxiliary kit 4 is provided with a flexible fixed edge 401 that matches the flange 301. Ribs 5 that can fold and deform the fixed edges 401 are respectively provided in the four fixed edges 401. The ribs 5 are arranged in a ring shape. The size and shape of the cavity of the vacuum auxiliary kit 4 are adjusted by the deformation of the ribs 5. The function of the ribs 5 is similar to the nose bridge ribs of a mask. The material of the ribs 5 is such that it will not automatically recover after being folded and deformed, and manual force is required to fold and deform it again.
[0017] The vacuum assist kit 4 is made of rubber. Rubber has high elasticity, high tensile strength, good tear resistance and wear resistance, good processability, is easy to bond with other materials, generates little heat when deformed, and has excellent airtightness, waterproofness, electrical insulation, and thermal insulation properties.
[0018] The ribs 5 are flat and made of metal or polyolefin resin. They should have low shrinkage and good dimensional stability, low elasticity, good hardness, excellent tensile strength, good impact strength, good temperature resistance, and good extrusion performance.
[0019] The outer periphery of the flange 301 of the auxiliary plug-in 3 is rounded to prevent the sharp part of the flange 301 from causing harm to the human body.
[0020] A conductive groove 303 aligned with the tip window 2 is provided on the outside of the cavity bottom of the auxiliary plug 3, and the conductive groove 303 is provided between the two vacuum connectors 302. The light from the laser source transmitted to the tip window 2 is transmitted out through the conductive groove 303.
[0021] The inner end of the vacuum assisting sleeve 4 extends to the periphery of the cavity bottom of the auxiliary plug 3, or the inner end of the vacuum assisting sleeve 4 is only fixed to the inner wall of the auxiliary plug 3 near the cavity opening. As long as the auxiliary plug 33 and the vacuum assisting sleeve 44 can be sealed and leak-proof, it will be fine.
[0022] The present invention provides a vacuum assisting kit 4. When treating a larger area, the vacuum assisting kit 4 does not deform and can cooperate with the flange 301 of the auxiliary plug 3 to act as a sealing ring, ensuring a vacuum-tight environment. When treating a smaller area, the ribs 5 (which deform similarly to the nose bridge ribs of a mask) can be used to wrap the smaller area with the vacuum assisting kit 4, thereby ensuring a vacuum environment without affecting the treatment effect.
[0023] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A semiconductor laser hair removal treatment device treatment head, comprising a concave cavity treatment head body (1), the cavity bottom of the treatment head body (1) is provided with a tip window (2) for transmitting light from a laser source, the cavity bottom of the treatment head body (1) is provided with two vacuum extraction pipes connected to a vacuum pump, the treatment head body (1) is provided with an auxiliary plug-in (3) for contacting a part to be treated, the auxiliary plug-in (3) is a concave cavity matching the inner cavity of the treatment head body (1), the cavity opening of the auxiliary plug-in (3) is provided with a flange (301) for contacting the part to be treated, and the cavity bottom of the auxiliary plug-in (3) is provided with a vacuum connector (302) connected to the vacuum extraction pipe, characterized in that: The auxiliary plug-in (3) is provided with a vacuum auxiliary kit (4) matching the inner cavity of the auxiliary plug-in (3); the auxiliary plug-in (3) is made of a flexible and airtight material; the inner end of the vacuum auxiliary kit (4) is fixed to the inner wall of the auxiliary plug-in (3); the cavity of the vacuum auxiliary kit (4) is provided with a flexible fixed edge (401) matching the flange (301); ribs (5) capable of folding and deforming the fixed edge (401) are respectively provided in the fixed edges (401) on all sides; the ribs (5) on all sides form a ring; and the size and shape of the cavity of the vacuum auxiliary kit (4) are adjusted by the deformation of the ribs (5).
2. The semiconductor laser hair removal treatment device treatment head according to claim 1, characterized in that: The vacuum assist kit (4) is made of rubber.
3. The semiconductor laser hair removal treatment device treatment head according to claim 1 or 2, characterized in that: The ribs (5) are flat and are metal strips or polyolefin resin strips.
4. The semiconductor laser hair removal treatment device treatment head according to claim 3, characterized in that: The outer periphery of the flange (301) of the auxiliary plug-in unit (3) is rounded.
5. The semiconductor laser hair removal treatment device treatment head according to claim 1, characterized in that: A conduction groove (303) aligned with the tip window (2) is provided on the outer side of the cavity bottom of the auxiliary plug-in (3), and the conduction groove (303) is provided between two vacuum connectors (302).
6. The semiconductor laser hair removal treatment device treatment head according to claim 1, characterized in that: The inner end of the vacuum auxiliary kit (4) extends to the periphery of the cavity bottom of the auxiliary plug-in unit (3), or the inner end of the vacuum auxiliary kit (4) is only fixed to a position of the inner wall of the auxiliary plug-in unit (3) close to the cavity opening.