Semiconductor glue spraying device
By adopting a combination of a nozzle, a displacement structure and a plate structure in a semiconductor spray device, the problem of difficult control of the spraying area is solved, precise control of the spraying operation is achieved, and the electroplating quality is improved.
Patent Information
- Application Number
- CN202422502514.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-10-16
AI Technical Summary
In existing semiconductor spray glue technology, the spraying area is difficult to accurately control, causing glue to splash onto the pins, affecting the electroplating quality, and the residual glue is difficult to remove.
A semiconductor glue spraying device consisting of a nozzle, a first displacement structure, a second displacement structure, a lead frame, a track structure and a plate structure is used. By controlling the movement of the nozzle and adjusting the position of the plate structure, glue is prevented from splashing onto the external pins, thereby achieving precise control of the spraying area.
The precise control of the spraying area during the glue spraying operation is achieved, which avoids the pin electroplating quality being affected by the glue and improves the stability of product quality.
Smart Images
Figure CN223312351U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of semiconductor technology, and in particular to a semiconductor glue spraying device. Background Art
[0002] Spray glue technology is a process that uses a spraying device to evenly distribute glue on a specified surface. This technology effectively enhances the adhesion between the frame and the plastic package while ensuring uniformity, reducing the possibility of delamination caused by various factors.
[0003] In current semiconductor packaging processes, internal delamination of components is a significant quality defect. During the packaging process, the non-hermetic lead frame plastic package easily absorbs moisture from the air. When the plastic package undergoes high-temperature processing during reflow or wave soldering, the internal vapor pressure increases. In certain circumstances, this internal pressure can cause delamination within the package. Severe delamination can lead to electrical failure.
[0004] However, existing glue spraying methods present difficulties in controlling the spraying area. Specifically, glue easily splashes onto the pins, making it difficult to completely remove before electroplating. Residual glue can interfere with the uniform distribution of the coating, thus affecting product quality. Therefore, achieving precise control of the spraying area during glue spraying is a critical issue. Utility Model Content
[0005] The purpose of the embodiments of the present application is to provide a semiconductor glue spraying device that can achieve precise control of the spraying area during the glue spraying operation.
[0006] To solve the above technical problems, the embodiments of the present application provide a semiconductor glue spraying device, which includes a nozzle, a first displacement structure, a second displacement structure, a lead frame, a track structure, and a plate structure. The nozzle is connected to the second displacement structure, which is connected to the first displacement structure. The first displacement structure is used to control the nozzle to move horizontally, and the second displacement structure is used to control the nozzle to move vertically. The lead frame includes a packaging portion and external pins, and the nozzle is used to spray glue on the packaging portion. The track structure includes a first track and a second track. The lead frame is fixedly arranged between the first track and the second track, with the first track close to the packaging portion and the second track connected to the external pins. The plate structure is arranged between the nozzle and the lead frame.
[0007] The semiconductor glue spraying device provided in the embodiments of the present application addresses the problem of being unable to precisely control the spraying area during glue spraying operations. The device comprises a nozzle, a first displacement structure, a second displacement structure, a lead frame, a track structure, and a plate-like structure. The nozzle movement is controlled by the first and second displacement structures, and the plate-like structure is movably positioned between the lead frame and the nozzle. The position of the plate-like structure is adjusted according to actual conditions to prevent glue from splashing onto the external pins. This allows precise control of the spraying area during glue spraying operations, preventing the quality of the pin electroplating from being affected by the glue.
[0008] In some embodiments, the plate-like structure is disposed between the first rail and the second rail, and the plate-like structure is close to the lead frame and movably connected to the second rail.
[0009] In some embodiments, the plate-like structure includes a first plate-like structure and a second plate-like structure. A slide rail is provided at the top of the first plate-like structure. The slide rail is slidably connected to the second plate-like structure for adjusting the position of the second plate-like structure.
[0010] In some embodiments, the plate-like structure is close to the nozzle, and the first displacement structure is provided with a connecting rod, one end of which is connected to the plate-like structure.
[0011] In some embodiments, the connecting rod is a telescopic rod, and the telescopic rod is used to adjust the height of the plate-like structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0013] Figure 1 is a schematic diagram of the overall structure of a semiconductor glue spraying device provided in some embodiments of the present application;
[0014] Figure 2 This is a schematic diagram of the position of a plate-shaped structure of a semiconductor glue spraying device provided in some embodiments of the present application;
[0015] Figure 3 is a partial structural diagram of a lead frame of a semiconductor adhesive spraying device provided in some embodiments of the present application;
[0016] Figure 4 This is a schematic diagram of the connection between the first plate-like structure and the second track of the semiconductor glue spraying device provided in some embodiments of the present application;
[0017] Figure 5 is a schematic diagram of the connection between the second plate-like structure of the semiconductor glue spraying device provided in some embodiments of the present application and the second track;
[0018] Figure 6 Schematic diagram of the connection between the third plate-like structure of the semiconductor glue spraying device provided in some embodiments of the present application and the second track;
[0019] Figure 7 Schematic diagram of the connection between the fourth plate-like structure of the semiconductor glue spraying device provided by some embodiments of the present application and the second track;
[0020] Figure 8 This is a schematic diagram of the position of another plate-like structure of a semiconductor spray device provided in some embodiments of the present application. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below with reference to the accompanying drawings. However, it will be understood by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can be implemented. The division of the following embodiments is for convenience of description and should not constitute any limitation on the specific implementation of the present application. The various embodiments can be combined with each other and referenced to each other under the premise of no contradiction.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.
[0023] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.
[0024] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.
[0025] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections, or electrical connections; direct connections, or indirect connections through an intermediate medium; and can refer to internal connectivity between two components or interaction between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.
[0026] Currently, glue spraying is commonly used to apply glue directly to the lead frame, but this poses a challenge in controlling the spray area. Glue splashed on the lead is often difficult to clean before electroplating, and residual glue affects the uniformity of the coating. The proportion of batch abnormalities caused by glue splash is as high as 30%. Because the glue is transparent, it is difficult to detect at inspection stations. Abnormal batches can flow into the electroplating process, ultimately leading to coating defects.
[0027] To this end, some embodiments of the present application provide a semiconductor glue spraying device. This device addresses the issue of the inability to precisely control the spraying area during glue spraying operations. By controlling the movement of a nozzle through a first displacement structure and a second displacement structure, a plate-like structure is movably positioned between the lead frame and the nozzle. The position of the plate-like structure is adjusted based on actual conditions to prevent glue from splashing onto the external leads. This allows for precise control of the spraying area during glue spraying operations, preventing the quality of lead plating from being affected by the glue.
[0028] The following combination Figures 1 to 7 , describing the semiconductor spraying device provided in some embodiments of the present application.
[0029] like Figures 1 to 3 As shown, some embodiments of the present application provide a semiconductor adhesive spraying device including a nozzle 10, a first displacement structure 20, a second displacement structure 30, a lead frame 40, a track structure, and a plate structure 60. The nozzle 10 is connected to the second displacement structure 30, which is connected to the first displacement structure 20. The first displacement structure 20 is used to control the horizontal movement of the nozzle 10, and the second displacement structure 30 is used to control the vertical movement of the nozzle 10. The lead frame 40 includes a packaging portion 41 and external pins 42. The nozzle 10 is used to spray adhesive on the packaging portion 41. The track structure includes a first track 51 and a second track 52. The lead frame 40 is fixedly arranged between the first track 51 and the second track 52. The first track 51 is close to the packaging portion 41, and the second track 52 is connected to the external pins 42. The plate structure 60 is arranged between the nozzle 10 and the lead frame 40.
[0030] The lead frame 40 includes an encapsulation portion 41 and external leads 42. The encapsulation portion 41 is the portion where the semiconductor components are mounted and requires encapsulation and protection, while the external leads 42 are used to connect to external circuits. The nozzle 10 sprays glue onto the encapsulation portion 41 according to a preset program. The track structure includes a first track 51 and a second track 52. The first track 51 and the second track 52 are respectively arranged on either side of the lead frame 40 to fix and guide the position of the lead frame 40 during the glue spraying process. A plate-like structure 60 can be provided between the nozzle 10 and the lead frame 40 to prevent glue from splashing onto the external leads 42 during the glue spraying process.
[0031] In some embodiments, the plate-like structure 60 may be disposed between the first rail 51 and the second rail 52 . The plate-like structure 60 may be close to the lead frame 40 and movably connected to the second rail 52 .
[0032] Specifically, such as Figure 4 As shown, the plate-like structure 60 can be connected to the second rail 52 by suction cups. A suction cup 70 is located at one end of the plate-like structure 60 near the second rail 52, allowing the plate-like structure 60 to be securely attached to the second rail 52. This simple, easy-to-use method provides sufficient stability. To remove or replace the plate-like structure 60, simply release the suction cups.
[0033] In actual situations, if Figure 5 As shown, a slot can be further provided on one side of the second track 52 near the plate-like structure 60. The slot matches the shape and size of the plate-like structure 60 so that the plate-like structure 60 can be tightly embedded in the second track 52. When removal or replacement is required, the plate-like structure 60 can be simply slid out of the slot.
[0034] In some embodiments, the plate-like structure 60 may include a first plate-like structure 61 and a second plate-like structure 62 . A slide rail 71 is provided at the top of the first plate-like structure 61 . The slide rail 71 is slidably connected to the second plate-like structure 62 for adjusting the position of the second plate-like structure 62 .
[0035] like Figure 6As shown, a slide rail 71 is provided at the top of the first plate-like structure 61, so that the second plate-like structure 62 is slidably connected along the slide rail 71. This connection method allows the position of the second plate-like structure 62 to be adjusted according to actual needs, thereby improving the flexibility and accuracy during the glue spraying process. Among them, the slide rail 71 may include structures such as guide grooves and limit blocks to ensure that the second plate-like structure 62 remains stable during the sliding process and prevents it from falling off the slide rail 71. When the plate structure needs to be disassembled or replaced, since the second plate-like structure 62 and the first plate structure 61 are slidably connected through the slide rail 71, it is only necessary to simply slide the second plate-like structure 62 off the slide rail 71. This design makes the disassembly and replacement process simple and quick, which helps to improve work efficiency and reduce maintenance costs.
[0036] In addition, if Figure 7 As shown, the plate-like structure 60 may also be a withdrawable plate.
[0037] In some embodiments, the plate-shaped structure 60 may be close to the nozzle 10 , and the first displacement structure 20 may be provided with a connecting rod 80 , one end of which may be connected to the plate-shaped structure 60 .
[0038] In some embodiments, the connecting rod 80 is a telescopic rod, which is used to adjust the height of the plate-like structure 60 .
[0039] like Figure 8 As shown, the plate structure 60 can be located a few millimeters below the nozzle 10 and facing the direction of the external pins 42. The connecting rod 80 can adjust the height of the glue spraying, thereby accurately controlling the glue spraying area under different package shapes.
[0040] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and that in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.
Claims
1. A semiconductor glue spraying device, characterized in that: include: A nozzle, a second displacement structure connected to the nozzle, and a first displacement structure connected to the second displacement structure, wherein the first displacement structure is used to control the nozzle to move in a horizontal direction, and the second displacement structure is used to control the nozzle to move in a vertical direction; The lead frame includes a packaging portion and external pins, and the nozzle is used to spray glue on the packaging portion; A track structure, comprising a first track and a second track, wherein the lead frame is fixedly disposed between the first track and the second track, wherein the first track is close to the packaging portion, and the second track is connected to the external pin; The plate-shaped structure is arranged between the shower head and the lead frame.
2. A semiconductor glue spraying device according to claim 1, characterized in that: The plate-shaped structure is disposed between the first track and the second track. The plate-shaped structure is close to the lead frame and is movably connected to the second track.
3. A semiconductor glue spraying device according to claim 2, characterized in that: The plate-like structure includes a first plate-like structure and a second plate-like structure. A slide rail is provided at the top of the first plate-like structure. The slide rail is slidably connected to the second plate-like structure for adjusting the position of the second plate-like structure.
4. A semiconductor glue spraying device according to claim 1, characterized in that: The plate-like structure is close to the nozzle, and the first displacement structure is provided with a connecting rod, one end of which is connected to the plate-like structure.
5. A semiconductor glue spraying device according to claim 4, characterized in that: The connecting rod is a telescopic rod, and the telescopic rod is used to adjust the height of the plate-like structure.