Crystal detection device

Abstract

The embodiment of the specification provides a crystal detection device, comprising: a moving assembly comprising a moving member and a first pickup member, the first pickup member being arranged on the moving member, the first pickup member picking up a crystal, and the moving member adjusting the position and / or angle of the first pickup member; the first detection assembly comprises a first image acquisition part and a size measurement table, the size measurement table carries the crystal, the first image acquisition part shoots the crystal on the size measurement table to obtain at least one first image of the crystal, and the at least one first image is used for determining the size of the crystal; and the second detection assembly comprises at least one second image acquisition piece and at least one flaw measurement table, the at least one flaw measurement table carries the crystal, the at least one second image acquisition piece shoots the crystal on the flaw measurement table to obtain at least one second image of the crystal, and the at least one second image is used for determining the flaw of the crystal.

Description

Technical Field

[0001] This specification relates to the field of crystal detection, and in particular to a crystal detection device. Background Art

[0002] With the advancement of science and technology, crystals (e.g., silicon carbide) are being widely used in various optoelectronic and electronic devices. Before using a crystal, its dimensions, defects, and other parameters need to be tested to understand the crystal's parameters and meet the requirements of different application scenarios. The detection of crystal dimensions, defects, and other parameters is mostly done manually, which is inefficient and difficult to guarantee accuracy.

[0003] Therefore, it is hoped to provide a crystal detection device that can automatically detect data such as the size and defects of the crystal, improve the efficiency of crystal detection, and ensure the accuracy of crystal detection. Summary of the Invention

[0004] One or more embodiments of the present specification provide a crystal inspection device, comprising: a first moving component, comprising a moving part and a first picking part, wherein the first picking part is disposed on the moving part, the first picking part picks up the crystal, and the moving part adjusts the position and / or angle of the first picking part; a first inspection component, comprising a first image acquisition component and a size measurement platform, wherein the size measurement platform carries the crystal, the first image acquisition component photographs the crystal on the size measurement platform to obtain at least one first image of the crystal, and the at least one first image is used to determine the size of the crystal; a second inspection component, comprising at least one second image acquisition component and at least one defect measurement platform, wherein the at least one defect measurement platform carries the crystal, the at least one second image acquisition component photographs the crystal on the defect measurement platform to obtain at least one second image of the crystal, and the at least one second image is used to determine defects in the crystal:

[0005] In some embodiments, the first picking member includes an air pump and a suction cup, the air pump and the suction cup are connected, the suction cup can contact the crystal, the air pump draws air to control the suction cup to absorb the crystal, and the air pump inflates air to control the suction cup to release the crystal.

[0006] In some embodiments, the crystal detection device further includes a third image acquisition component, which photographs the area where the crystal is located to obtain a third image, and the third image is used to determine the position of the crystal.

[0007] In some embodiments, the first detection component further includes a first track, a second track and a third track, wherein the first track, the second track and the third track are perpendicular to each other, at least one of the first image acquisition component and the dimension measuring platform is arranged on the first track and can move along the extension direction of the first track; at least one of the first image acquisition component and the dimension measuring platform is arranged on the second track and can move along the extension direction of the second track; at least one of the first image acquisition component and the dimension measuring platform is arranged on the second track and can move along the extension direction of the third track.

[0008] In some embodiments, the at least one second image includes multiple images reflecting defects in the crystal from different directions, the at least one second image acquisition component includes a front image acquisition component and a side image acquisition component, and the at least one defect measurement platform includes a first defect measurement platform. The front image acquisition component is arranged above the first defect measurement platform, and is used to photograph the top surface of the crystal to obtain the second image; the side image acquisition component is arranged on the side of the first defect measurement platform, and is used to photograph the side of the crystal to obtain the second image.

[0009] In some embodiments, the side image acquisition component includes a long side image acquisition component and a short side image acquisition component, and the long side image acquisition component and the short side image acquisition component are arranged on different sides of the defect measurement platform, and the shooting angles of the long side image acquisition component and the short side image acquisition component are vertical.

[0010] In some embodiments, the second detection component further includes a first driving member, a rotating member and a second picking member, the second picking member is arranged on the rotating member, the first driving member drives the rotating member to rotate around a first rotation axis, thereby driving the second picking member to rotate around the first rotation axis, wherein the first rotation axis is parallel to the height direction; the second picking member picks up the crystal placed on the first defect measurement table, and places the rotated crystal back on the first defect measurement table.

[0011] In some embodiments, the second image acquisition component further includes a back image acquisition component, and the back image acquisition component photographs the back surface of the crystal to obtain the second image.

[0012] In some embodiments, the at least one defect measurement station also includes a second defect measurement station, the reverse image acquisition component is arranged above the second defect measurement station, and the second detection component also includes a second driving component, a flipping component, a third picking component and a fourth picking component, the third picking component is arranged on the flipping component, and the third picking component picks up the crystal on the first defect measurement station; the second driving component drives the flipping component to rotate around the second rotation axis, thereby driving the third picking component to rotate around the second rotation axis, and the second rotation axis is parallel to the width direction; after the flipping component drives the third picking component to rotate around the second rotation axis by a preset angle, the fourth picking component picks up the crystal on the third picking component and places the crystal on the second defect measurement station for the reverse image acquisition component to shoot.

[0013] In some embodiments, the second detection component further includes a plurality of light sources. For each second image acquisition component, a light source is provided in the shooting direction of the second image acquisition component, and the distance between the light source and the second image acquisition component is greater than the distance between the crystal and the second image acquisition component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0015] Figure 1 is an exemplary block diagram of a crystal detection device according to some embodiments of this specification;

[0016] Figure 2 is a schematic diagram of a mobile assembly according to some embodiments of this specification;

[0017] Figure 3 is a schematic diagram of a first detection component according to some embodiments of this specification;

[0018] Figure 4 is a schematic diagram of another first detection component according to some embodiments of this specification;

[0019] Figure 5 is a schematic diagram of a second detection component according to some embodiments of this specification;

[0020] Figure 6A is a schematic diagram of a first defect measurement station according to some embodiments of this specification;

[0021] Figure 6B is another schematic diagram of a first defect measurement station according to some embodiments of this specification;

[0022] Figure 7 is a schematic diagram of a portion of the second detection component shown in some embodiments of this specification. DETAILED DESCRIPTION

[0023] To more clearly illustrate the technical solutions of the embodiments of this specification, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this specification. Those skilled in the art can apply this specification to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0024] It should be understood that the terms "system," "device," "unit," and / or "module" used herein are a method for distinguishing different components, elements, parts, portions, or assemblies at different levels. However, if other terms can achieve the same purpose, the terms may be replaced by other expressions.

[0025] As used in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not refer to the singular but also include the plural. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements.

[0026] Flowcharts are used throughout this specification to illustrate the operations performed by systems according to embodiments of this specification. It should be understood that preceding or following operations do not necessarily need to be performed in exact order. Instead, the steps may be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0027] Figure 1 is an exemplary block diagram of a crystal detection device according to some embodiments of this specification.

[0028] The crystal detection device 100 can be used to automatically detect the size, defects and other data of the crystal. The aforementioned crystals may include but are not limited to silicon carbide, germanium single crystals, etc. The aforementioned crystals may be natural crystals or artificially generated crystals. The size of the crystal may include geometric data such as the length, width, length, and height of the crystal. The defects of the crystal may include point defects of the crystal (i.e., defects at the atomic scale, such as vacancies, interstitial atoms, replacement atoms, etc.), line defects (i.e., defects distributed along a linear path in the crystal, such as dislocations), surface defects (i.e., defects on the surface or interface of the crystal, such as surface roughness, cracks, etc.) and body defects (i.e., defects existing inside the crystal, such as inclusions, holes, etc.).

[0029] In some embodiments, as Figure 1 As shown, the crystal detection device 100 may include a moving component 110 , a first detection component 120 , and a second detection component 130 .

[0030] The moving assembly 110 can be used to move the position of the crystal. In some embodiments, as Figure 1 As shown, the moving assembly 110 may include a moving member 111 and a first picking member 112, wherein the first picking member 112 may be arranged on the moving member 111, the first picking member 112 may pick up the crystal, and the moving member 111 may adjust the position and / or angle of the first picking member 112, thereby adjusting the position and / or angle of the crystal. For example, the moving assembly 110 may take the crystal out of the tray and place it on the size measuring table. For another example, the moving assembly 110 may also pick up the crystal placed on the size measuring table 122 and place it on the defect measuring table 132. For another example, the moving assembly 110 may also pick up the crystal placed on the size measuring table 122 or the defect measuring table 132 and put it back in the corresponding position after flipping or rotating it.

[0031] The moving member 111 can be a variety of movable structures. For example, the moving member 111 can be Figure 2 As another example, the moving member 111 can also be a guide rail system. The moving member 111 can also control the first picking member 112 to rotate or flip to drive the crystal to rotate or flip. For example, the mechanical arm can drive the first picking member 112 disposed thereon to rotate or flip.

[0032] The first picking member 112 can be any structure that can pick up the crystal. Figure 2 As shown, the first picking member 112 may include an air pump and a suction cup. The first picking member 112 may pick up the crystal by inflating and deflating air. For more details on the above example, please refer to the relevant description below in this specification. For another example, the first picking member 112 may also include a mechanical gripper.

[0033] The first detection component 120 can be used to obtain a first image of the crystal, which is used to determine the size of the crystal. The first image can be a two-dimensional image or a three-dimensional image.

[0034] In some embodiments, as Figure 1 As shown, the first detection component 120 may include a first image acquisition component 121 and a dimension measurement platform 122 .

[0035] The dimension measuring stage 122 can support the crystal.

[0036] In some embodiments, the surface of the size measurement platform 122 that contacts the crystal may be provided with size markings. Accordingly, when the first image acquisition component 121 captures the crystal on the size measurement platform 122, the captured first image may include at least a portion of the size markings to assist in analyzing the crystal's size. The size markings can be provided in various forms. For example, the size markings may be unit size markings. In another example, the size markings may be grid size markings.

[0037] The first image acquisition component 121 captures the crystal on the size measurement platform 122 to obtain at least one first image of the crystal. The first image acquisition component 121 may include but is not limited to a camera, a video camera, and the like.

[0038] In some embodiments, the first image capture component 121 captures the crystal on the size measurement platform 122 to obtain a first image of the crystal. For example, the first image capture component 121 captures the crystal on the size measurement platform 122 to obtain a first image of the crystal. The first image may be a stereoscopic image of the crystal, which may include multiple sides of the crystal.

[0039] In some embodiments, the first detection component 120 may include a first image capture component 121. For example, after the first image capture component 121 completes photographing the crystal on the size measurement platform 122, the moving component 110 may pick up the crystal on the size measurement platform 122, rotate or flip the crystal, and then place it back on the size measurement platform 122. The first image capture component 121 may then photograph the crystal again to obtain multiple first images of the crystal, thereby ensuring that the dimensions of the crystal in different directions can be obtained. For another example, after the first image capture component 121 completes photographing the crystal on the size measurement platform 122, the first image capture component 121 may move relative to the size measurement platform 122 (e.g., from the top surface of the size measurement platform 122 to the side of the size measurement platform 122). The moved first image capture component 121 may then photograph the crystal on the size measurement platform 122 again to obtain multiple first images of the crystal, thereby ensuring that the dimensions of the crystal in different directions can be obtained. For more description of how the first image capture component 121 moves, please refer to the relevant description below in this specification.

[0040] In some embodiments, the first detection assembly 120 may include multiple first image acquisition components 121. These multiple first image acquisition components 121 may be positioned relative to each other in different directions relative to the dimension measurement platform 122. Each of these multiple first image acquisition components 121 may capture the crystal on the dimension measurement platform 122 to obtain multiple first images of the crystal, thereby ensuring that the dimensions of the crystal in different directions can be obtained. For example, the first detection assembly 120 may include two first image acquisition components 121, respectively positioned on the top and side surfaces of the dimension measurement platform 122.

[0041] In some embodiments, the first image acquisition component 121 and the size measurement platform 122 are movable, so that the first image acquisition component 121 can be aligned with the crystal on the size measurement platform 122 to capture the image, ensuring that the crystal is within the capture range of the first image acquisition component 121. In addition, by making the size measurement platform 122 movable, it is convenient for the mobile component 110 to place the crystal on the size measurement platform 122 or pick up the crystal on the size measurement platform 122, avoiding obstruction by other structures (e.g., the first image acquisition component 121). For more details about the above embodiments, please refer to the relevant description below in this specification.

[0042] The second detection component 130 can be used to obtain a second image of the crystal, which is used to determine defects in the crystal. The second image can be a two-dimensional image or a three-dimensional image.

[0043] In some embodiments, as Figure 1As shown, the second detection component 130 may include at least one second image acquisition component 131 and at least one defect measurement platform 132 .

[0044] The defect measurement stage 132 may be used to carry a crystal.

[0045] The second image acquisition component 131 captures the crystal on the defect measurement platform 132 to obtain at least one second image of the crystal. The second image acquisition component 131 may include but is not limited to a camera, a video camera, etc.

[0046] In some embodiments, the second image acquisition component 131 photographs the crystal on the defect measurement platform 132 to obtain a second image of the crystal.

[0047] In some embodiments, the second inspection component 130 may include a second image capture component 131. For example, after the second image capture component 131 completes photographing the crystal on the defect measurement platform 132, the moving component 110 may pick up the crystal on the defect measurement platform 132, rotate or flip the crystal, and then place it back on the defect measurement platform 132. The second image capture component 131 may then photograph the crystal again to obtain multiple second images of the crystal, thereby ensuring a more comprehensive understanding of defects at different locations on the crystal. For another example, after the second image capture component 131 completes photographing the crystal on the defect measurement platform 132, the second image capture component 131 may move relative to the defect measurement platform 132 (e.g., from the top surface of the defect measurement platform 132 to the side of the defect measurement platform 132). The moved second image capture component 131 may then photograph the crystal on the defect measurement platform 132 again to obtain multiple second images of the crystal, thereby ensuring a more comprehensive understanding of defects at different locations on the crystal. For more description on how the second image capturing component 131 moves, please refer to the relevant content of the first image capturing component 121 .

[0048] In some embodiments, the second detection component 130 may include a plurality of second image acquisition components 131. For more information about the plurality of second image acquisition components 131, please refer to the relevant description later in this specification.

[0049] Some embodiments of this specification can automatically detect the size, defects and other data of the crystal through the aforementioned crystal detection device 100, thereby improving the efficiency of crystal detection and ensuring the accuracy of crystal detection.

[0050] In some embodiments, the crystal detection device 100 may further include other structures.

[0051] In some embodiments, the crystal detection device 100 may further include a processing device. The aforementioned processing device may be directly disposed in the crystal detection device 100 or may be disposed outside the crystal detection device 100 and be communicatively connected with multiple components in the crystal detection device 100 .

[0052] The processing device can control multiple components in the crystal detection apparatus 100. For example, the processing device can control the mobile component 100 to pick up the crystal and adjust the position and / or angle of the crystal. For another example, the processing device can also control the first image acquisition component 121 and the second image acquisition component 131 to photograph the crystal.

[0053] The processing device may also process data and / or information obtained from other devices or components of the crystal detection apparatus 100 .

[0054] In some embodiments, the processing device may acquire the first image and analyze the first image to determine the size of the crystal. For example, the processing device may analyze the size of each dimension of the crystal in the first image based on the dimension annotations in the first image to determine geometric data such as the length, width, and height of the crystal.

[0055] In some embodiments, the processing device can also obtain a second image, and perform modeling or use various data analysis algorithms, such as regression analysis, discriminant analysis, etc., to analyze and process the second image to determine the defects of the crystal. For example, the processing device can input the second image into a defect analysis model, and the output of the defect analysis model is the defect of the crystal. The aforementioned defect analysis model can be a convolutional neural network or any other machine learning model that can achieve its function. The defect analysis model can be obtained by training based on a first training sample with a first label. The aforementioned first training sample can include a sample second image of the sample crystal. The first label can include the defect of the sample crystal. The first training sample can be obtained by manually photographing the sample crystal, and the first label can be obtained by manually annotating the sample crystal.

[0056] In some embodiments, the processing device can further classify crystals based on their size and defects. For example, the processing device can analyze the crystals' size and defects, determining crystals that meet pre-defined criteria as qualified crystals and crystals that do not meet them as unqualified crystals. Furthermore, the processing device can control the moving assembly 110 to place qualified and unqualified crystals in different areas for subsequent processing.

[0057] In some embodiments, the crystal detection device 100 may further include a third image acquisition component 140. The third image acquisition component 140 may include but is not limited to a camera, a video camera, etc. In some embodiments, the third image acquisition component 140 may be fixedly set at a preset position in the crystal detection device 100, and the third image acquisition component 140 set at the preset position may capture various positions where crystals may exist in the crystal detection device 100. For example, the third image acquisition component 140 may be set on the top wall of the crystal detection device 100 to facilitate capturing various positions where crystals may exist. For another example, Figure 2 As shown, the third image acquisition component 140 can also be provided on the moving component 110 so that the moving component 110 can photograph various possible positions of the crystal before picking up the crystal.

[0058] The third image acquisition component 140 can shoot the area where the crystal is located to obtain a third image, and the third image is used to determine the position of the crystal, so that the mobile component 110 can pick up the crystal more accurately. In some embodiments, the processing device can analyze and process the third image to determine the position of the crystal. For example, the processing device can input the third image into a position analysis model, and the output of the position analysis model is the position of the crystal. The aforementioned position analysis model can be a convolutional neural network or any other machine learning model that can achieve its function. The position analysis model can be obtained by training based on a second training sample with a second label. The aforementioned second training sample may include a sample third image of the sample crystal, and the second label may include a sample position of the sample crystal. The second training sample can be obtained by manually shooting the sample crystal, and the second label can be obtained by manually marking the position of the sample crystal. When the third image acquisition component 140 is a movable component (for example, the third image acquisition component 140 is arranged on the movable component 110), the input of the position analysis model may also include the position of the third image acquisition component 140. The position of the third image acquisition component 140 can be obtained by the internal positioning component thereof, or obtained after analyzing and processing the initial position of the third image acquisition component 140 and the data of each movement thereof (for example, displacement and direction). Correspondingly, when training the aforementioned position analysis model, the second training sample may also include the position of the sample image acquisition component. The position of the sample image acquisition component can be obtained by manual annotation.

[0059] In some embodiments of this specification, a third image acquisition component 140 is provided to acquire a third image for determining the position of the crystal, so as to understand the position of the crystal and thereby achieve precise control of the crystal.

[0060] The following description will describe a configuration method of the mobile component 110 .

[0061] In some embodiments, as Figure 2 As shown, the first pickup member 112 may include an air pump 1121 and a suction cup 1122. The air pump 1121 can be used to pump air in and out. The suction cup 1122 can contact the crystal and can be made of a flexible material, such as silicone or rubber, to improve sealing when picking up the crystal and prevent the crystal from falling. Furthermore, the suction cup 1122 made of a flexible material can also prevent damage to the crystal during pickup.

[0062] Suction cup 1122 can be connected to air pump 1121. For example, suction cup 1122 can be directly connected to air pump 1121. In another example, suction cup 1122 can be connected to air pump 1121 via a pipe. When air pump 1121 draws air, suction cup 1122 generates negative pressure, which allows suction cup 1122 to absorb the crystal. When air pump 1121 inflates, the negative pressure in suction cup 1122 disappears, allowing suction cup 1122 to release the previously held crystal.

[0063] Some embodiments of this specification use an air pump 1121 and a suction cup 1122 to pick up crystals, which can be applied to crystals of different shapes and sizes and avoids possible damage to the crystals caused by directly grabbing the crystals.

[0064] The following description will describe a configuration method of the first detection component 120 .

[0065] In some embodiments, the first detection component 120 also includes a first track 123, a second track 124 and a third track 125, wherein the first track 123, the second track 124 and the third track 125 are perpendicular to each other, and at least one of the first image acquisition component 121 and the dimension measuring platform 122 is arranged on the first track 123 and can move along the extension direction of the first track 123; at least one of the first image acquisition component 121 and the dimension measuring platform 122 is arranged on the second track 124 and can move along the extension direction of the second track 124; at least one of the first image acquisition component 121 and the dimension measuring platform 122 is arranged on the third track 125 and can move along the extension direction of the third track 125.

[0066] In some embodiments, the first track 123, the second track 124, and the third track 125 can be implemented in a variety of ways. One or more of the first track 123, the second track 124, and the third track 125 can be embedded tracks. For example, Figure 3As shown, the second track 124 is an inner track, and the dimension measuring platform 122 can be set on a connecting structure, a portion of the aforementioned connecting structure is embedded in the second track 124 and can slide on the second track 124. One or more of the first track 123, the second track 124 and the third track 125 are protruding tracks.

[0067] It is worth noting that when multiple tracks are overlapped, the same component (for example, the first image acquisition component 121 or the dimension measurement platform 122) can be set on multiple tracks at the same time. Figure 3 As shown, the dimension measuring platform 122 is set on the second track 124, and the second track 124 is set on the third track 125. Therefore, the second track 124 can drive the dimension measuring platform 122 set thereon to move along the extension direction of the third track 125, so that the dimension measuring platform 122 can be set on the second track 124 and the third track 125 at the same time.

[0068] In some embodiments, the first image acquisition component 121 and the dimension measurement platform 122 can be respectively arranged on different tracks. Figure 3 As shown, the first image acquisition component 121 can be set on the first track 123 and can move along the extension direction of the first track 123, the dimension measuring platform 122 can be set on the second track 124 and can move along the extension direction of the second track 124, and the second track 124 can be set on the third track 125 and can move along the extension direction of the third track 125, that is, the dimension measuring platform 122 is set on the second track 124 and the third track 125 at the same time, and can move along the extension direction of the second track 124 and the third track 125 respectively.

[0069] In some embodiments, one of the first image acquisition component 121 and the size measurement platform 122 can be set on three tracks at the same time, and the other one of the first image acquisition component 121 and the size measurement platform 122 is fixedly set in the crystal detection device 100. For example, Figure 4 As shown, the size measuring platform 122 can be fixedly set in the crystal detection device 100, and the first image acquisition component 121 can be set on the second track 124 and can move along the extension direction of the second track 124, the second track 124 can be set on the first track 123 and can move along the extension direction of the first track 123, and the first track 123 can be set on the third track 125 and can move along the extension direction of the third track 125, so that the first image acquisition component 121 can be set on the first track 123, the second track 124 and the third track 125 at the same time, and can move along the extension directions of the first track 123, the second track 124 and the third track 125 respectively.

[0070] In some embodiments, the first image acquisition component 121 and the dimension measurement platform 122 can be disposed on the same track, and the first image acquisition component 121 and the dimension measurement platform 122 can each move along the extension direction of the track. For example, the first image acquisition component 121 can be disposed on the first track 123 and can move along the extension direction of the first track 123, and the first track 123 can be disposed on the second track 124 and can move along the extension direction of the second track 124. In other words, the first image acquisition component 121 is disposed on both the first track 123 and the second track 124 and can move along the extension directions of the first track 123 and the second track 124, respectively. The dimension measurement platform 122 can be disposed on the second track 124 and can move along the extension direction of the second track 124, and the second track 124 can be disposed on the third track 125 and can move along the extension direction of the third track 125. In other words, the dimension measurement platform 122 is disposed on both the second track 124 and the third track 125 and can move along the extension directions of the second track 124 and the third track 125, respectively.

[0071] In some embodiments of the present specification, by placing the first image acquisition component 121 and / or the dimension measurement platform 122 on one or more tracks, relative movement between the first image acquisition component 121 and the dimension measurement platform 122 can be achieved, thereby achieving alignment of the first image acquisition component 121 with the crystal on the dimension measurement platform 122, ensuring that the crystal is within the acquisition range of the first image acquisition component 121. In addition, this arrangement facilitates the moving component 110 to place the crystal on the dimension measurement platform 122, avoiding obstruction of the dimension measurement platform 122 by the first image acquisition component 121, and ensuring the stability and safety of the crystal during movement.

[0072] The following description of this specification will describe a configuration method of the second detection component 130 .

[0073] In some embodiments, the at least one second image includes multiple images reflecting defects in the crystal from different directions, so as to ensure a more comprehensive reflection of defects at various locations in the crystal.

[0074] In some embodiments, the at least one second image acquisition component may include a second image acquisition component 131, and the at least one defect measurement stage 132 may include a defect measurement stage. The second image acquisition component 131 may be configured to move relative to the defect measurement stage 132 to acquire second images of the crystal in different directions. For more information on how to configure the second image acquisition component 131 to move relative to the defect measurement stage 132, see the description of the movement of the first image acquisition component 121 relative to the size measurement stage 122.

[0075] In some embodiments, the at least one second image acquisition component may include a front image acquisition component 1311 and a side image acquisition component, and the at least one defect measurement platform 132 may include a first defect measurement platform 1321 .

[0076] like Figure 5 As shown, the front image capture unit 1311 can be positioned above the first defect measurement platform 1321 to capture the top surface of the crystal and obtain a second image. The second image can reflect the relevant defects on the top surface of the crystal. The top surface of the crystal can refer to the top surface of the crystal when it is placed on the first defect measurement platform 1321.

[0077] In some embodiments, the front image capture unit 1311 and the first defect measurement platform 1321 can move relative to each other. For example, the front image capture unit 1311 and / or the first defect measurement platform 1321 can be mounted on one or more tracks and can move along the extension direction of the one or more tracks. For more information on mounting the front image capture unit 1311 and / or the first defect measurement platform 1321 on tracks, please refer to the relevant information on mounting the first image capture unit 121 and / or the dimension measurement platform 122 on tracks.

[0078] A side image capture unit can be positioned on the side of the first defect measurement platform 1321 to capture the side of the crystal and obtain a second image. This second image can reflect defects on the side of the crystal. The side of the crystal can refer to any surface other than the top and bottom of the crystal when placed on the first defect measurement platform 1321.

[0079] In some embodiments, the side image capture component and the first defect measurement platform 1321 can move relative to each other. For example, the side image capture component and / or the first defect measurement platform 1321 can be mounted on one or more tracks and can move along the extension of the one or more tracks. For more information on mounting the side image capture component and / or the first defect measurement platform 1321 on tracks, see the section regarding mounting the first image capture component 121 and / or the dimension measurement platform 122 on tracks.

[0080] The front image acquisition component 1311 and the side image acquisition component can be used to acquire second images of the crystal from different angles, thereby enabling a more comprehensive evaluation of the defects of the crystal.

[0081] In some embodiments, the number of the side image acquisition component is one.

[0082] In some embodiments, as Figure 5As shown, the side image acquisition component may include a long side image acquisition component 1312 and a short side image acquisition component 1313. The long side image acquisition component 1312 and the short side image acquisition component 1313 are arranged on different sides of the first defect measurement platform 1321. The long side image acquisition component 1312 and the short side image acquisition component 1313, through the above-mentioned arrangement, can obtain a second image reflecting the crystal defects from two sides of the crystal at one time, thereby improving the detection efficiency of the crystal.

[0083] In some embodiments, as Figure 5 As shown, the second detection assembly 130 also includes a first driving member ( Figure 5 The first driving member 133 can drive the rotating member 133 to rotate around the first rotation axis A, thereby driving the second picking member 134 to rotate around the first rotation axis A. The second picking member 134 picks up the crystal placed on the first defect measurement table 1321, and puts the rotated crystal back on the first defect measurement table 1321, wherein the first rotation axis A is parallel to the height direction.

[0084] The first driving member can be a rotary motor, and the rotating member 133 can be a structure connected to the aforementioned rotary motor. In some embodiments, the second detection assembly 130 can also not include the rotating member 133, and the second picking member 134 can be directly connected to the first driving member and rotated under the drive of the first driving member.

[0085] Similar to the first pick-up member 112, the second pick-up member 134 may also be a variety of structures capable of picking up a crystal. For example, the second pick-up member 134 may include a mechanical gripper. In another example, the second pick-up member 134 may include an air pump and a suction cup, and the second pick-up member 134 may pick up a crystal by inflating and deflating air.

[0086] In some embodiments, the second pickup member 134 can move relative to the first defect measurement platform 1321. For example, the second pickup member 134 and / or the first defect measurement platform 1321 can be disposed on one or more tracks and can move along the extension direction of the one or more tracks. For more information about disposing the second pickup member 134 and / or the first defect measurement platform 1321 on tracks, please refer to the relevant information about disposing the first image acquisition member 121 and / or the dimension measurement platform 122 on tracks.

[0087] It is worth noting that when photographing the defects of the crystal, relatively more components are set up. If the state of the crystal on the defect measurement table 132 (for example, the placement angle) is adjusted by the mobile component 110, a larger moving space needs to be reserved for the mobile component 110, which is also prone to damage to other components. In some embodiments of this specification, the placement angle of the crystal on the first defect measurement table 1321 can be adjusted within a smaller space through the first driving member, the rotating member 133 and the second picking member 134, so that the side image acquisition member can photograph different sides of the crystal to obtain a second image reflecting the defects on different sides of the crystal, thereby ensuring the integrity of the crystal defect detection and avoiding the crystal detection device 100 from being too large.

[0088] For example, Figure 6A As shown, when there is only one side image acquisition member, after the side image acquisition member captures the side of a rectangular crystal Q, the second pickup member 134 can absorb the crystal Q, and the first driving member can drive the rotating member 133 to rotate 90° around the first rotation axis A, thereby driving the crystal Q on the second pickup member 134 to rotate 90° around the first rotation axis A. After the rotation is completed, the second pickup member 134 can put the crystal Q back on the first defect measurement platform 1321, as shown in FIG. Figure 6B As shown, the side image acquisition component can shoot the other side of the crystal Q. After shooting, the crystal Q can be rotated and shot again until all sides of the crystal Q are shot.

[0089] It is worth understanding that the rotation angle of the crystal each time can be determined by analyzing the shape of the crystal, the number of side image acquisition components, and the setting position. For example, when the crystal is rectangular and the number of side image acquisition components is one, the crystal can be rotated 90° each time for shooting. For another example, when the crystal is triangular and the number of side image acquisition components is one, the crystal can be rotated 120° each time for shooting. For another example, when the crystal is rectangular and the second detection component 130 includes a long side image acquisition component 1312 and a short side image acquisition component 1313, the crystal can be rotated 180° each time for shooting.

[0090] In some embodiments, the second image capture component 131 further includes a backside image capture component 1314. Backside image capture component 1314 captures the backside of the crystal to obtain a second image. This second image can reflect relevant defects on the bottom surface, thereby enabling a more comprehensive assessment of crystal defects. The bottom surface of the crystal can refer to the bottom surface of the crystal when it is placed on the first defect measurement platform 1321.

[0091] In some embodiments, the first defect measurement platform 1321 can be set to a transparent material, the back image acquisition component 1314 can be set below the first defect measurement platform 1321, and the shooting angle of the back image acquisition component 1314 can be set to face the bottom surface of the crystal in the first defect measurement platform 1321, so that the back image acquisition component 1314 can capture a second image reflecting the relevant defects on the bottom surface of the crystal.

[0092] In some embodiments, as Figure 5 as well as Figure 7 As shown, at least one defect measurement platform 132 further includes a second defect measurement platform 1322, and the reverse image acquisition component 1314 is disposed above the second defect measurement platform 1322. The second detection component 130 further includes a second driving component ( Figure 7 The third picking member 136 is arranged on the flipping member 135, and the third picking member 136 can pick up the crystal on the first defect measurement table 1321; after the third picking member 136 picks up the crystal on the first defect measurement table 1321, the second driving member can drive the flipping member 135 to rotate around the second rotation axis B, thereby driving the third picking member 136 to rotate around the second rotation axis B, and the second rotation axis B is parallel to the width direction.

[0093] Among them, the second driving member can be a rotary motor, and the flip member 135 can be a structure connected to the aforementioned rotary motor. Similar to the first picking member 112, the third picking member 136 and the fourth picking member 137 can also be various structures that can pick up crystals. For example, the third picking member 136 and / or the fourth picking member 137 can include a mechanical clamp. For another example, the third picking member 136 and / or the fourth picking member 137 can include an air pump and a suction cup, and accordingly, the third picking member 136 and / or the fourth picking member 137 can pick up the crystal by filling and releasing air.

[0094] In some embodiments, after the flip member 135 drives the third picking member 136 to rotate about the second rotation axis B by a preset angle, the fourth picking member 137 can pick up the crystal on the third picking member 136 and place the crystal on the second defect measurement platform 1322 for imaging by the reverse image acquisition member 1314. It is understandable that when the crystal rotates about the second rotation axis B by a preset angle with the flip member 135, its top and bottom surfaces can change. For example, the bottom surface of the crystal on the first defect measurement platform 1321 becomes the top surface of the crystal on the second defect measurement platform 1322, thereby enabling the reverse image acquisition member 1314 located above the second defect measurement platform 1322 to image the bottom surface of the crystal to obtain a second image reflecting the relevant defects on the bottom surface of the crystal.

[0095] In some embodiments, the predetermined angle by which the flipping member 135 drives the third picking member 136 to rotate about the second rotation axis B can be determined based on the shape of the crystal. For example, if the crystal is rectangular, the flipping member 135 can drive the third picking member 136 to rotate 180° about the second rotation axis B, thereby changing the bottom surface of the crystal on the first defect measurement stage 1321 to the top surface of the crystal on the second defect measurement stage 1322.

[0096] In some embodiments, the fourth pickup member 137 can move relative to the second defect measurement platform 1322 so that the fourth pickup member 137 can place the crystal on the second defect measurement platform 1322 and then leave, so that the reverse image acquisition member 1314 can capture the crystal on the second defect measurement platform 1322 to avoid obstruction. For example, the second defect measurement platform 1322 can be fixed, and the fourth pickup member 137 can be set on one or more tracks and can move along the extension direction of the one or more tracks. For more information about the fourth pickup member 137 being set on the track, please refer to the relevant content about the first image acquisition member 121 and / or the size measurement platform 122 being set on the track.

[0097] In some embodiments, the back image capture component 1314 and the second defect measurement platform 1322 can move relative to each other, allowing the back image capture component 1314 to capture images of the crystal on the second defect measurement platform 1322. For example, the back image capture component 1314 and / or the second defect measurement platform 1322 can be mounted on one or more tracks and can move along the extension direction of the one or more tracks. For more information on mounting the back image capture component 1314 and / or the second defect measurement platform 1322 on tracks, please refer to the relevant information regarding mounting the first image capture component 121 and / or the dimension measurement platform 122 on tracks.

[0098] It is worth noting that when photographing crystal defects, a relatively large number of components are required. If the position of the crystal on the defect measurement table 132 (for example, the placement angle) is adjusted by the movable component 110, a large movement space must be reserved for the movable component 110, which can also easily damage other components. In some embodiments of this specification, the above-mentioned arrangement can achieve the swapping between the top and bottom surfaces of the crystal in a smaller space, so as to photograph defects in different directions of the crystal. This can reduce the size of the crystal inspection device 100 and enable a more comprehensive assessment of crystal defects.

[0099] In some embodiments, the second detection component 130 further includes a plurality of light sources. For each second image acquisition component 131, a light source is provided in the shooting direction of the second image acquisition component 131, and the distance between the light source and the second image acquisition component 131 is greater than the distance between the crystal and the second image acquisition component 131. Thus, the crystal can be illuminated in different directions based on the aforementioned light source, thereby enhancing the contrast between the surface defects of the crystal and the surrounding areas, so that the defects of the crystal can be captured more clearly.

[0100] For example, Figure 5 As shown, a first light source 1381 is provided in the shooting direction of the front image capture component 1311. The aforementioned first light source 1381 is arranged below the first defect measurement platform 1321. When the front image capture component 1311 captures the crystal on the first defect measurement platform 1321, the first light source 1381 can illuminate the crystal on the first defect measurement platform 1321, thereby enhancing the contrast between the crystal surface defects and the surrounding area, so that the crystal defects can be captured more clearly. Similarly, a second light source 1382 can be provided in the shooting direction of the long side image capture component 1312, a third light source 1383 can be provided in the shooting direction of the short side image capture component 1313, and a fourth light source 1384 can be provided in the shooting direction of the back side image capture component 1314.

[0101] In some embodiments, one or more of the multiple light sources can be moved relative to the defect measurement stage 132 to adjust the illuminated area and illumination intensity to meet different lighting requirements. For example, the light source and / or defect measurement stage 132 can be mounted on one or more tracks and can be moved along the extension direction of the one or more tracks. For more information on the arrangement of the light source and / or defect measurement stage 132 on tracks, please refer to the relevant information regarding the arrangement of the first image acquisition component 121 and / or the dimension measurement stage 122 on tracks.

[0102] While the basic concepts have been described above, it will be apparent to those skilled in the art that the detailed disclosure is merely illustrative and does not limit this specification. Although not explicitly stated herein, various modifications, improvements, and revisions to this specification may be made by those skilled in the art. Such modifications, improvements, and revisions are suggested in this specification and remain within the spirit and scope of the exemplary embodiments of this specification.

[0103] This specification also uses specific terms to describe the embodiments of this specification. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "one embodiment," "an embodiment," or "an alternative embodiment" two or more times in different locations in this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of this specification may be appropriately combined.

[0104] In addition, unless expressly stated in the claims, the order of the processing elements and sequences, the use of alphanumeric characters, or the use of other names described in this specification are not intended to limit the order of the processes and methods of this specification. Although the above disclosure discusses some of the invention embodiments currently considered useful through various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the spirit and scope of the embodiments of this specification. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0105] Similarly, it should be noted that, in order to simplify the presentation of this specification and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this specification sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not imply that the subject matter of this specification requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single disclosed embodiment.

[0106] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required characteristics of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of this specification are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

[0107] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, and documents, cited in this specification is hereby incorporated by reference in its entirety. This includes application history documents that are inconsistent with or conflict with the content of this specification, as well as documents (currently or subsequently attached to this specification) that limit the broadest scope of the claims of this specification. It should be noted that if the descriptions, definitions, and / or terminology used in the accompanying materials are inconsistent or conflicting with the content of this specification, the descriptions, definitions, and / or terminology used in this specification will control.

[0108] Finally, it should be understood that the embodiments described in this specification are intended only to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly described and illustrated in this specification.

Claims

1. A crystal detection device, characterized in that: include: A first moving component includes a moving member and a first picking member, wherein the first picking member is disposed on the moving member, the first picking member picks up the crystal, and the moving member adjusts the position and / or angle of the first picking member; A first detection component includes a first image acquisition component and a size measurement platform, wherein the size measurement platform carries the crystal, and the first image acquisition component photographs the crystal on the size measurement platform to obtain at least one first image of the crystal, wherein the at least one first image is used to determine the size of the crystal; The second detection component includes at least one second image acquisition component and at least one defect measurement platform. The at least one defect measurement platform carries the crystal. The at least one second image acquisition component photographs the crystal on the defect measurement platform to obtain at least one second image of the crystal. The at least one second image is used to determine the defects of the crystal.

2. The crystal detection device according to claim 1, wherein: The first pickup member includes an air pump and a suction cup, the air pump and the suction cup are connected, and the suction cup can contact the crystal. The air pump evacuates air to control the suction cup to absorb the crystal, and the air pump inflates air to control the suction cup to release the crystal.

3. The crystal detection device according to claim 1, wherein: The crystal detection device further includes a third image acquisition component, The third image acquisition component captures the area where the crystal is located to obtain a third image, and the third image is used to determine the position of the crystal.

4. The crystal detection device according to claim 1, wherein: The first detection assembly further includes a first track, a second track, and a third track, wherein the first track, the second track, and the third track are perpendicular to each other. At least one of the first image acquisition component and the dimension measuring platform is disposed on the first track and is capable of moving along an extension direction of the first track; At least one of the first image acquisition component and the dimension measuring platform is disposed on the second track and is capable of moving along an extension direction of the second track; At least one of the first image acquisition component and the dimension measuring platform is disposed on the second track and is movable along an extension direction of the third track.

5. The crystal detection device according to claim 1, wherein: The at least one second image includes a plurality of images reflecting defects in the crystal from different directions, The at least one second image acquisition component includes a front image acquisition component and a side image acquisition component, and the at least one defect measurement platform includes a first defect measurement platform. The front image acquisition component is arranged above the first defect measurement platform, and is used to photograph the top surface of the crystal to obtain the second image; The side image acquisition component is arranged on the side of the first defect measurement platform, and is used to photograph the side of the crystal to obtain the second image.

6. The crystal detection device according to claim 5, wherein: The side image acquisition component includes a long side image acquisition component and a short side image acquisition component, which are arranged on different sides of the defect measurement platform, and the shooting angles of the long side image acquisition component and the short side image acquisition component are vertical.

7. The crystal detection device according to claim 5, wherein: The second detection assembly further includes a first driving member, a rotating member, and a second picking member, wherein the second picking member is disposed on the rotating member. The first driving member drives the rotating member to rotate around a first rotating axis, thereby driving the second picking member to rotate around the first rotating axis, wherein the first rotating axis is parallel to the height direction; The second picking member picks up the crystal placed on the first defect measurement stage, and places the rotated crystal back on the first defect measurement stage.

8. The crystal detection device according to claim 5, wherein: The second image acquisition component further includes a back image acquisition component, which photographs the back surface of the crystal to obtain the second image.

9. The crystal detection device according to claim 8, wherein: The at least one defect measurement station further includes a second defect measurement station, and the reverse side image acquisition component is arranged above the second defect measurement station. The second detection assembly further includes a second driving member, a flip member, a third picking member, and a fourth picking member. The third picking member is disposed on the flip member. The third picking member picks up the crystal on the first defect measurement stage; The second driving member drives the flip member to rotate around the second rotation axis, thereby driving the third picking member to rotate around the second rotation axis, and the second rotation axis is parallel to the width direction; After the flipping member drives the third picking member to rotate around the second rotation axis by a preset angle, the fourth picking member picks up the crystal on the third picking member and places the crystal on the second defect measurement table for the reverse image acquisition member to shoot.

10. The crystal detection device according to any one of claims 5 to 9, wherein: The second detection component also includes a plurality of light sources, For each second image capturing element, a light source is provided in the shooting direction of the second image capturing element, and the distance between the light source and the second image capturing element is greater than the distance between the crystal and the second image capturing element.

Images