Electronic computer with cooling and heat dissipation structure
The combined structure of heat conduction blocks, heat pipes, cooling fins and cooling units solves the problem of poor cooling effect of fans in the prior art, achieves efficient active and passive heat dissipation, and ensures the temperature control and dustproof effect of the electronic computer.
Patent Information
- Application Number
- CN202422608843.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-10-28
AI Technical Summary
In existing electronic computers, cooling effect of using fans alone is poor, resulting in excessively high temperature inside the computer case, affecting normal use.
A combination of heat-conducting blocks, heat pipes, cooling fins, cooling units and heat-dissipating components is used to dissipate heat through active and passive methods. The heat-conducting blocks transfer heat to the heat pipes, the coolant vaporizes and liquefies at the cooling fins, the cooling unit drives the fan blades through a motor to cool the cooling fins, and passively dissipates heat through the heat sink and ventilation panels.
It significantly improves the cooling and heat dissipation capacity of the computer, ensures that the temperature inside the chassis is within the normal range, prevents dust from entering, and improves the performance of the equipment.
Smart Images
Figure CN223320824U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computer heat dissipation, in particular to an electronic computer with a temperature reduction and heat dissipation structure. Background Art
[0002] Currently, electronic computers refer to devices that use electronic technology to process and calculate data. They can perform various tasks, including data storage, information processing, calculation and control.
[0003] When a computer is operating, its internal temperature gradually rises. The components that generate heat are mainly the central processing unit (CPU) and the graphics processing unit (GPU). These two are responsible for handling most computing tasks and therefore generate a lot of heat during operation. Fans are usually used to cool the inside of the computer.
[0004] However, in existing electronic computers, cooling the computer only by using a fan is poorly effective, resulting in excessively high temperatures inside the computer chassis, affecting normal use. Utility Model Content
[0005] The purpose of the present invention is to provide an electronic computer with a cooling and heat dissipation structure, aiming to solve the technical problem in the prior art that the cooling effect of the electronic computer by only using a fan is poor, resulting in excessively high temperature inside the chassis affecting normal use.
[0006] To achieve the above-mentioned objectives, the present invention adopts an electronic computer with a cooling and heat dissipation structure, comprising a case, a cover, a motherboard, a CPU, a GPU, and a cooling assembly, wherein the cover is detachably connected to the case and located on one side of the case, the motherboard is detachably connected to the case and located inside the case, the CPU is detachably connected to the motherboard and located on one side of the motherboard, the GPU is detachably connected to the motherboard and located on one side of the motherboard, and the cooling assembly is disposed inside the case;
[0007] The cooling assembly includes a heat conductive block, a first heat dissipation pipe, a second heat dissipation pipe, a cooling fin, a limiting rod, a cooling unit and a heat dissipation component. The heat conductive block is arranged on one side of the CPU and the GPU, one end of the first heat dissipation pipe is detachably connected to the heat conductive block and passes through the heat conductive block, one end of the second heat dissipation pipe is detachably connected to the heat conductive block and passes through the heat conductive block, the cooling fin is detachably connected to the first heat dissipation pipe and wraps the first heat dissipation pipe and the second heat dissipation pipe, the limiting rod is detachably connected to the cooling fin and is located below the cooling fin, and the limiting rod is fixedly connected to the inner wall of the chassis, the cooling unit is arranged on the inner wall of the chassis, and the heat dissipation component is arranged on the surface of the chassis.
[0008] In which, the cooling unit includes a fixed shell, a fixed rod, a motor and fan blades, the fixed shell is fixedly connected to the chassis and is located on the inner wall of the chassis, the fixed rod is fixedly connected to the fixed shell and is located on the inner wall of the fixed shell, the motor is fixedly connected to the fixed rod and is located at the end of the fixed rod away from the fixed shell, and the fan blades are fixedly connected to the output end of the motor and are located on the side of the fixed shell close to the cooling fins.
[0009] The heat dissipation component includes a heat sink and a dustproof unit. The heat sink is fixedly connected to the mainboard and is located on a side of the mainboard away from the CPU. The dustproof unit is arranged on the outside of the chassis.
[0010] Wherein, the dustproof unit includes a dustproof plate, which is fixedly connected to the chassis and wraps the heat sink.
[0011] Wherein, the heat dissipation component further includes a ventilation plate, which is fixedly connected to the machine cover and located inside the machine cover.
[0012] The utility model provides an electronic computer with a cooling and heat dissipation structure. The mainboard can fix the CPU and the GPU inside the chassis. The CPU and the GPU can be actively cooled by the cooling fins. The cooling fins are then cooled by the cooling unit. The CPU and the GPU can be passively cooled by the heat dissipation components, thereby significantly improving the cooling and heat dissipation capabilities of the electronic computer. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0014] Figure 1 The utility model is a structural diagram of an electronic computer with a cooling and heat dissipation structure.
[0015] Figure 2 The utility model is a structural schematic diagram of a cooling assembly of an electronic computer with a temperature reduction and heat dissipation structure.
[0016] Figure 3 It is a front view of a cooling assembly of an electronic computer with a temperature reduction and heat dissipation structure according to the present invention.
[0017] Figure 4 This utility model Figure 2A magnified view of the local structure at point A.
[0018] Figure 5 This utility model Figure 3 BB line structural cross-sectional view.
[0019] 101-chassis, 102-cover, 103-motherboard, 104-CPU, 105-GPU, 106-heat conducting block, 107-first heat dissipation pipe, 108-second heat dissipation pipe, 109-cooling fin, 110-limiting rod, 111-fixing shell, 112-fixing rod, 113-motor, 114-fan blades, 115-heat sink, 116-dustproof plate, 117-ventilation plate. DETAILED DESCRIPTION
[0020] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.
[0021] See also Figures 1 to 5 ,in Figure 1 This is a schematic diagram of the structure of an electronic computer with a cooling and heat dissipation structure of the present invention. Figure 2 This is a schematic diagram of the structure of the cooling assembly of an electronic computer with a cooling and heat dissipation structure of the utility model. Figure 3 This is a front view of a cooling assembly of an electronic computer with a cooling and heat dissipation structure according to the present invention. Figure 4 This utility model Figure 2 A magnified view of the local structure at point A, Figure 5 This utility model Figure 3 BB line structural cross-sectional view.
[0022] The present invention provides an electronic computer with a cooling and heat dissipation structure, comprising a case 101, a cover 102, a motherboard 103, a CPU 104, a GPU 105, and a cooling assembly, wherein the cover 102 is detachably connected to the case 101 and is located on one side of the case 101, the motherboard 103 is detachably connected to the case 101 and is located inside the case 101, the CPU 104 is detachably connected to the motherboard 103 and is located on one side of the motherboard 103, the GPU 105 is detachably connected to the motherboard 103 and is located on one side of the motherboard 103, and the cooling assembly is disposed inside the case 101;
[0023] The cooling assembly includes a heat conducting block 106, a first heat dissipation pipe 107, a second heat dissipation pipe 108, a cooling fin 109, a limiting rod 110, a cooling unit and a heat dissipation component. The heat conducting block 106 is arranged on one side of the CPU 104 and the GPU 105. One end of the first heat dissipation pipe 107 is detachably connected to the heat conducting block 106 and passes through the heat conducting block 106. One end of the second heat dissipation pipe 108 is detachably connected to the heat conducting block 106 and passes through the heat conducting block 106. The cooling fin 109 is detachably connected to the first heat dissipation pipe 107 and wraps the first heat dissipation pipe 107 and the second heat dissipation pipe 108. The limiting rod 110 is detachably connected to the cooling fin 109 and is located below the cooling fin 109. The limiting rod 110 is fixedly connected to the inner wall of the chassis 101. The cooling unit is arranged on the inner wall of the chassis 101, and the heat dissipation component is arranged on the surface of the chassis 101.
[0024] In this embodiment, the heat conductive block 106 can transfer the heat generated by the CPU 104 and the GPU 105 to one end of the first heat dissipation pipe 107 and the second heat dissipation pipe 108. Since the end of the first heat dissipation pipe 107 and the second heat dissipation pipe 108 close to each other contains coolant, the coolant will vaporize when heated and move to the end of the first heat dissipation pipe 107 and the second heat dissipation pipe 108 close to the cooling fin 109. At the same time, after transferring the heat to the cooling fin 109, the coolant will liquefy and flow back to the end of the first heat dissipation pipe 107 and the second heat dissipation pipe 108 close to each other. The cooling unit can actively cool the cooling fin 109, thereby accelerating the liquefaction speed of the coolant in the first heat dissipation pipe 107 and the second heat dissipation pipe 108.
[0025] Furthermore, the cooling unit includes a fixed shell 111, a fixed rod 112, a motor 113 and a fan blade 114, the fixed shell 111 is fixedly connected to the chassis 101 and is located on the inner wall of the chassis 101, the fixed rod 112 is fixedly connected to the fixed shell 111 and is located on the inner wall of the fixed shell 111, the motor 113 is fixedly connected to the fixed rod 112 and is located at the end of the fixed rod 112 away from the fixed shell 111, and the fan blade 114 is fixedly connected to the output end of the motor 113 and is located on the side of the fixed shell 111 close to the cooling fin 109.
[0026] In this embodiment, the fixing shell 111 and the fixing rod 112 fix the position of the motor 113 . Starting the motor 113 can drive the fan blades 114 to rotate, thereby cooling the cooling fins 109 .
[0027] Furthermore, the heat dissipation component includes a heat sink 115 and a dustproof unit. The heat sink 115 is fixedly connected to the motherboard 103 and is located on a side of the motherboard 103 away from the CPU 104 . The dustproof unit is arranged on the outside of the chassis 101 .
[0028] In this embodiment, the heat sink 115 can transfer part of the heat of the mainboard 103 to the outside of the chassis 101, thereby achieving the purpose of cooling.
[0029] Furthermore, the dustproof unit includes a dustproof plate. The dustproof plate 116 is fixedly connected to the chassis 101 and wraps the heat sink 115 .
[0030] In this embodiment, the dustproof plate 116 can prevent external dust from entering the chassis 101.
[0031] Furthermore, the heat dissipation component further includes a ventilation plate 117 , which is fixedly connected to the machine cover 102 and located inside the machine cover 102 .
[0032] In this embodiment, the ventilation plate 117 allows external air to flow into the interior of the chassis 101 , thereby reducing the internal temperature of the chassis 101 , and at the same time, can prevent some dust from entering the interior of the chassis 101 .
[0033] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made in accordance with the claims of the present invention are still within the scope of the utility model.
Claims
1. An electronic computer with a cooling and heat dissipation structure, characterized in that: The system comprises a chassis, a cover, a motherboard, a CPU, a GPU, and a cooling assembly, wherein the cover is detachably connected to the chassis and located on one side of the chassis, the motherboard is detachably connected to the chassis and located inside the chassis, the CPU is detachably connected to the motherboard and located on one side of the motherboard, the GPU is detachably connected to the motherboard and located on one side of the motherboard, and the cooling assembly is disposed inside the chassis; The cooling assembly includes a heat conductive block, a first heat dissipation pipe, a second heat dissipation pipe, a cooling fin, a limiting rod, a cooling unit and a heat dissipation component. The heat conductive block is arranged on one side of the CPU and the GPU, one end of the first heat dissipation pipe is detachably connected to the heat conductive block and passes through the heat conductive block, one end of the second heat dissipation pipe is detachably connected to the heat conductive block and passes through the heat conductive block, the cooling fin is detachably connected to the first heat dissipation pipe and wraps the first heat dissipation pipe and the second heat dissipation pipe, the limiting rod is detachably connected to the cooling fin and is located below the cooling fin, and the limiting rod is fixedly connected to the inner wall of the chassis, the cooling unit is arranged on the inner wall of the chassis, and the heat dissipation component is arranged on the surface of the chassis.
2. The electronic computer with a cooling and heat dissipation structure according to claim 1, wherein: The cooling unit includes a fixed shell, a fixed rod, a motor and fan blades. The fixed shell is fixedly connected to the chassis and is located on the inner wall of the chassis. The fixed rod is fixedly connected to the fixed shell and is located on the inner wall of the fixed shell. The motor is fixedly connected to the fixed rod and is located at an end of the fixed rod away from the fixed shell. The fan blades are fixedly connected to the output end of the motor and are located on a side of the fixed shell close to the cooling fins.
3. The electronic computer with a cooling and heat dissipation structure according to claim 1, wherein: The heat dissipation component includes a heat sink and a dustproof unit. The heat sink is fixedly connected to the mainboard and is located on a side of the mainboard away from the CPU. The dustproof unit is arranged on the outside of the chassis.
4. The electronic computer with a cooling and heat dissipation structure according to claim 3, wherein: The dustproof unit includes a dustproof plate, which is fixedly connected to the chassis and wraps the heat sink.
5. The electronic computer with a cooling and heat dissipation structure according to claim 3, wherein: The heat dissipation component further includes a ventilation plate, which is fixedly connected to the machine cover and located inside the machine cover.