Graphics card PCB (Printed Circuit Board) process edge structure capable of preventing board from being stuck
By setting process edge structures on the upper and lower sides of the graphics card PCB, the problems of board jamming and falling are solved, the circuits and components are protected, production efficiency and quality are improved, and costs are reduced.
Patent Information
- Application Number
- CN202422777748.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-11-14
AI Technical Summary
Existing graphics card PCBs are prone to board jamming and falling off during the reflow oven transfer stage, and board edge wear affects circuits and components, increasing production costs and complexity.
A graphics card PCB process edge structure is designed to prevent board jamming, including setting an upper process edge, a left process edge, and a right process edge on the upper and lower sides of the PCB board respectively, and setting chamfers and connection points at the corners. The size and shape of the process edge are optimized to protect circuits and components.
Effectively protect the circuits and components on the edge of the PCB board, reduce the risk of board jams, improve production efficiency and product quality, reduce production costs and maintenance difficulty, and adapt to the needs of automated production.
Smart Images
Figure CN223320841U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of graphics card PCBs, and in particular to a graphics card PCB process edge structure for preventing board jamming. Background Art
[0002] A graphics card is a key component in computer hardware that is responsible for processing and rendering images, videos, and other graphics-related tasks.
[0003] In the existing graphics card PCB production process, especially during the reflow oven transfer stage, graphics card PCBs are prone to board jamming and board drop. Secondly, since the edges of the graphics card PCBs are in direct contact with the transfer track during the transfer process, the edges of the boards are worn. This wear may not only damage the circuits and components on the PCB boards, but also affect the overall performance and reliability of the graphics card.
[0004] To prevent board jamming and board dropout, some existing solutions include adding additional protective layers or structures to the edges of PCB boards. However, these methods often increase production costs and complexity and may not be suitable for automated production environments.
[0005] Therefore, in order to effectively prevent the phenomenon of card jamming and board dropping, and to meet the needs of automated production, we propose a graphics card PCB process edge structure to prevent card jamming. Utility Model Content
[0006] The purpose of the utility model is to solve the shortcomings of the prior art, such as the graphics card PCB board is prone to board jamming and board falling during the reflow furnace transfer stage, and to propose a graphics card PCB process edge structure that prevents board jamming.
[0007] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0008] A graphics card PCB process edge structure is designed to prevent board jamming, including a PCB board, an upper process edge formed on the upper side of the PCB board, and a left process edge and a right process edge formed on the two sides of the lower side of the PCB board respectively;
[0009] The left process edge and the right process edge are respectively located on both sides of the gold finger of the PCB board, and the corners of the upper process edge, the left process edge and the right process edge are all formed with chamfered portions R, and connection points are formed between the connection points of each process edge and the PCB board.
[0010] Furthermore, the distance between the centers of two adjacent connection points is A, and the radius of the connection point is R2.
[0011] Furthermore, the value of the center distance A is 6 mm, and the value of the radius R2 is 1 mm.
[0012] Furthermore, the length of the upper process edge is Y and the width is S, the length of the hollowed-out part of the upper process edge is O and the width is C, and the width from the hollowed-out part of the upper process edge to the process edge is B.
[0013] Furthermore, the length Y of the upper process edge is 196 mm and the width S is 2 mm;
[0014] The length O of the hollowed-out portion of the upper process edge is 58 mm, and the width C is 2 mm;
[0015] The width B from the hollowed-out portion of the upper process edge to the process edge is 4 mm.
[0016] Furthermore, the length of the left process edge is I, the width is H, the length of one of the left process edges is M, the width from the hollow part of the left process edge to its side is G, the length of the left process edge close to the board edge is N, the width of the left process edge close to the PCB board is E, and the width of the left process edge close to the PCB board is F.
[0017] Furthermore, the length I of the left process edge is 25 mm and the width H is 9 mm;
[0018] The length of one side of the left process side is M, which is 7 mm;
[0019] The width G from the hollowed-out portion of the left process edge to its side is 2.5 mm;
[0020] The length N of the left process edge close to the board edge is 7 mm;
[0021] The width E from the left process edge to the PCB board is 4 mm;
[0022] The width F of the left process edge close to the PCB board is 10 mm.
[0023] Furthermore, the length of the right process edge is J, and the width is K; the length of the hollowed-out portion of the right process edge is V, and the width is C.
[0024] Furthermore, the length J of the right process side is 40 mm and the width K is 14 mm;
[0025] The length V of the hollowed-out portion of the right process edge is 22 mm, and the width C is 2 mm.
[0026] Furthermore, the value of the chamfered portion R is 2 mm.
[0027] The utility model proposes a graphics card PCB process edge structure for preventing board jamming. The beneficial effects are as follows: by respectively providing an upper process edge, a left process edge, and a right process edge on the upper and lower sides of the PCB board, the utility model effectively protects the circuits and components at the edge of the PCB board, reduces the risk of damage during processing or installation, facilitates subsequent positioning, clamping, welding, and other operations, and reduces the risk of board jamming;
[0028] The design of the process edge also provides guide rail transmission space for the automated SMT placement machine, ensuring that the graphics card PCB board can pass through the machine smoothly during the production process, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 This is a schematic diagram of the structure of the utility model Figure 1 ;
[0030] Figure 2 This is a schematic diagram of the structure of the utility model Figure 2 .
[0031] In the figure: 1. PCB board; 2. Top process edge; 3. Left process edge; 4. Right process edge. DETAILED DESCRIPTION
[0032] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0033] Reference Figure 1-2 This is an embodiment of the present invention, which discloses a graphics card PCB process edge structure for preventing board jamming. Specifically, the process edge structure includes a PCB board 1, an upper process edge 2 is formed on the upper side of the PCB board 1, and a left process edge 3 and a right process edge 4 are formed on both sides of the lower side of the PCB board 1;
[0034] The left process edge 3 and the right process edge 4 are respectively located on both sides of the gold finger of the PCB board 1, and the corners of the upper process edge 2, the left process edge 3 and the right process edge 4 are all formed with chamfered portions R, and connection points are formed between the connection points of each process edge and the PCB board 1.
[0035] In some embodiments, the center distance between two adjacent connection points in the present invention is A, and the radius of the connection point is R2.
[0036] In a specific embodiment, the center distance A is 6 mm, and the radius R2 is 1 mm.
[0037] In addition, the length of the upper process edge 2 in the present invention is Y and the width is S, the length of the hollowed-out part of the upper process edge 2 is O and the width is C, and the width from the hollowed-out part of the upper process edge 2 to the process edge is B.
[0038] In a specific embodiment, the length Y of the upper process edge 2 is 196 mm and the width S is 2 mm;
[0039] The length O of the hollowed-out portion of the upper process edge 2 is 58 mm, and the width C is 2 mm;
[0040] The width B from the hollowed-out portion of the upper process edge 2 to the process edge is 4 mm.
[0041] Furthermore, the length of the left process edge 3 in the present invention is I, the width is H, the length of one side of the left process edge 3 is M, the width from the hollow part of the left process edge 3 to its side is G, the length of the left process edge 3 close to the board edge is N, the width of the left process edge 3 close to the PCB board 1 is E, and the width of the left process edge 3 close to the PCB board 1 is F.
[0042] In a specific embodiment, the length I of the left process edge 3 is 25 mm and the width H is 9 mm;
[0043] The length of one side of the left process edge 3 is M, which is 7 mm;
[0044] The width G of the left process edge 3 from the hollowed-out portion to its side is 2.5 mm;
[0045] The length N of the left process edge 3 close to the board edge is 7 mm;
[0046] The width E of the left process edge 3 to the PCB board 1 is 4 mm;
[0047] The width F of the left process edge 3 close to the PCB board 1 is 10 mm.
[0048] Furthermore, in the present invention, the length of the right process edge 4 is J, and the width is K; the length of the hollowed portion of the right process edge 4 is V, and the width is C.
[0049] In a specific embodiment, the length J of the right process edge 4 is 40 mm and the width K is 14 mm;
[0050] The length V of the hollowed-out portion of the right process edge 4 is 22 mm, and the width C is 2 mm.
[0051] It should be noted that, in the embodiment of the present invention, the value of the chamfered portion R is 2 mm.
[0052] In summary, the present invention effectively protects the circuits and components at the edges of the PCB board by providing an upper process edge 2, a left process edge 3, and a right process edge 4 on the upper and lower sides of the PCB board 1, thereby reducing the risk of damage during processing or installation, facilitating subsequent positioning, clamping, and welding operations, and reducing the risk of board jamming.
[0053] The design of the process edge also provides guide rail transmission space for the automated SMT placement machine, ensuring that the graphics card PCB board can pass through the machine smoothly during the production process, thereby improving production efficiency.
[0054] That is, by adding a process edge to the graphics card PCB board, the utility model not only protects the circuits and components at the edge of the PCB board, but also improves production efficiency and product quality, reduces production costs and maintenance difficulty, and has significant technical effects and practical value.
[0055] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A graphics card PCB process edge structure for preventing board jamming, comprising a PCB board (1), characterized in that: An upper process edge (2) is formed on the upper side of the PCB board (1), and a left process edge (3) and a right process edge (4) are respectively formed on both sides of the lower side of the PCB board (1); The left process edge (3) and the right process edge (4) are respectively located on both sides of the gold finger of the PCB board (1); the corners of the upper process edge (2), the left process edge (3) and the right process edge (4) are all formed with chamfered portions R, and connection points are formed between the connection points of each process edge and the PCB board (1).
2. The graphics card PCB process edge structure for preventing board jamming according to claim 1, characterized in that: The distance between the centers of two adjacent connection points is A, and the radius of the connection point is R2.
3. The graphics card PCB process edge structure for preventing board jamming according to claim 2, characterized in that: The value of the center distance A is 6 mm, and the value of the radius R2 is 1 mm.
4. The graphics card PCB process edge structure for preventing board jamming according to claim 1, characterized in that: The length of the upper process edge (2) is Y and the width is S. The length of the hollowed-out portion of the upper process edge (2) is O and the width is C. The width from the hollowed-out portion of the upper process edge (2) to the process edge is B.
5. The graphics card PCB process edge structure for preventing board jamming according to claim 4, characterized in that: The length Y of the upper process edge (2) is 196 mm, and the width S is 2 mm; The length O of the hollowed-out portion of the upper process edge (2) is 58 mm, and the width C is 2 mm; The width B from the hollowed-out portion of the upper process edge (2) to the process edge is 4 mm.
6. The graphics card PCB process edge structure for preventing board jamming according to claim 1, characterized in that: The length of the left process edge (3) is I, the width is H, the length of one side of the left process edge (3) is M, the width from the hollowed-out portion of the left process edge (3) to its side is G, the length of the left process edge (3) close to the board edge is N, the width from the left process edge (3) close to the PCB board (1) is E, and the width of the left process edge (3) close to the PCB board (1) is F.
7. The graphics card PCB process edge structure for preventing board jamming according to claim 6, characterized in that: The length I of the left process edge (3) is 25 mm, and the width H is 9 mm; The length of one side of the left process edge (3) is M, which is 7 mm; The width G from the hollowed-out portion of the left process edge (3) to its side is 2.5 mm; The length N of the left process edge (3) close to the plate edge is 7 mm; The width E from the left process edge (3) to the PCB board (1) is 4 mm; The width F of the left process edge (3) close to the PCB board (1) is 10 mm.
8. The graphics card PCB process edge structure for preventing board jamming according to claim 1, characterized in that: The length of the right process edge (4) is J, and the width is K. The length of the hollowed portion of the right process edge (4) is V, and the width is C.
9. The graphics card PCB process edge structure for preventing board jamming according to claim 8, characterized in that: The length J of the right process edge (4) is 40 mm, and the width K is 14 mm; The length V of the hollowed-out portion of the right process edge (4) is 22 mm, and the width C is 2 mm.
10. A graphics card PCB process edge structure for preventing board jamming according to any one of claims 1 to 9, characterized in that: The value of the chamfered portion R is 2 mm.