Projection equipment

Abstract

The projection equipment provided by the embodiment of the utility model comprises a main board, a display board, an adapter board and a projection light path, the adapter plate is additionally arranged between the main board and the display board, and the adapter plate is connected with the cascade equipment, so that the main board only needs to receive one image signal at an access port, the main board sends the received image signal to the adapter plate, the adapter plate converts the image signal into two image signals, one image signal is used for displaying, and the image signal for displaying is sent to the display board; and the image signal used for transmission is sent to the cascade equipment to enable the cascade equipment to display, so that a set of interface used for loop-through output of the image signal does not need to be additionally designed at the input end and the output end of the projection equipment, the structure of the projection equipment is simplified, and the projection equipment is more convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of projection display, in particular to a projection device. Background Art

[0002] Currently, in laser projection equipment products, in order to meet the cascade application needs of users in actual installation, the mainboard of the projection equipment needs to transmit image signals to other display devices in addition to the display panel. However, the image format of the image signal transmitted to the display panel by the mainboard of the projection equipment is different from that of the image signal transmitted to other display devices. Therefore, it is necessary to design an additional set of interfaces for outputting image signals to the outside at the input and output ends of the projection equipment, which makes the structure of the projection equipment more complicated. Utility Model Content

[0003] A first aspect of an embodiment of the present invention provides a projection device, comprising: a main board, a display panel, a projection optical path, and an adapter board; the main board and the display panel are connected via the adapter board, and the adapter board is connected to a cascade device;

[0004] The main board is configured to receive an image signal, send the image signal to the adapter board, and supply power to the adapter board;

[0005] The adapter board is configured to, after power-on, receive the image signal sent by the main board, determine a first image signal for display and a second image signal for transmission based on the image signal, send the first image signal to the display board, and send the second image signal to the cascade device;

[0006] The display panel is configured to receive the first image signal and, under the illumination of the laser light emitted by the projection optical path, perform light modulation processing on the laser light based on the first image signal to output a display image;

[0007] The projection optical path is used to emit laser light and project the display image output by the display panel.

[0008] In some embodiments of the present invention, the adapter board includes: a power conversion module and a main chip;

[0009] The power conversion module is connected to the main chip, and the power conversion module is connected to the electrical signal output terminal of the main board; the main chip is connected to the image signal output terminal of the main board, the main chip is connected to the display panel, and the main chip is connected to the cascade device;

[0010] The power conversion module is used to convert the electrical signal output by the electrical signal output terminal of the mainboard into the operating voltage of the main chip;

[0011] The main chip is used to receive the image signal sent by the main board, determine a first image signal for display and a second image signal for transmission based on the image signal, send the first image signal to the display panel, and send the second image signal to the cascade device.

[0012] In some embodiments of the present invention, the main chip includes: a plurality of signal receiving terminals, a plurality of first signal sending terminals, and a plurality of second signal sending terminals;

[0013] The main chip receives the image signal sent by the image signal output terminal of the main board through the plurality of signal receiving terminals;

[0014] The main chip sends the first image signal to the display panel through the plurality of first signal sending terminals;

[0015] The master chip transmits the second image signal to the cascade device through a plurality of second signal transmitting terminals.

[0016] In some embodiments of the present invention, the power conversion module includes a basic voltage conversion unit, a core voltage conversion unit, and an operating voltage conversion unit;

[0017] The core voltage conversion unit and the working voltage conversion unit are both connected to the electrical signal output terminal of the mainboard through the basic voltage conversion unit;

[0018] The basic voltage conversion unit is used to convert the electrical signal output by the power supply terminal of the mainboard into a basic voltage;

[0019] The core voltage conversion unit is connected to the main chip and is used to convert the basic voltage into a core voltage for use by the main chip;

[0020] The operating voltage conversion unit is connected to the main chip and is used to convert the basic voltage into the operating voltage of the main chip.

[0021] In some embodiments of the present invention, the basic voltage conversion unit includes a first chip; the first chip is connected to the electrical signal output terminal of the mainboard;

[0022] The core voltage conversion unit includes a second chip; the second chip is connected to the first chip; the second chip is connected to the main chip, and the electrical signal output from the electrical signal output terminal of the mainboard is converted into a voltage through the first chip and the second chip in sequence, so that the second chip outputs the core voltage for use by the main chip;

[0023] The operating voltage of the main chip includes a first voltage, a second voltage, a third voltage, and a fourth voltage;

[0024] The working voltage conversion unit includes a third chip, a fourth chip, a fifth chip, and a sixth chip;

[0025] The third chip is connected to the first chip, the third chip is connected to the fourth chip, and the fourth chip is connected to the main chip; the electrical signal output by the electrical signal output terminal of the mainboard is converted into a voltage through the first chip, the third chip, and the fourth chip in sequence, so that the fourth chip outputs the first voltage for use by the main chip;

[0026] The third chip is connected to the main chip, and the electrical signal output by the electrical signal output terminal of the mainboard is converted into a voltage through the first chip and the third chip in sequence, so that the third chip outputs the second voltage for use by the main chip;

[0027] The third chip is connected to the fifth chip, and the fifth chip is connected to the main chip; the electrical signal output by the electrical signal output terminal of the mainboard is converted into a voltage through the first chip, the third chip, and the fifth chip in sequence, so that the fifth chip outputs the third voltage for use by the main chip;

[0028] The third chip is connected to the sixth chip, and the sixth chip is connected to the main chip. The electrical signal output from the electrical signal output end of the mainboard is converted into voltage through the first chip, the third chip, and the sixth chip in sequence, so that the sixth chip outputs the fourth voltage for use by the main chip.

[0029] In some embodiments of the present invention, the main chip further includes: a first power terminal, a second power terminal, a third power terminal, a fourth power terminal, and a fifth power terminal;

[0030] The second chip provides the core voltage to the main chip through the first power terminal;

[0031] The fourth chip provides the first voltage to the main chip through the second power terminal;

[0032] The third chip provides the second voltage to the main chip through the third power terminal;

[0033] The fifth chip provides the third voltage to the main chip through the fourth power terminal;

[0034] The sixth chip provides the fourth voltage to the main chip through the fifth power terminal.

[0035] In some embodiments of the present invention, the adapter board further includes: an audio receiving module; the audio receiving module is connected to the audio signal output terminal of the main board;

[0036] An audio receiving module, used for receiving an audio signal sent by the audio signal output terminal of the mainboard;

[0037] The main chip is further configured to integrate the second image signal and the audio signal to obtain an audio and video signal, and send the audio and video signal to the audio and video signal receiving end of the cascade device.

[0038] In some embodiments of the present invention, the main chip is connected to an audio device for audio playback, and the main chip is further used to convert the audio signal into an audio signal in a format suitable for playback by the audio device, and send the audio signal to the audio device.

[0039] In some embodiments of the present invention, the adapter board further includes: an indicator circuit;

[0040] The indication circuit includes a first power interface, a transistor, an indicator light, a first resistor, a second resistor and a third resistor; the first power interface is connected to the input end of the transistor; the first power interface is connected to the main chip through the first resistor and the second resistor; the main chip is connected to the control end of the transistor through the second resistor; and the output end of the transistor is connected to the indicator light through the third resistor.

[0041] In some embodiments of the present invention, the adapter board further includes: a memory, a first test circuit and / or a second test circuit;

[0042] The first test circuit is connected to the memory; the first test circuit is used to debug the software in the memory; the memory is connected to the main chip; the memory is used to store the software executed by the main chip;

[0043] The first test circuit includes a first test port, a fourth resistor, a fifth resistor, a second power interface, a first diode, and a second diode; the first test port is connected to the memory through the fourth resistor; the anode of the first diode is connected to the second power interface, and the cathode of the first diode is connected to the memory through the fifth resistor; the anode of the second diode is connected to the second power interface, and the cathode of the second diode is connected to the memory through the fifth resistor;

[0044] The second test circuit is connected to the memory; the second test circuit is used to debug the software in the memory;

[0045] The second test circuit includes a second test port, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, and a third power supply interface; the second test port includes a first connection port, a second connection port, and a third connection port; the first connection port is connected to the memory through the sixth resistor; the second connection port is connected to the memory through the seventh resistor; the third power supply interface is connected to the first interface through the eighth resistor and the sixth resistor; the third power supply interface is connected to the second interface through the ninth resistor and the seventh resistor; and the third interface is grounded.

[0046] A projection device provided by an embodiment of the present invention includes: a main board, a display board, an adapter board, and a projection optical path; an adapter board is added between the main board and the display board, and the adapter board is connected to a cascade device, so that the main board only needs to receive one image signal at an access port, and the main board sends the received image signal to the conversion board, and the adapter board converts the image signal into two image signals, one for display, and the image signal for display is sent to the display board for projection display; and the other for transmission, and the image signal for transmission is sent to the cascade device, so that the cascade device performs display. In this way, there is no need to design an additional set of interfaces for loop-through output image signals at the input and output ends of the projection device, which simplifies the structure of the projection device and makes it more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings introduced below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0048] Figure 1 It is a structural diagram of a projection device in the related art;

[0049] Figure 2 This is one of the structural schematic diagrams of a projection device provided by an embodiment of the present utility model;

[0050] Figure 3 A schematic structural diagram of an adapter plate provided in an embodiment of the present utility model;

[0051] Figure 4 A schematic diagram of the operation of a main chip provided by an embodiment of the utility model;

[0052] Figure 5 A schematic structural diagram of a main chip provided in an embodiment of the present utility model;

[0053] Figure 6A schematic diagram of a signal terminal for image transmission of a main chip provided by an embodiment of the present utility model;

[0054] Figure 7 A schematic diagram illustrating the relationship between a power conversion module and a main chip provided by an embodiment of the present utility model;

[0055] Figure 8 A schematic diagram of the internal structure of a power conversion module provided by an embodiment of the present utility model;

[0056] Figure 9 A schematic diagram of an electrical signal terminal of a main chip provided by an embodiment of the present utility model;

[0057] Figure 10 A schematic diagram of a power-on process within a power adapter module provided in an embodiment of the present utility model;

[0058] Figure 11 A third schematic diagram of a projection device provided by an embodiment of the present utility model;

[0059] Figure 12 A schematic structural diagram of an indicator circuit provided in an embodiment of the present utility model;

[0060] Figure 13 A schematic structural diagram of a first test circuit provided in an embodiment of the present utility model;

[0061] Figure 14 A schematic structural diagram of a second test circuit provided in an embodiment of the present utility model;

[0062] Figure 15 A schematic diagram of the connection relationship between a main chip and a memory provided in an embodiment of the present utility model. DETAILED DESCRIPTION

[0063] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention will be further described below with reference to the accompanying drawings and examples. However, the example embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concepts of the example embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained with reference to the accompanying drawings as examples, but changes can be made as needed, and all changes are included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate the relative position relationship and do not represent the true proportion.

[0064] Projection equipment is a device that uses an optical system and projection space to display flat image information on a projection surface, such as Figure 1 As shown, an embodiment of the present invention provides a projection device, including: a main board 100, a display panel 101, and a projection optical path 102; the main board 100 and the display panel 101 are connected.

[0065] During projection display, the main board 100 of the projection device receives the image signal and transmits the image signal to the display panel 101. The projection optical path 102 emits laser and incidents the laser onto the display panel 101. The display panel 101 emits a display image based on the received laser and image signal and projects the display image.

[0066] The projection optical path 102 includes at least a laser 1021 and a lens 1022. The laser 1021 emits laser light, which is incident on the display panel 101. The display panel 101 modulates the laser light to emit a display image, which is then projected through the lens 1022.

[0067] In addition to projecting images independently, projectors can also display the same image together with other display devices, a situation known as cascading. In this cascaded application, the projector's mainboard not only transmits image signals to the display panel, but also to the other display devices. However, the image signals transmitted by the projector's mainboard to the display panel and to the other display devices differ in image format. Therefore, additional interfaces for looping through the output image signals are required at the projector's input and output terminals, complicating the projector's structure.

[0068] Based on this, the projection device of the embodiment of the present invention uses an adapter plate to replace the interface for looping through the output image signal. Figure 2 As shown, an embodiment of the present invention provides a structure of a projection device, including a main board 100, an adapter board 103, a display board 101, and a projection optical path 102; the main board 100 of the projection device and the display board 101 of the projection device are connected through the adapter board 103, and the cascade device 302 is connected to the adapter board 103.

[0069] It should be noted that the cascade device 302 is a display device, such as a projection device, a television, a computer, and the like.

[0070] The main board 100 is used to receive image signals, send the image signals to the adapter board 103, and supply power to the adapter board 103;

[0071] The adapter board 103 is configured to receive an image signal sent by the main board after power is applied, determine a first image signal for display and a second image signal for transmission based on the image signal, send the first image signal to the display board 101, and send the second image signal to the cascade device 302;

[0072] The display panel 101 is configured to receive a first image signal and, under the illumination of the laser light emitted by the projection optical path 102, perform light modulation processing on the laser light based on the first image signal to output a display image;

[0073] The projection optical path 102 is used to emit laser light and project the display image output by the display panel 101.

[0074] Exemplarily, when the mainboard is connected to a power source, mainboard 100 supplies power to adapter board 103, which powers on. Mainboard 100 of the projection device receives an image signal, such as a Vx1 signal. Mainboard 100 of the projection device transmits the Vx1 signal to adapter board 103. Adapter board 103 receives the Vx1 signal from mainboard 100 of the projection device and, based on the received image signal, determines the Vx1 signal for display and the HDMI signal for transmission. Adapter board 103 then outputs the Vx1 signal to display panel 101 and the HDMI signal to cascade device 302. Cascade device 302 receives the HDMI signal and displays it. During projection by projection device 301, laser 1021 is used to emit laser light, which is incident on display panel 101. Display panel 101 modulates the laser light based on the Vx1 signal, and displays the image emitted by display panel 101. The displayed image is then projected through lens 1022.

[0075] The projection device of the embodiment of the present invention uses an adapter board added between the main board and the display board to connect the adapter board to the cascade device. In this way, the main board only needs to receive one image signal at the access port, and the main board sends the received image signal to the conversion board. The conversion board uses this image signal to convert it into two image signals, one for display, and the image signal for display is sent to the display board for projection display; the other for transmission, and the image signal for transmission is sent to the cascade device, so that the cascade device can display. In this way, there is no need to design an additional set of interfaces for loop-through output image signals at the input and output ends of the projection device, which simplifies the structure of the projection device and makes it more convenient to use.

[0076] Combine Figure 3 As shown, the adapter board includes: a power conversion module 303 and a main chip 304; the power conversion module 303 is connected to the main chip 304, and the power conversion module 303 is connected to the electrical signal output terminal 1001 of the main board 100; the main chip 304 is connected to the image signal output terminal 1002 of the main board 100, the main chip 304 is connected to the display panel 101, and the main chip 304 is connected to the cascade device 302.

[0077] The power conversion module 303 is used to convert the electrical signal output from the electrical signal output terminal 1001 of the mainboard 100 of the projection device into an operating voltage for the main chip 304 .

[0078] The main chip 304 is used to receive the image signal sent by the mainboard, determine the first image signal for display and the second image signal for transmission according to the image signal, send the first image signal to the display board, and send the second image signal to the cascade device.

[0079] Exemplarily, the mainboard 100 outputs an electrical signal to the power conversion module 303 through the electrical signal output terminal 100, the power conversion module 303 converts the voltage into the operating voltage of the main chip 304, the mainboard 100 receives the Vx1 signal, the mainboard 100 sends the Vx1 signal to the main chip 304 through the image signal output terminal 1002, the main chip 304 receives the Vx1 signal of the mainboard 100, converts the Vx1 signal into an HDMI signal, sends the Vx1 signal to the display panel 101 of the projection device, and sends the HDMI signal to the cascade device 302.

[0080] In some embodiments, combined Figure 4 As shown, the main chip 304 includes a receiving unit 3041 and a processing unit 3042;

[0081] The receiving unit 3041 is connected to the image signal output terminal of the main board 100 of the projection device; the receiving unit 3041 is connected to the processing unit 3042; the processing unit 3042 is connected to the display board 101 of the projection device; and the processing unit 3042 is connected to the cascade device 302.

[0082] The receiving unit 3041 is configured to receive an image signal outputted from the image signal output terminal of the projection device's mainboard 100. For example, the receiving unit 3041 receives a Vx1 signal outputted from the image signal output terminal of the projection device's mainboard 100.

[0083] The processing unit 3042 is configured to convert the image signal into a first image signal and a second image signal. For example, the processing unit 3042 converts the Vx1 signal output by the projection device's mainboard 100 into a Vx1 signal and an HDMI signal. The first image signal is the Vx1 signal, and the second image signal is the HDMI signal.

[0084] The processing unit 3042 is further configured to send the first image signal to the display panel 101. The processing unit 3042 is further configured to send the second image signal to the cascade device 302.

[0085] For example, the main chip can be NT68411, combined with Figure 5As shown, the receiving unit 3041 may include a DATA MUX multiplexer, and the processing unit 3042 may include an AUDIO VIDEO functional module. The DATA MUX receives the Vx1 signal, adjusts the format of the received Vx1 signal, and transmits the adjusted Vx1 signal to the AUDIO VIDEO functional module. The AUDIO VIDEO functional module converts the adjusted Vx1 signal into an HDMI signal. The AUDIO VIDEO functional module transmits the Vx1 signal to the display panel and transmits the HDMI signal to the cascaded device.

[0086] In some embodiments, the master chip includes: a plurality of signal receiving terminals, a plurality of first signal sending terminals, and a plurality of second signal sending terminals.

[0087] The main chip is connected to the image signal output terminal of the main board of the projection device through a plurality of signal receiving terminals; the main chip receives the image signal output from the image signal output terminal of the main board of the projection device through the plurality of signal receiving terminals;

[0088] The main chip is connected to the display panel of the projection device through the multiple first signal sending terminals, and the main chip sends the first image signal to the display panel of the projection device through the multiple first signal sending terminals.

[0089] The main chip is connected to the cascade device through a plurality of second signal sending terminals, and the main chip sends the second image signal to the cascade device through the plurality of second signal sending terminals.

[0090] For example, combined with Figure 6 As shown, the signal receiving terminals are VX1_RX0N~VX1_RX7P, and the main chip receives 8-channel Vx1 signals output by the image signal output terminal of the mainboard of the projection device through VX1_RX0N~VX1_RX7P. The first signal sending terminals are VX1_0N~VX1_7P, and the main chip sends 8-channel Vx1 signals to the display board of the projection device through VX1_0N~VX1_7P. The second signal sending terminals are HTXA_CN~HTXA_2P, and the main chip sends 4-channel HDMI signals to the image signal receiving terminal of the cascade device through HTXA_CN~HTXA_2P.

[0091] Combine Figure 7 As shown, the power conversion module includes a basic voltage conversion unit 3030 , a core voltage conversion unit 3031 , and an operating voltage conversion unit 3032 .

[0092] The core voltage conversion unit 3031 and the working voltage conversion unit 3032 are both connected to the electrical signal output terminal of the mainboard of the projection device through the basic voltage conversion unit 3030;

[0093] A basic voltage conversion unit 3030 is used to convert the electrical signal output from the power supply terminal of the mainboard of the projection device into a basic voltage;

[0094] The core voltage conversion unit 3031 is connected to the main chip 304 and is used to convert the base voltage into the core voltage for use by the main chip 304;

[0095] The operating voltage conversion unit 3032 is connected to the main chip 304 and is configured to convert the basic voltage into an operating voltage for the main chip 304 .

[0096] Exemplarily, the basic voltage conversion unit includes a first chip; the first chip is connected to the electrical signal output terminal of the mainboard of the projection device, and the electrical signal output by the electrical signal output terminal of the mainboard of the projection device is voltage-adjusted by the first chip, so that the first chip outputs a basic voltage, wherein the basic voltage is 5V, combined with Figure 8 As shown, the first chip is TMI3331:3A, and the working process is: TMI3331:3A converts the 12V voltage and 0.2A current provided by the motherboard into a basic voltage of 5V and a current of 0.5A.

[0097] The core voltage conversion unit includes a second chip connected to the first chip, which is also connected to the main chip. The electrical signal output from the projection device's mainboard's electrical signal output terminal undergoes voltage conversion through the first and second chips, allowing the second chip to output a core voltage for use by the main chip. The core voltage is 1V. The second chip is a CD1653:3A. Its operating process is as follows: TMI3331:3A converts the 12V voltage and 0.2A current provided by the mainboard into a 5V base voltage and 0.5A current. This power then enters CD1653:3A, which converts the 5V base voltage and 0.5A current into a 1V core voltage and 1.5A current. This 1V core voltage and 1.5A current are then supplied to the main chip 304.

[0098] Among them, the operating voltage of the main chip includes a first voltage, a second voltage, a third voltage, and a fourth voltage, and the operating voltage conversion unit includes a third chip, a fourth chip, a fifth chip, and a sixth chip.

[0099] The third chip is connected to the first chip, the third chip is connected to the fourth chip, and the fourth chip is connected to the main chip; the electrical signal output from the electrical signal output end of the projection device's mainboard is sequentially converted to a voltage through the first chip, the third chip, and the fourth chip, so that the fourth chip outputs the first voltage for use by the main chip; wherein the first voltage is 1.8V, the third chip is CD1653:3A, and the fourth chip is AZ1117:1A. The specific working process is: TMI3331:3A converts the 12V voltage provided by the mainboard and 0 .2A current is converted into a basic voltage of 5V and a current of 0.5A, and then the electricity is input to CD1653:3A. CD1653:3A converts the basic voltage of 5V and the current of 0.5A into electricity of 3.3V voltage and 0.3A current. Then the electricity of 3.3V voltage and 0.3A current enters AZ1117:1A. AZ1117:1A converts the voltage of 3.3V and the current of 0.3A into electricity of 1.8V voltage, and the electricity of 1.8V voltage is supplied to the main chip 304 for use.

[0100] The third chip is connected to the main chip, and the electrical signal output from the electrical signal output end of the mainboard of the projection device is converted into voltage through the first chip and the third chip in sequence, so that the third chip outputs a second voltage for use by the main chip; wherein the second voltage is 3.3V. For example, the specific working process is: TMI3331:3A converts the 12V voltage and 0.2A current provided by the mainboard into a basic voltage of 5V and a current of 0.5A, and then inputs the electricity to CD1653:3A, CD1653:3A converts the basic voltage of 5V and the current of 0.5A into a 3.3V voltage and a current of 0.3A, and supplies the 3.3V voltage and 0.3A current to the second sending unit 3043 for use, and can also be used for the GPIO port of the main chip.

[0101] The third chip is connected to the fifth chip, and the fifth chip is connected to the main chip; the electrical signal output from the electrical signal output end of the mainboard of the projection device is converted into voltage through the first chip, the third chip, and the fifth chip in sequence, so that the fifth chip outputs a third voltage for use by the main chip, wherein the third voltage is 2.5V. For example, the fifth chip is AZ1117:1A, and the specific working process is; TMI3331:3A converts the 12V voltage and 0.2A current provided by the mainboard into a basic voltage of 5V and a current of 0.5A, and then inputs the electricity to CD1653:3A, CD1653:3A converts the basic voltage of 5V and the current of 0.5A into 3.3V voltage and 0.3A current, and then the 3.3V voltage and 0.3A current enter AZ1117:1A, AZ1117:1A converts the 3.3V voltage and 0.3A current into 2.5V voltage, and supplies the 2.5V voltage to the main chip 304 for use.

[0102] The third chip is connected to the sixth chip, which is connected to the main chip. The electrical signal output from the electrical signal output terminal of the projection device's mainboard is sequentially converted through the first, third, and sixth chips, causing the sixth chip to output a fourth voltage for use by the main chip. The fourth voltage is 1.5V. For example, the sixth chip is AZ1117:1A. The specific operating process is as follows: Another path is: TMI3331:3A converts the 12V voltage and 0.2A current provided by the mainboard into a base voltage of 5V and a current of 0.5A. This current is then fed to CD1653:3A. CD1653:3A converts the base voltage of 5V and the current of 0.5A into 3.3V and the current of 0.3A. This current is then fed to AZ1117:1A. AZ1117:1A converts the 3.3V and the current of 0.3A into 1.5V, which is then fed to the main chip 304.

[0103] In some embodiments, the master chip further includes: a first power terminal, a second power terminal, a third power terminal, a fourth power terminal, and a fifth power terminal;

[0104] The second chip provides core voltage to the main chip through the first power terminal;

[0105] The fourth chip provides the first voltage to the main chip through the second power terminal;

[0106] The third chip provides a second voltage to the main chip through a third power supply terminal;

[0107] The fifth chip provides a third voltage to the main chip through the fourth power terminal;

[0108] The sixth chip provides a fourth voltage to the main chip through the fifth power terminal.

[0109] For example, combined with Figure 9 As shown, VDD10_RX is a first power supply terminal, and the second chip provides a core voltage of 1.0V to the main chip 304 through VDD10_RX.

[0110] VDD18_RX is a second power supply terminal, and the fourth chip provides a first voltage of 1.8V to the main chip 304 through VDD18_RX.

[0111] TX_VCC33 is a third power supply terminal, and the third chip provides a second voltage of 3.3V to the main chip 304 through TX_VCC33.

[0112] TXVCC25 is a fourth power supply terminal, and the fifth chip provides a 2.5V voltage to the main chip 304 through TXVCC25.

[0113] TX_VCC15 is a fifth power supply terminal, and the sixth chip provides a voltage of 1.5V to the main chip 304 through TX_VCC15.

[0114] Among them, after multi-level power supply, the power-on time sequence logic combination of the power conversion module can be realized Figure 10 As shown, the second chip is powered first. When the second chip converts the voltage to 0.9V, the third chip increases the voltage from 0.9V to 3.3V within a first time T1, reaching a minimum of 2.8V. The fifth chip increases the voltage from 0.9V to 2.5V within a second time T3, reaching a minimum of 2.25V. The fourth chip increases the voltage from 0.9V to 1.8V within a third time T4, reaching a minimum of 1.65V. The sixth chip increases the voltage from 0.9V to 1.5V within a fourth time T5, reaching a minimum of 1.35V. T1 is greater than 0.5ms and less than 5ms, and T3, T4, and T5 are all greater than 1ms and less than 10ms.

[0115] In some embodiments, the adapter board further includes: an audio receiving module; the audio receiving module is connected to the audio signal output terminal of the mainboard of the projection device;

[0116] An audio receiving module, used for receiving an audio signal sent from an audio signal output terminal of a mainboard of a projection device;

[0117] The main chip is also used to integrate the second image signal and the audio signal to obtain an audio and video signal, and send the audio and video signal to the audio and video signal receiving end of the cascade device.

[0118] In some embodiments, the main chip is connected to an audio device for audio playback, and the main chip is further used to convert the audio signal into an audio signal in a format suitable for playback by the audio device and send the audio signal to the audio device.

[0119] For example, the main chip can be NT68411, combined with Figure 11As shown, the receiving unit may include a DATA MUX multiplexer, the processing unit includes an AUDIO VIDEO functional module, and the audio receiving module is a terminal for receiving audio signals in LINE IN / I2S format. The DATA MUX receives the Vx1 signal, converts it into an audio-free HDMI TX2.0 signal through the AUDIO VIDEO functional module, and sends the Vx1 signal to the display panel. The audio signal terminal receives the LINE IN signal (analog audio information) or the I2S IN signal (digital audio information), integrates the audio-free HDMI TX2.0 signal with the audio signal, and generates an HDMI TX2.0 signal with audio. This HDMI TX2.0 signal with audio is then sent to the cascaded device. If the audio device is a device that receives digital audio signals, the AUDIO VIDEO function module converts the audio signal in the LINE IN / I2S format into SPDIF / I2S (digital audio signal), and the SPDIF / I2S (digital audio signal) can be directly sent to the audio device; if the audio device is a device that receives analog audio signals, the AUDIO VIDEO function module converts the audio signal in the LINE IN / I2S format into a digital audio signal, and the digital audio signal is converted into an analog signal using a DAC (Digital-to-Analog Converter) to obtain AUDIO L / R (left and right channel analog audio signals), and the AUDIO L / R is output to the audio device, which plays the audio signal. The audio device can be a speaker or other device, or a device used for an external power amplifier.

[0120] In some embodiments, the adapter board further includes: an indicator circuit;

[0121] Combine Figure 12 As shown, the indication circuit includes a first power interface 305-a, a transistor 305-b, an indicator light 305-c, a first resistor 305-d, a second resistor 305-e and a third resistor 305-f; the first power interface 305-a is connected to the input end of the transistor 305-b; the first power interface 305-a is connected to the main chip through the first resistor 305-d and the second resistor 305-e, specifically, connected to the F2 interface of the main chip; the F2 interface of the main chip is connected to the control end of the transistor 305-b through the second resistor 305-e; the output end of the transistor 305-b is connected to the indicator light 305-c through the third resistor 305-f.

[0122] Specifically, the first power interface 305-a receives a 3.3V voltage, the control terminal of transistor 305-b is the base, the input terminal of transistor 305-b is the collector, and the output terminal of transistor 305-b is the emitter. When the main chip is powered on, an electrical signal is sent through the F2 interface, and the first power interface 305-a provides a 3.3V voltage, which turns on transistor 305-b. The emitter of transistor 305-b then powers indicator light 305-c through the third resistor 305-f. After power is applied, indicator light 305-c lights up, informing the user that the adapter board has been successfully powered on.

[0123] In some embodiments, the adapter board further includes: a memory, a first test circuit and / or a second test circuit;

[0124] The first test circuit is connected to the memory; the first test circuit is used to debug the software in the memory; the memory is connected to the main chip; the memory is used to store the software executed by the main chip; for example, the memory stores the software of the functions introduced above executed by the main chip.

[0125] Combine Figure 13 As shown, the first test circuit includes a first test port CEC_CTRL, a fourth resistor 306-a, a fifth resistor 306-b, a second power supply interface 306-c, a first diode 306-d, and a second diode 306-e; the first test port CEC_CTRL is connected to the memory through the fourth resistor 306-a; the anode of the first diode 306-d is connected to the second power supply interface 306-c, and the cathode of the first diode 306-d is connected to the memory through the fifth resistor 306-b; the anode of the second diode 306-e is connected to the second power supply interface 306-c, and the cathode of the second diode 306-e is connected to the memory through the fifth resistor 306-b.

[0126] Exemplarily, the first diode 306-d and the second diode 306-e can prevent the current of the first test port CEC_CTRL from flowing to the second power interface 306-c. The first test port CEC_CTRL is connected to the HDMI interface. The first test port CEC_CTRL is connected to the memory 307 through the P1 interface of the main chip. During the test process, the second power interface 306-c provides a pull-up voltage of 3.3V. The first test port CEC_CTRL is connected to the HDMI interface. The HDMI interface is then connected to the test equipment. The test equipment tests the program in the memory 307 through the first test circuit.

[0127] The second test circuit is connected to the memory; the second test circuit is used to debug the software in the memory;

[0128] Combine Figure 14As shown, the second test circuit includes a second test port XP1, a sixth resistor 308-a, a seventh resistor 308-b, an eighth resistor 308-c, a ninth resistor 308-d, and a third power interface 308-e; the second test port XP1 includes a first connection port XP1-1, a second connection port XP1-2, and a third connection port XP1-3; the first connection port XP1-1 is connected to the memory through the sixth resistor 308-a; the second connection port XP1-2 is connected to the memory through the seventh resistor 308-b; the third power interface 308-e is connected to the first interface XP1-1 through the eighth resistor 308-c and the sixth resistor 308-a; the third power interface 308-e is connected to the second interface XP1-2 through the ninth resistor 308-d and the seventh resistor 308-b; and the third interface XP1-3 is grounded.

[0129] Exemplarily, the second test port XP1 is connected to the Vx1 interface. During the test, the third power supply interface 308-e provides a pull-up voltage of 3.3V. The second test port XP1 is connected to the Vx1 interface, and the Vx1 interface is then connected to the test equipment. The test equipment tests the program in the memory 309 through the second test circuit.

[0130] The first test circuit and the second test circuit are connected to the memory, not directly, but through the main chip transfer, combined with Figure 15 As shown, the main chip 304 is connected to the memory 309. Specifically, the CE pin of the main chip 304 is connected to the CE pin of the memory 309 through resistor R1. Port 8 of the memory is connected to a 3.3V voltage, and port 7 of the memory is connected to a 3.3V voltage through resistor R7. The SDI pin of the main chip 304 is connected to the SDI port of the memory 309 through resistors R3 and R8; the SDO pin of the main chip 304 is connected to the SDO port of the memory 309 through resistors R4 and R6.

[0131] In this document, relational terms such as “first” and “second” are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any actual relationship or order between these entities or operations.

[0132] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A projection device, characterized in that: include: Main board, display board, projection optical path, adapter board; The main board and the display panel are connected via the adapter board, and the adapter board is connected to the cascade device; The main board is configured to receive an image signal, send the image signal to the adapter board, and supply power to the adapter board; The adapter board is configured to, after power-on, receive the image signal sent by the main board, determine a first image signal for display and a second image signal for transmission based on the image signal, send the first image signal to the display board, and send the second image signal to the cascade device; The display panel is configured to receive the first image signal and, under the illumination of the laser light emitted by the projection optical path, perform light modulation processing on the laser light based on the first image signal to output a display image; The projection optical path is used to emit laser light and project the display image output by the display panel.

2. The projection device according to claim 1, wherein: The adapter board includes: a power conversion module and a main chip; The power conversion module is connected to the main chip, and the power conversion module is connected to the electrical signal output terminal of the main board; the main chip is connected to the image signal output terminal of the main board, the main chip is connected to the display panel, and the main chip is connected to the cascade device; The power conversion module is used to convert the electrical signal output by the electrical signal output terminal of the mainboard into the operating voltage of the main chip; The main chip is used to receive the image signal sent by the main board, determine a first image signal for display and a second image signal for transmission based on the image signal, send the first image signal to the display panel, and send the second image signal to the cascade device.

3. The projection device according to claim 2, characterized in that The main chip includes: a plurality of signal receiving terminals, a plurality of first signal sending terminals, and a plurality of second signal sending terminals; The main chip receives the image signal sent by the image signal output terminal of the main board through the plurality of signal receiving terminals; The main chip sends the first image signal to the display panel through the plurality of first signal sending terminals; The master chip transmits the second image signal to the cascade device through a plurality of second signal transmitting terminals.

4. The projection device according to claim 2, characterized in that The power conversion module includes a basic voltage conversion unit, a core voltage conversion unit, and an operating voltage conversion unit; The core voltage conversion unit and the working voltage conversion unit are both connected to the electrical signal output terminal of the mainboard through the basic voltage conversion unit; The basic voltage conversion unit is used to convert the electrical signal output by the power supply terminal of the mainboard into a basic voltage; The core voltage conversion unit is connected to the main chip and is used to convert the basic voltage into a core voltage for use by the main chip; The operating voltage conversion unit is connected to the main chip and is used to convert the basic voltage into the operating voltage of the main chip.

5. The projection device according to claim 4, characterized in that: The basic voltage conversion unit includes a first chip; the first chip is connected to the electrical signal output terminal of the mainboard; The core voltage conversion unit includes a second chip; the second chip is connected to the first chip; the second chip is connected to the main chip, and the electrical signal output from the electrical signal output terminal of the mainboard is converted into a voltage through the first chip and the second chip in sequence, so that the second chip outputs the core voltage for use by the main chip; The operating voltage of the main chip includes a first voltage, a second voltage, a third voltage, and a fourth voltage; The working voltage conversion unit includes a third chip, a fourth chip, a fifth chip, and a sixth chip; The third chip is connected to the first chip, the third chip is connected to the fourth chip, and the fourth chip is connected to the main chip; the electrical signal output by the electrical signal output terminal of the mainboard is converted into a voltage through the first chip, the third chip, and the fourth chip in sequence, so that the fourth chip outputs the first voltage for use by the main chip; The third chip is connected to the main chip, and the electrical signal output by the electrical signal output terminal of the mainboard is converted into a voltage through the first chip and the third chip in sequence, so that the third chip outputs the second voltage for use by the main chip; The third chip is connected to the fifth chip, and the fifth chip is connected to the main chip; the electrical signal output by the electrical signal output terminal of the mainboard is converted into a voltage through the first chip, the third chip, and the fifth chip in sequence, so that the fifth chip outputs the third voltage for use by the main chip; The third chip is connected to the sixth chip, and the sixth chip is connected to the main chip. The electrical signal output from the electrical signal output end of the mainboard is converted into voltage through the first chip, the third chip, and the sixth chip in sequence, so that the sixth chip outputs the fourth voltage for use by the main chip.

6. The projection device according to claim 5, characterized in that The main chip further includes: a first power terminal, a second power terminal, a third power terminal, a fourth power terminal, and a fifth power terminal; The second chip provides the core voltage to the main chip through the first power terminal; The fourth chip provides the first voltage to the main chip through the second power terminal; The third chip provides the second voltage to the main chip through the third power terminal; The fifth chip provides the third voltage to the main chip through the fourth power terminal; The sixth chip provides the fourth voltage to the main chip through the fifth power terminal.

7. The projection device according to claim 2, wherein: The adapter board further includes: an audio receiving module; the audio receiving module is connected to the audio signal output terminal of the main board; An audio receiving module, used for receiving an audio signal sent by the audio signal output terminal of the mainboard; The main chip is further configured to integrate the second image signal and the audio signal to obtain an audio and video signal, and send the audio and video signal to the audio and video signal receiving end of the cascade device.

8. The projection device according to claim 7, characterized in that The main chip is connected to an audio device for audio playback, and is further configured to convert an audio signal into an audio signal in a format suitable for playback by the audio device, and send the converted signal to the audio device.

9. The projection device according to any one of claims 2 to 8, characterized in that: The adapter board further includes: an indicator circuit; The indication circuit includes a first power interface, a transistor, an indicator light, a first resistor, a second resistor and a third resistor; the first power interface is connected to the input end of the transistor; the first power interface is connected to the main chip through the first resistor and the second resistor; the main chip is connected to the control end of the transistor through the second resistor; and the output end of the transistor is connected to the indicator light through the third resistor.

10. The projection device according to any one of claims 2 to 8, characterized in that: The adapter board further includes: a memory, a first test circuit and / or a second test circuit; The first test circuit is connected to the memory; the first test circuit is used to debug the software in the memory; the memory is connected to the main chip; the memory is used to store the software executed by the main chip; The first test circuit includes a first test port, a fourth resistor, a fifth resistor, a second power interface, a first diode, and a second diode; the first test port is connected to the memory through the fourth resistor; the anode of the first diode is connected to the second power interface, and the cathode of the first diode is connected to the memory through the fifth resistor; the anode of the second diode is connected to the second power interface, and the cathode of the second diode is connected to the memory through the fifth resistor; The second test circuit is connected to the memory; the second test circuit is used to debug the software in the memory; The second test circuit includes a second test port, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, and a third power supply interface; the second test port includes a first connection port, a second connection port, and a third connection port; the first connection port is connected to the memory through the sixth resistor; the second connection port is connected to the memory through the seventh resistor; the third power supply interface is connected to the first connection port through the eighth resistor and the sixth resistor; the third power supply interface is connected to the second connection port through the ninth resistor and the seventh resistor; and the third connection port is grounded.

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