Semiconductor material preheating device

By designing a semiconductor material preheating device with a workbench, a pad, a high-frequency heating machine, a rotating mechanism and a lifting mechanism, the problem of inconvenient replacement of the heating tank in the existing technology is solved, the automatic replacement of the heating tank is realized, and the production efficiency is improved.

CN223322190UActive Publication Date: 2025-09-09TUMI SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421956541.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-13
Publication Date
2025-09-09
Estimated Expiration
2034-08-13

AI Technical Summary

Technical Problem

Existing semiconductor material preheating devices are inconvenient to replace, time-consuming and labor-intensive, and affect production efficiency.

Method used

A semiconductor material preheating device is designed, which includes a workbench, a pad, a high-frequency heater, a rotating mechanism and a lifting mechanism. Through the cooperation of the rotating and lifting mechanisms, the automatic replacement of the heating tank is realized, which simplifies the operation process.

Benefits of technology

The heating tank can be easily replaced, which improves production efficiency and reduces manpower consumption.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a semiconductor material preheating device which comprises a working table, a cushion block is fixedly installed on the top of the working table, a high-frequency heating machine is connected to the top of the cushion block in an inserted mode, and a rotating mechanism and a lifting mechanism are arranged on the working table. According to the semiconductor material preheating device, a worker firstly places a plurality of heating tanks filled with silicon hexachloride on the rotating mechanism, then starts the high-frequency heating machine, and then starts the lifting mechanism to drive the first heating tank to move upwards, so that the first heating tank is located in an induction coil of the high-frequency heating machine; after the high-frequency heating machine completes preheating of the disilicon hexachloride in the first heating tank, the lifting mechanism is started to drive the first heating tank to move downwards, the rotating mechanism drives the multiple heating tanks to rotate to proper positions, the steps are repeated, the subsequent disilicon hexachloride in the heating tanks is preheated, replacement operation is convenient, and the replacement efficiency is high. Time and labor are saved, and the production efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor material production, in particular to a semiconductor material preheating device. Background Art

[0002] Semiconductor materials are a type of electronic materials with semiconductor properties that can be used to make semiconductor devices and integrated circuits. Semiconductor materials can be classified according to their chemical composition, and amorphous and liquid semiconductors with special structures and properties can be listed as a separate category. According to this classification method, semiconductor materials can be divided into elemental semiconductors, inorganic compound semiconductors, organic compound semiconductors, and amorphous and liquid semiconductors.

[0003] Silicon hexachloride is a commonly used liquid source in the semiconductor manufacturing industry. Silicon nitride film has been widely used in semiconductor devices due to its excellent chemical stability, thermal stability, insulation and mechanical strength. It is often used as a protective layer, insulating layer, mask layer or etching barrier layer. Due to the specific chemical properties and reactivity of silicon hexachloride, it usually needs to be preheated before processing. Generally, a heating tank containing silicon hexachloride is placed in the induction coil of a high-frequency heating machine, and then the preheated heating tank is replaced. However, the replacement operation is relatively inconvenient, time-consuming and labor-intensive, which affects production efficiency. Therefore, a semiconductor material preheating device is proposed to solve the above problems. Utility Model Content

[0004] In response to the deficiencies in the prior art, the present invention provides a semiconductor material preheating device having the advantages of being easy to replace, solving the problem that the replacement operation is inconvenient, time-consuming and labor-intensive, and affects production efficiency.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a semiconductor material preheating device, comprising a workbench, a pad fixedly mounted on the top of the workbench, a high-frequency heating machine plugged into the top of the pad, and a rotating mechanism and a lifting mechanism provided on the workbench;

[0006] The rotating mechanism includes a motor, which is fixedly connected to the top of the workbench. A mounting plate is fixedly installed on the output end of the motor. A rotating table is provided on the top of the mounting plate. A plurality of heating tanks are plugged into the top of the rotating table.

[0007] Furthermore, a groove is provided on the top of the pad, and the groove matches the high-frequency heating machine.

[0008] Furthermore, the rotating platform is threadedly connected to the mounting plate via a first bolt.

[0009] Furthermore, a through hole is opened inside the rotating table, and the through hole matches the heating tank.

[0010] Furthermore, the lifting mechanism includes a mounting frame, which is arranged at the bottom of the workbench. Two electric push rods are fixedly installed on the top of the mounting frame. Both of the two electric push rods pass through and extend above the workbench. Lifting plates are fixedly installed on the output ends of the two electric push rods, and pads are fixedly installed on the tops of the two lifting plates.

[0011] Furthermore, the mounting bracket is threadedly connected to the workbench via a second bolt.

[0012] Compared with the existing technology, the technical solution of this application has the following beneficial effects:

[0013] The semiconductor material preheating device is provided with a workbench, a pad, a high-frequency heating machine, a rotating mechanism, a heating tank and a lifting mechanism. The staff first places multiple heating tanks filled with silicon hexachloride on the rotating mechanism, then turns on the high-frequency heating machine, and then turns on the lifting mechanism to drive the first heating tank to move upward so that the first heating tank is located in the induction coil of the high-frequency heating machine. After the high-frequency heating machine preheats the silicon hexachloride inside the first heating tank, the lifting mechanism is turned on to drive the first heating tank to move downward, the rotating mechanism drives multiple heating tanks to rotate to appropriate positions, and the lifting mechanism is turned on to drive the second heating tank to move upward so that the second heating tank is located in the induction coil of the high-frequency heating machine. After the high-frequency heating machine preheats the silicon hexachloride inside the second heating tank, the above steps are repeated to preheat the silicon hexachloride inside subsequent heating tanks. The replacement operation is relatively convenient, saves time and labor, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a top view of the utility model;

[0015] Figure 2 This is the front view of the utility model;

[0016] Figure 3 For this utility model Figure 2 Enlarged view of point A in the middle.

[0017] In the figure: 1 workbench, 2 pad, 3 high-frequency heating machine, 4 rotating mechanism, 41 motor, 42 mounting plate, 43 rotating table, 5 heating tank, 6 lifting mechanism, 61 mounting frame, 62 electric push rod, 63 lifting plate, 64 pad. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figure 1-3 A semiconductor material preheating device in this embodiment includes a workbench 1, a pad 2 is fixedly installed on the top of the workbench 1, a high-frequency heating machine 3 is plugged into the top of the pad 2, a groove is opened on the top of the pad 2, and the groove matches the high-frequency heating machine 3. A rotating mechanism 4 and a lifting mechanism 6 are provided on the workbench 1, and a plurality of heating tanks 5 are provided on the rotating mechanism 4.

[0020] Specifically, the staff first places multiple heating tanks 5 filled with silicon hexachloride on the rotating mechanism 4, then turns on the high-frequency heating machine 3, and then turns on the lifting mechanism 6 to drive the first heating tank 5 to move upward, so that the first heating tank 5 is located in the induction coil of the high-frequency heating machine 3. After the high-frequency heating machine 3 preheats the silicon hexachloride inside the first heating tank 5, the lifting mechanism 6 is turned on to drive the first heating tank 5 to move downward, and the rotating mechanism 4 drives multiple heating tanks 5 to rotate to a suitable position. The lifting mechanism 6 is turned on to drive the second heating tank 5 to move upward, so that the second heating tank 5 is located in the induction coil of the high-frequency heating machine 3. After the high-frequency heating machine 3 preheats the silicon hexachloride inside the second heating tank 5, the above steps are repeated to preheat the silicon hexachloride inside the subsequent heating tank 5. The replacement operation is more convenient, saves time and effort, and improves production efficiency.

[0021] In this embodiment, the rotating mechanism 4 includes a motor 41, which is fixedly connected to the top of the workbench 1. A mounting plate 42 is fixedly installed on the output end of the motor 41. A rotating platform 43 is provided on the top of the mounting plate 42. The rotating platform 43 is threadedly connected to the mounting plate 42 through a first bolt. A plurality of heating tanks 5 are plugged into the top of the rotating platform 43. A through hole is opened inside the rotating platform 43, and the through hole matches the heating tank 5.

[0022] Specifically, by turning on the motor 41 , the motor 41 drives the mounting plate 42 , the rotating platform 43 and the plurality of heating tanks 5 to rotate.

[0023] In this embodiment, the lifting mechanism 6 includes a mounting frame 61, which is threadedly connected to the workbench 1 through a second bolt. The mounting frame 61 is arranged at the bottom of the workbench 1, and two electric push rods 62 are fixedly installed on the top of the mounting frame 61. The two electric push rods 62 both penetrate and extend to the top of the workbench 1. The output ends of the two electric push rods 62 are fixedly installed with lifting plates 63, and the tops of the two lifting plates 63 are fixedly installed with pads 64, and the material of the pads 64 is high-temperature resistant material.

[0024] Specifically, by turning on the electric push rod 62 , the electric push rod 62 drives the lifting plate 63 and the pad 64 to move linearly.

[0025] The working principle of the above embodiment is:

[0026] The staff first inserts multiple heating tanks 5 filled with disiloxane hexachloride into the interior of the rotating table 43, then turns on the high-frequency heating machine 3, turns on the first electric push rod 62, and the first electric push rod 62 drives the lifting plate 63, the pad 64 and the first heating tank 5 to move upward, so that the first heating tank 5 is located in the induction coil of the high-frequency heating machine 3. After the high-frequency heating machine 3 preheats the disiloxane hexachloride inside the first heating tank 5, the first electric push rod 62 is turned on, and the first electric push rod 62 drives the lifting plate 63, the pad 64 and the first heating tank 5 to move downward and reset, and then turns on the motor 41, and the motor 41 drives the mounting plate 42, the rotating table 43 and multiple heating tanks 5 to rotate to the appropriate position, turns on the first electric push rod 62, and the first electric push rod 62 drives The lifting plate 63, the pad 64 and the second heating tank 5 move upward so that the second heating tank 5 is located in the induction coil of the high-frequency heating machine 3. After the high-frequency heating machine 3 preheats the silicon hexachloride inside the second heating tank 5, the first electric push rod 62 is turned on. The first electric push rod 62 drives the lifting plate 63, the pad 64 and the second heating tank 5 to move downward and reset. The above steps are repeated to preheat the silicon hexachloride inside the subsequent heating tank 5. The second electric push rod 62 is turned on. The second electric push rod 62 drives the lifting plate 63, the pad 64 and the first preheated heating tank 5 to move upward. The first preheated heating tank 5 is removed and the unpreheated heating tank 5 is placed. The replacement operation is more convenient, saves time and effort, and improves production efficiency.

[0027] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0028] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor material preheating device, comprising a workbench (1), characterized in that: A cushion block (2) is fixedly mounted on the top of the workbench (1), a high-frequency heating machine (3) is plugged into the top of the cushion block (2), and a rotating mechanism (4) and a lifting mechanism (6) are provided on the workbench (1); The rotating mechanism (4) includes a motor (41), the motor (41) is fixedly connected to the top of the workbench (1), a mounting plate (42) is fixedly mounted on the output end of the motor (41), a rotating platform (43) is provided on the top of the mounting plate (42), and a plurality of heating tanks (5) are plugged into the top of the rotating platform (43).

2. A semiconductor material preheating device according to claim 1, characterized in that: A groove is provided on the top of the cushion block (2), and the groove matches the high-frequency heating machine (3).

3. The semiconductor material preheating device according to claim 1, characterized in that: The rotating platform (43) is threadedly connected to the mounting plate (42) via a first bolt.

4. The semiconductor material preheating device according to claim 1, characterized in that: A through hole is provided inside the rotating platform (43), and the through hole matches the heating tank (5).

5. The semiconductor material preheating device according to claim 1, characterized in that: The lifting mechanism (6) includes a mounting frame (61), the mounting frame (61) is arranged at the bottom of the workbench (1), and two electric push rods (62) are fixedly installed on the top of the mounting frame (61), and the two electric push rods (62) both penetrate and extend above the workbench (1), and the output ends of the two electric push rods (62) are fixedly installed with a lifting plate (63), and the tops of the two lifting plates (63) are fixedly installed with a pad (64).

6. A semiconductor material preheating device according to claim 5, characterized in that: The mounting frame (61) is threadedly connected to the workbench (1) via a second bolt.