Anti-deformation PCB circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to an anti-deformation PCB (printed circuit board), which comprises a crossed substrate, a plurality of air holes are arranged on the crossed substrate, a cushioning component is arranged on one side of each two air holes, the crossed substrate is connected with a plurality of reinforcing rods, a plurality of supporting columns are arranged on the reinforcing rods, and the supporting columns are arranged on the crossed substrate. Connecting sleeves are arranged at the ports of the crossed substrates, open grooves are formed in the connecting sleeves, circuit boards are arranged in the open grooves, and by means of the structure of the cushioning assemblies, the reinforcing rods, the supporting columns, the connecting sleeves and the open grooves, the problems that due to the structure, the size of a circuit board body is increased, and extra space is occupied are solved; and meanwhile, the maintenance of the circuit board in the later period of coating the whole circuit board by the structure is relatively troublesome.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a deformation-resistant PCB circuit board. Background Art

[0002] Circuit boards are known by various names, including ceramic circuit boards, alumina ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, and printed (copper etching technology) circuit boards. Circuit boards miniaturize and visualize electrical circuits, playing a vital role in the mass production of fixed circuits and optimizing electrical layouts. Circuit boards can also be called printed circuit boards or printed circuit boards.

[0003] In the application document with publication number CN219499627U, a deformation-resistant PCB circuit board is mentioned. The device increases the thickness by connecting the circuit board body and the thickened plate, so that structural glue is applied on the upper and lower parts of the circuit board body. When the structural glue reaches a certain degree of drying, the overall circuit board body, the upper cover and the protective frame are fixed to the circuit board, so that the circuit board body is connected above the cross, so that the connecting frame is fixed at the upper edge of the circuit board body, and then the connected circuit board body is connected to the inside of the heat dissipation frame, so that the lower screws of the upper clamping plate and the mounting holes are connected, thereby driving the overall upper clamping plate to be fixed above the heat dissipation frame, and the staff welds the overall structure to the equipment through the welding through-holes, so as to drive the use of the circuit board, but there are still certain defects, which need to be optimized. The specific defects are as follows: the structure increases the volume of the circuit board body, occupies extra space, and at the same time, the structure covers the entire circuit board, which is more troublesome when the circuit board is repaired later.

[0004] Therefore, it is particularly important to design a deformation-resistant PCB circuit board to change the above technical defects and improve overall practicality. Utility Model Content

[0005] The purpose of the present invention is to provide a deformation-resistant PCB circuit board to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A deformation-resistant PCB circuit board includes a cross substrate, wherein the cross substrate is provided with a plurality of air holes, a shock-absorbing component is provided on one side of every two air holes, the cross substrate is connected to a plurality of reinforcement rods, and the reinforcement rods are provided with a plurality of support columns. The ports of the cross substrate are all provided with connecting sleeves, the interior of the connecting sleeves is provided with a slot, and the interior of the slot is provided with a circuit board.

[0008] As a preferred solution of the present invention, the shock-absorbing assembly includes a telescopic rod, a damping spring, a connecting plate, and a fixed plate. The two ends of the telescopic rod and the damping spring are fixedly connected to the connecting plate and the fixed plate respectively. The fixed plate and the cross base plate are fixedly connected. The telescopic rod includes a large sleeve and a small sleeve. The small sleeve can slide inside the large sleeve, and a limit block is provided at one end of the small sleeve to prevent it from detaching from the large sleeve.

[0009] As a preferred solution of the present invention, the ventilation holes are arranged at equal intervals, and thermal conductive gel is provided inside the ventilation holes. The reinforcement rods, support columns, cross substrates, and connecting sleeves are made of copper.

[0010] As a preferred solution of the present invention, four groups of reinforcement rods are provided, and the reinforcement rods are fixedly connected to the cross base plate, and a rubber sleeve is provided on the top of the support column.

[0011] As a preferred solution of the present invention, through-holes are provided at the four corners of the top of the circuit board, and threaded holes are provided at corresponding positions on the connecting sleeve.

[0012] As a preferred solution of the present invention, the slots are adapted to the circuit board, and the ports of the cross substrate are located between the connecting sleeves and connected via epoxy adhesive.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. In the utility model, a deformation-resistant PCB circuit board is set up, and a shock-absorbing component, a reinforcement rod, a support column, a connecting sleeve, and a slotted structure are used to install it on the back of the circuit through a cross substrate, thereby reducing the occupied area. The cross substrate is designed with air holes filled with thermal conductive gel to enhance heat dissipation. At the same time, a shock-absorbing component is installed to protect the circuit board from impact and deformation. The copper reinforcement rod and the support column reinforce the substrate and support the circuit board. The bonding connecting sleeve limits the circuit board and facilitates the installation of nut connections. This solves the problem that the structure increases the volume of the circuit board body and occupies extra space. At the same time, the structure covers the entire circuit board, which is more troublesome when repairing the circuit board in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the overall structure diagram of the utility model;

[0016] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 3 It is a schematic diagram of the back side of the utility model as a whole.

[0018] In the figure: 1. cross substrate; 101. air vent; 102. shock-absorbing assembly; 103. reinforcement rod; 104. support column; 105. connecting sleeve; 106. slot; 107. circuit board. DETAILED DESCRIPTION

[0019] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0020] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. Several embodiments of the present invention are provided. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] For examples, see Figure 1-3 , the utility model provides a technical solution:

[0024] A deformation-resistant PCB circuit board includes a cross substrate 1, which is provided with a plurality of air holes 101. A shock absorbing component 102 is provided on one side of each two air holes 101. The cross substrate 1 is connected to a plurality of reinforcement rods 103. The reinforcement rods 103 are provided with a plurality of support columns 104. The ports of the cross substrate 1 are all provided with connecting sleeves 105. The interior of the connecting sleeve 105 is provided with a slot 106. The interior of the slot 106 is provided with a circuit board 107. The interior of the air holes is filled with thermal conductive gel to enhance the heat dissipation effect. Then, the shock absorbing component 102 on the cross substrate 1 is used to buffer the impact and slight deformation that the circuit board 107 may suffer, thereby protecting the circuit board from serious damage. The reinforcement rods 103 fixedly connected to the cross substrate 1 reinforce the cross substrate 1 to prevent its deformation and support The column 104 further supports the circuit board 107. Next, two connecting sleeves 105 are bonded to the ports of the cross substrate 1 and adapted to accommodate the circuit board 107. Then, the other two connecting sleeves 105 are bonded. At this time, the four corners of the circuit board 107 are located inside the connecting sleeves 105 to limit the circuit board 107. At the same time, the thermal conductive gel, the shock absorbing component 102, and one end of the support column 104 are in contact with the circuit board 107. There are through-holes at the top four corners of the circuit board 107, and threaded holes are provided at the corresponding positions on the connecting sleeves 105. During the installation process, nuts are passed through the positions of the circuit board and the connecting sleeves to connect with other components. At this time, the entire structure is assembled. During maintenance, the components on the circuit board can be inspected normally. If necessary, the connecting sleeves 105 and the cross substrate 1 can be removed and then bonded again.

[0025] The shock absorbing component 102 includes a telescopic rod, a damping spring, a connecting plate, and a fixed plate. The two ends of the telescopic rod and the damping spring are fixedly connected to the connecting plate and the fixed plate respectively. The fixed plate and the cross base plate 1 are fixedly connected. The telescopic rod includes a large sleeve and a small sleeve. The small sleeve can slide inside the large sleeve, and a limit block is provided at one end of the small sleeve to avoid separation from the large sleeve. The shock absorbing component 102 buffers the impact micro-deformation that the circuit board may suffer to avoid its serious deformation. The air vents 101 are arranged at equal intervals, and the interior of the air vents 101 is provided with thermal conductive gel. The reinforcement rod 103, the support column 104, the cross base plate 1, and the connecting sleeve 105 are made of copper. A rubber sleeve is provided on the top, and the copper material facilitates the heat dissipation of the circuit board and has strong supporting force. Four groups of reinforcement rods 103 are provided, and the reinforcement rods 103 are fixedly connected to the cross substrate 1. The center part and the near edge of the entire circuit board are supported by the reinforcement rods 103. The top four corners of the circuit board 107 are penetrated by through holes, and threaded holes are penetrated at the relative positions on the connecting sleeve 105. During installation, the position of the connecting sleeve 105 and the circuit board 107 can be fixed by nuts, and the slot 106 is adapted to the circuit board 107. The port of the cross substrate 1 is connected between the connecting sleeves 105 through epoxy adhesive to avoid thermal stress during welding, which causes deformation of the connecting sleeve 105 or the cross substrate 1.

[0026] The working process of the present invention is as follows: when using this anti-deformation PCB circuit board, first prepare a cross substrate 1, which is pre-designed with a number of equally spaced air holes 101. These air holes are filled with thermally conductive gel to enhance the heat dissipation effect. Then, the shock-absorbing component 102 on the cross substrate 1 is used to buffer the impact and slight deformation that the circuit board 107 may suffer, thereby protecting the circuit board from serious damage. Subsequently, a number of copper reinforcement rods 103 are fixedly connected to the cross substrate 1. These reinforcement rods 103 reinforce the cross substrate 1 to prevent its deformation, and further support the circuit board 107 through the support columns 104 thereon. Next, the two connecting sleeves 105 are bonded to the cross substrate 1. At the port of the substrate 1, it is adapted to accommodate the circuit board 107, and then the other two connecting sleeves 105 are bonded. At this time, the four corners of the circuit board 107 are located inside the connecting sleeve 105, which limits the circuit board 107. At the same time, the thermal conductive gel, the shock-absorbing component 102, and one end of the support column 104 are in contact with the circuit board 107. There are through-holes at the four corners of the top of the circuit board 107, and threaded holes are provided at the corresponding positions on the connecting sleeve 105. During the installation process, the nut is passed through the position of the circuit board and the connecting sleeve to connect with other components. At this time, the entire structure is assembled. During maintenance, the components on the circuit board can be inspected normally. If necessary, the connecting sleeve 105 and the cross substrate 1 can be removed and then bonded again.

[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A deformation-resistant PCB circuit board, comprising a cross substrate (1), characterized in that: The cross substrate (1) is provided with a plurality of air holes (101), and a shock absorbing component (102) is provided on one side of every two of the air holes (101). The cross substrate (1) is connected to a plurality of reinforcing rods (103), and a plurality of supporting columns (104) are provided on the reinforcing rods (103). A connecting sleeve (105) is provided at each end of the cross substrate (1), and a slot (106) is provided inside the connecting sleeve (105), and a circuit board (107) is provided inside the slot (106).

2. The anti-deformation PCB circuit board according to claim 1, characterized in that: The shock absorbing assembly (102) includes a telescopic rod, a damping spring, a connecting plate, and a fixed plate. The ends of the telescopic rod and the damping spring are fixedly connected to the connecting plate and the fixed plate respectively. The fixed plate is fixedly connected to the cross base plate (1). The telescopic rod includes a large sleeve and a small sleeve. The small sleeve can slide inside the large sleeve, and a limit block is provided at one end of the small sleeve to prevent it from being separated from the large sleeve.

3. The anti-deformation PCB circuit board according to claim 1, characterized in that: The ventilation holes (101) are arranged at equal intervals, and heat-conducting gel is provided inside the ventilation holes (101). The reinforcing rods (103), support columns (104), cross substrate (1), and connecting sleeves (105) are made of copper.

4. The anti-deformation PCB circuit board according to claim 1, characterized in that: Four groups of the reinforcement rods (103) are provided, and the reinforcement rods (103) are fixedly connected to the cross base plate (1), and a rubber sleeve is provided on the top of the support column (104).

5. The anti-deformation PCB circuit board according to claim 1, characterized in that: The top four corners of the circuit board (107) are penetrated with through holes, and the connecting sleeve (105) is penetrated with threaded holes at corresponding positions.

6. The anti-deformation PCB circuit board according to claim 1, characterized in that: The slot (106) is adapted to the circuit board (107), and the ports of the cross substrate (1) are located between the connecting sleeves (105) and connected via epoxy adhesive.

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