LED support and LED lamp bead packaging structure thereof

Abstract

The utility model relates to an LED support and an LED lamp bead packaging structure thereof, and the LED support comprises a bonding pad which is provided with a glue fixing groove used for accommodating conductive glue; in any cross section, perpendicular to the height direction of the LED support, of the glue fixing groove, the area of a first cross section is larger than that of a second cross section, and the distance between the position, on the glue fixing groove, of the first cross section and the bottom end of the bonding pad is smaller than the distance between the position, on the glue fixing groove, of the second cross section and the bottom end of the bonding pad. According to the utility model, the structure of the glue fixing groove is designed, the conductive glue is filled in the glue fixing groove, and after the conductive glue is hardened, the conductive glue and the glue fixing groove form an interlocking structure, so that under the structure, even if the bonding strength of the conductive glue is gradually reduced, the conductive glue cannot carry the chip to be completely separated from the bonding pad; and the risk of lamp bead failure caused by separation of the conductive adhesive from the bonding pad is reduced.

Description

Technical Field

[0001] The present application relates to the field of chips, and in particular to an LED bracket and an LED lamp bead packaging structure thereof. Background Art

[0002] As a specialized optoelectronic semiconductor device, LEDs (light-emitting diodes) are currently widely used in various indoor and outdoor display screens, automobiles, and backlighting applications due to their numerous advantages, including small size, solid-state properties, long lifespan, environmental friendliness, and energy efficiency. They have become a key development direction for a new generation of energy-saving and environmentally friendly lighting sources. LED conductive adhesives, as a key material for bonding LED chips to substrates, provide electrical conductivity, thermal conductivity, and adhesion, making them a hot topic of research both domestically and internationally. LED conductive adhesives are composed of a complex mixture of organic and inorganic materials, primarily consisting of resins, curing agents, conductive fillers, and coupling agents, each of which plays a distinct role. As an adhesive that possesses both electrical conductivity and adhesive properties, conductive adhesives can connect various conductive materials, creating an electrical path between the materials being connected.

[0003] Adhesion strength is a key performance indicator for conductive adhesives, but epoxy resins typically have poor toughness after curing. During the use of LED lamp beads, the epoxy resin is affected by ambient temperature and humidity, and the bonding strength gradually decreases. This can eventually cause the conductive adhesive to separate from the pads, and with it, the chip to separate from the circuit, causing the lamp to fail. Furthermore, some chips have relatively smooth sidewalls, which also pose a risk of separation from the conductive adhesive during use, causing the chip to separate from the circuit and further causing the lamp to fail. Utility Model Content

[0004] The present application provides an LED bracket and its LED lamp bead packaging structure, which can solve the problem in the related art that the bonding strength of the conductive adhesive will gradually decrease after long-term use, and there is a risk that the chip will be out of the circuit.

[0005] In a first aspect, an embodiment of the present application provides an LED bracket, comprising: a soldering pad, on which a solid glue groove for accommodating conductive glue is provided; wherein, in any cross-section of the solid glue groove perpendicular to the height direction of the LED bracket, the area of ​​the first cross-section is greater than the area of ​​the second cross-section, and the distance between the position of the first cross-section on the solid glue groove and the bottom end of the soldering pad is less than the distance between the position of the second cross-section on the solid glue groove and the bottom end of the soldering pad.

[0006] In combination with the first aspect, in one embodiment, the LED bracket further includes: a base and a cup groove, the cup groove is arranged on the base and is used to accommodate the chip; wherein the solder pad is arranged on the base and is located inside the cup groove, and the solid glue groove runs through the top and bottom ends of the solder pad.

[0007] In combination with the first aspect, in one embodiment, the base includes: a filling piece and a pin, the solder pad is arranged on the filling piece, and the bottom end of the solid glue groove contacts the surface of the filling piece; the pin is arranged on the surface of the filling piece.

[0008] In combination with the first aspect, in one embodiment, the glue solidifying groove is conical.

[0009] In combination with the first aspect, in one embodiment, the side wall of the glue solidifying groove has a step.

[0010] In a second aspect, an embodiment of the present application provides an LED lamp bead packaging structure, which includes: the LED bracket, conductive glue and chip as described above, the conductive glue is arranged inside the glue groove; the chip is fixed to the LED bracket by the conductive glue.

[0011] In combination with the second aspect, in one embodiment, in any cross-section of the chip perpendicular to the height direction of the LED bracket, the area of ​​the third cross-section is greater than the area of ​​the fourth cross-section. When the chip is installed on the LED bracket, the distance between the position of the third cross-section on the chip and the bottom end of the solder pad is less than the distance between the position of the fourth cross-section on the chip and the bottom end of the solder pad.

[0012] In conjunction with the second aspect, in one embodiment, along a chip height direction, the chip includes a first substrate and a second substrate arranged from bottom to top;

[0013] The area of ​​any cross section on the second substrate is greater than the area of ​​any cross section on the first substrate.

[0014] In combination with the second aspect, in one embodiment, the top end of the conductive glue is located at a set position of the chip.

[0015] In combination with the second aspect, in one embodiment, the set position is located between 1 / 3 and 1 / 2 of the total height of the chip.

[0016] The beneficial effects of the technical solutions provided in the embodiments of the present application include:

[0017] An embodiment of the present application provides an LED bracket and its LED lamp bead packaging structure. By designing the structure of the solid glue groove, conductive glue is filled in the solid glue groove, and after the conductive glue hardens, an interlocking structure is formed with the solid glue groove. Under this structure, even if the bonding strength of the conductive glue gradually decreases, the conductive glue cannot completely separate the chip from the solder pad, thereby reducing the risk of lamp bead failure caused by the conductive glue separating from the solder pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 Schematic diagram of the LED bracket structure provided in an embodiment of the present application (first perspective);

[0020] Figure 2 Schematic diagram of the LED bracket structure provided in an embodiment of the present application (second perspective);

[0021] Figure 3 Schematic diagram of a chip provided in an embodiment of the present application (first perspective);

[0022] Figure 4 Schematic diagram of a chip provided in an embodiment of the present application (second perspective);

[0023] Figure 5 Schematic diagram of the LED lamp bead packaging structure provided in an embodiment of the present application (first perspective);

[0024] Figure 6 Schematic diagram of the LED lamp bead packaging structure provided in an embodiment of the present application (second perspective).

[0025] In the figure: 1. Glue groove; 2. Solder pad; 3. Cup groove; 4. Conductive glue; 5. Chip; 50. First substrate; 51. Second substrate; 6. Base; 60. Pin; 61. Filler. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] The embodiment of the present application provides an LED bracket and its LED lamp bead packaging structure, which can solve the problem in the related art that the bonding strength of the conductive adhesive will gradually decrease after long-term use, and there is a risk that the chip will be detached from the circuit.

[0028] Conductive glue 4 serves as an adhesive for bonding the chip 5 and the pad 2, and plays an important role in bonding, conductivity and heat dissipation. The bonding performance is greatly affected by environmental factors. Affected by temperature and humidity, the bonding strength of the conductive glue 4 will decrease, and the size of the bonding strength directly affects the reliability of the LED lamp bead. Therefore, the reliability of the LED lamp bead can be improved by improving the connectivity between the conductive glue 4 and the pad 2 and the conductive glue 4 and the chip 5.

[0029] Therefore, in the first aspect, an embodiment of the present application provides an LED bracket, which includes: a soldering pad 2, on which a solid glue groove 1 for accommodating a conductive glue 4 is provided; wherein, in any cross-section of the solid glue groove 1 perpendicular to the height direction of the bracket, the area of ​​the first cross-section is greater than the area of ​​the second cross-section, and the distance between the position of the first cross-section on the solid glue groove 1 and the bottom end of the soldering pad 2 is less than the distance between the position of the second cross-section on the solid glue groove 1 and the bottom end of the soldering pad 2.

[0030] In this application, the structure of the solid glue groove 1 is designed, and the conductive glue 4 is filled in the solid glue groove 1. After the conductive glue 4 hardens, an interlocking structure is formed with the solid glue groove 1. Under this structure, even if the bonding strength of the conductive glue 4 gradually decreases, the conductive glue 4 cannot completely separate the chip 5 from the solder pad 2, thereby reducing the risk of lamp failure caused by the conductive glue 4 separating from the solder pad 2.

[0031] See also Figure 1 As shown, since the distance between the position of the first cross-section on the solid glue groove 1 and the bottom end of the pad 2 is smaller than the distance between the position of the second cross-section on the solid glue groove 1 and the bottom end of the pad 2, that is, the first cross-section is located at the bottom end of the second cross-section. Therefore, when the bonding strength of the conductive adhesive 4 gradually decreases until it loses adhesion with the solid glue groove 1, the solidified conductive adhesive 4 still cannot escape from the solid glue groove 1 because the area of ​​the first cross-section is larger than the area of ​​the second cross-section.

[0032] On this basis, there is no restriction on the shape of the glue tank 1, and the glue tank 1 can be any shape, for example Figure 1 The glue-solidifying groove 1 shown is conical. In addition, the glue-solidifying groove 1 can also be in a "convex" shape, a "cross" shape, an "I" shape, etc.

[0033] Furthermore, to increase the contact area between the adhesive groove 1 and the conductive adhesive 4 and further prevent the conductive adhesive 4 from escaping from the adhesive groove 1, a step is provided on the side wall of the adhesive groove 1. Multiple steps can be provided along the height of the bracket. The step configurations can be varied: for example, the step can be a protruding structure extending around the inner wall of the adhesive groove 1; or, for another example, the step can be a plurality of protrusions spaced circumferentially along the inner wall of the adhesive groove 1.

[0034] Based on the above embodiment, in this embodiment, the bracket further includes: a base 6 and a cup 3. Specifically, the cup 3 is provided on the base 6 and is used to accommodate the chip 5; the solder pad 2 is provided on the base 6 and is located inside the cup 3, and the glue groove 1 passes through the top and bottom ends of the solder pad 2.

[0035] That is, after the chip 5 is connected to the pad 2, a portion of the chip 5 is located inside the cup groove 3, and the other portion is fixed inside the fixing groove 1 by the conductive glue 4. Since the fixing groove 1 passes through the top and bottom ends of the pad 2, the conductive glue 4 is also connected to the base 6 after being injected into the fixing groove 1. The base 6 includes: a filler 61 and a pin 60. The pad 2 is set on the filler 61, and the bottom end of the fixing groove 1 is in contact with the surface of the filler 61; the pin 60 is set on the surface of the filler 61. That is, after the conductive glue 4 is cured, the bottom end is connected to the filler 61, the surface is connected to the inner wall of the fixing groove 1, and it partially wraps the chip 5, thereby achieving the connection and fixation of the chip 5 to the pad 2 and the base 6.

[0036] Secondly, an embodiment of the present application provides an LED lamp bead packaging structure, which includes: an LED bracket, conductive glue 4 and a chip 5 provided in any of the above embodiments of the present application, the conductive glue 4 is arranged inside the solid glue groove 1; the chip 5 is fixed to the LED bracket through the conductive glue 4.

[0037] In this application, the structure of the solid glue groove 1 is designed, and the conductive glue 4 is filled in the solid glue groove 1. After the conductive glue 4 hardens, an interlocking structure is formed with the solid glue groove 1. Under this structure, even if the bonding strength of the conductive glue 4 gradually decreases, the conductive glue 4 cannot completely separate the chip 5 from the solder pad 2, thereby reducing the risk of lamp failure caused by the conductive glue 4 separating from the solder pad 2.

[0038] In order to prevent the conductive adhesive 4 from being separated from the pad 2 and the chip 5 from being separated from the circuit, in addition to designing the structure of the adhesive groove 1, in this embodiment, in order to prevent the chip 5 from being separated from the conductive adhesive 4 after the bonding strength of the conductive adhesive 4 gradually decreases, the chip 5 is further provided with the following configuration:

[0039] Specifically, in any cross-section of the chip 5 perpendicular to the height direction of the LED bracket, the area of ​​the third cross-section is greater than the area of ​​the fourth cross-section. When the chip 5 is installed on the LED bracket, the distance between the position of the third cross-section on the chip 5 and the bottom end of the soldering pad 2 is less than the distance between the position of the fourth cross-section on the chip 5 and the bottom end of the soldering pad 2.

[0040] Compared to a configuration where any cross-sectional area and shape are identical on the chip 5 perpendicular to the height of the LED bracket, this configuration creates a protrusion at any point on the chip 5, forming an interlocking structure with the cured conductive adhesive 4. Even if the adhesive strength of the conductive adhesive 4 gradually decreases, the chip 5 cannot completely break away from the conductive adhesive 4, reducing the risk of lamp failure. This structural design improves the connectivity between the conductive adhesive 4 and the pad 2, and between the conductive adhesive 4 and the chip 5, thereby improving the reliability of the LED lamp.

[0041] Based on the above embodiment, in this embodiment, along the height direction of the chip 5, the chip 5 includes a first substrate 50 and a second substrate 51 arranged from bottom to top; and the area of ​​any cross section on the second substrate 51 is greater than the area of ​​any cross section on the first substrate 50.

[0042] For details, see Figure 4 As shown, the chip 5 is configured as a "convex" shaped structure, and a step-shaped structure is formed at the connection between the second substrate 51 and the first substrate 50. When the conductive adhesive 4 wraps around the surface of the chip 5 and solidifies, an interlocking structure is formed between the conductive adhesive 4 and the chip 5.

[0043] In addition, the chip 5 can also be set to a conical structure, that is, the circumscribed circle diameter of the chip 5 gradually decreases along the height direction of the chip 5. When the conductive glue 4 is cured, the circumscribed circle diameter of the through hole in the middle of the conductive glue 4 for accommodating the chip 5 also gradually decreases. Therefore, the bottom end of the chip 5 cannot escape from the cured conductive glue 4 through the top of the through hole.

[0044] The above embodiments are merely multiple possible implementations of the embodiments of the present application, and the embodiments of the present application are not limited thereto.

[0045] During the die-bonding process, the chip 5 is placed directly above the uncured conductive adhesive 4. As the adhesive 4 flows, it envelops the chip 5 within it. It's important to note that the top of the adhesive 4 is located at the desired position for the chip 5. Since the chip's light-emitting surface is at the top, if the top of the adhesive 4 is too high, the fluidity of the uncured adhesive 4 could cause the adhesive 4 to continue moving up the chip 5's height and reach the top electrode, short-circuiting the chip's positive and negative electrodes. If the top of the adhesive 4 is too low, the connection between the adhesive 4 and the chip 5 is less secure. Therefore, the desired position can be set between 1 / 3 and 1 / 2 of the chip's total height. The adhesive 4 is then cured. Once hardened and solidified, the chip 5 is securely fixed within the adhesive 4. This placement significantly reduces the risk of the chip 5 falling out of the adhesive 4.

[0046] A glue solid groove 1 is opened on the pad 2 for fixing the chip 5, and a conductive glue 4 is applied to the glue solid groove 1. The conductive glue 4 flows into the glue solid groove 1 along the surface of the pad 2 due to its fluidity, and then the conductive glue 4 is hardened. The hardened conductive glue 4 forms an interlocking structure with the pad 2 and the chip 5 that is not easy to separate. As the LED lamp beads are used for a longer time, they will be affected by humidity and temperature and the conductive glue 4 will gradually become damp, resulting in a decrease in the bonding strength until the conductive glue 4 separates from the pad 2 and the surface of the chip 5. However, due to the structural interlocking nature of this solid crystal method, the conductive glue 4, the pad 2 and the chip 5 are still in a contact and conductive state, which greatly reduces the risk of lamp bead failure caused by the chip 5 separating from the conductive glue 4 and the conductive glue 4 separating from the pad 2.

[0047] In the description of this application, it should be noted that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0048] It should be noted that, in this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0049] The foregoing is merely a list of specific embodiments of the present application, intended to enable those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the broadest scope consistent with the principles and novel features of the present application.

Claims

1. An LED bracket, characterized in that: It includes: A soldering pad (2), wherein a glue-fixing groove (1) for accommodating a conductive glue (4) is provided on the soldering pad (2); Among them, in any cross-section of the solid glue groove (1) perpendicular to the height direction of the LED bracket, there is a first cross-section whose area is greater than the second cross-section, and the distance between the position of the first cross-section on the solid glue groove (1) and the bottom end of the soldering pad (2) is less than the distance between the position of the second cross-section on the solid glue groove (1) and the bottom end of the soldering pad (2).

2. The LED bracket according to claim 1, wherein: The LED bracket also includes: Base (6); A cup groove (3), the cup groove (3) is arranged on the base (6) and is used to accommodate the chip (5); The soldering pad (2) is arranged on the base (6) and is located inside the cup groove (3), and the glue solidifying groove (1) passes through the top and bottom ends of the soldering pad (2).

3. The LED bracket according to claim 2, characterized in that: The base (6) comprises: A filling piece (61), the solder pad (2) is arranged on the filling piece (61), and the bottom end of the glue groove (1) contacts the surface of the filling piece (61); A pin (60) is provided on the surface of the filling piece (61).

4. The LED bracket according to claim 1, wherein: The glue solidifying groove (1) is conical.

5. The LED bracket according to claim 1, wherein: The side wall of the glue solidifying groove (1) is provided with steps.

6. An LED lamp bead packaging structure, characterized in that: It includes: The LED bracket according to any one of claims 1 to 5; Conductive glue (4), the conductive glue (4) is arranged inside the glue-fixing groove (1); A chip (5) is fixed to the LED bracket via a conductive adhesive (4).

7. The LED lamp bead packaging structure according to claim 6, characterized in that: In any cross-section of the chip (5) perpendicular to the height direction of the LED bracket, there is a third cross-section whose area is greater than the fourth cross-section; when the chip (5) is mounted on the LED bracket, the distance between the position of the third cross-section on the chip (5) and the bottom end of the soldering pad (2) is less than the distance between the position of the fourth cross-section on the chip (5) and the bottom end of the soldering pad (2).

8. The LED lamp bead packaging structure according to claim 7, wherein: Along the height direction of the chip (5), the chip (5) comprises a first base (50) and a second base (51) arranged from bottom to top; The area of ​​any cross section on the second base (51) is greater than the area of ​​any cross section on the first base (50).

9. The LED lamp bead packaging structure according to claim 6, wherein: The top of the conductive glue (4) is located at a set position of the chip (5).

10. The LED lamp bead packaging structure according to claim 9, characterized in that: The set position is located between the 1 / 3 position and the 1 / 2 position of the total height of the chip (5).

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