High-precision welding device for chip processing

Abstract

The utility model discloses a high-precision welding device for chip processing, which comprises a base, an object placing table for placing a PCB (printed circuit board) is arranged on the base, the object placing table is provided with a positioning component for clamping the PCB, the object placing table is rotatably connected with the base, a positioning rod is arranged on the base above the object placing table, and the positioning rod is used for positioning a chip on the PCB; the lower end of the positioning rod is provided with a positioning block, the positioning block comprises a first plate body and a second plate body, the positioning rod is arranged above the object placing table, a chip can be pressed and positioned on the object placing table, the chip is prevented from moving relative to a PCB in the welding process, the object placing table can rotate, welding of pins on the periphery of the chip is facilitated, and the welding efficiency is improved. The second plate body at the bottom of the positioning rod can rotate along with the storage table, the positioning rod can be kept to effectively position the chip all the time in the rotation process of the storage table, and stable chip welding is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a high-precision welding device for chip processing. Background Art

[0002] The process of installing a chip on a PCB (printed circuit board) is a core step in chip assembly, involving multiple delicate steps and techniques. First, the chip must be accurately placed in the designated location according to the design pattern and pad positions on the PCB board, with the chip pins aligned and in contact with the pads. The chip pins and pads are then soldered together using melted solder paste. Current chip processing and soldering stations are equipped with a PCB placement table. When manually soldering the chip using a welding torch, workers need to use tweezers with one hand to position the chip to prevent movement during soldering, while using the other hand to perform soldering. Because the chip is surrounded by pins, workers need to solder the chip from different positions, making soldering inconvenient. Utility Model Content

[0003] The utility model solves the inconvenience of chip soldering on PCB board and proposes a high-precision soldering device for chip processing. A positioning rod is arranged on the storage table of the soldering device to assist in positioning the chip and facilitate the soldering of the chip.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A high-precision soldering device for chip processing includes a base, a platform for placing a printed circuit board (PCB) on the base, a positioning assembly for clamping the PCB on the platform, and a rotatably connected platform. The base has a positioning rod above the platform, which is used to position the chip on the PCB; a positioning block is provided at the lower end of the positioning rod. The positioning block includes a first plate and a second plate. The first plate is fixedly connected to the lower end of the positioning rod, and the second plate is located below the first plate and rotatably connected to the first plate. The rotation center of the first plate is coaxial with the rotation center of the platform. The positioning block contacts the chip to position the chip on the PCB.

[0006] Preferably, a rotating platform is provided on the base, the rotating platform being rotatably connected to the base, and the storage platform being fixedly connected to the rotating platform. A first fixing seat is fixedly provided on the base, a first positioning screw is threadedly connected to the first fixing seat, the axis of the first positioning screw is arranged horizontally, and a first positioning plate is provided at one end of the first positioning screw, and the first positioning plate is used to contact the cylindrical side surface of the rotating platform to form a positioning of the rotating platform.

[0007] Preferably, a column is provided on the base, a sliding sleeve is sleeved on the column, a beam is fixedly connected to the sliding sleeve, the beam is perpendicular to the column, a positioning rod is provided on the beam, and the positioning rod is parallel to the extension direction of the column.

[0008] Preferably, the positioning rod is threadedly connected to the crossbeam, and a handle is provided on the top of the positioning rod.

[0009] Preferably, the sliding sleeve is slidably connected to the column in the vertical direction, and a third positioning screw is provided on the sliding sleeve, the third positioning screw is threadedly connected to the sliding sleeve, and the third positioning screw is used to contact the column to form a positioning of the sliding sleeve on the column.

[0010] Preferably, the positioning assembly includes two clamps, which are symmetrically arranged on the storage platform. One clamp includes a second positioning plate, a second positioning screw, and a second fixing seat. The second fixing seat is fixedly connected to the storage platform. The second positioning screw is threadedly connected to the second fixing seat. The end of the second positioning screw is fixedly connected to the second positioning plate. The second positioning screw is arranged horizontally. The second positioning plates of the two clamps simultaneously contact the chip to form a positioning of the chip on the storage platform.

[0011] Preferably, a recessed slide groove is provided on the storage table, and contact plates corresponding in number to the slide groove are provided on the second positioning plate, the lower part of the contact plate extends to the inside of the slide groove, and the contact plates of the two clamping members are arranged opposite to each other.

[0012] The beneficial effects of the utility model are:

[0013] 1. A positioning rod is provided above the placement table of the high-precision welding device for chip processing. The positioning rod can press the chip on the placement table to prevent the chip from moving relative to the PCB board during the welding process, thereby facilitating the welding of the chip.

[0014] 2. The placement table of the high-precision welding device for chip processing can be rotated to facilitate the welding of the pins around the chip. The second plate at the bottom of the positioning rod can rotate with the placement table, which can keep the positioning rod always effectively positioning the chip during the rotation of the placement table, ensuring stable chip welding. It has a simple structure and practical functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of the high-precision welding device for chip processing;

[0016] Figure 2 This is a schematic diagram of the structure of the base plate of the high-precision welding device for chip processing from a top view;

[0017] Figure 3 A schematic diagram of the structure of the high-precision welding device placement table for chip processing;

[0018] Figure 4A schematic diagram of the structure of the second positioning plate of the high-precision welding device for chip processing;

[0019] Figure 5 This is a structural diagram of the high-precision welding device A for chip processing.

[0020] In the figure: 1, base; 2, rotating table; 3, storage table; 4, column; 5, sliding sleeve; 6, third positioning screw; 7, crossbeam; 8, positioning rod; 9, positioning block;

[0021] 101. First fixed seat; 21. First slewing bearing; 22. First positioning screw; 23. First positioning plate; 31. Contact plate; 32. Second positioning plate; 33. Second positioning screw; 34. Second fixed seat; 35. Slide groove; 91. First plate body; 92. Second plate body; 93. Second slewing bearing. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0023] Reference Figure 1-2 A high-precision welding device for chip processing includes a base 1, on which a storage table 3 for placing a PCB board is provided, and the storage table 3 is provided with a positioning assembly for clamping the PCB board. The positioning assembly includes two clamping members, and the two clamping members are symmetrically arranged on the storage table 3. One clamping member includes a second positioning plate 32, a second positioning screw 33 and a second fixing seat 34, the second fixing seat 34 is fixedly connected to the storage table 3, the second positioning screw 33 is threadedly connected to the second fixing seat 34, and the end of the second positioning screw 33 is rotatably connected to the second positioning plate 32. The second positioning plates 32 of the two clamping members are arranged relative to each other, and rotating the second positioning screw 33 can form the movement of the second positioning plate 32. The second positioning screw 33 is arranged horizontally, and the second positioning plates 32 of the two clamping members are in contact with the chip at the same time, which can restrict the chip to the storage table 3.

[0024] refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The storage platform 3 is provided with multiple recessed slots 35, and the second positioning plate 32 is provided with multiple contact plates 31. The number of contact plates 31 corresponds to the number of slots 35. The lower portions of the contact plates 31 extend into the slots 35, and the contact plates 31 of the two clamping members are arranged opposite each other. Since the chip is placed on the storage platform 3, the contact plates 31 extending into the slots 35 provide more stable positioning for the chip.

[0025] Furthermore, a rotating platform 2 is provided on the base 1, which is rotatably connected to the base 1 via a first slewing bearing 21. A storage platform 3 is fixedly connected to the rotating platform 2, which is also rotatably connected to the base 1. A first fixing seat 101 is fixedly provided on the base 1, and a first positioning screw 22 is threadedly connected to the first fixing seat 101. The axis of the first positioning screw 22 is arranged horizontally, and a first positioning plate 23 is provided at one end of the first positioning screw 22. Rotating the first positioning screw 22 causes the first positioning plate 23 to move, and the first positioning plate 23 contacts the cylindrical side surface of the rotating platform 2, thereby positioning the rotating platform 2.

[0026] A column 4 is provided on the base 1, and the column 4 is perpendicular to the base 1. A sliding sleeve 5 is sleeved on the column 4, and a crossbeam 7 is fixedly connected to the sliding sleeve 5. The crossbeam 7 is arranged perpendicular to the column 4. A positioning rod 8 is provided on the crossbeam 7, and the positioning rod 8 is arranged parallel to the extension direction of the column 4.

[0027] refer to Figure 1 and Figure 5 The lower end of the positioning rod 8 is provided with a positioning block 9. The positioning block 9 contacts the chip to form the chip's position on the PCB board. The positioning block 9 includes a first plate 91 and a second plate 92. The first plate 91 is fixedly connected to the lower end of the positioning rod 8, and the second plate 92 is located below the first plate 91. The second plate 92 and the first plate 91 are rotatably connected via a second slewing bearing 93. The rotation center of the first plate 91 is coaxially arranged with the rotation center of the placement table 3. The second plate 92 is used to contact the chip. When the placement table 3 rotates, the second plate 92 can rotate with the chip and the placement table 3. During the rotation of the placement table 3, the chip is always effectively positioned to ensure stable chip soldering.

[0028] The positioning rod 8 is located above the platform 3. The positioning rod 8 can move away from or closer to the platform 3 to release or press the chip, thereby positioning the chip on the PCB.

[0029] As a preferred embodiment, the positioning rod 8 is threadedly connected to the crossbeam 7, and a handle is provided on the top of the positioning rod 8. By turning the handle, the positioning rod 8 rotates, and the positioning rod 8 can move in the vertical direction with the positioning block 9.

[0030] As a preferred embodiment, the positioning rod 8 is fixedly connected to the crossbeam 7, and the sliding sleeve 5 is slidably connected to the column 4 in the vertical direction. The sliding sleeve 5 is provided with a third positioning screw 6, which is threadedly connected to the sliding sleeve 5. The third positioning screw 6 is used to contact the column 4 to form a position of the sliding sleeve 5 on the column 4. By loosening the third positioning screw 6, the sliding sleeve 5 can slide on the column 4, and the positioning rod 8 and positioning block 9 can be moved and adjusted in the vertical direction. When the positioning block 9 contacts the chip, the third positioning screw 6 is tightened to position the sliding sleeve 5 on the column 4.

[0031] The method of using the high-precision welding device for chip processing in this embodiment is as follows:

[0032] The PCB is positioned using contact plate 31 and mounted on table 3, maintaining the chip mounting position on the PCB at the rotation center of table 3. The Jiangxi chip is placed in the chip mounting position on the PCB board, and the positions of positioning rod 8 and positioning block 9 are adjusted so that the second plate 92 of positioning block 9 presses the chip in place, preventing the chip from moving relative to the PCB during soldering and facilitating soldering. When the pins on the other side of the chip need to be soldered, table 3 is rotated to facilitate soldering the pins on the other side of the chip. As table 3 rotates, second plate 92 rotates with the chip and table 3, maintaining effective chip positioning throughout the rotation of table 3 and ensuring stable chip soldering.

[0033] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high-precision welding device for chip processing, comprising a base, on which is provided a storage platform for placing a PCB board, characterized in that: The storage platform is provided with a positioning assembly for clamping the PCB board, and the storage platform is rotatably connected to the base; The base is provided with a positioning rod above the storage table, and the positioning rod is used to position the chip on the PCB board; the lower end of the positioning rod is provided with a positioning block, and the positioning block includes a first plate body and a second plate body, the first plate body is fixedly connected to the lower end of the positioning rod, the second plate body is located below the first plate body and is rotatably connected to the first plate body, the rotation center of the first plate body is coaxially arranged with the rotation center of the storage table, and the positioning block contacts the chip so that the chip is located on the PCB board.

2. The high-precision welding device for chip processing according to claim 1, characterized in that: The base is provided with a rotating platform, the rotating platform is rotatably connected to the base, and the storage table is fixedly connected to the rotating platform; A first fixing seat is fixedly provided on the base, a first positioning screw is threadedly connected to the first fixing seat, the axis of the first positioning screw is horizontally arranged, a first positioning plate is provided at one end of the first positioning screw, and the first positioning plate is used to contact the cylindrical side surface of the turntable to form the positioning of the turntable.

3. The high-precision welding device for chip processing according to claim 2, characterized in that: A column is provided on the base, a sliding sleeve is sleeved on the column, a beam is fixedly connected to the sliding sleeve, the beam is perpendicular to the column, a positioning rod is provided on the beam, and the positioning rod is parallel to the extension direction of the column.

4. The high-precision welding device for chip processing according to claim 3, characterized in that: The positioning rod is threadedly connected to the crossbeam, and a handle is provided on the top of the positioning rod.

5. The high-precision welding device for chip processing according to claim 4, characterized in that: The sliding sleeve is slidably connected to the column in the vertical direction. A third positioning screw is provided on the sliding sleeve. The third positioning screw is threadedly connected to the sliding sleeve. The third positioning screw is used to contact the column to form a positioning of the sliding sleeve on the column.

6. The high-precision welding device for chip processing according to any one of claims 1 to 5, characterized in that: The positioning assembly includes two clamping members, which are symmetrically arranged on the storage platform; A clamping member includes a second positioning plate, a second positioning screw and a second fixing seat, the second fixing seat is fixedly connected to the storage table, the second positioning screw is threadedly connected to the second fixing seat, the end of the second positioning screw is fixedly connected to the second positioning plate, the second positioning screw is horizontally arranged, and the second positioning plates of the two clamping members are in contact with the chip at the same time to form the positioning of the chip on the storage table.

7. The high-precision welding device for chip processing according to claim 6, characterized in that: A recessed slide groove is provided on the storage table, and contact plates corresponding in number to the slide groove are provided on the second positioning plate. The lower portion of the contact plate extends to the interior of the slide groove, and the contact plates of the two clamping members are arranged opposite to each other.

Images