Horizontal conveying type drying mechanism for chip capacitor end sealing
Through the horizontal conveying drying mechanism, the heat radiation heating of the conveyor belt and electric heating rod is used to solve the slurry sagging problem caused by the Ferris wheel type drying equipment, and improve the sealing quality of the chip capacitor.
Patent Information
- Application Number
- CN202422236184.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-09-11
AI Technical Summary
In the prior art, Ferris wheel-type drying equipment easily causes slurry sagging when drying chip capacitors, affecting the end-capping quality.
It adopts a horizontal conveying drying mechanism, uses a chain transmission device to drive the conveyor belt for horizontal transportation, combines the heat radiation heating of the electric heating rod and the insulation effect of the insulation cover to avoid slurry sagging.
Ensure the quality of chip capacitor termination, reduce slurry sagging, and improve termination effect.
Smart Images

Figure CN223332091U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip capacitor production equipment, in particular to a horizontal conveying drying mechanism for chip capacitor end sealing. Background Art
[0002] With the rapid development of electronic technology, the types of electronic components are becoming more and more diverse. As people's requirements for the quality of electronic products continue to increase, capacitors, as a basic and important electronic component, are also widely used in the production of electronic products. The production and processing technology of capacitors is also constantly improving.
[0003] As one of the key processes in capacitor manufacturing, the capping process plays a decisive role in the production efficiency, product performance and quality of capacitors. The capping process usually requires a capping machine to complete.
[0004] In the prior art, the end-capping process generally includes the following steps:
[0005] (1) Prepare a material carrier, a fixing sticker, and uncapped chip capacitors. Then, stick the fixing sticker on any side of the material carrier, and spread the uncapped chip capacitors on the other side of the material carrier so that the chip capacitors are implanted in the material holes of the material carrier, and at the same time, any end of the chip capacitors is stuck to the fixing sticker;
[0006] (2) silver printing is performed on the loading tray of step (1) to seal the ends of the chip capacitor that are not adhered to the fixed sticker;
[0007] (3) Dry the carrier plate in step (2), and then stick another fixed sticker on the other side of the carrier plate so that it sticks to the end of the chip capacitor that has completed the termination operation, and tear off the fixed sticker that sticks to the end of the chip capacitor that has not been terminated, so that the end of the chip capacitor that has not been terminated is exposed;
[0008] (4) silver printing is performed on the loading tray of step (3) to achieve the end sealing of the chip capacitor that has not been sealed;
[0009] (5) Dry the loading tray in step (4), and then tear off the fixing sticker to obtain a chip capacitor with both ends sealed.
[0010] In the prior art, the termination requirement for chip capacitors is generally to form a straight termination line on the surface of the capacitor. However, the drying step in the existing termination process generally uses a Ferris wheel-type drying device for drying, such as the Chinese utility model patent "A Drying Device for Chip Capacitor Termination" with publication number CN221197945U. Due to the Ferris wheel-type drying method, the slurry is prone to form sagging at the end of the capacitor under the action of gravity, thereby affecting the termination quality of the chip capacitor. Furthermore, since the Ferris wheel-type drying equipment can only dry the slurry layer by delivering hot air, the wind speed will also cause the slurry to sag, which will also affect the termination quality of the chip capacitor. Utility Model Content
[0011] The purpose of the utility model is to provide a horizontal conveying drying mechanism for chip capacitor termination, which is conducive to ensuring the termination quality of the chip capacitor and has a simple and reasonable structure and is convenient and flexible to use.
[0012] To achieve this purpose, the present invention adopts the following technical solutions:
[0013] A horizontal conveying drying mechanism for chip capacitor termination, comprising a chain transmission device, a conveyor belt, an electric heating rod and a heat preservation cover;
[0014] The conveyor belt is wound around the outside of the chain transmission device, and the conveyor belt is rotated under the drive of the chain transmission device; the surface of the conveyor belt is a horizontal surface, and the surface of the conveyor belt is used to support the loading platform, and the loading platform is used to place the loading tray;
[0015] There are multiple electric heating rods, which are installed in parallel on the top of the conveyor belt at equal intervals, and a drying gap is left between the electric heating rods and the conveyor belt;
[0016] The heat preservation cover is arranged on the top of the electric heating rod, and all the electric heating rods, the middle section of the chain transmission device and the middle section of the conveyor belt are located inside the heat preservation cover; one side wall of the heat preservation cover also has the feed port and the discharge port of the horizontal conveying drying mechanism.
[0017] Preferably, the conveying direction of the conveyor belt is a straight line, and the chain transmission device includes a forward and reverse motor.
[0018] Preferably, it further comprises an air volume regulating valve, which is installed on the top of the heat preservation cover and is communicated with the interior of the heat preservation cover.
[0019] Preferably, at least three air volume regulating valves are provided, and the three air volume regulating valves are installed at equal intervals on the top of the heat insulation cover.
[0020] Preferably, the height of the drying gap is 3 to 5 cm.
[0021] Preferably, a heat preservation gap is left between the electric heating rod and the top wall of the heat preservation cover, and the height ratio of the heat preservation gap to the drying gap is (4-7):1.
[0022] Preferably, the height of the insulation gap is 10 to 25 cm.
[0023] The technical solution provided by the utility model may have the following beneficial effects:
[0024] 1. The chip capacitors are dried using the drying mechanism of this solution so that the chip capacitors can be transported horizontally in the drying mechanism, thereby preventing the slurry from sagging under the action of gravity.
[0025] 2. The drying method of the drying mechanism in this solution is heat radiation, not hot air drying. Therefore, it can also reduce the sagging phenomenon of the slurry to a certain extent, which is more conducive to ensuring the sealing quality of the chip capacitor. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 The utility model is a structural schematic diagram of a horizontal conveying drying mechanism for sealing chip capacitors.
[0027] Figure 2 The utility model is a cross-sectional view of a horizontal conveying drying mechanism for sealing chip capacitors.
[0028] Figure 3 The utility model is a partial structural schematic diagram of a horizontal conveying drying mechanism for sealing chip capacitors.
[0029] Figure 4 It is a structural schematic diagram of the material loading tray in the utility model.
[0030] Among them: loading platform 23;
[0031] Chain transmission device 31, conveyor belt 32, electric heating rod 33, heat preservation cover 34, air volume regulating valve 35;
[0032] Loading tray 4. DETAILED DESCRIPTION
[0033] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.
[0034] This technical solution provides a horizontal conveying drying mechanism for chip capacitor termination, comprising a chain transmission device 31, a conveyor belt 32, an electric heating rod 33 and a heat preservation cover 34;
[0035] The conveyor belt 32 is wound around the outside of the chain transmission device 31, and the conveyor belt 32 is rotated by the chain transmission device 31; the surface of the conveyor belt 32 is a horizontal surface, and the surface of the conveyor belt 32 is used to support the loading platform 23, and the loading platform 23 is used to place the loading tray 4;
[0036] The electric heating rods 33 are provided with a plurality of them, and the plurality of electric heating rods 33 are installed in parallel on the top of the conveyor belt 32 at equal intervals, and a drying gap is left between the electric heating rods 33 and the conveyor belt 32;
[0037] The heat preservation cover 34 is arranged on the top of the electric heating rod 33, and all the electric heating rods 33, the middle section of the chain transmission device 31 and the middle section of the conveyor belt 32 are located inside the heat preservation cover 34; one side wall of the heat preservation cover 34 also has the feed port and the discharge port of the horizontal conveying drying mechanism.
[0038] The termination requirement for chip capacitors is generally to form a straight termination line on the surface of the capacitor, and the drying step in the existing termination process is generally carried out using Ferris wheel-style drying equipment. Due to the Ferris wheel-style drying method, the slurry is prone to forming sagging at the end of the capacitor under the action of gravity, thereby affecting the termination quality of the chip capacitor. Furthermore, since the Ferris wheel-style drying equipment can only dry the slurry layer by delivering hot air, the wind speed will also cause the slurry to sag, which will also affect the termination quality of the chip capacitor.
[0039] Therefore, in order to prevent the drying process from affecting the sealing quality of the chip capacitor, this technical solution proposes a drying mechanism for drying the chip capacitor sealing process, such as Figure 1-3 As shown, it includes a chain transmission device 31 for driving the conveyor belt 32 to rotate, a conveyor belt 32 for supporting the loading platform 23, an electric heating rod 33 for providing heat and performing thermal radiation heating on the chip capacitor, and a heat preservation cover 34 for preventing heat loss.
[0040] Specifically, since the surface of the conveyor belt 32 is a horizontal plane, the chip capacitors of this scheme can be transported horizontally in the drying mechanism, thereby avoiding the slurry from sagging under the action of gravity; in addition, the drying method of the drying mechanism in this scheme is thermal radiation, not hot air drying, so it can also reduce the sagging phenomenon of the slurry to a certain extent, which is more conducive to ensuring the sealing quality of the chip capacitors.
[0041] It should be noted that in this embodiment, a side wall of the heat-insulating cover 34 provides both the feed and discharge ports for the drying mechanism, allowing the loading and unloading of the drying mechanism to be carried out using a common transfer mechanism 2, thereby reducing equipment costs. In one embodiment, the feed and discharge ports can be arranged on the same side by the reciprocating motion of a conveyor belt 32 extending linearly within the drying mechanism; in another embodiment, the feed and discharge ports can be arranged on the same side by providing an annular conveyor belt 32 connected end to end, which is not a limitation of this embodiment.
[0042] It should be noted that the material carrier 4 of this solution is a carrier used for sealing the chip capacitor in the prior art, such as Figure 4 As shown, a plurality of mounting holes (not shown in the figure) for mounting chip capacitors are provided on its surface.
[0043] To further illustrate, the conveying direction of the conveyor belt 32 is a straight line, and the chain transmission device 31 includes a forward and reverse motor.
[0044] In a preferred embodiment of the present technical solution, the chain transmission device 31 includes a forward and reverse motor. The use of the forward and reverse motor can make the rotation direction of the conveyor belt 32 forward or reverse, thereby easily meeting the needs of reciprocating transportation.
[0045] To further explain, it also includes an air volume regulating valve 35 , which is installed on the top of the heat preservation cover 34 , and the air volume regulating valve 35 is communicated with the interior of the heat preservation cover 34 .
[0046] In another preferred embodiment of the present technical solution, in order to take into account both the drying effect and the heat dissipation effect, the present solution further provides an air volume regulating valve 35 on the top of the heat preservation cover 34 to facilitate adjustment of the air volume inside the heat preservation cover 34 .
[0047] Further explanation, at least three air volume regulating valves 35 are provided, and the three air volume regulating valves 35 are installed at equal intervals on the top of the heat preservation cover 34. In this way, the drying effect of the drying mechanism is uniform.
[0048] To further illustrate, the height of the drying gap is 3 to 5 cm.
[0049] As a preferred embodiment of the present invention, the height of the drying gap is also optimized, such as Figure 2 The middle distance m is shown in order to improve the drying efficiency of the slurry.
[0050] To further illustrate, a heat preservation gap is left between the electric heating rod 33 and the top wall of the heat preservation cover 34, and the height ratio of the heat preservation gap to the drying gap is (4-7):1.
[0051] As another preferred embodiment of the present invention, the height of the insulation gap is also optimized, such as Figure 2 The middle distance n is shown so as to take into account both the drying effect and the heat preservation effect of the drying mechanism.
[0052] To further illustrate, the height of the thermal insulation gap is 10 to 25 cm.
[0053] As a better embodiment of the above embodiment, a specific limit is placed on the height of the thermal insulation gap, which is beneficial to ensuring the sealing quality of the laminated capacitor.
[0054] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.
[0055] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.
[0056] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.
[0057] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.
[0058] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.
[0059] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.
[0060] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present invention without inventive effort, and such implementations will fall within the scope of protection of the present invention.
Claims
1. A horizontal conveying drying mechanism for chip capacitor termination, characterized by: It includes chain drive, conveyor belt, electric heating rod and heat preservation cover; The conveyor belt is wound around the outside of the chain transmission device, and the conveyor belt is rotated under the drive of the chain transmission device; the surface of the conveyor belt is a horizontal surface, and the surface of the conveyor belt is used to support the loading platform, and the loading platform is used to place the loading tray; There are multiple electric heating rods, which are installed in parallel on the top of the conveyor belt at equal intervals, and a drying gap is left between the electric heating rods and the conveyor belt; The heat preservation cover is arranged on the top of the electric heating rod, and all the electric heating rods, the middle section of the chain transmission device and the middle section of the conveyor belt are located inside the heat preservation cover; one side wall of the heat preservation cover also has the feed port and the discharge port of the horizontal conveying drying mechanism.
2. The horizontal conveying drying mechanism for chip capacitor termination according to claim 1, characterized in that: The conveying direction of the conveyor belt is a straight line, and the chain transmission device includes a forward and reverse motor.
3. The horizontal conveying drying mechanism for chip capacitor termination according to claim 1, characterized in that: It also includes an air volume regulating valve, which is installed on the top of the heat preservation cover and is communicated with the interior of the heat preservation cover.
4. The horizontal conveying drying mechanism for chip capacitor termination according to claim 3, characterized in that: At least three air volume regulating valves are provided, and the three air volume regulating valves are installed at equal intervals on the top of the heat insulation cover.
5. The horizontal conveying drying mechanism for chip capacitor termination according to claim 1, characterized in that: The height of the drying gap is 3 to 5 cm.
6. The horizontal conveying drying mechanism for chip capacitor termination according to claim 1, characterized in that: A heat preservation gap is left between the electric heating rod and the top wall of the heat preservation cover, and the height ratio of the heat preservation gap to the drying gap is (4-7):
1.
7. The horizontal conveying drying mechanism for chip capacitor termination according to claim 6, characterized in that: The height of the thermal insulation gap is 10 to 25 cm.
Citation Information
Patent Citations
Drying device for chip capacitor end sealing
CN221197945U