Inspection assembly and visual inspection device of semiconductor device thereof

Abstract

The utility model discloses an inspection assembly and a visual inspection device of a semiconductor device thereof, and relates to the technical field of device inspection, the visual inspection device of the semiconductor device comprises a base, one side of the base is provided with a groove for fixing a braid and allowing the braid to pass through, the braid is internally provided with the semiconductor device, and the semiconductor device is arranged in the groove; at least two grooves with different sizes are formed in the base in parallel, so that braids with different widths can penetrate through the grooves; and the cover plate covers the base in a turnover manner so as to prevent the braid from being separated from the corresponding groove, and a visual inspection window is formed in the cover plate. Due to the fact that the at least two grooves with different sizes are formed in the base so that the braids with different widths can penetrate through the grooves for inspection operation, the device can enable the two braids with different widths to be integrated on one mechanism for inspection, operation personnel can use the device conveniently, and compatibility of the braids with different widths can be achieved. The device is a device capable of inspecting at least two braids with different widths.

Description

Technical Field

[0001] The utility model relates to the field of device inspection technology, and more specifically, to a visual inspection device for semiconductor devices and an inspection assembly comprising the visual inspection device for semiconductor devices. Background Art

[0002] In the prior art, during use of a common inspection device, the cover of the inspection device presses the tape (which is a structure that arranges items (such as chips, components, etc.) according to certain rules on a tape carrier to facilitate automated processing and assembly) directly into the groove of the inspection device, and the common inspection device is a single-slot design, that is, it is only suitable for inspection operations on tapes of a certain width. Common inspection devices are not compatible with inspection operations on tapes of different widths.

[0003] In summary, how to provide a device that can inspect at least two braids of different widths is a problem that needs to be urgently solved by those skilled in the art. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a visual inspection device for semiconductor devices, which is a device capable of inspecting at least two braids of different widths.

[0005] Another object of the present invention is to provide an inspection assembly comprising the above-mentioned visual inspection device for the semiconductor device.

[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0007] A visual inspection device for semiconductor devices, comprising:

[0008] A base, one side of which has a groove for fixing a braid and providing a passage for the braid, wherein the braid has a built-in semiconductor device, and the base is provided with at least two grooves of different sizes in parallel to allow the braids of different widths to pass through;

[0009] A cover plate is flippably arranged on the base to prevent the braid from escaping from the corresponding groove, and an inspection window is provided on the cover plate.

[0010] In one embodiment, a visual inspection reference for comparison with the braid is further included.

[0011] In one embodiment, the visual reference object is a scale set within the visual window.

[0012] In one embodiment, the visual inspection reference is a standard braided tape provided on a side of the base facing the cover.

[0013] In one embodiment, the standard braid is arranged on the base in parallel with the groove.

[0014] In one embodiment, the groove includes a first groove for testing the braid having a width dimension of 8 mm and a second groove for testing the braid having a width dimension of 12 mm.

[0015] In one embodiment, the groove includes a bottom groove for accommodating the bottom material pocket of the braid and a step groove in contact with both sides of the braid, and the step groove is used to raise both sides of the braid so that the bottom material pocket does not contact the bottom groove.

[0016] In one embodiment, the inlet ends of the bottom trough and the step trough are both provided with circular arc chamfers of the feed track, and the outlet ends of the bottom trough and the step trough are both provided with circular arc chamfers of the discharge track.

[0017] In one embodiment, a feed limiting protrusion is provided on the inner side of the inlet end of the cover plate, and a discharge limiting protrusion is provided on the inner side of the outlet end of the cover plate. Both the feed limiting protrusion and the discharge limiting protrusion are used to cooperate with the step groove to limit the two sides of the braid.

[0018] In one embodiment, the inspection window is provided between the inlet end of the cover plate and the outlet end of the cover plate.

[0019] In one embodiment, the base and the cover are both covered with a black electroplated oxide film.

[0020] In one embodiment, the cover is connected to the base via a hinge.

[0021] An inspection assembly comprises any one of the above-mentioned visual inspection devices for semiconductor devices.

[0022] When using the semiconductor device inspection device provided by the present invention, the cover plate can be opened first, and then the braid can be placed into the groove of the base. Then, the cover plate can be flipped and closed onto the base. Finally, the operator can pull the braid to pass the semiconductor devices on the braid through the inspection window one by one. The operator can use the inspection window to check whether the devices on the braid are complete. Moreover, because the base is provided with at least two grooves of different sizes, which are suitable for braids of different widths to pass through for inspection, the device can integrate two different widths of braids into a single mechanism for inspection, which is convenient for the operator and can achieve compatibility with braids of different widths.

[0023] In summary, the visual inspection device for semiconductor devices provided by the present invention is a device that can inspect at least two braids of different widths.

[0024] In addition, the utility model also provides an inspection component including the visual inspection device of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0026] Figure 1 This is a structural schematic diagram of the semiconductor device inspection device provided by the present invention when the cover is opened relative to the base;

[0027] Figure 2 A side view of a visual inspection device for a semiconductor device;

[0028] Figure 3 This is a top view of the semiconductor device inspection device with the cover covering the base.

[0029] Reference numerals:

[0030] 1-base; 11-groove; 12-first groove; 13-second groove; 14-bottom groove; 15-step groove; 16-arc chamfer; 2-cover plate; 21-feed limit protrusion; 22-discharge limit protrusion; 23-inspection window; 3-electroplated oxide film. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] The core of the present invention is to provide a visual inspection device for semiconductor devices, which is a device capable of inspecting at least two braids of different widths. Another core of the present invention is to provide an inspection assembly including the visual inspection device for semiconductor devices.

[0033] Please refer to Figures 1 to 3 , Figure 1 This is a structural schematic diagram of the semiconductor device inspection device provided by the present invention when the cover is opened relative to the base; Figure 2 A side view of a visual inspection device for a semiconductor device; Figure 3 This is a top view of the semiconductor device inspection device with the cover covering the base.

[0034] This specific embodiment provides a visual inspection device for a semiconductor device, comprising:

[0035] The base 1 has a groove 11 on one side for fixing a braid and providing a passage for the braid. The braid has a built-in semiconductor device. The base 1 is provided with at least two grooves 11 of different sizes in parallel to allow braids of different widths to pass through.

[0036] The cover plate 2 is a flip cover provided on the base 1 to prevent the braid from escaping from the corresponding groove 11 , and an inspection window 23 is provided on the cover plate 2 .

[0037] It should be noted that two or three grooves 11 can be provided in parallel on the base 1 so that two or three braids of different widths can pass through the grooves 11. In actual use, the shape, structure, and size of the base 1 and the cover 2 can be determined according to actual conditions and actual needs.

[0038] When using the semiconductor device inspection device provided by the present invention, first, the cover plate 2 can be opened, then the braid can be placed into the groove 11 of the base 1. Then, the cover plate 2 can be flipped over and closed onto the base 1. Finally, the operator can pull the braid so that the semiconductor devices on the braid pass through the inspection window 23 one by one. The operator can use the inspection window 23 to check whether the semiconductor devices on the braid are intact. Moreover, because the base 1 is provided with at least two grooves 11 of different sizes to accommodate braids of different widths for inspection, the device can integrate two different widths of braids into a single mechanism for inspection, which is convenient for the operator and ensures compatibility with braids of different widths.

[0039] In summary, the visual inspection device for semiconductor devices provided by the present invention is a device that can inspect at least two braids of different widths.

[0040] In one embodiment, a visual inspection reference for comparison with the braid is also included, so that the operator can quickly visually determine whether the braid is complete based on the visual inspection reference.

[0041] In one embodiment, the visual inspection reference is a scale set within the inspection window 23, that is, the operator can determine whether the inspected braid is complete based on whether the braid reaches the scale position corresponding to the complete braid.

[0042] In one embodiment, the visual inspection reference is a standard braid set on the side of the base 1 facing the cover 2, that is, the operator can determine whether the braid to be tested is complete by judging whether the shape of the braid to be tested is consistent with that of the standard braid.

[0043] In one embodiment, the standard braid is arranged parallel to the groove 11 on the base 1 so that when the braid to be tested passes through the groove 11 , the operator can compare and analyze the braid to be tested with the standard braid in real time to determine whether the braid to be tested is complete.

[0044] In one embodiment, the groove 11 includes a first groove 12 for testing a braid having a width dimension of 8 mm and a second groove 13 for testing a braid having a width dimension of 12 mm.

[0045] It should be noted that the braid includes a carrier tape and a sealing tape for encapsulating the carrier tape. The carrier tape is used to load qualified products in a certain order. The sealing tape is covered on the carrier tape surface at high temperature to prevent products from falling. The carrier tape is provided with a bottom material pocket, which is responsible for loading the components. Common inspection devices in the prior art usually only have a groove 11 for inspecting 8mm braid. However, to achieve inspection compatibility for braids of different widths, this device provides a first groove 12 and a second groove 13 on the base 1. Since common braid widths mainly include 8mm and 12mm, the first groove 12 and the second groove 13 are respectively used to inspect braids with widths of 8mm and 12mm. Of course, grooves 11 of other sizes can also be provided according to actual usage requirements.

[0046] In one embodiment, the groove 11 includes a bottom groove 14 for accommodating the bottom material pocket of the braid and a step groove 15 in contact with both sides of the braid. The step groove 15 is used to raise both sides of the braid so that the bottom material pocket does not contact the bottom groove 14. Figure 1 and Figure 2 shown.

[0047] It should be noted that when the braid is placed in the groove 11, both sides of the braid are in contact with the stepped groove 15. Due to the lifting effect of the stepped groove 15, the bottom pocket of the braid is spaced apart from the bottom groove 14, so that the bottom pocket is suspended relative to the bottom groove 14, avoiding the bottom pocket and the bottom groove 14 from contacting and rubbing against each other when the braid moves, thereby preventing breakage and deformation. In other words, by improving the structure of the groove 11 and adding the stepped groove 15, the present application can achieve the suspension of the bottom pocket, so that the bottom pocket does not rub against the bottom groove 14 of the base 1 during the movement of the braid, thereby avoiding the risk of damage and deformation of the bottom pocket.

[0048] It should also be noted that the bottom groove 14, the step groove 15 and the base 1 can be set as an integrated structure to facilitate the processing and manufacturing of the base 1, and also to facilitate the control of the dimensions of the bottom groove 14 and the step groove 15, so that the braid can pass through the bottom groove 14 smoothly, and the step groove 15 can lift the braid to avoid friction between the bottom material pocket of the braid and the bottom groove 14.

[0049] In one embodiment, the inlet ends of the bottom trough 14 and the step trough 15 are both provided with a feed track arc chamfer 16, and the outlet ends of the bottom trough 14 and the step trough 15 are both provided with a discharge track arc chamfer 16. Figure 1 shown.

[0050] It should be noted that the inlet and outlet ends of the groove 11 of the common inspection device in the prior art are not provided with any smooth transition, that is, the inlet and outlet ends of the groove 11 of the common inspection device are all straight edges and right angles, which makes it easy for the braid to scrape against the straight edges and right angles when entering and exiting, causing the braid to deform and break. The present application improves the structure of the inlet and outlet ends of the groove 11, and sets a feed track arc chamfer 16 at the inlet end of the bottom groove 14 and the step groove 15, and sets a discharge track arc chamfer 16 at the outlet end of the bottom groove 14 and the step groove 15, that is, all edges of the device that come into contact with the braid are designed with arc chamfers 16, which prevents the braid from scraping against the inlet and outlet ends of the groove 11, causing the braid to deform and break.

[0051] In one embodiment, a feed limiting protrusion 21 is provided on the inner side of the inlet end of the cover plate 2, and a discharge limiting protrusion 22 is provided on the inner side of the outlet end of the cover plate 2. The feed limiting protrusion 21 and the discharge limiting protrusion 22 are both used to cooperate with the step groove 15 to limit the two sides of the braid. Figure 1 and Figure 2 shown.

[0052] That is, the feed limiting protrusion 21 can cooperate with the inlet end of the stepped groove 15, and the discharge limiting protrusion 22 can cooperate with the outlet end of the stepped groove 15 to limit the two sides of the braid, preventing the braid from shaking up and down in the groove 11 during movement, which could cause the braid to escape from the groove 11 and cause abnormal conditions. In other words, by adding the feed limiting protrusion 21 and the discharge limiting protrusion 22 to the cover plate 2, shaking and deviation of the braid during inspection can be avoided, thereby preventing the braid from being scratched or crushed.

[0053] It should be noted that the inner side of the cover plate 2 refers to the side of the cover plate 2 covering the base 1, and the feed limit protrusion 21, the discharge limit protrusion 22 and the cover plate 2 can be set as an integrated structure to facilitate the processing and manufacturing of the cover plate 2, and also facilitate the control of the size and position of the feed limit protrusion 21 and the discharge limit protrusion 22 to ensure that the feed limit protrusion 21 and the discharge limit protrusion 22 respectively cooperate with the inlet and outlet ends of the step groove 15 to limit the position of both sides of the braid to prevent the braid from shaking up and down or falling out of the groove 11 when moving.

[0054] In one embodiment, an inspection window 23 is provided between the inlet end of the cover plate 2 and the outlet end of the cover plate 2. Figure 1 and Figure 3As shown, when inspecting the braid, the braid passes through the inspection device, passing through the feed track arc chamfer 16, the step groove 15, the feed limit protrusion 21, the inspection window 23, the discharge track arc chamfer 16, and the discharge limit protrusion 22. The operator can inspect the braid through the inspection window 23.

[0055] In one embodiment, both the base 1 and the cover 2 are coated with a black electroplated oxide film 3. This means that the device incorporates an electroplated oxidation light absorption process, making the cover 2 and base 1 appear entirely black, thus preventing light reflections from causing visual fatigue to the operator and affecting the effectiveness of device inspection.

[0056] In one embodiment, the cover 2 is connected to the base 1 via a hinge, so that an operator can open or close the cover 2 easily.

[0057] In addition to the above-mentioned visual inspection device for semiconductor devices, the present invention also provides an inspection component including the visual inspection device for semiconductor devices disclosed in the above-mentioned embodiments. For the structures of other parts of the inspection component, please refer to the prior art and will not be described in detail herein.

[0058] It should be noted that a standard braid can be provided on the side of the base 1 facing the cover 2. The standard braid serves as a visual inspection reference. The standard braid is provided on the base 1 parallel to the groove 11. Furthermore, the inspection assembly may include a detector (e.g., a camera) for photographing the braid to be tested and uploading the image of the braid to be tested to the control device. Furthermore, the detector may photograph the standard braid and upload the image of the standard braid to the control device. After receiving the images of the braid to be tested and the standard braid, the control device may perform a comparative analysis to accurately determine whether the braid to be tested is consistent with the complete braid. If so, the braid to be tested is complete; if not, the braid to be tested is incomplete. In other words, in addition to allowing the operator to visually inspect the braid to be tested, this device can also automatically detect and determine whether the braid to be tested is complete. Of course, in actual use, the structure and type of the inspection assembly may be selected based on actual conditions and needs.

[0059] In addition, it should be noted that the directions or positional relationships indicated by "in and out" and "inside" in the present invention are based on the directions or positional relationships shown in the accompanying drawings, and are only for the purpose of simplifying the description and facilitating understanding, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, it cannot be understood as a limitation on the present invention.

[0060] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other. Any combination of all the embodiments provided by this utility model is within the scope of protection of this utility model and will not be described in detail here.

[0061] The above describes in detail the inspection assembly and semiconductor device visual inspection device provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above examples is only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A visual inspection device for semiconductor devices, characterized in that: include: A base (1), one side of which has a groove (11) for fixing a braid and providing for the braid to pass through, the braid having a built-in semiconductor device, and at least two grooves (11) of different sizes are arranged in parallel on the base (1) to allow the braids of different widths to pass through; A cover plate (2) is provided on the base (1) so as to prevent the braid from being separated from the corresponding groove (11), and an inspection window (23) is provided on the cover plate (2).

2. The visual inspection device for semiconductor devices according to claim 1, wherein: Also included is a visual reference for comparison with the braid.

3. The visual inspection device for semiconductor devices according to claim 2, wherein: The visual inspection reference object is a scale set within the range of the visual inspection window (23).

4. The visual inspection device for semiconductor devices according to claim 2, wherein: The visual inspection reference object is a standard braided tape provided on a side of the base (1) facing the cover plate (2).

5. The visual inspection device for semiconductor devices according to claim 4, wherein: The standard braid is arranged on the base (1) in parallel with the groove (11).

6. The visual inspection device for semiconductor devices according to any one of claims 1 to 5, characterized in that: The groove (11) includes a first groove (12) for testing the braid with a width dimension of 8 mm and a second groove (13) for testing the braid with a width dimension of 12 mm.

7. The visual inspection device for semiconductor devices according to any one of claims 1 to 5, characterized in that: The groove (11) comprises a bottom groove (14) for accommodating a bottom material pocket of the braid and a step groove (15) in contact with both sides of the braid, wherein the step groove (15) is used to raise both sides of the braid so that the bottom material pocket does not contact the bottom groove (14).

8. The visual inspection device for semiconductor devices according to claim 7, wherein: The inlet ends of the bottom groove (14) and the step groove (15) are both provided with a feed track circular arc chamfer (16), and the outlet ends of the bottom groove (14) and the step groove (15) are both provided with a discharge track circular arc chamfer (16).

9. The visual inspection device for semiconductor devices according to claim 7, wherein: A feed limiting protrusion (21) is provided on the inner side of the inlet end of the cover plate (2), and a discharge limiting protrusion (22) is provided on the inner side of the outlet end of the cover plate (2). The feed limiting protrusion (21) and the discharge limiting protrusion (22) are both used to cooperate with the step groove (15) to limit the two sides of the braid.

10. The visual inspection device for semiconductor devices according to claim 9, wherein: The inspection window (23) is provided between the inlet end of the cover plate (2) and the outlet end of the cover plate (2).

11. The visual inspection device for semiconductor devices according to any one of claims 1 to 5, characterized in that: The base (1) and the cover plate (2) are both covered with a black electroplated oxide film (3).

12. The visual inspection device for semiconductor devices according to any one of claims 1 to 5, characterized in that: The cover plate (2) is connected to the base (1) via a hinge.

13. A test assembly, characterized in that: A visual inspection device comprising the semiconductor device according to any one of claims 1 to 12.

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