Semiconductor testing device

Abstract

The utility model discloses a semiconductor testing device, and relates to the technical field of semiconductors. The clamping device comprises a heating table, a first clamping arm, a second clamping arm, a sliding rail, a sliding table and a locking piece, the first clamping arm and the second clamping arm are arranged on the two sides of the heating table respectively, the sliding rail is installed between the first clamping arm and the second clamping arm, and the sliding table is connected to the sliding rail in a sliding mode. The locking piece is embedded in the sliding table and is in threaded connection with the sliding table, and the locking piece is close to the end part of the heating table and is in pressing contact with the semiconductor device on the heating table so as to limit the semiconductor device. Therefore, the position of the locking piece can be slid and the locking piece can be screwed according to the semiconductor devices of different sizes placed on the heating table, so that the position of the semiconductor devices can be limited by the locking piece, and the product applicability of the semiconductor testing device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor testing device. Background Art

[0002] With the rapid development of semiconductor technology, the performance test requirements for semiconductor devices are increasing. For example, it is necessary to perform heating tests on semiconductor devices through testing equipment so as to fully obtain performance test data of the semiconductor devices after heating.

[0003] Currently, traditional semiconductor heating test equipment has some limitations. For example, in practical applications, if the semiconductor device is placed directly for heating, it may cause the semiconductor device to shift in position, thereby affecting the heating effect of the semiconductor device. If the semiconductor device is directly fixed with a fixture, different fixtures are required to adapt to semiconductor devices of different sizes, resulting in poor tooling applicability. Utility Model Content

[0004] Aiming at the problem of poor applicability of a clamp for clamping a semiconductor device, the present utility model is proposed to provide a semiconductor testing device that overcomes the above problem or at least partially solves the above problem.

[0005] The utility model provides a semiconductor testing device, which includes:

[0006] Heating table;

[0007] a first clamping arm and a second clamping arm, wherein the first clamping arm and the second clamping arm are respectively arranged on both sides of the heating platform;

[0008] a slide rail installed between the first clamping arm and the second clamping arm;

[0009] a slide, the slide being slidably connected to the slide rail;

[0010] A locking member is embedded in the slide and is threadedly connected to the slide, wherein the locking member is close to the end of the heating platform and forms a pressure contact with the semiconductor device located on the heating platform to limit the semiconductor device.

[0011] An optional utility model content, the locking member includes:

[0012] a connecting portion, the connecting portion being embedded in the slide and threadedly connected to the slide;

[0013] a screwing portion, the screwing portion being located on an end of the connecting portion away from the heating platform;

[0014] A pressure contact portion is located on an end portion of the connecting portion close to the heating stage to form a pressure contact with the semiconductor device.

[0015] An optional utility model content is that a hexagon socket is provided on the end surface of the screwing portion away from the connecting portion.

[0016] An optional utility model content, the slide is embedded between the two slide rails, so that the slide is limited by the two slide rails.

[0017] An optional utility model content, the cross-sectional shape of the slide in the vertical direction is an I-shape.

[0018] An optional utility model content, the connecting part and the screwing part are an integrated structure.

[0019] An optional utility model content, the slide rail and the first clamping arm, the slide rail and the second clamping arm form a detachable connection respectively.

[0020] An optional utility model content, the slide rail and the first clamping arm, the slide rail and the second clamping arm are respectively screwed.

[0021] An optional utility model content, the slide rail and the first clamping arm, the slide rail and the second clamping arm are respectively clamped and fixed.

[0022] An optional utility model content, two first clamping parts are horizontally arranged on the first clamping arm, and the heating platform is embedded in a first clamping cavity formed by the two first clamping parts.

[0023] An optional utility model content, the first clamping portion and the first clamping arm are an integrated structure.

[0024] An optional utility model content, two second clamping parts are horizontally arranged on the second clamping arm, and the heating platform is embedded in a second clamping cavity formed by the two second clamping parts.

[0025] An optional utility model content, the second clamping portion and the second clamping arm are an integrated structure.

[0026] Compared with the prior art, the present invention includes a heating platform, a first clamping arm, a second clamping arm, a slide rail, a slide and a locking member, wherein the first clamping arm and the second clamping arm are respectively arranged on both sides of the heating platform, the slide rail is installed between the first clamping arm and the second clamping arm, and the slide is slidably connected to the slide rail. The locking member is embedded in the slide and is threadedly connected to the slide, wherein the locking member is close to the end of the heating platform and forms a pressure contact with the semiconductor device located on the heating platform to limit the position of the semiconductor device. Therefore, the position of the locking member can be slid and the locking member can be screwed according to the different sizes of semiconductor devices placed on the heating platform to achieve the position limitation of the semiconductor device by the locking member, thereby improving the product applicability of the semiconductor testing device.

[0027] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be construed as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components.

[0029] In the attached figure:

[0030] Figure 1 This is a structural diagram of a semiconductor testing device provided by an embodiment of the present utility model;

[0031] Figure 2 This is a side structural diagram of a semiconductor testing device provided by an embodiment of the present utility model;

[0032] Figure 3 This is a partial structural diagram of a semiconductor testing device provided by an embodiment of the present utility model;

[0033] Figure 4 This is a structural schematic diagram of a first clamping arm provided by an embodiment of the present utility model;

[0034] Figure 5 This is a schematic top view of a semiconductor testing device provided by an embodiment of the present utility model;

[0035] Figure 6 This is a schematic diagram of the three-dimensional structure of a slide provided by an embodiment of the present utility model;

[0036] Figure 7 This is a front view structural diagram of a slide provided by an embodiment of the utility model;

[0037] Figure 8 This is a structural diagram of another connecting portion provided by an embodiment of the present utility model;

[0038] Figure numerals: 1, heating table; 2, first clamping arm; 3, second clamping arm; 4, slide rail; 5, slide table; 501, threaded through hole; 6, locking piece; 61, connecting part; 62, screwing part; 6201, hexagon socket; 63, pressing part; 7, first clamping part; 8, second clamping part. DETAILED DESCRIPTION

[0039] The following describes exemplary embodiments of the present invention in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0040] With the rapid development of semiconductor technology, the performance test requirements for semiconductor devices are increasing. For example, it is necessary to perform heating tests on semiconductor devices through testing equipment so as to fully obtain performance test data of the semiconductor devices after heating.

[0041] Currently, traditional semiconductor heating test equipment has some limitations. For example, in practical applications, if the semiconductor device is placed directly for heating, it may cause the semiconductor device to shift in position, thereby affecting the heating effect of the semiconductor device. If the semiconductor device is directly fixed with a fixture, different fixtures are required to adapt to semiconductor devices of different sizes, resulting in poor tooling applicability.

[0042] Based on the above technical problems, the present invention is proposed. The present invention may include a heating platform 1, a first clamping arm 2, a second clamping arm 3, a slide rail 4, a slide 5 and a locking member 6. The first clamping arm 2 and the second clamping arm 3 are respectively arranged on both sides of the heating platform 1, the slide rail 4 is installed between the first clamping arm 2 and the second clamping arm 3, and the slide 5 is slidably connected to the slide rail 4. The locking member 6 is embedded in the slide 5 and is threadedly connected to the slide 5, wherein the locking member 6 is close to the end of the heating platform 1 and forms a pressure contact with the semiconductor device located on the heating platform 1 to limit the semiconductor device. Therefore, according to the semiconductor devices of different sizes placed on the heating platform 1, the position of the locking member 6 can be slid and the locking member 6 can be screwed to achieve the position limitation of the semiconductor device by the locking member 6, thereby improving the product applicability of the semiconductor testing device.

[0043] Reference Figure 1-8 An embodiment of the present invention provides a semiconductor testing device, which may include a heating platform 1, a first clamping arm 2, a second clamping arm 3, a slide rail 4, a slide 5, and a locking member 6. The first clamping arm 2 and the second clamping arm 3 are respectively arranged on either side of the heating platform 1, the slide rail 4 is installed between the first clamping arm 2 and the second clamping arm 3, and the slide 5 is slidably connected to the slide rail 4. The locking member 6 is embedded in the slide 5 and threadedly connected to the slide 5. The locking member 6 is close to the end of the heating platform 1 and forms a pressure contact with the semiconductor device located on the heating platform 1 to limit the position of the semiconductor device.

[0044] In an embodiment of the present invention, the semiconductor testing device may include a heating platform 1, a first clamping arm 2, a second clamping arm 3, a slide rail 4, a slide 5, and a locking member 6. A heating element is integrated into the heating platform 1, so that the semiconductor device on the heating platform 1 is heated by heat conduction from the heating element, thereby testing the heat resistance of the semiconductor device.

[0045] Semiconductor devices may include, but are not limited to, semiconductor chips packaged by TO (Transistor Outline), DIP (dual in-line package), SOP (Small Out-Line Package), PLCC (Plastic Leaded Chip Carrier), BGA (Ball Grid Array), BQFP (quad flat package with bumper), CLCC (ceramic leaded chip carrier), COB (Chips on Board), FP (flat package), flip-chip, CPAC (globe top pad array carrier), and other types of packaging.

[0046] The first clamping arm 2 and the second clamping arm 3 are respectively fixedly connected to the heating platform 1. The first clamping arm 2 and the second clamping arm 3 each extend to the upper end surface of the heating platform 1 to provide mounting for the slide rail 4. In some embodiments, one end of the slide rail 4 is fixed to the first clamping arm 2, and the other end of the slide rail 4 is fixed to the second clamping arm 3.

[0047] The slide 5 is mounted on the slide rail 4 and is slidably connected to the slide rail 4, thereby enabling the slide 5 to perform reciprocating linear motion along the slide rail 4 under the action of an external force. The locking member 6 is vertically arranged and embedded in the slide 5. It can also be understood that the locking member 6 is completely installed through the slide 5, wherein the two ends of the locking member 6 are respectively located outside the upper and lower end surfaces of the slide 5.

[0048] The locking member 6 is threadedly connected to the slide 5, that is, the locking member 6 is provided with an external thread, and the slide 5 is provided with a threaded through hole 501. By cooperating with the external thread and the threaded through hole 501, the locking member 6 can be screwed so that the bottom end of the locking member 6 can be moved away from the slide 5 or closer to the slide 5, thereby adjusting the distance between the locking member 6 and the heating platform 1. After the semiconductor device is placed on the heating platform 1, the slide 5 can be moved so that the locking member 6 is located above the semiconductor device. The locking member 6 is screwed so that the bottom end of the locking member 6 is close to the semiconductor device until it contacts the surface of the semiconductor device. The position of the semiconductor device can be locked by cooperating with the heat release platform and the locking member 6, thereby preventing the semiconductor device from shifting in position during the heating process and affecting the heating effect.

[0049] Moreover, semiconductor devices of different specifications, such as semiconductor devices of different widths, lengths, and heights, can be placed on the heating table 1. The position of the locking member 6 can be adjusted by sliding the slide 5, and the locking member 6 can be screwed to achieve positional limitation of semiconductor devices of different specifications by the locking member 6, thereby improving the product applicability of the semiconductor testing device.

[0050] In summary, an embodiment of the present utility model discloses a semiconductor testing device, which may include a heating platform 1, a first clamping arm 2, a second clamping arm 3, a slide rail 4, a slide 5 and a locking member 6, wherein the first clamping arm 2 and the second clamping arm 3 are respectively arranged on both sides of the heating platform 1, the slide rail 4 is installed between the first clamping arm 2 and the second clamping arm 3, and the slide 5 is slidably connected to the slide rail 4. The locking member 6 is embedded in the slide 5 and is threadedly connected to the slide 5, wherein the locking member 6 is close to the end of the heating platform 1 and forms a pressure contact with the semiconductor device located on the heating platform 1 to limit the position of the semiconductor device. Therefore, the position of the locking member 6 can be slid and the locking member 6 can be screwed according to the semiconductor devices of different sizes placed on the heating platform 1 to achieve the position limitation of the semiconductor device by the locking member 6, thereby improving the product applicability of the semiconductor testing device.

[0051] An optional embodiment of the utility model, referring to Figure 1 、 Figure 3 as well as Figure 4As shown, the locking member 6 may include a connecting portion 61, a screwing portion 62, and a pressing portion 63. The connecting portion 61 is embedded in the slide 5 and is threadedly connected to the slide 5. The screwing portion 62 is located at the end of the connecting portion 61 away from the heating platform 1. The pressing portion 63 is located at the end of the connecting portion 61 close to the heating platform 1 to form a pressing contact with the semiconductor device.

[0052] In an embodiment of the utility model, the locking member 6 may include a connecting portion 61, a screwing portion 62 and a pressing portion 63. The connecting portion 61 is vertically arranged and completely passes through the slide 5. An external thread is provided on the connecting portion 61, and the connecting portion 61 is threadedly connected to the slide 5. For example, the connecting portion 61 may be a round rod structure. The screwing portion 62 is located on the end of the connecting portion 61 away from the heating platform 1. That is, the screwing portion 62 is located above the connecting portion 61 and is fixedly connected to the connecting portion 61. In some embodiments, the connecting portion 61 and the screwing portion 62 are an integrated structure. In other embodiments, when the connecting portion 61 and the screwing portion 62 are respectively made of metal materials, the connecting portion 61 and the screwing portion 62 can also be fixed by welding.

[0053] The pressure contact portion 63 is located on the end of the connecting portion 61 close to the heating platform 1. In other words, the pressure contact portion 63 is located below the connecting portion 61 and is fixedly connected to the connecting portion 61. The pressure contact portion 63 is used to form a pressure contact with the semiconductor device to lock the semiconductor device in place and prevent the semiconductor device from shifting during the heating process.

[0054] In an optional embodiment of the utility model, the cross-sectional shape of the pressing portion 63 includes a rectangle or a circle.

[0055] In the embodiment of the present invention, the cross-sectional shape of the pressure contact portion 63 can also be understood as the horizontal cross-sectional shape of the pressure contact portion 63. The cross-sectional shape may include, but is not limited to, a rectangle and a circle. A rectangle or a circle facilitates the processing of the pressure contact portion 63, thereby improving the production efficiency of the semiconductor testing device.

[0056] The cross-sectional area of ​​the pressing portion 63 is greater than the cross-sectional area of ​​the connecting portion 61 , thereby expanding the contact area between the pressing portion 63 and the semiconductor device, making it easier to disperse the pressing force of the pressing portion 63 on the semiconductor device, thereby avoiding crushing the semiconductor device or causing damage to the semiconductor device.

[0057] An optional embodiment of the utility model, referring to Figure 8As shown, a hexagonal socket 6201 is formed on the end surface of the screwing portion 62 away from the connecting portion 61 .

[0058] In the embodiment of the present invention, the hexagonal socket 6201 provided on the end surface of the screwing portion 62 away from the connecting portion 61 serves the following purposes: on the one hand, it facilitates the user to screw the screwing portion 62 using standard tools; on the other hand, it facilitates the positioning of the screwing portion 62 by a robotic arm, thereby enabling the automatic screwing of the screwing portion 62 by a hexagonal screwing head provided on the robotic arm and adapted to the shape of the hexagonal socket 6201. For example, a rotational motion output device such as a motor can be used to drive the hexagonal screwing head to rotate, thereby driving the screwing portion 62 to rotate synchronously, thereby achieving adjustment of the distance between the pressure contact portion 63 and the semiconductor device.

[0059] An optional embodiment of the utility model, referring to Figure 1 、 Figure 2 、 Figure 3 as well as Figure 4 As shown, the semiconductor testing device may include a heating platform 1, a first clamping arm 2, a second clamping arm 3, two slide rails 4, a slide 5 and a locking member 6. The first clamping arm 2 and the second clamping arm 3 are respectively arranged on both sides of the heating platform 1, and the two slide rails 4 are installed between the first clamping arm 2 and the second clamping arm 3. The slide 5 is slidably connected to the slide rails 4. The slide 5 is embedded between the two slide rails 4 to limit the slide 5 through the two slide rails 4. The locking member 6 is embedded in the slide 5 and is threadedly connected to the slide 5. The locking member 6 is close to the end of the heating platform 1 and forms a pressure contact with the semiconductor device located on the heating platform 1 to limit the semiconductor device.

[0060] In an embodiment of the present invention, the semiconductor testing device may include a heating platform 1, a first clamping arm 2, a second clamping arm 3, a slide rail 4, a slide 5, and a locking member 6. A heating element is integrated into the heating platform 1, so that the semiconductor device on the heating platform 1 is heated by heat conduction from the heating element, thereby testing the heat resistance of the semiconductor device.

[0061] Semiconductor devices may include, but are not limited to, semiconductor chips packaged by TO (Transistor Outline), DIP (dual in-line package), SOP (Small Out-Line Package), PLCC (Plastic Leaded Chip Carrier), BGA (Ball Grid Array), BQFP (quad flat package with bumper), CLCC (ceramic leaded chip carrier), COB (Chips on Board), FP (flat package), flip-chip, CPAC (globe top pad array carrier), and other types of packaging.

[0062] The first clamping arm 2 and the second clamping arm 3 are respectively fixedly connected to the heating platform 1. The first clamping arm 2 and the second clamping arm 3 each extend to the upper end surface of the heating platform 1 to provide mounting for the slide rail 4. In some embodiments, one end of the slide rail 4 is fixed to the first clamping arm 2, and the other end of the slide rail 4 is fixed to the second clamping arm 3.

[0063] The slide 5 is mounted on the slide rail 4 and is slidably connected to the slide rail 4. The slide 5 can be embedded between the two slide rails 4, so that the slide 5 is limited by the two slide rails 4. Under the action of external force, the slide 5 can make reciprocating linear motion along the two slide rails 4. The locking member 6 is vertically arranged and embedded in the slide 5. It can also be understood that the locking member 6 is completely arranged through the slide 5, wherein the two ends of the locking member 6 are respectively located outside the upper and lower end surfaces of the slide 5.

[0064] The locking member 6 is threadedly connected to the slide 5, that is, the locking member 6 is provided with an external thread, and the slide 5 is provided with a threaded through hole 501. By cooperating with the external thread and the threaded through hole 501, the locking member 6 can be screwed so that the bottom end of the locking member 6 can be moved away from the slide 5 or closer to the slide 5, thereby adjusting the distance between the locking member 6 and the heating platform 1. After the semiconductor device is placed on the heating platform 1, the slide 5 can be moved so that the locking member 6 is located above the semiconductor device. The locking member 6 is screwed so that the bottom end of the locking member 6 is close to the semiconductor device until it contacts the surface of the semiconductor device. The position of the semiconductor device can be locked by cooperating with the heat release platform and the locking member 6, thereby preventing the semiconductor device from shifting in position during the heating process and affecting the heating effect.

[0065] Moreover, semiconductor devices of different specifications, such as semiconductor devices of different widths, lengths, and heights, can be placed on the heating table 1. The position of the locking member 6 can be adjusted by sliding the slide 5, and the locking member 6 can be screwed to achieve positional limitation of semiconductor devices of different specifications by the locking member 6, thereby improving the product applicability of the semiconductor testing device.

[0066] In some embodiments, reference Figure 5 As shown, at least one slide 5 can be mounted on the two slide rails 4. Those skilled in the art can determine the specific number of slides 5 based on actual design requirements, and this is not limited here. If the two slide rails 4 serve as a set of slide modules, the semiconductor testing device can also include multiple sets of slide modules, each set of slide modules being secured using a pair of first clamping arms 2 and second clamping arms 3. Those skilled in the art can determine the specific number of slide modules based on actual design requirements, and this is not limited here.

[0067] An optional embodiment of the utility model, referring to Figure 6 and Figure 7 As shown, the cross-sectional shape of the slide 5 in the vertical direction is an I-shape.

[0068] In an embodiment of the present utility model, the cross-sectional shape of the slide 5 in the vertical direction (also referred to as the longitudinal cross-sectional shape) is an I-shape. Therefore, when assembling the slide 5, one end of the slide 5 can be sleeved on the first slide rail 4, and then the second slide rail 4 can be embedded in the slide 5 and arranged parallel to the first slide rail 4, so that the position of the slide 5 can be limited, so that the slide 5 can perform reciprocating linear motion along the slide rail 4.

[0069] In an optional embodiment of the utility model, the slide rail 4 and the first clamping arm 2, and the slide rail 4 and the second clamping arm 3 respectively form a detachable connection.

[0070] In the embodiment of the present invention, the slide rail 4 is fixed to the first clamping arm 2 using a detachable connection, and the slide rail 4 is fixed to the second clamping arm 3 using a detachable connection. Detachable connection methods include, but are not limited to, bolt connections, threaded connections, screw connections, and clamping connections. As a preferred embodiment, the slide rail 4 is screwed to the first clamping arm 2, and the slide rail 4 is screwed to the second clamping arm 3. The screw connection ensures a secure connection between the slide rail 4 and the two clamping arms.

[0071] In some other optional embodiments of the utility model, the slide rail 4 is respectively clamped and fixed to the first clamping arm 2, and the slide rail 4 is respectively clamped and fixed to the second clamping arm 3. For example, a slot is provided on the first clamping arm 2, and a block is provided on the slide rail 4. The slot and the block are matched in shape to form a limit for the slide rail 4. Correspondingly, a slot is provided on the second clamping arm 3, and a block is provided on the slide rail 4. The slot and the block are matched in shape to form a limit for the slide rail 4. Therefore, during the assembly process of the slide rail 4, the first clamping arm 2 can be fixed to the heating table 1 first, and then one end of the slide rail 4 can be embedded in the slot of the first clamping arm 2, and then the other end of the slide rail 4 can be embedded in the slot of the second clamping arm 3, and finally the second clamping arm 3 can be fixed to the heating table 1.

[0072] An optional embodiment of the utility model, referring to Figure 1 and Figure 3 As shown, two first clamping parts 7 are horizontally provided on the first clamping arm 2 , and the heating platform 1 is embedded in a first clamping cavity formed by the two first clamping parts 7 .

[0073] In the embodiment of the present invention, two first clamping portions 7 are horizontally provided on the first clamping arm 2. In some embodiments, the first clamping portion 7 can be an integral structure with the first clamping arm 2, so that a first clamping cavity can be enclosed by the first clamping arm 2 and the two first clamping portions 7, and the heating platform 1 is horizontally embedded in the first clamping cavity, thereby completing the first clamping positioning, improving the structural stability of the first clamping arm 2, and ensuring that the first clamping arm 2 is installed vertically.

[0074] An optional embodiment of the utility model, referring to Figure 1 and Figure 3As shown, two second clamping parts 8 are horizontally provided on the second clamping arm 3 , and the heating platform 1 is embedded in a second clamping cavity formed by the two second clamping parts 8 .

[0075] In the embodiment of the present invention, two second clamping portions 8 are horizontally provided on the second clamping arm 3. In some embodiments, the second clamping portion 8 can be an integral structure with the second clamping arm 3, so that a second clamping cavity can be enclosed by the second clamping arm 3 and the two second clamping portions 8. The heating platform 1 is horizontally embedded in the second clamping cavity, thereby completing the second clamping positioning, improving the structural stability of the second clamping arm 3, and ensuring that the second clamping arm 3 is installed vertically.

[0076] When installing the first clamping arm 2, the two first clamping portions 7 on the first clamping arm 2 can be sleeved onto the heating platform 1, and the first clamping arm 2 and the heating platform 1 can be fastened with screws, thereby further improving the connection stability between the first clamping arm 2 and the heating platform 1.

[0077] When installing the second clamping arm 3, the two second clamping portions 8 on the second clamping arm 3 can be sleeved onto the heating platform 1, and the second clamping arm 3 and the heating platform 1 can be fastened by screws, thereby further improving the connection stability between the second clamping arm 3 and the heating platform 1.

[0078] In some optional embodiments of the present invention, a heat-conducting layer is further provided within the heating platform 1. The heat-conducting layer is located between the surface of the heating platform 1 and the heating element, thereby ensuring good heat conduction between the heating element and the semiconductor device, thereby improving the heating efficiency and uniformity of the semiconductor device. For example, the heat-conducting layer can be made of thermally conductive silicone grease.

[0079] In summary, an embodiment of the present invention provides a semiconductor testing device, which may include a heating platform 1, a first clamping arm 2, a second clamping arm 3, a slide rail 4, a slide 5, and a locking member 6. The first clamping arm 2 and the second clamping arm 3 are respectively arranged on both sides of the heating platform 1, the slide rail 4 is installed between the first clamping arm 2 and the second clamping arm 3, and the slide 5 is slidably connected to the slide rail 4. The locking member 6 is embedded in the slide 5 and is threadedly connected to the slide 5, wherein the locking member 6 is close to the end of the heating platform 1 and forms a pressure contact with the semiconductor device located on the heating platform 1 to limit the position of the semiconductor device. Therefore, the position of the locking member 6 can be slid and the locking member 6 can be screwed according to the semiconductor devices of different sizes placed on the heating platform 1 to achieve the position limitation of the semiconductor device by the locking member 6, thereby improving the product applicability of the semiconductor testing device.

[0080] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0081] It is easy for those skilled in the art to think that any combination of the above embodiments is feasible, so any combination of the above embodiments is an implementation scheme of the present utility model. However, due to space limitations, this specification will not describe them in detail here.

[0082] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0083] Similarly, it should be understood that in order to streamline the present invention and aid in understanding one or more of the various aspects of the present invention, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof.

[0084] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of the present invention and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

Claims

1. A semiconductor testing device, characterized in that: The semiconductor testing device comprises: Heating table (1); A first clamping arm (2) and a second clamping arm (3), wherein the first clamping arm (2) and the second clamping arm (3) are respectively arranged on both sides of the heating platform (1); A slide rail (4), the slide rail (4) being installed between the first clamping arm (2) and the second clamping arm (3); A slide (5), wherein the slide (5) is slidably connected to the slide rail (4); A locking member (6), the locking member (6) is embedded in the slide (5) and is threadedly connected to the slide (5), wherein the locking member (6) is close to the end of the heating platform (1) and forms a pressure contact with the semiconductor device located on the heating platform (1) to limit the semiconductor device.

2. The semiconductor testing device according to claim 1, wherein: The locking member (6) comprises: a connecting portion (61), the connecting portion (61) being embedded in the slide (5) and being threadedly connected to the slide (5); a screwing portion (62), the screwing portion (62) being located on the end of the connecting portion (61) away from the heating platform (1); A pressure contact portion (63) is located on the end of the connecting portion (61) close to the heating platform (1) to form a pressure contact with the semiconductor device.

3. The semiconductor testing device according to claim 2, wherein: An inner hexagonal socket (6201) is provided on the end surface of the screwing portion (62) away from the connecting portion (61).

4. The semiconductor testing device according to claim 1, wherein: The slide (5) is embedded between the two slide rails (4) so ​​as to limit the slide (5) through the two slide rails (4).

5. The semiconductor testing device according to claim 4, wherein: The cross-sectional shape of the slide (5) in the vertical direction is an I-shape.

6. The semiconductor testing device according to claim 1, wherein: The slide rail (4) and the first clamping arm (2), and the slide rail (4) and the second clamping arm (3) respectively form a detachable connection.

7. The semiconductor testing device according to claim 6, wherein: The slide rail (4) and the first clamping arm (2), and the slide rail (4) and the second clamping arm (3) are respectively screw-connected.

8. The semiconductor testing device according to claim 6, wherein: The slide rail (4) and the first clamping arm (2), and the slide rail (4) and the second clamping arm (3) are respectively clamped and fixed.

9. The semiconductor testing device according to claim 1, wherein: Two first clamping parts (7) are horizontally arranged on the first clamping arm (2), and the heating platform (1) is embedded in a first clamping cavity formed by the two first clamping parts (7).

10. The semiconductor testing device according to claim 9, wherein: The first clamping portion (7) and the first clamping arm (2) are an integrated structure.

11. The semiconductor testing device according to claim 1, wherein: Two second clamping parts (8) are horizontally arranged on the second clamping arm (3), and the heating platform (1) is embedded in a second clamping cavity formed by the two second clamping parts (8).

12. The semiconductor testing device according to claim 11, wherein: The second clamping portion (8) and the second clamping arm (3) are an integrated structure.

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