Circuit board
By designing the border area and connection area on the circuit board to match the specifications of existing production equipment, the difficulties in mass production caused by inconsistent circuit board shapes are solved, and efficient and low-cost circuit board production is achieved.
Patent Information
- Application Number
- CN202422722785.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-11-08
AI Technical Summary
Existing production equipment is difficult to adapt to circuit boards of various shapes, resulting in the inability to directly carry out mass production. Additional tooling needs to be designed, which increases costs.
A circuit board structure is designed, including a border area and a connection area. The border area matches the specifications of existing production equipment, and the circuit board is fixed through the connection area to achieve mass production.
The mass production of circuit boards of different shapes can be realized on existing production equipment, which reduces the cost of additional tooling design and improves production efficiency.
Smart Images
Figure CN223334838U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip processing, in particular to a circuit board. Background Art
[0002] With the development of science and technology and social progress, the requirements for production efficiency and precision of precision components such as chips are becoming increasingly higher. When manufacturing electronic products, production equipment will usually print chips on thin metal frames. However, to achieve higher precision and efficiency, it is necessary to print chips directly on circuit boards. This process is usually called COB process.
[0003] Since circuit boards are directly used in products, their shapes vary. Some circuit boards are even irregular in shape and cannot match the specifications of existing production equipment such as fixtures, guide rails, semiconductor lead frame boxes, etc. Therefore, existing production equipment cannot be directly used for mass production. Additional tools need to be designed for fixation, which incurs additional costs. Utility Model Content
[0004] In view of this, in order to solve at least one of the aforementioned technical problems, an embodiment of the present invention provides a circuit board.
[0005] In order to achieve the above-mentioned purpose, the present invention mainly provides the following technical solutions:
[0006] The present invention provides a circuit board, comprising:
[0007] A frame area (100), the frame area (100) encloses a middle opening (101);
[0008] Connecting area (200);
[0009] At least one product area (300), the product area (300) is located in the middle opening (101), the product area (300) and the frame area (100) are connected through the connection area (200), and the product area (300) is used to connect the chip.
[0010] There are multiple connection areas (200), and at least two opposite sides of the product area (300) are connected to the connection areas (200).
[0011] There are multiple product areas (300), at least two of the multiple product areas (300) are arranged at intervals in a first direction, an extension length of the border area (100) in the first direction is greater than an extension length of the border area (100) in a second direction, and the second direction is perpendicular to the first direction;
[0012] The product area (300) is provided with connection areas (200) on opposite sides in the second direction.
[0013] There are multiple product areas (300), at least two of the multiple product areas (300) are spaced apart in the second direction, an extension length of the border area (100) in the first direction is greater than an extension length of the border area (100) in the second direction, and the second direction is perpendicular to the first direction;
[0014] Two adjacent product areas (300) in the second direction are connected via a connecting area (200).
[0015] Wherein, a plurality of openings are provided at the connection position between the product area (300) and the connection area (200);
[0016] Alternatively, the thickness of the connecting position between the product area (300) and the connecting area (200) is smaller than the center thickness of the connecting area (200).
[0017] The thickness of the connection area (200) at the junction with the frame area (100) is greater than the center thickness of the connection area (200).
[0018] The width of the connection position between the connection area (200) and the product area (300) is greater than or equal to 4.5 mm and less than or equal to 5.5 mm.
[0019] wherein the width of the connection area (200) in a direction approaching or away from the product area (300) is uniform;
[0020] Alternatively, the width of the connection region (200) decreases in a direction approaching the product region (300).
[0021] The outer edge of the frame area (100) extends in the first direction for a distance less than the depth of the semiconductor lead frame box;
[0022] The extension distance of the outer edge of the frame area (100) in the second direction is equal to the guide rail width of the chip manufacturing tool.
[0023] The distance between the outer edge of the frame area (100) and the edge of the middle opening (101) is greater than or equal to 4.5 mm and less than or equal to 5.5 mm.
[0024] The present invention provides a circuit board, which is connected to the frame area by a connector, and can be fixed by the frame area, so that the existing production equipment can be used for batch production of the circuit board, thereby increasing efficiency and saving costs. In the prior art, the shapes of the circuit boards are different, and some circuit boards are even irregular in shape, which cannot match the specifications of the existing production equipment such as clamps, guide rails, semiconductor lead frame boxes, etc. Therefore, the existing production equipment cannot be directly used for batch production, and additional tools need to be designed for fixing, which incurs additional costs. Compared with the prior art, in the present application document, the circuit board is connected to the frame area by a connector, and the shape of the frame area is a shape that matches the specifications of the production equipment. Then, the production equipment can perform operations such as clamping, moving, and storing through the frame area, and the product area is located in the frame area and can be a variety of shapes, thereby realizing batch production of different product areas based on existing general production equipment, without the need to design and manufacture clamps for different product areas separately, thereby reducing production costs and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 A schematic structural diagram of a circuit board provided by an embodiment of the present utility model at a first viewing angle;
[0026] Figure 2 A schematic structural diagram of another circuit board provided by an embodiment of the present invention at a second viewing angle. DETAILED DESCRIPTION
[0027] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the following is a detailed description of the specific implementation method, structure, characteristics and effects of a circuit board proposed according to the utility model in combination with the accompanying drawings and preferred embodiments.
[0028] like Figure 1-2 As shown, an embodiment of the present invention provides a circuit board, comprising:
[0029] A frame area (100), the frame area (100) encloses a middle opening (101);
[0030] Connecting area (200);
[0031] At least one product area (300), the product area (300) is located in the middle opening (101), the product area (300) and the frame area (100) are connected through the connection area (200), and the product area (300) is used to connect the chip.
[0032] The circuit board is used to connect the chip through the production equipment. The circuit board can be a PCB board and is suitable for the COB process. The production equipment mainly includes a guide rail, a moving mechanism, a robot arm and a welding mechanism. The guide rail is used to support the circuit board and guide the movement of the circuit board. The guide rail usually includes two guide moving devices located on opposite sides of the circuit board, which are used to guide and move the circuit board from both sides of the circuit board. When in use, the circuit board is transferred to the guide rail by the robot arm and moved to a specified position. The robot arm then picks up the chip and places it on the product area (300) of the circuit board. The welding mechanism welds the chip. For example, the COB process can be used to punch the chip on the product area (300). A semiconductor lead frame material box is provided in front of the guide rail. For convenience of explanation, the semiconductor lead frame material box is referred to as the material box below. The material box, also known as MAGAZINE, includes an internal space, and a plurality of relative support bars are provided in the internal space in the height direction. After the chip welding is completed, the guide rail moves the circuit board to the opening of the material box, cooperates with the moving mechanism to feed the circuit board into the material box, and supports the circuit board through the support bars.
[0033] In the following embodiments, the first direction refers to Figure 1-2 The X-axis direction is the length direction of the circuit board, and the second direction is the Figure 1-2 The Y-axis direction is the width direction of the circuit board.
[0034] The border area (100) is the structure of the outermost circle of the circuit board, and the size of the border area (100) determines the outer contour of the circuit board. The border area (100) is a frame whose specifications are compatible with the components of the production equipment such as the guide rail and the material box, so that the border area (100) can be clamped and moved by the guide rail, and can be sent into the internal space of the material box, and can be supported by the support bar. The specific size of the border area (100) can be set as needed, as long as it is adapted to the equipment size in the production environment. As in this application, for the FRONT production equipment, it is used to punch the chip on the LEAD FRAME. The guide rail width of the production equipment is 45 mm, then the extension distance of the outer edge of the border area (100) in the second direction Y, that is, the peripheral width M of the border area (100) is equal to the guide rail width of the chip making tool of 45 mm. After the chip connection is completed, the circuit board will be pushed into the semiconductor lead frame material box. Therefore, the extension distance of the outer edge of the border area (100) in the first direction X, that is, the outer perimeter length N of the border area (100) should be less than the depth of the internal space of the material box. For example, if the depth of the internal space is 160 mm, the length N of the border area (100) can be less than 160 mm, such as 150 mm, 155 mm, etc., to ensure that the circuit board can completely enter the internal space. The thickness of the border area (100) can be set as needed, such as the purpose of the product area (300). For example, the overall thickness of the circuit board is consistent, which is greater than or equal to 0.6 mm and less than or equal to 0.8 mm.
[0035] The product area (300) is the area on the circuit board used to connect the chip. The shape of the product area (300) needs to match the usage scenario and can be a variety of shapes, such as Figure 1 The approximate square shown in Figure 2 The product area (300) is a long strip as shown in the figure, or it can be various irregular shapes. After the processing is completed, the product area (300) needs to be removed by the connecting area (200) and enter the next step of processing, and then used for the product, and the connecting area (200) and the border area (100) are discarded. The connecting area (200) is a bridge connecting the product area (300) and the border area (100), which is intended to support the product area (300) and at the same time ensure that the product area (300) is easy to detach from the connecting area (200). Since the product area (300) is located in the middle opening (101) of the border area (100), the product area (300) can be any shape and can be applied to existing production equipment and material boxes through the border area (100).
[0036] The number and arrangement of the product areas (300) can be various, which will be further illustrated in the following text.
[0037] The present invention provides a circuit board that is connected to the frame area by a connector. The frame area can be used to fix the circuit board, so that the existing production equipment can be used for batch production of the circuit board, increasing efficiency and saving costs. In the prior art, the shapes of the circuit boards vary, and some circuit boards are even irregular in shape. They cannot match the specifications of existing production equipment such as clamps, guide rails, and semiconductor lead frame magazines. Therefore, existing production equipment cannot be directly used for batch production. Additional tools need to be designed for fixation, which incurs additional costs. Compared with the prior art, in the present application document, the circuit board is connected to the frame area by a connector. The shape of the frame area is a shape that matches the specifications of the production equipment. Then, the production equipment can perform operations such as clamping, moving, and storing through the frame area. The circuit board is located in the frame area and can be of various shapes. Then, different circuit boards can be mass-produced based on existing general production equipment, without the need to design and manufacture clamps for different circuit boards separately, thereby reducing production costs and improving production efficiency. In other words, when using the COB process, the circuit board of the present application is compatible with the guide rails of the existing equipment, without the need to readjust or make tools, and the light-emitting and receiving chips are printed on the product area in the middle. After production is completed, the entire unit can be placed in a general material box without the need for additional container design.
[0038] In one embodiment, there are multiple connection areas (200), and at least two opposite sides of the product area (300) are connected to connection areas (200). For example, the product area (300) can be connected to connection areas (200) on two opposite sides in the second direction Y, thereby ensuring the stability of the position of the product area (300) and avoiding too many connection areas (200) making it difficult for the product area (300) to separate from the connection area (200).
[0039] like Figure 1 As shown, there are a plurality of product areas (300), at least two of the plurality of product areas (300) are arranged at intervals in a first direction X, an extension length of the frame area (100) in the first direction X is greater than an extension length of the frame area (100) in a second direction Y, and the second direction Y is perpendicular to the first direction X. Connecting areas (200) are provided on opposite sides of the product area (300) in the second direction Y.
[0040] More specifically, if the number of product areas (300) is 6, the 6 product areas (300) are evenly distributed in the first direction X, that is, in the longitudinal direction of the middle opening (101), and the connection areas (200) are connected to both sides of each product area (300) in the second direction Y, and the connection areas (200) are directly connected to the border area (100). In the above embodiment, the size of the product area (300) can be 18.4 mm in the first direction X and 19.6 mm in the second direction Y.
[0041] Or, as Figure 2 As shown, there are a plurality of product areas (300), at least two of the plurality of product areas (300) are arranged at intervals in the second direction Y, the extension length of the frame area (100) in the first direction X is greater than the extension length of the frame area (100) in the second direction Y, and the second direction Y is perpendicular to the first direction X. Two adjacent product areas (300) in the second direction Y are connected by a connecting area (200).
[0042] For example, there are 18 product areas (300), which are arranged in 3 rows and 6 columns in the middle opening (101). That is, every 3 product areas (300) form a group, and the three product areas (300) in a group are arranged in the second direction Y, and the 6 groups of product areas (300) are arranged in the first direction X. Among the three product areas (300) in a group, a connecting area (200) is respectively provided between the two product areas (300) on both sides and the border area (100), and the two sides of the product area (300) in the middle are connected to the two product areas (300) on both sides through the connecting area (200), thereby realizing a compact arrangement of the product areas (300) when the number of product areas (300) is small.
[0043] It can be understood that the above are only two specific implementation methods, and the product area (300) can also have more layout methods and can be set up as needed, such as irregular layout.
[0044] In one embodiment, a plurality of openings are provided at the connection position between the product area (300) and the connection area (200), and the plurality of openings are spaced apart in the first direction X. The connection position between the product area (300) and the connection area (200) is punched using a stamp hole process, so that the product area (300) is more easily separated from the connection area (200) under the action of an external force, and the connection area (200) is not easily separated from the frame area (100).
[0045] In another embodiment, the thickness of the connection position between the product area (300) and the connection area (200) may be smaller than the center thickness of the connection area (200). By reducing the thickness of the connection position between the product area (300) and the connection area (200), the product area (300) can be more easily separated from the connection area (200) under the action of an external force. The thickness can be reduced by processing a groove extending on the first mode X at the connection position between the product area (300) and the connection area (200).
[0046] In one embodiment, the thickness of the connecting area (200) and the border area (100) at the junction is greater than the center thickness of the connecting area (200), thereby preventing the connecting area (200) from separating from the border area (100) under external force.
[0047] In one embodiment, the width D of the connecting position between the connecting area (200) and the product area (300) in the first direction X is greater than or equal to 4.5 mm and less than or equal to 5.5 mm. For example, the width D can be 5 mm. This ensures the supporting strength of the product area (300) and facilitates the separation of the connecting area (200) and the product area (300).
[0048] In one embodiment, the width of the connection area (200) in the direction of approaching or moving away from the product area (300) is uniform, that is, the connection area (200) is a relatively regular, approximately square structure, and the overall width of the connection area (200) is 5 mm. Alternatively, the width of the connection area (200) in the direction of approaching the product area (300) decreases. That is, the width of the connection area (200) at the position where it connects with the product area (300) is smaller, thereby ensuring that the connection area (200) and the product area (300) are easily separated, while the width of the connection area (200) at the position where it connects with the border area (100) is larger, thereby ensuring the supporting strength of the connection area (200) and preventing the connection area (200) from separating from the border area (100). For example, the width of the connection area (200) at the position where it connects with the product area (300) is 5 mm, while the width of the connection area (200) at the position where it connects with the border area (100) is 6 mm.
[0049] In one embodiment, the distance between the outer edge of the frame area (100) and the edge of the middle opening (101) is greater than or equal to 4.5 mm and less than or equal to 5.5 mm. This ensures the supporting strength of the frame area (100) while ensuring that the middle opening (101) has sufficient space to accommodate multiple product areas (300), thereby increasing the space utilization rate of the circuit board.
[0050] For example, a first distance L1 between the outer edge of the frame area (100) and the edge of the middle opening (101) on one side in the first direction X is 5.33 mm, and a second distance L2 between the outer edge of the frame area (100) and the edge of the middle opening (101) on one side in the second direction Y is 4.7 mm.
[0051] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.
Claims
1. A circuit board, characterized in that: include: A frame area (100), wherein the frame area (100) encloses a central opening (101); Connecting area (200); At least one product area (300), the product area (300) is located in the middle opening (101), the product area (300) and the frame area (100) are connected through the connection area (200), and the product area (300) is used to connect a chip.
2. The circuit board according to claim 1, wherein: There are multiple connection areas (200), and at least two opposite sides of the product area (300) are respectively connected to the connection areas (200).
3. The circuit board according to claim 1, wherein: There are multiple product areas (300), at least two of the multiple product areas (300) are arranged at intervals in a first direction, an extension length of the border area (100) in the first direction is greater than an extension length of the border area (100) in a second direction, and the second direction is perpendicular to the first direction; The connecting area (200) is provided on opposite sides of the product area (300) in the second direction.
4. The circuit board according to claim 1, wherein: There are multiple product areas (300), at least two of the multiple product areas (300) are arranged at intervals in the second direction, the extension length of the border area (100) in the first direction is greater than the extension length of the border area (100) in the second direction, and the second direction is perpendicular to the first direction; Two adjacent product areas (300) in the second direction are connected via the connecting area (200).
5. The circuit board according to claim 1, wherein: A plurality of openings are provided at the connection position between the product area (300) and the connection area (200); Alternatively, the thickness of the connecting position between the product area (300) and the connecting area (200) is smaller than the center thickness of the connecting area (200).
6. The circuit board according to claim 1, wherein: The thickness of the connecting area (200) and the border area (100) at the connection position is greater than the center thickness of the connecting area (200).
7. The circuit board according to claim 1, wherein: The width of the connecting position between the connecting area (200) and the product area (300) in the first direction is greater than or equal to 4.5 mm and less than or equal to 5.5 mm.
8. The circuit board according to claim 1, wherein: The width of the connection area (200) in a direction approaching or away from the product area (300) is uniform; Alternatively, the width of the connection area (200) decreases in a direction approaching the product area (300).
9. The circuit board according to claim 1, wherein: The extension distance of the outer edge of the frame area (100) in the first direction is less than the depth of the semiconductor lead frame box; The extension distance of the outer edge of the frame area (100) in the second direction is equal to the guide rail width of the chip manufacturing tool.
10. The circuit board according to claim 1, wherein: The distance between the outer edge of the frame area (100) and the edge of the middle opening (101) is greater than or equal to 4.5 mm and less than or equal to 5.5 mm.