LED packaging device

Abstract

The utility model relates to the technical field of semiconductor light emitting, and discloses an LED packaging device which comprises a support, an LED light emitting chip, a light-transmitting glue layer, a high-reflection glue layer and a lens. The LED light-emitting chip is arranged on the support and internally provided with a plurality of light scattering particles. The light-transmitting glue layer at least covers part of the upper surface of the LED light-emitting chip. And the upper surface of the light-transmitting glue layer is rhombic. The high-reflection glue layer is arranged on the support and at least covers the side face of the light-transmitting glue layer. Cavity structures are arranged between the lens and the light-transmitting glue layer and between the lens and the high-reflection glue layer. The lens includes a first optical interface and a second optical interface. The first optical interface is a plane or a micro-cambered surface, and the second optical interface is a convex curved surface. The light scattering particles are arranged in the light-transmitting adhesive layer, and the upper surface of the light-transmitting adhesive layer is rhombic, so that a rhombic light field with uniform light emission is realized. Through the arrangement of the lens surface type, the preset light emitting angle and illumination intensity of light are accurately achieved, and the requirements of application scenes are met. The LED packaging device also has the advantages of good light spot edge cut-off performance, small size and the like.

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