Electronic device including dummy contact hole

Abstract

The utility model relates to an electronic device. The electronic device includes a display layer and a sensor layer disposed on the display layer. The sensor layer includes a first electrode, a second electrode including a sensing pattern and a bridge pattern, an insulating layer disposed between the sensing pattern and the bridge pattern, and a dummy pattern disposed on the same layer as the bridge pattern and spaced apart from the bridge pattern. A plurality of contact holes are defined through the insulating layer, the plurality of contact holes including an active contact hole through which a portion of the bridge pattern is exposed and a dummy contact hole through which a portion of the dummy pattern is exposed. The sensing pattern is electrically connected to the bridge pattern via the active contact hole, and the first electrode or the sensing pattern is connected to the dummy pattern via the dummy contact hole.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2023-0142323 filed on October 23, 2023, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to an electronic device, and more particularly, to an electronic device including a dummy contact hole. Background Art

[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation units, portable game consoles, and automotive displays display images and provide touch-based input methods, in addition to conventional input methods such as buttons, keyboards, and mice, that allow users to easily and intuitively input information or commands. Many of these electronic devices utilize conductive patterns to sense touch events. These conductive patterns may tend to reflect external light, and the reflected light may be perceived by the user. Utility Model Content

[0005] An electronic device includes a display layer configured to display an image, and a sensor layer disposed on the display layer. The sensor layer includes a first electrode, a second electrode intersecting the first electrode and including a sensing pattern and a bridge pattern, an insulating layer disposed between the sensing pattern and the bridge pattern, and a dummy pattern disposed on the same layer as the bridge pattern and spaced apart from the bridge pattern. A plurality of contact holes are defined through the insulating layer, the plurality of contact holes including effective contact holes and dummy contact holes, the effective contact holes exposing a portion of the bridge pattern, the dummy contact holes exposing a portion of the dummy pattern, the sensing pattern being electrically connected to the bridge pattern via the effective contact holes, and the first electrode or the sensing pattern being connected to the dummy pattern via the dummy contact holes.

[0006] The first electrode may include first grid lines extending in a first direction and second grid lines extending in a second direction intersecting the first direction, and the sensing pattern may include third grid lines extending in the first direction and fourth grid lines extending in the second direction.

[0007] The dummy contact holes may be provided in plurality, the plurality of dummy contact holes may be defined at a first intersection where the first grid line intersects or meets the second grid line and a second intersection where the third grid line intersects or meets the fourth grid line, and the effective contact hole may overlap with the bridge pattern at a position where the third grid line intersects or meets the fourth grid line.

[0008] The first electrode may further include a first non-opening region having a width greater than that of the first grid line, and the sensing pattern may further include a second non-opening region having a width greater than that of the third grid line.

[0009] The effective contact hole may overlap with the second non-opening region.

[0010] The dummy contact hole may be provided in plurality, and the plurality of dummy contact holes may overlap with the first non-opening region.

[0011] The dummy contact hole may be provided in plurality, and the plurality of dummy contact holes may be defined at a first intersection where the first grid line intersects or meets the second grid line, a second intersection where the third grid line intersects or meets the fourth grid line, and the first non-opening area.

[0012] The display layer may include a plurality of first light-emitting areas, a plurality of second light-emitting areas, and a plurality of third light-emitting areas. The plurality of first light-emitting areas may be arranged alternately with the plurality of second light-emitting areas in the second direction. The plurality of third light-emitting areas may be arranged in the second direction, and one of the plurality of third light-emitting areas may be spaced apart from one of the plurality of first light-emitting areas and one of the plurality of second light-emitting areas in the first direction.

[0013] The effective contact hole may be defined between two third light emitting regions adjacent to each other in the second direction among the plurality of third light emitting regions, and the bridge pattern may overlap a region between the two third light emitting regions.

[0014] The dummy contact hole may be defined between two other third light emitting regions adjacent to each other in the second direction among the plurality of third light emitting regions, and the dummy pattern may overlap a region between the two other third light emitting regions.

[0015] The bridge pattern may extend in a first direction, and the dummy pattern may be spaced apart from the bridge pattern in a second direction intersecting the first direction.

[0016] The bridge pattern may include a curved portion facing the dummy pattern and curved to bypass the dummy pattern.

[0017] The effective contact hole may be spaced apart from the dummy contact hole in the first direction, and the effective contact hole and the dummy contact hole may be aligned with each other in the first direction.

[0018] The bridge pattern may include a line portion extending in a first direction, and the dummy contact hole may be spaced apart from the bridge pattern in a second direction intersecting the first direction.

[0019] The bridge pattern may further include a meandering portion extending from the line portion, and the dummy contact hole may be spaced apart from the meandering portion in the second direction.

[0020] The bridge pattern may further include a connection portion connected to the line portion, and the effective contact hole may overlap with the connection portion.

[0021] The bridge pattern may further include a protrusion portion protruding from the line portion in the second direction, and the effective contact hole may overlap with the protrusion portion.

[0022] The sensor layer may further include a plurality of dummy bridge patterns disposed on the same layer as the bridge pattern and spaced apart from the bridge pattern.

[0023] The plurality of dummy bridge patterns may include: a first dummy bridge pattern that overlaps the first electrode and the sensing pattern and is electrically floating; a second dummy bridge pattern that may overlap the first electrode and may be electrically connected to the first electrode; and a third dummy bridge pattern that may overlap the sensing pattern and may be electrically connected to the sensing pattern.

[0024] An electronic device includes a display layer configured to display an image, and a sensor layer disposed on the display layer. The sensor layer includes a first electrode, a second electrode intersecting the first electrode and including a sensing pattern and a bridge pattern, an insulating layer disposed between the sensing pattern and the bridge pattern, and a dummy pattern disposed on the same layer as the bridge pattern and spaced apart from the bridge pattern. A plurality of contact holes are defined through the insulating layer, the plurality of contact holes including effective contact holes overlapping the bridge pattern and dummy contact holes that do not overlap the bridge pattern but overlap the dummy pattern. The bridge pattern includes a line portion extending in a first direction. The dummy contact holes are spaced apart from the bridge pattern in a second direction intersecting the first direction.

[0025] The bridge pattern may further include a meandering portion extending from the line portion, and the dummy contact hole may be spaced apart from the meandering portion in the second direction.

[0026] The bridge pattern may further include a connection portion connected to the line portion, and the effective contact hole may overlap with the connection portion.

[0027] The bridge pattern may further include a protrusion portion protruding from the line portion in the second direction, and the effective contact hole may overlap with the protrusion portion.

[0028] The electronic device includes: a first conductive layer including a bridge pattern and a plurality of dummy patterns; a second conductive layer including a plurality of conductive patterns having a grid structure; and an insulating layer disposed between the first conductive layer and the second conductive layer and having a plurality of effective contact holes and a plurality of dummy contact holes defined therethrough. The plurality of effective contact holes overlap with the bridge pattern, and the plurality of dummy contact holes respectively overlap with the plurality of dummy patterns.

[0029] The mesh structure may include a plurality of intersections, and each of the plurality of intersections may overlap with at least one contact hole among the plurality of effective contact holes and the plurality of dummy contact holes.

[0030] The grid structure may include multiple grid lines and multiple non-opening areas, the non-opening areas having a width greater than that of the grid lines, and each of the non-opening areas may overlap with at least one effective contact hole among the effective contact holes or at least one dummy contact hole among the dummy contact holes.

[0031] The bridge pattern may include a line portion extending in a first direction, and the plurality of dummy contact holes may be spaced apart from the bridge pattern in a second direction intersecting the first direction.

[0032] The bridge pattern may further include a plurality of meandering portions extending from the line portion, and the plurality of dummy contact holes may be spaced apart from the plurality of meandering portions in the second direction.

[0033] The bridge pattern may further include a plurality of connection portions having a width greater than that of the line portion, and the plurality of effective contact holes may overlap the plurality of connection portions, respectively.

[0034] The bridge pattern may further include a plurality of protrusion portions protruding from the line portion in the second direction, and the plurality of effective contact holes may overlap the plurality of protrusion portions. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and other aspects of the present disclosure will become readily apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0036] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure;

[0037] Figure 2 is a perspective view of an electronic device according to an embodiment of the present disclosure;

[0038] Figure 3 is a block diagram of an electronic device according to an embodiment of the present disclosure;

[0039] Figure 4A is a cross-sectional view of a display panel according to an embodiment of the present disclosure;

[0040] Figure 4B is a cross-sectional view of a sensor layer according to an embodiment of the present disclosure;

[0041] Figure 5 is a plan view of a sensor layer according to an embodiment of the present disclosure;

[0042] Figure 6 is an enlarged plan view of a portion of a display panel according to an embodiment of the present disclosure;

[0043] Figure 7 is an enlarged plan view of a portion of a sensor layer according to an embodiment of the present disclosure;

[0044] Figure 8 is a cross-sectional view of a sensor layer according to an embodiment of the present disclosure;

[0045] Figure 9 is a cross-sectional view of a sensor layer according to an embodiment of the present disclosure;

[0046] Figure 10 is a cross-sectional view of a sensor layer according to an embodiment of the present disclosure;

[0047] Figure 11 is an enlarged plan view of a portion of a display panel according to an embodiment of the present disclosure;

[0048] Figure 12 is an enlarged plan view of a portion of a sensor layer according to an embodiment of the present disclosure;

[0049] Figure 13 is an enlarged plan view of a portion of a sensor layer according to an embodiment of the present disclosure;

[0050] Figure 14 is an enlarged plan view of a portion of a sensor layer according to an embodiment of the present disclosure;

[0051] Figure 15 is an enlarged plan view of a portion of a sensor layer according to an embodiment of the present disclosure;

[0052] Figure 16 is an enlarged plan view of a portion of a display panel according to an embodiment of the present disclosure; and

[0053] Figure 17 is an enlarged plan view of a portion of a display panel according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0054] In this disclosure, it will be understood that when an element (or region, layer or portion) is referred to as being "on," "connected to" or "coupled to" another element or layer, it can be directly on, directly connected to or directly coupled to the other element or layer, or intervening elements or layers may be present.

[0055] Throughout the specification and drawings, the same reference numerals may represent the same elements. Although each of the drawings may represent one or more specific embodiments of the present disclosure and are drawn to scale so that relative lengths, thicknesses, and angles can be inferred therefrom, it will be understood that the present disclosure is not necessarily limited to the relative lengths, thicknesses, and angles shown. These values ​​may be changed within the spirit and scope of the present disclosure, for example, to allow for manufacturing limitations, etc. As used herein, the term "and / or" may include any and all combinations of one or more of the relevant listed items.

[0056] It will be understood that although the terms first, second, etc. can be used to describe various elements in this article, these elements should not necessarily be limited by these terms. These terms are used to distinguish an element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below can be referred to as the second element. As used herein, the singular forms "a", "an", and "the" are intended to also include plural forms, unless the context clearly indicates otherwise.

[0057] For ease of description, spatially relative terms such as “below,” “beneath,” “lower,” “above,” “upper,” etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figures.

[0058] It will also be understood that when used in this specification, the terms “include” and / or “including” indicate the presence of stated features, integers, steps, operations, elements and / or parts, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof.

[0059] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0060] Figure 1 is a perspective view of an electronic device 1000 according to an embodiment of the present disclosure. Figure 2 is a perspective view of an electronic device 1000 - 1 according to an embodiment of the present disclosure.

[0061] refer to Figure 1 and Figure 2, the electronic device 1000 or 1000-1 can be activated in response to an electrical signal. For example, the electronic device 1000 or 1000-1 can be a mobile phone, a foldable mobile phone, a notebook computer, a television, a tablet computer, a car navigation unit, a game console, or a wearable device, however, it should not necessarily be limited thereto or thereby. Figure 1 A tablet computer is shown as a representative example of the electronic device 1000, and Figure 2 A notebook computer is shown as a representative example of the electronic device 1000 - 1 .

[0062] The electronic device 1000 may include an active area 1000A and a peripheral area 1000NA disposed (defined or formed) therein. The electronic device 1000 may display an image through the active area 1000A. The active area 1000A may include a surface defined by a first direction DR1 and a second direction DR2. The peripheral area 1000NA may at least partially surround the active area 1000A. As used herein, the phrase "at least partially surrounds" is understood to mean that the surrounding element contacts the surrounded element on at least one side or portion thereof, may contact the surrounded element on two sides (whether these sides are opposite sides or adjacent sides), may contact the surrounded element on more than two sides, and may even completely surround the surrounded element. Depending on the embodiment, the peripheral area 1000NA may be omitted.

[0063] The thickness direction of the electronic device 1000 may be measured in a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and the rear surface (or lower surface) of each member of the electronic device 1000 may be defined with respect to the third direction DR3.

[0064] The electronic device 1000 may include a display panel DP. The display panel DP may display an image and may sense an external input applied thereto. For example, the external input may be a user input. The user input may include various forms of external input, such as a part of the user's body, a stylus, a pen, light, heat, or pressure.

[0065] Figure 1 A bar-type electronic device 1000 is shown as a representative example, however, the present disclosure should not necessarily be limited thereto or thereby. As an example, the following description can be applied to various electronic devices, such as a rollable electronic device, a slidable electronic device, a stretchable electronic device, etc.

[0066] Figure 3 is a block diagram of an electronic device 1000 according to an embodiment of the present disclosure.

[0067] refer to Figure 3 , the electronic device 1000 may include a display layer 100 , a sensor layer 200 , a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power circuit 1000P.

[0068] The display layer 100 may have a configuration for generating an image. The display layer 100 may be a light-emitting type display layer. For example, the display layer 100 may be an organic light-emitting diode (OLED) display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer.

[0069] The sensor layer 200 may be provided on the display layer 100. The sensor layer 200 may sense external input applied thereto. The sensor layer 200 may be an integrated sensor formed continuously in the manufacturing process of the display layer 100, or the sensor layer 200 may be an external type sensor attached to the display layer 100.

[0070] The main driver 1000C may control the overall operation of the electronic device 1000. For example, the main driver 1000C may control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may be referred to as a host. The main driver 1000C may also include a graphics controller.

[0071] The display driver 100C can drive the display layer 100. The display driver 100C can receive image data and control signals from the main driver 1000C. The control signals may include various signals. As an example, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, a data enable signal, etc.

[0072] The sensor driver 200C may drive the sensor layer 200. The sensor driver 200C may receive a control signal from the main driver 1000C. The control signal may include a clock signal of the sensor driver 200C.

[0073] The power circuit 1000P may include a power management integrated circuit (PMIC). The power circuit 1000P may generate a plurality of driving voltages to drive the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. As an example, the driving voltages may include a gate high voltage, a gate low voltage, an ELVSS voltage, an ELVDD voltage, an initialization voltage, etc. However, the present disclosure should not necessarily be particularly limited thereto.

[0074] The electronic device 1000 can sense external input applied thereto. The electronic device 1000 can sense passive input generated by the touch event 2000. The touch event 2000 can include all input members that cause a change in capacitance, such as the user's body and an input device (e.g., a pen or stylus).

[0075] Figure 4A is a cross-sectional view of a display panel DP according to an embodiment of the present disclosure.

[0076] refer to Figure 4A , the display panel DP may include a display layer 100 and a sensor layer 200 .

[0077] The display layer 100 may be configured to generate an image. The display layer 100 may be a light-emitting type display layer. For example, the display layer 100 may be an organic light-emitting diode (OLED) display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0078] The base layer 110 may be a member that provides a base surface on which the circuit layer 120 is disposed. The base layer 110 may have a single-layer or multi-layer structure. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, however, the present disclosure should not necessarily be limited thereto or thereby. The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 by a coating or deposition process. The insulating layer, the semiconductor layer, and the conductive layer may then be selectively patterned by a variety of photolithography processes.

[0079] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. The encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may protect the light-emitting element layer 130 from moisture, oxygen, and foreign matter such as dust particles.

[0080] At least one buffer layer (BFL) may be formed on the upper surface of the base layer 110. The buffer layer (BFL) may enhance adhesion between the base layer 110 and the semiconductor pattern. The buffer layer (BFL) may be formed in multiple layers. The display layer 100 may further include a barrier layer. The buffer layer (BFL) may include silicon oxide, silicon nitride, and / or silicon oxynitride. For example, the buffer layer (BFL) may have a stacked structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0081] A semiconductor pattern (such as a source region SC, an active region AL, a drain region DR, and a connection signal line SCL) may be provided on the buffer layer BFL. The semiconductor pattern may include polysilicon, however, it should not necessarily be limited thereto or thereby. The semiconductor pattern may include amorphous silicon, low-temperature polysilicon, or an oxide semiconductor.

[0082] Figure 4A A portion of a semiconductor pattern is shown, and the semiconductor pattern may be further arranged in other regions. The semiconductor pattern may be arranged to span a plurality of pixels in a specific rule. The semiconductor pattern may have different electrical characteristics, depending on whether it is doped, or whether it is doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a first region with relatively high conductivity (such as a source region SC, a drain region DR, and a connection signal line SCL) and a second region with relatively low conductivity (such as an active region AL). The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant, and the N-type transistor may include a doped region doped with an N-type dopant. The second region may be a non-doped region, or may be a region doped with a concentration lower than that of the first region.

[0083] The first region may have a greater conductivity than the second region and may be substantially used as an electrode or a signal line. The second region may substantially correspond to the active area AL (or channel) of the transistor 100PC. For example, a portion of the semiconductor pattern may be the active area AL of the transistor 100PC, another portion of the semiconductor pattern may be the source region SC or the drain region DR of the transistor 100PC, and the remaining portion of the semiconductor pattern may be a connection electrode or a connection signal line SCL.

[0084] Figure 4A One transistor 100PC and one light emitting element 100PE are shown included in each pixel.

[0085] The source region SC, the active region AL, and the drain region DR of the transistor 100PC may be formed of a semiconductor pattern. The source region SC and the drain region DR may extend from the active region AL in opposite directions in a cross section. Figure 4A A portion of a connection signal line SCL formed of a semiconductor pattern is shown. In a plan view, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC.

[0086] The first insulating layer 10 may be provided on the buffer layer BFL. The first insulating layer 10 may overlap with a plurality of pixels in common and may cover a semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The first insulating layer 10 may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide and / or hafnium oxide. In the present embodiment, the first insulating layer 10 may have a silicon oxide layer with a single-layer structure. Not only the first insulating layer 10, but also the insulating layer of the circuit layer 120 described later may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the materials mentioned above, however, it should not necessarily be limited thereto or thereby.

[0087] The gate GT of the transistor 100PC may be disposed on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT may overlap with the active area AL. The gate GT may be used as a mask in a process of doping the semiconductor pattern.

[0088] The second insulating layer 20 may be provided on the first insulating layer 10 and may cover the gate electrode GT. The second insulating layer 20 may overlap with a plurality of pixels in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single layer or a multilayer structure. The second insulating layer 20 may include silicon oxide, silicon nitride, and / or silicon oxynitride. In this embodiment, the second insulating layer 20 may have a multilayer structure of a silicon oxide layer and a silicon nitride layer.

[0089] The third insulating layer 30 may be provided on the second insulating layer 20. The third insulating layer 30 may have a single layer or a multi-layer structure. As an example, the third insulating layer 30 may have a multi-layer structure of a silicon oxide layer and a silicon nitride layer.

[0090] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 defined through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0091] The fourth insulating layer 40 may be provided on the third insulating layer 30. The fourth insulating layer 40 may have a silicon oxide layer having a single-layer structure. The fifth insulating layer 50 may be provided on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0092] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 defined through the fourth insulating layer 40 and the fifth insulating layer 50.

[0093] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0094] The light-emitting element layer 130 may be provided on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. As an example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. Hereinafter, an organic light-emitting element will be described as the light-emitting element 100PE, however, it should not be particularly limited thereto.

[0095] The light emitting element 100PE may include a first electrode AE, a light emitting layer EL, and a second electrode CE.

[0096] The first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be connected to the second connection electrode CNE2 through a contact hole CNT-3 defined through the sixth insulating layer 60.

[0097] The pixel defining layer 70 may be disposed on the sixth insulating layer 60 and may cover a portion of the first electrode AE. An opening 70-OP may be defined by the pixel defining layer 70. At least a portion of the first electrode AE ​​may be exposed through the opening 70-OP defined by the pixel defining layer 70.

[0098] The display layer 100 may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may at least partially surround the light-emitting region PXA. In this embodiment, the light-emitting region PXA may be defined as a portion corresponding to the first electrode AE ​​exposed by the opening 70-OP.

[0099] The light-emitting layer EL may be provided on the first electrode AE. The light-emitting layer EL may be provided in a region corresponding to the opening 70-OP. For example, the light-emitting layer EL may be formed in each pixel after being divided into a plurality of sections. When the light-emitting layer EL is formed in each pixel after being divided into a plurality of sections, each of the light-emitting layers EL may emit blue light, red light, and / or green light, however, it should not necessarily be limited to this or thereby. The light-emitting layer EL may be formed integrally and may be provided in common to a plurality of pixels. In this case, the light-emitting layer EL may provide blue light or white light.

[0100] The second electrode CE may be disposed on the light emitting layer EL. The second electrode CE may have an integral shape (eg, have a single continuous structure without interruption), and may be commonly disposed across a plurality of pixels.

[0101] According to an embodiment, a hole control layer may be provided between the first electrode AE ​​and the light-emitting layer EL. The hole control layer is commonly provided in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. An electron control layer may be provided between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. Each of the hole control layer and the electron control layer may be commonly formed in multiple pixels using an open mask.

[0102] The encapsulation layer 140 may be provided on the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked on top of each other, however, the layers of the encapsulation layer 140 should not necessarily be limited thereto or thereby. The inorganic layer may protect the light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, however, it should not necessarily be limited thereto or thereby.

[0103] The sensor layer 200 may include a base layer 201 , a first conductive layer 202 , an intermediate insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0104] The base layer 201 may be an inorganic layer including silicon nitride, silicon oxynitride, and / or silicon oxide. Alternatively, the base layer 201 may be an organic layer including an epoxy-based resin, an acrylic-based resin, or an imide-based resin. The base layer 201 may have a single-layer structure or a multi-layer structure having layers stacked in the third direction DR3.

[0105] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure, or a multi-layer structure in which layers are stacked in the third direction DR3 .

[0106] Each of the first conductive layer 202 and the second conductive layer 204 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (ITZO), etc. In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc.

[0107] Each of the first conductive layer 202 and the second conductive layer 204 having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of titanium / aluminum / titanium. The multi-layer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0108] The intermediate insulating layer 203 and / or the cap insulating layer 205 may include an inorganic layer, which may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and / or hafnium oxide.

[0109] The intermediate insulating layer 203 and / or the cover insulating layer 205 may include an organic layer. The organic layer may include an acrylic-based resin, a methacrylic-based resin, a polyisoprene-based resin, an ethylene-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyimide-based resin, a polyamide-based resin, and / or a perylene-based resin.

[0110] Figure 4B The sensor layer 200 according to the embodiment of the present disclosure (refer to Figure 4A ) cross-sectional view.

[0111] refer to Figure 4A and Figure 4B , the second grid line MS2 included in the second conductive layer 204 may have a second width 204wt that is equal to or greater than the first width 202wt of the first grid line MS1 included in the first conductive layer 202. When the user USR views the first grid line MS1 and the second grid line MS2 from one side of the sensor layer 200, since the width of the first grid line MS1 is smaller than the width of the second grid line MS2, the probability of the user USR recognizing the first grid line MS1 may be reduced.

[0112] Each of the first and second mesh lines MS1 and MS2 may include a first metal layer M1 and a second metal layer M2 disposed between the first metal layers M1. As an example, the first metal layer M1 may include titanium (Ti) and the second metal layer M2 may include aluminum (Al), however, this is an example.

[0113] According to an embodiment, the first thickness TK1 of the second metal layer M2 of the first grid line MS1 and the second thickness TK2 of the second metal layer M2 of the second grid line MS2 may be substantially the same, however, the present disclosure is not necessarily limited thereto. As an example, the second thickness TK2 may be greater than the first thickness TK1. According to an embodiment, each of the first thickness TK1 and the second thickness TK2 may be approximately 1000 angstroms or greater, for example, approximately 6000 angstroms.

[0114] Figure 5is a plan view of a sensor layer 200 according to an embodiment of the present disclosure.

[0115] refer to Figure 5 , the sensor layer 200 may include a sensing region 200A defined therein and a peripheral region 200NA adjacent to the sensing region 200A.

[0116] The sensor layer 200 may include a plurality of first electrodes 210 and a plurality of second electrodes 220 arranged in a sensing region 200A. The first electrodes 210 may be arranged in a first direction DR1, and the second electrodes 220 may be arranged in a second direction DR2 intersecting the first direction DR1. Each of the first electrodes 210 may extend in the second direction DR2, and each of the first electrodes 210 may intersect with the second electrode 220. Each of the second electrodes 220 may extend in the first direction DR1, and each of the second electrodes 220 may intersect with the first electrode 210. The region where the first and second electrodes 210 and 220 intersect may form a sensing unit SU.

[0117] Figure 5 Eight first electrodes 210 and twelve second electrodes 220 are shown as a representative example, however, the number of each of the first electrodes 210 and the second electrodes 220 should not necessarily be particularly limited thereto. As an example, the number of the first electrodes 210 and the number of the second electrodes 220 may be determined according to the electronic device 1000 (refer to FIG. Figure 1 )'s screen ratio.

[0118] The sensor layer 200 may include a plurality of first traces 210 t electrically connected to the first electrodes 210 , respectively, and a plurality of second traces 220 t electrically connected to the second electrodes 220 , respectively.

[0119] According to the present disclosure, the first trace 210t and the second trace 220t may be arranged in the peripheral area 200NA, however, they should not necessarily be limited thereto or thereby. As an example, the second trace 220t may be extended and may be arranged in the sensing area 200A. In this case, the size of the peripheral area 200NA may be reduced. As a result, the size of the electronic device 1000 (refer to FIG. 1 ) may be reduced. Figure 1 ) on the front surface of the peripheral area 1000NA (reference Figure 1 ) and can achieve a narrow border.

[0120] Figure 6 is an enlarged plan view of a portion of the display panel DP according to an embodiment of the present disclosure.

[0121] refer to Figure 4A 、 Figure 5 and Figure 6The display layer 100 of the display panel DP may include a plurality of light-emitting regions PXA. The light-emitting regions PXA may include a first light-emitting region PXA-R, a second light-emitting region PXA-G, and a third light-emitting region PXA-B. As an example, the first light-emitting region PXA-R may be a red light-emitting region, the second light-emitting region PXA-G may be a green light-emitting region, and the third light-emitting region PXA-B may be a blue light-emitting region.

[0122] One first light emitting region PXA-R and one second light emitting region PXA-G may be arranged alternately and repeatedly with each other in the second direction DR2. The third light emitting region PXA-B may be arranged in the second direction DR2. The third light emitting region PXA-B may be spaced apart from the first light emitting region PXA-R and the second light emitting region PXA-G in the first direction DR1. Figure 6 The arrangement relationship among the first light emitting region PXA-R, the second light emitting region PXA-G, and the third light emitting region PXA-B shown in FIG. 1 is an example, and the present disclosure should not necessarily be particularly limited thereto.

[0123] The first electrode 210 may have a first mesh structure MSS1. As an example, the first mesh structure MSS1 may include a plurality of first mesh lines MS11 extending in a first direction DR1 and a plurality of second mesh lines MS12 extending in a second direction DR2. A portion where one first mesh line MS11 intersects or meets one second mesh line MS12 may be referred to as a first intersection point MCP1.

[0124] Each of the second electrodes 220 may include a sensing pattern 221 and a bridge pattern 222 disposed on a different layer from the sensing patterns 221. The sensing patterns 221 may be spaced apart from each other in the first direction DR1, and the bridge pattern 222 may electrically connect adjacent sensing patterns 221. Each of the sensing patterns 221 may have a second mesh structure MSS2. As an example, the second mesh structure MSS2 may include a plurality of third mesh lines MS21 extending in the first direction DR1 and a plurality of fourth mesh lines MS22 extending in the second direction DR2. The portion where one third mesh line MS21 intersects or meets one fourth mesh line MS22 may be referred to as a second intersection point MCP2.

[0125] According to an embodiment, the first electrode 210 and the sensing pattern 221 may be provided on the same layer. The bridge pattern 222 may be provided on a different layer from the first electrode 210 and the sensing pattern 221. As an example, the first electrode 210 and the sensing pattern 221 may be included in the second conductive layer 204 (refer to FIG. Figure 4A ), and the bridge pattern 222 may be included in the first conductive layer 202 (reference Figure 4A). In this case, the sensor layer 200 may have a structure in which the bridge pattern 222 is provided closer to the display layer 100 than the sensing pattern 221. Therefore, the sensor layer 200 may have a bottom bridge structure, however, this is an example, and the present disclosure should not necessarily be limited thereto or thereby. According to an embodiment, the first electrode 210 and the sensing pattern 221 may be included in the first conductive layer 202 (refer to FIG. Figure 4A ), and the bridge pattern 222 may be included in the second conductive layer 204 (reference Figure 4A In this case, the sensor layer 200 may have a top bridge structure.

[0126] According to the present embodiment, a plurality of contact holes CN-R, CN-D1, and CN-D2 may be provided (defined or formed) to pass through the sensor layer 200. For example, the contact holes CN-R, CN-D1, and CN-D2 may be formed to pass through the intermediate insulating layer 203 (refer to FIG. Figure 4A ). The intermediate insulating layer 203 may be provided on the first conductive layer 202 (refer to Figure 4A ) and the second conductive layer 204 (reference Figure 4A ) between them and can be called an insulating layer.

[0127] The contact holes CN-R, CN-D1, and CN-D2 may include an effective contact hole CN-R, a first dummy contact hole CN-D1, and a second dummy contact hole CN-D2. Each of the effective contact hole CN-R, the first dummy contact hole CN-D1, and the second dummy contact hole CN-D2 may be provided to the first intersection MCP1 or the second intersection MCP2.

[0128] The effective contact hole CN-R may be a point at which the sensing pattern 221 is electrically connected to the bridge pattern 222. As an example, the effective contact hole CN-R may be formed to pass through the intermediate insulating layer 203 disposed between the sensing pattern 221 and the bridge pattern 222, and a portion of the bridge pattern 222 may be exposed through the effective contact hole CN-R. The portion of the bridge pattern 222 exposed through the effective contact hole CN-R may be electrically connected to the sensing pattern 221.

[0129] The effective contact hole CN-R may overlap with the bridge pattern 222. The bridge pattern 222 may be electrically connected to the two sensing patterns 221 spaced apart from each other through the effective contact hole CN-R. For example, the effective contact hole CN-R may be provided to transmit a signal, and a signal may be provided to the second conductive layer 204 (reference signal) through the effective contact hole CN-R. Figure 4A ) is transmitted to the conductive pattern in the first conductive layer 202 (reference Figure 4AThe first dummy contact hole CN-D1 and the second dummy contact hole CN-D2 may not be connected to the bridge pattern 222 and may not overlap with the bridge pattern 222.

[0130] All the first intersections MCP1 and second intersections MCP2 defined in the first grid structure MSS1 and the second grid structure MSS2 may overlap with the effective contact hole CN-R, the first dummy contact hole CN-D1, or the second dummy contact hole CN-D2 in a one-to-one correspondence. In this case, the arrangement of the contact holes CN-R, CN-D1, and CN-D2 in the sensor layer 200 may be substantially uniform. As a result, the deviation in the amount of reflection of external light caused by the presence or absence of the effective contact hole CN-R in the sensor layer 200 may be reduced. Therefore, the pattern visibility of a specific pattern that is visible due to the deviation in the amount of reflection is reduced, and thus the electronic device 1000 (referring to FIG. 1 ) may be increased. Figure 1 Increasing the visibility of the electronic device 1000 may mean that patterns unnecessary for viewing an image, such as a contact hole, are not visible.

[0131] Figure 7 is an enlarged plan view of a portion of the sensor layer 200 according to an embodiment of the present disclosure. Figure 8 is a cross-sectional view of a sensor layer 200 according to an embodiment of the present disclosure. For example, Figure 8 It is along Figure 7 A cross-sectional view taken along line II' shown in FIG. Figure 9 is a cross-sectional view of a sensor layer 200 according to an embodiment of the present disclosure. Figure 9 It is along Figure 7 A cross-sectional view taken along line II-II' shown in FIG. Figure 10 is a cross-sectional view of a sensor layer 200 according to an embodiment of the present disclosure. Figure 10 It is along Figure 7 A cross-sectional view taken along line III-III' shown in FIG.

[0132] refer to Figures 7 to 10 The sensor layer 200 may further include a first dummy pattern DMP1 overlapping the first dummy contact hole CN-D1 and a second dummy pattern DMP2 overlapping the second dummy contact hole CN-D2. The first dummy pattern DMP1 and the second dummy pattern DMP2 may be provided on the same layer as the bridge pattern 222. A portion of the first dummy pattern DMP1 may be exposed through the first dummy contact hole CN-D1, and a portion of the second dummy pattern DMP2 may be exposed through the second dummy contact hole CN-D2.

[0133] The first and second dummy patterns DMP1 and DMP2 may be spaced apart from the bridge pattern 222. The bridge pattern 222 may extend in a first direction DR1 and may be spaced apart from the bridge pattern 222 in a second direction DR2 intersecting the first direction DR1.

[0134] The bridge pattern 222 may include a connection portion 222cn overlapping the active contact hole CN-R, a line portion 222ln extending from the connection portion 222cn in the first direction DR1, and a curved portion 222rw extending from the line portion 222ln and curved. The connection portion 222cn may have a width greater than that of the line portion 222ln. The curved portion 222rw may have a curved shape that bypasses the first dummy pattern DMP1. For example, the first dummy pattern DMP1 may be spaced apart from the curved portion 222rw in the second direction DR2.

[0135] According to an embodiment, the bridge pattern 222 may be connected to the sensing pattern 221 in the effective contact hole CN-R. The first dummy pattern DMP1 may be connected to the first electrode 210 in the first dummy contact hole CN-D1, and the second dummy pattern DMP2 may be connected to the first electrode 210 in the second dummy contact hole CN-D2. For example, the patterns respectively included in the two conductive layers (for example, included in the first conductive layer 202 (refer to Figure 4A ) and the conductive pattern included in the second conductive layer 204 (reference Figure 4A The conductive patterns in the contact holes CN-R, CN-D1, and CN-D2 may be connected to each other. The first and second dummy patterns DMP1 and DMP2 electrically connected to the first electrode 210 may be referred to as first and second auxiliary patterns.

[0136] Since the first and second dummy patterns DMP1 and DMP2 that overlap with the first and second dummy contact holes CN-D1 and CN-D2 and have a floating shape are provided, the cross-sectional structure defining the effective contact hole CN-R and the cross-sectional structure defining the first and second dummy contact holes CN-D1 and CN-D2 can have shapes similar to each other. Therefore, the difference in the amount of reflection of external light between the effective contact hole CN-R and the first and second dummy contact holes CN-D1 and CN-D2 can be reduced. Therefore, the electronic device 1000 (refer to Figure 1 ) can be set to have increased visibility by reducing the visibility of the pattern due to reflection of external light.

[0137] Figure 11 is an enlarged plan view of a portion of the display panel DP according to an embodiment of the present disclosure. Figure 12is an enlarged plan view of a portion of the sensor layer 200 - 1 according to an embodiment of the present disclosure.

[0138] refer to Figure 4A 、 Figure 5 、 Figure 11 and Figure 12 The first electrode 210a may have a first mesh structure MSS1a. As an example, the first mesh structure MSS1a may include a plurality of first mesh lines MS11 extending in a first direction DR1, a plurality of second mesh lines MS12 extending in a second direction DR2, and a first non-opening area WRA-b.

[0139] Each of the sensing patterns 221a may have a second mesh structure MSS2a. As an example, the second mesh structure MSS2a may include a plurality of third mesh lines MS21 extending in the first direction DR1, a plurality of fourth mesh lines MS22 extending in the second direction DR2, and a second non-opening area WRA-a.

[0140] Each of the first non-opening area WRA-b and the second non-opening area WRA-a may have a width greater than the width of the grid line. As an example, the width WT1 of the second non-opening area WRA-a may be greater than the width WT2 of the third grid line MS21. In addition, the width of the first non-opening area WRA-b may be greater than the width of the first grid line MS11.

[0141] According to an embodiment, the second non-opening area WRA-a may be defined between two third light-emitting areas PXA-B adjacent to each other in the second direction DR2 among the third light-emitting areas PXA-B. The bridge pattern 222a may overlap the area between the two third light-emitting areas PXA-B adjacent to each other. In this case, the effective contact hole CN-Ra may be provided to overlap with the second non-opening area WRA-a.

[0142] The first non-opening area WRA-b may be defined between the other two third light-emitting areas PXA-B adjacent to each other in the second direction DR2 among the third light-emitting areas PXA-B. The plurality of dummy contact holes CN-Da may overlap the area between the other two third light-emitting areas PXA-B adjacent to each other (i.e., the first non-opening area WRA-b).

[0143] According to an embodiment, the sensor layer 200-1 may further include a plurality of dummy patterns DMPa, which overlap with the dummy contact holes CN-Da and are spaced apart from the bridge pattern 222a. The dummy patterns DMPa may overlap with the dummy contact holes CN-Da in a one-to-one correspondence. Therefore, the dummy patterns DMPa may also overlap with the first non-opening area WRA-b.

[0144] Each of the non-opening areas WRA-a and WRA-b may overlap with at least one effective contact hole of the effective contact hole CN-Ra or at least one dummy contact hole of the dummy contact hole CN-Da. In this case, the arrangement of the contact holes CN-Ra and CN-Da of the sensor layer 200-1 may be substantially uniform. As a result, the difference in the amount of reflection of external light caused by the presence or absence of the effective contact hole CN-Ra in the sensor layer 200-1 may be reduced. Therefore, the electronic device 1000 (refer to Figure 1 ) can be set to have increased visibility by reducing the visibility of the pattern due to reflection of external light.

[0145] Figure 13 is an enlarged plan view of a portion of the sensor layer 200 - 2 according to an embodiment of the present disclosure.

[0146] refer to Figure 13 The bridge pattern 222a-1 may include a connection portion 222cn overlapping the active contact hole CN-Ra, a line portion 222ln extending from the connection portion 222cn in the first direction DR1, and a curved portion 222a-rw extending from the line portion 222ln and curved. The curved portion 222a-rw may have a curved shape to bypass the dummy pattern DMPa. For example, the dummy pattern DMPa may be spaced apart from the curved portion 222a-rw in the second direction DR2.

[0147] According to an embodiment, compared to Figure 13 In the structure shown, the dummy pattern DMPa and the dummy contact hole CN-Da may be disposed closer to the curved portion 222a-rw. In this case, the effective contact hole CN-Ra and the dummy contact hole CN-Da may be aligned with each other in the first direction DR1.

[0148] Figure 14 is an enlarged plan view of a portion of the sensor layer 200 - 3 according to an embodiment of the present disclosure.

[0149] refer to Figure 14 The bridge pattern 222a-2 may include a line portion 222ln extending in the first direction DR1 and a protrusion 222a-pt protruding from the line portion 222ln in the second direction DR2. The effective contact hole CN-Ra1 may overlap the protrusion 222a-pt, and the sensing pattern 221a may be electrically connected to the bridge pattern 222a-2 through the effective contact hole CN-Ra1.

[0150] The effective contact hole CN-Ra1 may be spaced apart from the dummy contact hole CN-Da in the first direction DR1, and the effective contact hole CN-Ra1 and the dummy contact hole CN-Da may be aligned with each other in the first direction DR1.

[0151] Figure 15 is an enlarged plan view of a portion of the sensor layer 200 - 4 according to an embodiment of the present disclosure.

[0152] refer to Figure 15 The bridge pattern 222a-3 may include a line portion 222ln extending in the first direction DR1, a protruding portion 222a-pt protruding from the line portion 222ln in the second direction DR2, and a curved portion 222a-rw extending from the line portion 222ln and curved. The effective contact hole CN-Ra1 may overlap the protruding portion 222a-pt, and the sensing pattern 221a may be electrically connected to the bridge pattern 222a-3 through the effective contact hole CN-Ra1. The dummy pattern DMPa may be spaced apart from the curved portion 222a-rw in the second direction DR2.

[0153] The effective contact hole CN-Ra1 may be spaced apart from the dummy contact hole CN-Da in the first direction DR1, and the effective contact hole CN-Ra1 and the dummy contact hole CN-Da may be aligned with each other in the first direction DR1.

[0154] Figure 16 is an enlarged plan view of a portion of the display panel DP according to an embodiment of the present disclosure.

[0155] refer to Figure 4A 、 Figure 5 、 Figure 11 and Figure 16 The first electrode 210a of the sensor layer 200-5 may have a first mesh structure MSS1a. As an example, the first mesh structure MSS1a may include a plurality of first mesh lines MS11 extending in a first direction DR1, a plurality of second mesh lines MS12 extending in a second direction DR2, and a first non-opening area WRA-b.

[0156] Each of the sensing patterns 221a of the sensor layer 200-5 may have a second mesh structure MSS2a. As an example, the second mesh structure MSS2a may include a plurality of third mesh lines MS21 extending in the first direction DR1, a plurality of fourth mesh lines MS22 extending in the second direction DR2, and a second non-opening area WRA-a.

[0157] According to the present embodiment, a plurality of contact holes CN-Ra, CN-Da, and CN-Db may be defined through the sensor layer 200-5. The contact holes CN-Ra, CN-Da, and CN-Db may be defined through the intermediate insulating layer 203 (refer to FIG. Figure 4A). The contact holes CN-Ra, CN-Da, and CN-Db may include an effective contact hole CN-Ra, a first dummy contact hole CN-Da, and a second dummy contact hole CN-Db.

[0158] Each of the first non-opening area WRA-b and the second non-opening area WRA-a can overlap with at least one effective contact hole of the effective contact hole CN-Ra or at least one first dummy contact hole of the first dummy contact hole CN-Da. In addition, the second dummy contact hole CN-Db can overlap with the first intersection MCP1 and the second intersection MCP2. In this case, the arrangement of the contact holes CN-Ra, CN-Da and CN-Db in the sensor layer 200-5 can be substantially uniform. As a result, the difference in the amount of reflection of external light caused by the presence or absence of the effective contact hole CN-Ra in the sensor layer 200-5 can be reduced. Therefore, the electronic device 1000 (refer to Figure 1 ) can be set to have increased visibility by reducing the visibility of the pattern due to reflection of external light.

[0159] Figure 17 is an enlarged plan view of a portion of the display panel DP according to an embodiment of the present disclosure.

[0160] Figure 17 One sensing pattern 221 b 1 (hereinafter referred to as a first sensing pattern) of the second electrode 220 , another sensing pattern 221 b 2 (hereinafter referred to as a second sensing pattern) of the second electrode 220 , and the first electrode 210 a are shown as representative examples.

[0161] refer to Figure 5 and Figure 17 , the first sensing pattern 221b1 and the second sensing pattern 221b2 may be spaced apart from each other with the first electrode 210a interposed therebetween. Thus, the first sensing pattern 221b1 and the second sensing pattern 221b2 may be electrically connected to each other via the bridge pattern 222b of the second electrode 220. As an example, the first sensing pattern 221b1 may be connected to the bridge pattern 222b via the effective contact hole CN-Rb1, and the second sensing pattern 221b2 may be connected to the bridge pattern 222b via the effective contact hole CN-Rb2. Figure 17 A structure in which the first sensing patterns 221 b 1 and the second sensing patterns 221 b 2 are electrically connected to each other through two bridge patterns 222 b is illustrated as a representative example, however, the present disclosure should not necessarily be limited thereto or thereby.

[0162] Sensor layer 200-6 may further include dummy bridge patterns 222dm1, 222dm2, and 222dm3, which are provided on the same layer as bridge pattern 222b and spaced apart from bridge pattern 222b. For example, when only bridge pattern 222b is provided, bridge pattern 222b may be regularly arranged at specific regions where first electrode 210a and second electrode 220 intersect. In this case, regions where bridge pattern 222b is provided and regions where bridge pattern 222b is not provided may exhibit differences in reflection. As in this embodiment, when dummy bridge patterns 222dm1, 222dm2, and 222dm3 are added to regions other than the specific regions where first electrode 210a and second electrode 220 intersect, the differences in reflection caused by the presence or absence of bridge pattern 222b in sensor layer 200-6 can be reduced by the dummy bridge patterns 222dm1, 222dm2, and 222dm3. Therefore, the electronic device 1000 (refer to Figure 1 ) can be set to have increased visibility by reducing the visibility of the pattern due to reflection of external light.

[0163] Each of the dummy bridge patterns 222dm1, 222dm2, and 222dm3 may be electrically floating or connected to the same electrode. The dummy bridge patterns 222dm1, 222dm2, and 222dm3 may include a first dummy bridge pattern 222dm1, a second dummy bridge pattern 222dm2, and a third dummy bridge pattern 222dm3. The first dummy bridge pattern 222dm1 may overlap both the first electrode 210a and the second electrode 220. As an example, the first dummy bridge pattern 222dm1 may overlap the first sensing pattern 221b1 and the first electrode 210a. The second dummy bridge pattern 222dm2 may overlap only the first electrode 210a. The third dummy bridge pattern 222dm3 may overlap only the second electrode 220.

[0164] The sensor layer 200-6 may further include a first dummy pattern DMP1a and a second dummy pattern DMP2a, which are disposed on the same layer as the first dummy bridge pattern 222dm1. The first electrode 210a may be connected to the first dummy pattern DMP1a via a first dummy contact hole CN-Dm1, and the first sensing pattern 221b1 may be connected to the second dummy pattern DMP2a via a second dummy contact hole CN-Dm2. The first dummy pattern DMP1a and the second dummy pattern DMP2a may be spaced apart from each other, with the first dummy bridge pattern 222dm1 interposed therebetween. Furthermore, the first dummy contact hole CN-Dm1 and the second dummy contact hole CN-Dm2 may not overlap with the first dummy bridge pattern 222dm1. Therefore, the first dummy bridge pattern 222dm1 may be electrically floating.

[0165] The first electrode 210a can be connected to both ends of the second dummy bridge pattern 222dm2 via the third dummy contact hole CN-Dm3. Therefore, the second dummy bridge pattern 222dm2 can be electrically connected to the first electrode 210a. Since the second dummy bridge pattern 222dm2 is electrically connected to the first electrode 210a, the second dummy bridge pattern 222dm2 can be referred to as an auxiliary bridge or an auxiliary pattern.

[0166] The first sensing pattern 221b1 may be connected to both ends of the third dummy bridge pattern 222dm3 via the fourth dummy contact hole CN-Dm4. Therefore, the third dummy bridge pattern 222dm3 may be electrically connected to the second electrode 220. Since the third dummy bridge pattern 222dm3 is electrically connected to the second electrode 220, the third dummy bridge pattern 222dm3 may be referred to as an auxiliary bridge or an auxiliary pattern.

[0167] According to this embodiment, the sensor layer 200-6 may further define fifth dummy contact holes CN-Dm5, and the sensor layer 200-6 may further include third dummy patterns DMP3a disposed to correspond to the fifth dummy contact holes CN-Dm5. The third dummy patterns DMP3a may be disposed on the same layer as the bridge pattern 222b and may be spaced apart from the bridge pattern 222b. For example, the third dummy patterns DMP3a may be insulated from the bridge pattern 222b.

[0168] The first electrode 210a may be connected to the third dummy pattern DMP3a via the fifth dummy contact hole CN-Dm5. Specifically, a portion of the third dummy pattern DMP3a may be adjacent to the bridge pattern 222b. Thus, the bridge pattern 222b may have a curved portion that bypasses the third dummy pattern DMP3a. For example, the fifth dummy contact hole CN-Dm5 may also be provided in the non-opening area WRA that overlaps with the bridge pattern 222b.

[0169] The fifth dummy contact hole CN-Dm5 may be spaced apart from the effective contact holes CN-Rb1 and CN-Rb2 in the first direction DR1. Since the bridge pattern 222b includes a curved portion, the fifth dummy contact hole CN-Dm5 may be positioned aligned with the effective contact holes CN-Rb1 and CN-Rb2 in the first direction DR1.

[0170] The shape of the bridge pattern 222b and the arrangement of the fifth dummy contact hole CN-Dm5 should not necessarily be particularly limited to Figure 17 As an example, the shape of the bridge pattern 222b or the arrangement of the fifth dummy contact hole CN-Dm5 may be changed to Figure 12 、 Figure 13 、 Figure 14 or Figure 15 The shapes or arrangements shown, or the various embodiments described above may be combined in various ways.

[0171] According to an embodiment, at least two contact holes may be defined in each of the non-opening areas WRA of the sensor layer 200-6. One of the two contact holes may be an effective contact hole CN-Rb1 or CN-Rb2, and the other of the two contact holes may be a dummy contact hole CN-Dm4 or CN-Dm5. According to an embodiment, all of the two contact holes may be dummy contact holes CN-Dm1, CN-Dm2, CN-Dm4, or CN-Dm5. According to an embodiment, all of the two contact holes may be effective contact holes CN-Rb1 or CN-Rb2. In this case, the arrangement of the contact holes in the sensor layer 200-6 may be substantially uniform. As a result, the difference in the amount of reflection of external light caused by the presence or absence of the effective contact holes CN-Rb1 and CN-Rb2 in the sensor layer 200-6 may be reduced. Therefore, the electronic device 1000 (refer to Figure 1 ) can be set to have increased visibility by reducing the visibility of the pattern due to reflection of external light.

[0172] Although the embodiments of the present disclosure have been described herein, it should be understood that the present disclosure should not be necessarily limited to these embodiments, but that those skilled in the art can make various changes and modifications within the spirit and scope of the present disclosure. Therefore, the disclosed subject matter should not be necessarily limited to any single embodiment described herein.

Claims

1. An electronic device, characterized in that The electronic device comprises: Display layer; and A sensor layer is provided on the display layer, and the sensor layer includes: a first electrode; a second electrode intersecting the first electrode and including a sensing pattern and a bridge pattern; an insulating layer disposed between the sensing pattern and the bridge pattern; and a dummy pattern provided on the same layer as the bridge pattern and spaced apart from the bridge pattern, wherein a plurality of contact holes are defined through the insulating layer, The plurality of contact holes include effective contact holes and dummy contact holes, wherein a portion of the bridge pattern is exposed through the effective contact holes, and a portion of the dummy pattern is exposed through the dummy contact holes. wherein the sensing pattern is electrically connected to the bridge pattern via the effective contact hole, and The first electrode or the sensing pattern is connected to the dummy pattern via the dummy contact hole.

2. The electronic device according to claim 1, wherein: The first electrode includes first grid lines extending in a first direction and second grid lines extending in a second direction intersecting the first direction, and The sensing pattern includes third grid lines extending in the first direction and fourth grid lines extending in the second direction.

3. The electronic device according to claim 2, wherein: The dummy contact holes are provided in plurality. wherein the plurality of dummy contact holes are defined at a first intersection where the first grid line intersects or meets the second grid line and a second intersection where the third grid line intersects or meets the fourth grid line, and The effective contact hole overlaps with the bridge pattern at a position where the third grid line intersects or meets the fourth grid line.

4. The electronic device according to claim 2, wherein: The first electrode further includes a first non-opening region having a width greater than a width of the first grid line, and The sensing pattern further includes a second non-opening area, and the second non-opening area has a width greater than a width of the third grid line.

5. The electronic device according to claim 4, wherein: The effective contact hole overlaps with the second non-opening area.

6. The electronic device according to claim 4, wherein: The dummy contact holes are provided in plurality, and Wherein, a plurality of the dummy contact holes overlap with the first non-opening area.

7. The electronic device according to claim 4, wherein: The dummy contact holes are provided in plurality, and The plurality of dummy contact holes are defined at a first intersection where the first grid line intersects or meets the second grid line, a second intersection where the third grid line intersects or meets the fourth grid line, and the first non-opening area.

8. The electronic device according to claim 2, wherein: The display layer includes a plurality of first light-emitting areas, a plurality of second light-emitting areas, and a plurality of third light-emitting areas. wherein the plurality of first light emitting regions are alternately arranged with the plurality of second light emitting regions in the second direction; wherein the plurality of third light emitting regions are arranged in the second direction, and Wherein, a third light emitting region among the plurality of third light emitting regions is spaced apart from a first light emitting region among the plurality of first light emitting regions and a second light emitting region among the plurality of second light emitting regions in the first direction.

9. An electronic device, characterized in that The electronic device comprises: Display layer; and A sensor layer is provided on the display layer, and the sensor layer includes: a first electrode; a second electrode intersecting the first electrode and including a sensing pattern and a bridge pattern; an insulating layer disposed between the sensing pattern and the bridge pattern; and a dummy pattern provided on the same layer as the bridge pattern and spaced apart from the bridge pattern, wherein a plurality of contact holes are defined through the insulating layer, The plurality of contact holes include effective contact holes overlapping with the bridge pattern and dummy contact holes not overlapping with the bridge pattern but overlapping with the dummy pattern. wherein the bridge pattern includes a line portion extending in a first direction, and The dummy contact hole is spaced apart from the bridge pattern in a second direction intersecting with the first direction.

10. An electronic device, characterized in that The electronic device comprises: a first conductive layer comprising a bridge pattern and a plurality of dummy patterns; a second conductive layer comprising a plurality of conductive patterns; and an insulating layer disposed between the first conductive layer and the second conductive layer and provided with a plurality of effective contact holes and a plurality of dummy contact holes defined therethrough, wherein the plurality of effective contact holes overlap with the bridge pattern, and The plurality of dummy contact holes overlap with the plurality of dummy patterns respectively.

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