Heat-conducting silica gel pad

By designing a transparent plastic soft film and a card block and slot structure on the thermal conductive silicone pad, the problems of the thermal conductive silicone pad being inconvenient to carry and inaccurately cut are solved, portability and cutting accuracy are achieved, and the thermal conductive effect is maintained.

CN223345992UActive Publication Date: 2025-09-16FUJIAN BOQIN PRECISION MACHINERY TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422598885.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-28
Publication Date
2025-09-16
Estimated Expiration
2034-10-28

AI Technical Summary

Technical Problem

Existing thermally conductive silicone pads are not easy to carry, are easily skewed when cut, and affect the thermal conductivity after gluing, and leave adhesive after cutting.

Method used

A structure is designed including a transparent plastic soft film and a thermal conductive silicone pad body, which are connected by a card block and a card slot. Cross-cutting lines and longitudinal cutting lines are set to facilitate cutting. The card block and the card slot are mushroom-shaped structures, which are convenient for fixing and removing the thermal conductive silicone pad.

Benefits of technology

The portability and cutting accuracy of the thermal conductive silicone pad are achieved, the skewed cutting edge and adhesive residue are avoided, and the thermal conductive effect is maintained.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heat conduction silica gel pad which comprises a transparent plastic soft film, a heat conduction silica gel pad body is attached to the top of the transparent plastic soft film, the transparent plastic soft film and the heat conduction silica gel pad body are connected through a fixing structure, and a positioning mechanism is arranged at the top of the heat conduction silica gel pad body. According to the heat-conducting silica gel pad, the transverse cutting lines and the longitudinal cutting lines are arranged, the transverse cutting lines and the longitudinal cutting lines are perpendicular to each other and are distributed at the top of the heat-conducting silica gel pad body at equal intervals, it can be guaranteed that the cut edge cannot be inclined when a pair of scissors is used for cutting along the transverse cutting lines and the longitudinal cutting lines, and use of the heat-conducting silica gel pad body is facilitated.
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Description

Technical Field

[0001] The utility model relates to the technical field of heat-conducting materials, in particular to a heat-conducting silica gel pad. Background Art

[0002] Thermally conductive silicone pads have certain flexibility, excellent insulation, compressibility, and natural stickiness on the surface. They are specially produced for designs that use gaps to transfer heat and can fill gaps.

[0003] However, existing thermally conductive silicone pads are all separate and inconvenient to carry. Moreover, the thermally conductive silicone pads are bonded to the transparent plastic film, which leaves adhesive on the pads after they are removed, affecting their thermal conductivity. Furthermore, the thermally conductive silicone pads need to be cut according to the situation before use, and the existing thermally conductive silicone pads are prone to skewed cutting edges, making them difficult to use. To address these issues, innovative designs based on existing thermally conductive silicone pads are urgently needed. Utility Model Content

[0004] The purpose of the present invention is to provide a thermally conductive silicone pad to solve the problems raised by the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a thermally conductive silicone pad, comprising a transparent plastic soft film, a thermally conductive silicone pad body being attached to the top of the transparent plastic soft film, the transparent plastic soft film and the thermally conductive silicone pad body being connected by a fixing structure, and a positioning mechanism being provided on the top of the thermally conductive silicone pad body;

[0006] The fixing structure includes a card block and a card slot. The card block is fixed on the top of the transparent plastic soft film, and the card slot is opened at the bottom of the thermal conductive silicone pad body. The top of the card block is located inside the card slot.

[0007] The positioning mechanism includes a transverse cutting line and a longitudinal cutting line. The transverse cutting line is arranged in the transverse direction of the top of the thermal conductive silicone pad body, and the longitudinal cutting line is arranged in the longitudinal direction of the top of the thermal conductive silicone pad body.

[0008] Preferably, the thermally conductive silicone pad bodies are distributed at equal intervals on the top of the transparent plastic soft film, and the distance between the thermally conductive silicone pad bodies is designed to be 1 cm.

[0009] Preferably, the thermally conductive silicone pad body close to the end of the transparent plastic soft film is 2.5 cm away from the end of the transparent plastic soft film.

[0010] Preferably, the transverse and longitudinal lines are designed to be perpendicular to each other, and the transverse and longitudinal lines are equally spaced on the top of the thermally conductive silicone pad body.

[0011] Preferably, the card block and the card slot are both designed as mushroom-shaped structures, and the card block and the card slot are snap-connected.

[0012] Preferably, there are two of the card blocks and card slots symmetrically distributed about the central axis of the thermal conductive silicone pad body.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the thermally conductive silicone pad is provided with transverse and longitudinal lines, and the transverse and longitudinal lines are designed to be perpendicular to each other, and the transverse and longitudinal lines are evenly spaced on the top of the thermally conductive silicone pad body. Cutting along the transverse and longitudinal lines with scissors can ensure that the cutting edges will not be skewed, which is conducive to the use of the thermally conductive silicone pad body;

[0014] The thermal conductive silicone pads are evenly spaced on top of the transparent plastic film, and the distance between the thermal conductive silicone pads is designed to be 1 cm, so that the transparent plastic film and several thermal conductive silicone pads can be rolled up, making it convenient to carry several thermal conductive silicone pads.

[0015] The card block and the card slot are both designed as mushroom-shaped structures, and the card block and the card slot are snap-connected. There are two card blocks and two card slots symmetrically distributed about the central axis of the thermal conductive silicone pad body, which is conducive to fixing the thermal conductive silicone pad body on the transparent plastic soft film, and also conveniently removing the thermal conductive silicone pad body for use. There is no need to stick the thermal conductive silicone pad body on the transparent plastic soft film, which ensures the cleanliness of the thermal conductive silicone pad body and is conducive to the heat conduction of the thermal conductive silicone pad body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 For this utility model Figure 1 A in the middle is an enlarged structural diagram;

[0018] Figure 3 This is a schematic diagram of the side cross-sectional structure of the utility model;

[0019] Figure 4 It is a schematic diagram of the cross-sectional structure of the utility model from above.

[0020] In the figure: 1. Transparent plastic film; 2. Thermal conductive silicone pad body; 3. Horizontal cutting line; 4. Vertical cutting line; 5. Card block; 6. Card slot. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] See also Figure 1-4 The utility model provides a technical solution: a thermally conductive silicone pad, comprising a transparent plastic soft film 1, a thermally conductive silicone pad body 2 is attached to the top of the transparent plastic soft film 1, the transparent plastic soft film 1 and the thermally conductive silicone pad body 2 are connected by a fixed structure, and a positioning mechanism is provided on the top of the thermally conductive silicone pad body 2;

[0023] The fixing structure includes a card block 5 and a card slot 6. The card block 5 is fixed on the top of the transparent plastic soft film 1. The card slot 6 is opened at the bottom of the thermal conductive silicone pad body 2. The top of the card block 5 is located inside the card slot 6.

[0024] The positioning mechanism includes a transverse cutting line 3 and a longitudinal cutting line 4. The transverse cutting line 3 is arranged in the transverse direction of the top of the thermal conductive silicone pad body 2, and the longitudinal cutting line 4 is arranged in the longitudinal direction of the top of the thermal conductive silicone pad body 2.

[0025] The thermal conductive silicone pad bodies 2 are evenly spaced on the top of the transparent plastic soft film 1, and the distance between the thermal conductive silicone pad bodies 2 is designed to be 1 cm, so that the transparent plastic soft film 1 and several thermal conductive silicone pad bodies 2 can be rolled up, making it convenient to carry several thermal conductive silicone pad bodies 2.

[0026] The thermal conductive silicone pad body 2 near the end of the transparent plastic soft film 1 is 2.5 cm away from the end of the transparent plastic soft film 1, which is convenient for removing the thermal conductive silicone pad body 2 near the end of the transparent plastic soft film 1, thereby facilitating the subsequent removal of the thermal conductive silicone pad body 2.

[0027] The transverse cutting line 3 and the longitudinal cutting line 4 are designed to be perpendicular to each other, and the transverse cutting line 3 and the longitudinal cutting line 4 are evenly spaced on the top of the thermal conductive silicone pad body 2. Cutting along the transverse cutting line 3 and the longitudinal cutting line 4 with scissors can ensure that the cutting edge will not be skewed, which is conducive to the use of the thermal conductive silicone pad body 2.

[0028] The card block 5 and the card slot 6 are both designed as mushroom-shaped structures, and the card block 5 and the card slot 6 are snap-connected. There are two card blocks 5 and two card slots 6 symmetrically distributed about the central axis of the thermal conductive silicone pad body 2, which is conducive to fixing the thermal conductive silicone pad body 2 on the transparent plastic soft film 1, and also convenient for removing the thermal conductive silicone pad body 2 for use.

[0029] Working principle: When using the thermal conductive silicone pad, first hold the end of the transparent plastic soft film 1, and use the other hand to remove the thermal conductive silicone pad body 2 from the block 5, so that the block 5 and the card slot 6 are separated. When the thermal conductive silicone pad body 2 needs to be cut according to the size of the component, the staff cuts the thermal conductive silicone pad body 2 along the transverse cutting line 3 and the longitudinal cutting line 4 to ensure that the cutting edge will not be skewed.

[0030] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A thermally conductive silicone pad, comprising a transparent plastic soft film (1), characterized in that: A thermally conductive silicone pad body (2) is attached to the top of the transparent plastic soft film (1), the transparent plastic soft film (1) and the thermally conductive silicone pad body (2) are connected via a fixed structure, and a positioning mechanism is provided on the top of the thermally conductive silicone pad body (2); The fixing structure comprises a card block (5) and a card slot (6); the card block (5) is fixed on the top of the transparent plastic soft film (1); the card slot (6) is provided on the bottom of the thermal conductive silicone pad body (2); and the top of the card block (5) is located inside the card slot (6); The positioning mechanism comprises a transverse cutting line (3) and a longitudinal cutting line (4), wherein the transverse cutting line (3) is arranged in the transverse direction of the top of the thermal conductive silicone pad body (2), and the longitudinal cutting line (4) is arranged in the longitudinal direction of the top of the thermal conductive silicone pad body (2).

2. The thermally conductive silicone pad according to claim 1, characterized in that: The thermally conductive silicone pad bodies (2) are distributed at equal intervals on the top of the transparent plastic soft film (1), and the distance between the thermally conductive silicone pad bodies (2) is designed to be 1 cm.

3. The thermally conductive silicone pad according to claim 1, characterized in that: The thermally conductive silicone pad body (2) close to the end of the transparent plastic soft film (1) is 2.5 cm away from the end of the transparent plastic soft film (1).

4. The thermally conductive silicone pad according to claim 1, characterized in that: The transverse lines (3) and the longitudinal lines (4) are designed to be perpendicular to each other, and the transverse lines (3) and the longitudinal lines (4) are distributed at equal intervals on the top of the thermal conductive silicone pad body (2).

5. The thermally conductive silicone pad according to claim 1, characterized in that: The clamping block (5) and the clamping slot (6) are both designed as mushroom-shaped structures, and the clamping block (5) and the clamping slot (6) are clamped together.

6. The thermally conductive silicone pad according to claim 5, characterized in that: There are two of the clamping blocks (5) and the clamping slots (6) symmetrically distributed about the central axis of the thermally conductive silicone pad body (2).