Ignition-free electronic detonator

Abstract

The utility model provides a non-ignition gunpowder electronic detonator. The non-ignition gunpowder electronic detonator comprises a tube plug, an electronic control module, a semiconductor bridge, a reinforcing cap, an initiating explosive, a high explosive and a tube shell, wherein the tube plug, the electronic control module and the semiconductor bridge form a first assembly; the tube shell, the high explosive, the initiating explosive and the reinforcing cap form a second assembly. And the first assembly is inserted into the second assembly, and final assembly is completed. The first assembly and the second assembly maintain a safety gap. By means of the method, ignition powder is omitted, and the transduction element does not make contact with the initiating explosive. The safety problem caused by the ignition powder in the production, storage and transportation processes is solved, and the problems that the ignition powder is easily influenced by the environment and the sensitivity is changed are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic detonators, in particular to a pyrotechnic powder-free detonator. Background Art

[0002] After years of development, industrial electronic detonators have become a mainstream solution in the civil explosives industry. Safety issues during the production, transportation, and use of detonators remain a primary concern for those working in the industry.

[0003] Existing industrial electronic detonators, such as Figure 1 As shown, it includes a foot line 101, a rubber tube plug 102, a detonator electronic control module 103, an ignition powder head 104, a tube shell 105, a reinforcement cap 106, an explosive 107 and a high explosive 108. In the existing production process, the high explosive, the explosive and the reinforcement cap are first pressed into the tube shell; then the foot line is riveted to the detonator electronic module, the energy conversion element of the detonator electronic module is dipped in ignition powder, and finally the detonator electronic module dipped in powder is installed into the tube shell to form the final detonator. Since ignition powder is relatively sensitive, the assembly, storage and transportation process of the electronic module after being dipped in powder is easily stimulated by sparks, which poses a great safety risk. At the same time, ignition powder is easily affected by environmental humidity, which will cause inconsistent ignition sensitivity of the ignition powder, and then cause the detonator to refuse to explode. Therefore, it cannot be stored for a long time, and the tube must be loaded as soon as possible after dipping, which is not conducive to production scheduling.

[0004] Accordingly, a new pyrotechnic powder-free detonator solution is needed in this field to solve the above problems. Summary of the Invention

[0005] In order to overcome the above-mentioned defects, the present invention is proposed to provide an electronic detonator without ignition powder, which solves or at least partially solves the safety risks caused by ignition powder during assembly, storage and transportation and the technical problem of detonator refusal to explode caused by quality degradation of ignition powder due to ambient humidity or storage time.

[0006] This electronic detonator without ignition explosives consists of two components: the first, which includes a tube plug, an electronic control module, and a semiconductor bridge; the second, which includes a reinforcing cap, a primer, a secondary explosive, and a tube shell. The first component is inserted into the second. During detonation, the electronic control module discharges electricity into the semiconductor bridge. Under the action of high voltage, the semiconductor bridge rapidly heats up and enters a plasma state. The internal pressure of the semiconductor bridge suddenly increases, forming a detonation plasma stream. This high-speed, high-temperature plasma stream strikes the primer and ignites it, which ultimately detonates the secondary explosive, completing the detonation of the detonator.

[0007] The pipe plug is connected to the electronic control module, the electronic control module is connected to the semiconductor bridge, and the electronic control module includes an energy storage capacitor and an ignition switch, which can control the discharge of the semiconductor bridge.

[0008] One end of the tube shell is open and the other end is closed with a concave energy-gathering hole. First, high explosive is pressed into the tube shell from the opening, then detonator is pressed, and finally the reinforcing cap is pressed in. The reinforcing cap is fixed and limited to the tube shell.

[0009] The first component's plug has a T-shaped structure, partially inserted into the tube shell and partially stuck outside. The tube shell is compressed in the portion inserted into the plug, connecting and securing the first and second components to form the final detonator. The semiconductor bridge of the first component does not contact the reinforcing cap of the second component, maintaining a safety gap. The semiconductor bridge chip is soldered to the electronic module's control substrate, with the bridge surface perpendicular to the substrate and facing the explosive.

[0010] The semiconductor bridge chip is soldered to the electronic control module substrate, with the bridge surface perpendicular to the PCB and facing the reinforcing cap. The reinforcing cap has a circular hole in its center, allowing the plasma jet from the semiconductor bridge to penetrate and reach the explosive during explosion. The reinforcing cap has a circular hole in its center, allowing the semiconductor bridge surface to be unobstructed from the explosive during explosion, allowing the plasma jet from the semiconductor bridge to reach the explosive during explosion.

[0011] The semiconductor bridge includes a package substrate, a welded metal frame, a metal PAD, a semiconductor bridge region, metal binding wires, and a package top cover. The package top cover has a trumpet-shaped package opening that can concentrate the detonation plasma flow density, increasing the plasma flow pressure and speed.

[0012] The semiconductor bridge region consists of a silicon substrate layer, a silicon dioxide insulating layer, a metal layer, and a protective layer. During the explosion, voltage triggers the silicon bottom to explode. As the explosive plasma jet shoots toward the initiator, the metal layer undergoes an oxidation reaction at high temperatures, releasing a large amount of heat, further increasing the jet temperature.

[0013] The semiconductor bridge region consists of a silicon substrate layer, a silicon dioxide insulating layer, a metal layer, and a protective layer. During an explosion, voltage triggers the silicon substrate to explode. As the exploding plasma jets toward the detonator, the metal layer fragments undergo oxidation reactions at high temperatures, releasing a large amount of heat, further increasing the jet temperature.

[0014] The above one or more technical solutions of the present invention have at least one or more of the following beneficial effects:

[0015] The first component of the electronic detonator does not contain ignition powder, making the related production process safer.

[0016] After drying, traditional ignition powder needs to be assembled as soon as possible to prevent it from absorbing moisture and causing the detonator to fail to explode. Therefore, ignition-free powder can be produced and stored at any time, making production arrangements more convenient.

[0017] The ignition powder-free detonator saves the cost of ignition powder and also saves the cost of the ignition powder dipping process, which has certain economic benefits.

[0018] In the production of electronic modules, the semiconductor bridge is also soldered by chip welding, which does not require separate equipment and therefore does not increase the cost of the assembly process.

[0019] The semiconductor bridge structure allows the detonation plasma flow to be directed toward the explosive, enabling surface mount technology (SMT). The semiconductor energy-focusing structure can increase the gap distance or reduce the firing voltage or capacity of the electronic control module.

[0020] The metal layer in the semiconductor bridge area undergoes oxidation reaction during the explosion, further increasing the energy intensity of the plasma jet. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The disclosure of the present invention will become more easily understood with reference to the accompanying drawings. Those skilled in the art will readily appreciate that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. Among them:

[0022] Figure 1 It is a structural diagram of an existing electronic detonator;

[0023] Figure 2 This is a schematic diagram of the structure of the electronic detonator in the utility model;

[0024] Figure 3 This is a schematic diagram of the electronic detonator control module of the present utility model.

[0025] Figure 4 The utility model relates to a packaging structure of a semiconductor bridge.

[0026] Figure 5 It is a top view of the semiconductor bridge packaging structure of the present invention.

[0027] Figure 6 It is an exploded view of the semiconductor bridge package structure of the present invention.

[0028] List of reference numerals:

[0029] 101 foot line; 102 pipe plug; 103 electronic control module; 104 ignition head; 105 tube shell; 106 reinforcement cap; 107 detonator; 108 high explosive; 201 semiconductor bridge; 301 PCB substrate; 302 detonator capacitor; 303 electronic control chip; 401 package substrate; 402 welding metal frame; 403 metal PAD; 404 semiconductor bridge area; 405 metal binding wire; 406 package top cover; 407 trumpet-shaped opening. DETAILED DESCRIPTION

[0030] Some embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0031] Figure 2 The present invention is a schematic structural diagram of a powder-free electronic detonator according to an embodiment of the present invention, comprising a tube plug, an electronic control module, a semiconductor bridge, a reinforcing cap, a priming charge, a secondary explosive, and a tube shell.

[0032] The pipe plug is connected to the electronic control module, and the electronic control module is connected to the semiconductor bridge, and the three constitute a first assembly component.

[0033] On the other side, the shell is first pressed into the high explosive, then the detonator, and finally the reinforcing cap, and the reinforcing cap is pressed out of the shell to form a limit for the reinforcing cap. After the above assembly, the second assembly component is formed.

[0034] Inserting the first assembly into the second assembly creates a T-shaped structure, with some parts inserted into the housing and others stuck outside. The T-shaped structure ensures that the farthest semiconductor bridge of the first assembly and the reinforcing cap of the second assembly maintain a safe distance of approximately 1 to 3 mm.

[0035] Finally, pressure is applied to the tube shell at the tube plug to fix the first assembly component and the second assembly component.

[0036] During detonation, the electronic control module discharges the semiconductor bridge. Under the high voltage, the semiconductor bridge rapidly heats up and enters a plasma state. The pressure within the semiconductor bridge suddenly increases, forming a detonation plasma jet that rapidly shoots toward the explosive. The high-temperature, high-speed plasma jet ignites the explosive, which ultimately detonates the high explosive, completing the detonation of the detonator.

[0037] Figure 3 The electronic control module of the ignition powder-free electronic detonator according to one embodiment of the utility model comprises: a PCB substrate, an initiating capacitor, an electronic control chip, and a semiconductor bridge.

[0038] The electronic control chip receives instructions to control the charging of the ignition capacitor. When detonating, the electronic control chip controls the ignition capacitor to discharge the semiconductor bridge.

[0039] Figure 4 、 5 Figure 6 is a diagram of the semiconductor bridge structure of a pyrotechnic powder-free electronic detonator according to an embodiment of the present invention. The structure includes: a package substrate; a welded metal frame; a metal PAD; a semiconductor bridge region; metal binding wires; a package top cover; and a trumpet-shaped opening.

[0040] First, a soldered metal frame is assembled at both ends of the package substrate. Metal pads are grown on both sides of the semiconductor bridge area. The semiconductor bridge area is then attached to the center of the package substrate. Metal wire bonds are used to connect the metal pads and the soldered metal frame. Finally, the package top cover with a flared opening is bonded to the package.

[0041] The semiconductor bridge is vertically soldered to the electronic control module PCB substrate, with the bridge facing the reinforcement cap opening. The semiconductor bridge area is located in the center of the trumpet-shaped opening package. The trumpet-shaped energy-focusing opening of the semiconductor bridge faces the explosive. During detonation, the plasma flow is more concentrated toward the explosive. The higher energy density of the plasma flow can better ignite the explosive or increase the distance between the semiconductor bridge and the explosive, thereby achieving a safer effect.

[0042] The semiconductor bridge region consists of a silicon substrate layer, a silicon dioxide insulating layer, a metal layer, and a protective layer. During an explosion, voltage triggers the silicon substrate to explode. As the exploding plasma jets toward the detonator, the metal layer fragments undergo oxidation reactions at high temperatures, releasing a large amount of heat, further increasing the jet temperature.

[0043] In the embodiment, the metal layer can be a single-layer structure or a multi-layer structure; it can be a whole-layer metal structure or a metal layer composed of metal blocks.

[0044] In an embodiment, the metal layer may be a combination of one or more elements such as Cr, Cu, Sc, Ru, B, Mn, Ti, Al, or a combination of compounds containing calcium.

[0045] The detonating agent is a mixture of any one or more of DDNP, GTX and nickel hydrazine nitrate.

[0046] In an embodiment, it can be an electronic detonator module with a 35V100UF initiating capacitor.

[0047] In the embodiment, in order to obtain a longer assembly gap, an electronic detonator module with a 40v100uf or 50v100uf ignition capacitor can be used.

[0048] Thus far, the technical solution of the present invention has been described in conjunction with one embodiment shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. An electronic detonator without ignition powder, characterized in that: The electronic detonator comprises two components, the first component comprising a tube plug, an electronic control module and a semiconductor bridge, and the second component comprising a reinforcing cap, a detonator, a secondary explosive and a tube shell; the first component is inserted into the second component to form a finished electronic detonator; the semiconductor bridge is welded on a PCB substrate of the electronic control module, with the bridge surface of the semiconductor bridge perpendicular to the PCB substrate and facing the reinforcing cap.

2. The ignition powder-free electronic detonator according to claim 1, characterized in that: The pipe plug is connected to an electronic control module, and the electronic control module is connected to a semiconductor bridge; the electronic control module includes a control chip, an energy storage capacitor and an ignition switch, and the control chip can control the ignition switch to make the energy storage capacitor discharge to the semiconductor bridge.

3. The ignition powder-free electronic detonator according to claim 1, characterized in that: One end of the tube shell is open, and the other end is closed and has a concave energy-gathering hole. First, high explosive is pressed into the tube shell from the opening, then detonator is pressed, and finally the reinforcing cap is pressed.

4. The ignition powder-free electronic detonator according to claim 1, characterized in that: The tube plug has a T-shaped structure, which can be partially inserted into the tube shell and partially stuck outside the tube shell; the tube shell inserted into the tube plug is compressed to connect and fix the first component and the second component to form the final detonator; the semiconductor bridge does not contact the reinforcement cap and has a certain safety gap.

5. The ignition powder-free electronic detonator according to claim 1, characterized in that: The center of the reinforcing cap is provided with a circular hole, and the plasma flow when the semiconductor bridge explodes can pass through the circular hole of the reinforcing cap and be shot toward the detonator.

6. The ignition powder-free electronic detonator according to claim 1, characterized in that: The semiconductor bridge comprises a packaging substrate, a welding metal frame, a metal PAD, a semiconductor bridge area, metal binding wires, and a packaging top cover; wherein the packaging top cover has a trumpet-shaped packaging opening.

7. The ignition powder-free electronic detonator according to claim 6, characterized in that: The semiconductor bridge region includes a silicon substrate layer, a silicon dioxide insulating layer, a metal layer and a protective layer. During the explosion, the voltage stimulates the silicon substrate to explode. When the explosion plasma flow is ejected toward the detonator, the metal layer fragments undergo oxidation reaction or chemical reaction under the action of high temperature, releasing a large amount of heat, further increasing the jet temperature.

8. The ignition powder-free electronic detonator according to claim 6, characterized in that: The semiconductor bridge region is located in the center of the trumpet-shaped opening package.

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